DEVICE FOR MEASURING PLASMA ION DENSITY AND APPARATUS FOR DIAGNOSING PLASMA USING THE SAME
20220270852 · 2022-08-25
Inventors
Cpc classification
Y02E30/10
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H01J37/32311
ELECTRICITY
H01J2237/24585
ELECTRICITY
H01J37/32935
ELECTRICITY
International classification
Abstract
Disclosed herein is a device for measuring a plasma ion density, which includes a transceiver antenna configured to apply and receive a microwave, of which a frequency is varied, to and from plasma, and a frequency analyzer configured to analyze a frequency of the microwave received from the transceiver antenna and measure a cut-off frequency, wherein the frequency of the microwave applied to the plasma is varied in the range of 100 kHz to 500 MHz.
Claims
1. A device for measuring a plasma ion density, comprising: a transceiver antenna configured to apply and receive a microwave, of which a frequency is varied, to and from plasma; and a frequency analyzer configured to analyze a frequency of the microwave received from the transceiver antenna and measure a cut-off frequency, wherein the frequency of the microwave applied to the plasma is varied in a range of 100 kHz to 500 MHz.
2. The device of claim 1, further comprising a converter configured to convert the cut-off frequency, which is measured by the frequency analyzer, into a plasma ion density.
3. The device of claim 1, wherein the transceiver antenna includes a probe-type antenna.
4. The device of claim 1, wherein the transceiver antenna includes a loop-type antenna.
5. The device of claim 1, wherein the transceiver antenna includes a planar ring-type antenna.
6. The device of claim 1, wherein the transceiver antenna includes a planar cone-type antenna.
7. The device of claim 1, wherein the transceiver antenna includes a planar bar-type antenna.
8. A device for measuring a plasma ion density, comprising: a transceiver antenna configured to apply and receive a microwave, of which a frequency is varied, to and from plasma; and a frequency analyzer configured to analyze a frequency of the microwave received from the transceiver antenna and measure a cut-off frequency, wherein the frequency of the microwave applied to the plasma is varied in a range of 100 kHz to 500 MHz.
9. The device of claim 8, further comprising a converter configured to convert the cut-off frequency, which is measured by the frequency analyzer, into a plasma ion density.
10. The device of claim 8, wherein the transceiver antenna includes a probe-type antenna.
11. The device of claim 8, wherein the transceiver antenna includes a loop-type antenna.
12. The device of claim 8, wherein the transceiver antenna includes a planar ring-type antenna.
13. The device of claim 8, wherein the transceiver antenna includes a planar cone-type antenna.
14. The device of claim 8, wherein the transceiver antenna includes a planar bar-type antenna.
15. A method of diagnosing plasma, comprising: generating plasma in a vacuum chamber; applying and receiving a microwave, of which a frequency is varied in the vacuum chamber, to and from the plasma; analyzing a frequency of the microwave received from the transceiver antenna and measuring a cut-off frequency; converting the cut-off frequency, which is measured by a frequency analyzer, into a plasma ion density or a plasma electron density; and comparing the plasma ion density with the plasma electron density, which are converted by a converter.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0043] The above and other objects, features and advantages of the present invention will become more apparent to those skilled in the art by describing exemplary embodiments thereof in detail with reference to the accompanying drawings, in which:
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DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS
[0061] Hereinafter, an overall configuration and operation according to exemplary embodiments of the present invention will be described. These embodiments are illustrative and do not limit the configuration and operation of the present invention, and other configurations and operations that are not explicitly shown in the embodiments can be regarded as the technical spirit of the present invention when those skilled in the art can easily understand through the following embodiments of the present invention.
[0062]
[0063] Referring to
[0064] The OES 85 may be used not only to detect plasma and active species in the plasma but also to detect pollutant particles. In the laser optical system, a laser generated from the laser beam source 80 passes through plasma in the vacuum chamber through a window on a wall surface of the vacuum chamber and the detectors 81, 82, and 83 detect the laser, and thus pollutant particles in the plasma may be measured from the detected result.
[0065] In addition, in order to measure a plasma frequency, transceiver antennas 10 and 11, a network signal analyzer or frequency analyzer 20, a switching circuit 21, a vacuum chamber 30, a power supply 40, a matching circuit 50, a substrate 60, and a substrate support 70 are provided.
[0066] A variety of types of the transceiver antennas 10 and 11 may be used, and the planar-type transceiver antenna 11 may be embedded in a wall surface of the vacuum chamber 30 or embedded in the substrate support 70.
