Vertical Combiner for Overlapped Linear Phased Array
20170279178 · 2017-09-28
Inventors
Cpc classification
International classification
Abstract
A vertical combiner for an overlapping linear phased array is provided. The vertical vector combiner enables two strip-line signals from different layers to be combined, or divided, by vertical transitions between substrate layers and produce a desired output signal phase. The combiner can terminate in a short to act as an antenna. In an antenna application, the antenna provides multiple substrate layers for each strip-line signal, each having a metal ground plane. The ground planes are be coupled by vertical transitions access enabling a stepped ground within the structure which increases bandwidth. The multi-layer combiner architecture enables integration with phased array feed networks for millimeter wave phased array antennas.
Claims
1. A vertical electrical signal combiner comprising: a first feed substrate layer having a first strip-line signal feed; a second feed substrate layer having a second strip-line signal feed; and a combiner substrate layer interposed between the first feed substrate layer and the second feed substrate layer, the combiner layer having a strip-line Y-coupler coupled to the first strip-line signal feed and the second strip-line signal feed by vertical signal transitions through, respectively, the first and combiner substrate layers and wherein the combiner provides a resultant signal that is a vector sum of a first signal from the first strip-line signal feed and a second signal from the second strip-line.
2. The vertical combiner of claim 1 wherein a phase of the resultant signal is a sum of the phase of the first signal and a phase of the second signal.
3. The vertical electrical signal combiner of claim 1 wherein each layer further provides a ground plane where each substrate layer ground plane is coupled by a plurality of vertical interconnects between substrate layers.
4. The vertical electrical signal combiner of claim 3 wherein a bottom ground plane substrate layer is provided below the second feed substrate layer.
5. The vertical electrical signal combiner of claim 1 wherein the strip-line of the combiner layer terminates in a short on the combiner substrate layer.
6. An antenna element comprising the vertical vector combiner of claim 5, wherein the first feed substrate layer has a slot in a ground plane portion of the first feed substrate layer, the slot positioned above the short of the strip-line of the combiner.
7. The antenna element of claim 6 wherein the slot is ‘H’ shaped.
8. The antenna element of claim 7 wherein an end of the short of the strip line combiner is ¼ wavelength to a middle of the slot.
9. The antenna element of claim 8 further comprising a top ground plane substrate layer on top of the first feed substrate layer having an opening above the slot in the first feed substrate layer.
10. The antenna element of claim 9 further comprising an antenna positioned on top of an opening in the top ground plane substrate layer.
11. The antenna element of claim 6 wherein each substrate layer further provides a ground plane where each substrate layer ground plane is connected by a plurality of vertical interconnect between substrate layers.
12. An overlapped linear sub-array comprising: a plurality of antenna elements arranged in a plurality of rows and columns, each of the plurality of antenna elements comprising: a first feed substrate layer having a first strip-line signal feed; a second feed substrate layer having a second strip-line signal feed; and a combiner substrate layer interposed between the first feed substrate layer and the second feed substrate layer, the combiner layer having a strip-line coupling the first strip-line signal feed with the second strip-line signal feed wherein the combiner layer is coupled to the first strip-line signal feed and second strip-line signal feed by vertical signal transitions between the respective substrate layers and the combiner substrate layer wherein the combiner provides a resultant signal that is a vector sum of a first signal from the first strip-line signal feed and a second signal from the second strip-line; and an antenna element positioned above the first feed substrate layer; a feeding network for providing a respective column driving signal to one of the first or second strip-line signal feed of the combiner of each of the antenna elements in a respective column and a respective row driving signal to the other one of the first or second strip-line signal feed of the combiner of each of the antenna elements in a respective row.
13. The overlapped linear sub-array of claim 12 wherein a phase of the resultant signal is a sum of the phase of the first signal and a phase of the second signal.
14. The overlapped linear sub-array of claim 12 wherein in each antenna element the strip-line of the combiner layer terminates in a short on the combiner substrate layer.
15. The overlapped linear sub-array of claim 12 wherein in each antenna element the first feed substrate layer has a slot in a ground plane portion of the first feed substrate layer, the slot positioned above the strip-line of the combiner.
16. The overlapped linear sub-array of claim 15 wherein the slot is ‘H’ shaped.
17. The overlapped linear sub-array of claim 15 wherein an end of the strip line combiner is¼ wavelength to a middle of the slot.
18. The overlapped linear sub-array of claim 15 further comprising a top ground plane substrate layer on top of the first feed substrate layer having an opening above the slot in the first feed substrate layer.
19. The overlapped linear sub-array of claim 18 wherein the antenna positioned on top of an opening in the top ground plane substrate layer.
20. The overlapped linear sub-array of claim 19 wherein the opening and the antenna are square shaped.
21. The overlapped linear sub-array of claim 15 wherein each layer further provides a ground plane where each substrate layer ground plane is coupled by a plurality of vertical interconnects.
22. The overlapped linear sub-array of claim 21 wherein a bottom ground plane substrate layer is provided below the second feed substrate layer.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] Further features and advantages of the present disclosure will become apparent from the following detailed description, taken in combination with the appended drawings, in which:
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[0020] It will be noted