[0067] The switching circuit 21 may be provided between the time division network signal analyzer or frequency analyzer 20 and the plurality of transceiver antennas 10 and 11, and a time difference between signals, which are transmitted and received between the time division network signal analyzer or frequency analyzer 20 and the plurality of transceiver antennas 10 and 11 by a switching operation of the switching circuit 21, may be discriminated so that it is possible to operate each of the transceiver antennas 10 and 11.
[0068]
[0069] Referring to
[0070] When the intensity of the laser beam is attenuated, the detector 81 may detect the attenuation, and it may be determined that the number of the pollutant particles is increased. When the laser beam is scattered, the detector 82 detects scattering of the laser beam according to a scattering angle to determine a size of the pollutant particle.
[0071] In addition, when the scattering of the laser beam is detected in the detector 83, a size of the pollutant particle may be determined according to a scattering angle of the laser beam. According to a degree of symmetry between the sizes of the pollutant particles determined by the detector 82 and the detector 83, it is possible to determine whether a shape of the pollutant particle is spherical or non-spherical.
[0072]
[0073] Referring to
[0074] The transceiver antenna 10 may apply and receive a microwave with a variable frequency to and from the plasma, and a position of the transceiver antenna 10 may be moved in the vacuum chamber 30.
[0075] The transceiver antenna 10 may be formed in various shapes such as a transceiver antenna with a probe in the form of a rod, a radiation antenna in the form of a rod and a receiving antenna in the form of a loop, a planar ring-type apparatus for diagnosing plasma, a planar cone-type apparatus for diagnosing plasma, and a planar bar-type apparatus for diagnosing plasma, a planar ring-type apparatus for diagnosing plasma, a planar cone-type apparatus for diagnosing plasma, and a planar bar-type apparatus for diagnosing plasma may be formed to be embedded in the wall surface of the vacuum chamber 30 or the substrate support 70.
[0076] The frequency analyzer 20 may be connected to the transceiver antenna 10 to vary a frequency of a microwave, which is applied to plasma, and analyze a frequency of a received microwave.
[0077] The power supply 40 may supply high-frequency power so as to generate plasma by ionizing a gas supplied into the vacuum chamber 30, and the matching circuit 50 may be a component for impedance matching and may be formed to minimize reflection loss.
[0078] In a semiconductor process, the substrate support 70 is provided in the vacuum chamber 30 for deposition or etching, the substrate 60 such as a semiconductor wafer or a display substrate is located on the substrate support 70, and when a gas for generating plasma is injected into the vacuum chamber 30, the gas is ionized to generate plasma due to power supplied from the power supply 40.
[0079] Ions and electrons are included in the plasma, and deposition or etching may be accurately performed by controlling movement of the ions and the electrons in the plasma. A variation in plasma density is measured and the power supplied from the power supply 40 is adjusted so that the deposition or etching may be performed more accurately.
[0080] The plasma is an ionized neutral gas, and thus ions and electrons can be regarded as existing at substantially the same density. Unlike the electrons which are a single type of particle, the ions are various types as well as positive (+) ions and negative (−) ions. When a mixed gas is injected into the vacuum chamber 30, various types of positive (+) ions and negative (−) ions may exist.
[0081] According to the related art, an electron density is calculated by measuring only an electron plasma frequency, a plasma density is calculated from the calculated electron density, and the power supplied from the power supply 40 is adjusted to perform a semiconductor process. However, in this case, as described above, it is impossible to accurately control movement of various types of ions existing in the plasma.
[0082]
[0083] Referring to
[0084] A frequency band of the microwave may be varied in the range of 100 kHz to 500 MHz, and more preferably, in the range of 400 kHz to 100 MHz, and the microwave is cut off at a frequency of 2.51 MHz. The cut-off frequency corresponds to an ion plasma frequency that is a natural frequency.
[0085] The ion plasma frequency f.sub.pi may be expressed by the following Equation 1 and an ion density may be calculated from Equation help 1.
[0086] Here, e is an elementary quantum of electricity, n.sub.i is the ion density (cm.sup.−3), ϵ.sub.0 is a dielectric constant in a vacuum, and M.sub.i is ion mass.
[0087] Referring to
[0088] The frequency band of the microwave may be varied in the range of 0.5 GHz to 2 GHz, and the microwave is cut off at a frequency of 0.69 GHz. The cut-off frequency corresponds to an electron plasma frequency that is a natural frequency.
[0089] The electron plasma frequency may be expressed by the following Equation 2, and an electron density may be calculated from Equation 2.
[0090] Here, e is an elementary quantum of electricity, n.sub.e is the electron density (cm.sup.−3), ϵ.sub.0 is a dielectric constant in a vacuum, and m.sub.e is electron mass.
[0091] Since the ion density n.sub.i and the electron density n.sub.e are equal to each other in the plasma, a theoretical value of the ion plasma frequency f.sub.pi may be expressed with respect to the electron plasma frequency f.sub.pe by the following Equation 3.
[0092]
[0093] Referring to
[0094] The frequency band of the microwave is varied in the range of 0 MHz to 10 MHz, and as the power applied from the power supply 40 for plasma generation is increased, the ion plasma frequency f.sub.pi is in creased.
[0095] Referring to
[0096] The frequency band of the microwave is varied in the range of 0 MHz to 0.4 GHz and, as the power applied from the power supply 40 for plasma generation is increased, the electron plasma frequency f.sub.pe is increased.
[0097] FIG.
[0098] Referring to
[0099] As expressed by Equation 3, the theoretical value of the ion plasma frequency is shown as a linear line in the graph, which has a slope of the square root of a mass ratio with a relationship proportional to the electron plasma frequency, and the actually measured value of the ion plasma frequency is also measured in the range in which a difference is maximally within 4.42% when compared to the theoretical value of the ion plasma frequency.
[0100] Referring to
[0101] As described above, when a density of the plasma generated from only He gas is measured, it can be seen that accurate measurement is possible in both the case of using the electron density and the case of using the ion density.
[0102]
[0103] Referring to
[0104] The frequency band of the microwave is varied in the range of 0 MHz to 10 MHz and, as the power applied from the power supply 40 for plasma generation is increased, the ion plasma frequency f.sub.pi is increased.
[0105] Referring to
[0106] The frequency band of the microwave is varied in the range of 0 MHz to 2 GHz and, as the power applied from the power supply 40 for plasma generation is increased, the electron plasma frequency f.sub.pe is increased.
[0107]
[0108] Referring to
[0109] As expressed by Equation 3, the theoretical value of the ion plasma frequency is shown as a linear line in the graph, which has a slope of the square root of a mass ratio with a relationship proportional to the electron plasma frequency, and the actually measured value of the ion plasma frequency is also measured in the range in which a difference is maximally within 3.97% when compared to the theoretical value of the ion plasma frequency.
[0110] Referring to
[0111] As described above, when a density of the plasma generated from only Ne gas is measured, it can be seen that accurate measurement is possible in both the case of using the electron density and the case of using the ion density.
[0112]
[0113] Referring to
[0114] The frequency band of the microwave is varied in the range of 0 MHz to 10 MHz and, as the power applied from the power supply 40 for plasma generation is increased, the ion plasma frequency f.sub.pi is increased.
[0115] Referring to
[0116] The frequency band of the microwave is varied in the range of 0 MHz to 2 GHz and, as the power applied from the power supply 40 for plasma generation is increased, the electron plasma frequency f.sub.pe is increased.
[0117]
[0118] Referring to
[0119] As expressed by Equation 3, the theoretical value of the ion plasma frequency is shown as a linear line in the graph, which has a slope of the square root of a mass ratio with a relationship proportional to the electron plasma frequency, and the actually measured value of the ion plasma frequency is also measured in the range in which a difference is maximally within 2.15% when compared to the theoretical value of the ion plasma frequency.
[0120] Referring to
[0121] As described above, when a density of the plasma generated from only Ar gas is measured, it can be seen that accurate measurement is possible in both the case of using the electron density and the case of using the ion density.
[0122]
[0123] Referring to
[0124] As expressed by Equation 3, a theoretical value of a He ion plasma frequency and a theoretical value of the Ar ion plasma frequency are proportional to the electron plasma frequency f.sub.pe, and a case in which only He gas is injected and a case in which only Ar gas is injected are indicated by a dotted line and a linear line in the graph, respectively. When the mixed gas is injected, an actually measured value f.sub.pi of the actual ion plasma frequency is shown as one measured value.
[0125] When the mixed gas is injected, the behavior of several ions is measured as one ion plasma frequency.
[0126] As shown in the graphs, the actually measured value f.sub.pi of the ion plasma frequency represents a large difference from the theoretical value of the He ion plasma frequency and, when the ratio of the He gas in the mixed gas is low, the actually measured value f.sub.pi of the ion plasma frequency is equal to the theoretical value of an Ar ion plasma frequency. However, as the ratio of the He gas in the mixed gas is increased, the actually measured value f.sub.pi of the ion plasma frequency shows a difference from the theoretical value of the Ar ion plasma frequency.
[0127] That is, since the theoretical value of the Ar ion plasma frequency is calculated from the electron plasma frequency, it can be seen that a variation in ion density in the plasma cannot be accurately measured by measuring only the electron plasma frequency.
[0128] Meanwhile, as described above, the theoretical value of the He ion plasma frequency is calculated from the electron plasma frequency f.sub.pe when only He gas is injected into the vacuum chamber 30, and the theoretical value of the Ar ion plasma frequency is calculated from the electron plasma frequency f.sub.pe when only Ar gas is injected into the vacuum chamber 30. Thus, when the mixed gas is injected into the vacuum chamber 30, the He ion plasma frequency, the Ar ion plasma frequency, a He ion concentration, and an Ar ion concentration are calculated and compared below.
[0129] Referring to
[0130] For reference, the difference is exhibited to be a very small in the graph. However, since a vertical axis of the graph is a log value, the difference is actually a very large difference, and the reason that the vertical axis is the log value is that the He ion density is too small and thus is shown in one graph.
[0131] Meanwhile, the He ion density and the Ar ion density are values calculated from the following equations.
[0132] As described above, when a mixed gas is injected, since only one ion plasma frequency is measured with respect to the behavior of the entire ions, Equation 4 is derived by estimating that the one ion plasma frequency is measured from a center of mass motion of He ions and Ar ions.
[0133] Like Equation 1, Equation 5 is an equation representing the He ion plasma frequency as the He ion density, and Equation 6 is an equation representing the Ar ion plasma frequency as the Ar ion density. In addition, in Equation 6, the Ar ion density is expressed as the He ion density using Equation 7.
[0134] Eventually, the He ion plasma frequency, the Ar ion plasma frequency, and He ion density, which are three variables, may be calculated from three equations of Equation 4, Equation 5, and Equation 6, and then the Ar ion density may be calculated from Equation 7.
[0135] Therefore, when there is a difference between the electron density and the Ar ion density in the mixed gas, plasma process control cannot be accurately performed by measuring only the electron density, and more accurate process control may be possible by measuring the Ar ion density.
[0136] In addition, a general ion measurement method according to the related art obtains an approximate value by assuming the Bohm speed in an ion current equation whereas, since the Bohm rate is not considered, the ion density measurement method according to the present invention may be regarded as a more accurate measurement method.
[0137]
[0138] Referring to
[0139]
[0140] Referring to
[0141]
[0142] Referring to
[0143]
[0144] Referring to
[0145]
[0146] Referring to
[0147] The planar ring-type apparatus for diagnosing plasma, a planar cone-type apparatus for diagnosing plasma, and a planar bar-type apparatus for diagnosing plasma may be used by being embedded in the wall surface of the vacuum chamber 30, the substrate support 70, and the like and used by being embedded in a wafer-type substrate.
[0148]
[0149] Referring to
[0150] The method of processing plasma according to the present invention performs generating plasma in the vacuum chamber 30 first (S100) and inserting the transceiver antenna 10 into the vacuum chamber 30 to apply and receive a microwave, of which a frequency is varied, to and from the plasma in the vacuum chamber 30 (S200).
[0151] The frequency analyzer 20 performs analyzing the frequency of the microwave received by the transceiver antenna 10 and measuring a cut-off frequency (S300). When the frequency of the microwave is varied in the range of 0 MHz to 10 MHz, an ion plasma frequency which is the cut-off frequency may be measured. When the frequency of the microwave is varied in the range of 0.5 GHz to 2 GHz, an electron plasma frequency which is the cut-off frequency may be measured.
[0152] Next, converting the cut-off frequency measured by the frequency analyzer 20 into a plasma ion density or a plasma electron density is performed (S400), and comparing the plasma ion density, which is converted by a converter, with the plasma electron density is performed (S500).
[0153] In this regard, as described above with reference to Equations 4 to 7 and
[0154] Although a comparator is not shown in the drawing, the power controller 41 performs controlling power supplied from the power supply 40 applied for plasma generation according to a difference between the plasma ion density and the plasma electron density, which are compared by the comparator (S600). When the difference is present between the plasma electron density and the plasma ion density in a mixed gas, plasma process control cannot be accurately performed by measuring only the plasma electron density, and more accurate process control may be possible by measuring the plasma ion density.
[0155] In addition, the method of diagnosing plasma may be implemented as a computer program, and each component of the present invention may be implemented as hardware or software.
[0156] In accordance with the present invention, there is an effect of allowing an ion density in plasma to be measured.
[0157] In addition, in accordance with the present invention, there is another effect of measuring the ion density in the plasma to allow a plasma density to be accurately measured.
[0158] In addition, in accordance with the present invention, there is still another effect of measuring the ion density in the plasma and comparing the ion density with an electron density to allow movement of ions to be accurately controlled in a thin film deposition process.
[0159] The effects according to the present invention are not limited to the above effects, and other effects not explicitly indicated above can be easily understood by those skilled in the art through the configurations and operations in the detailed description of the present invention.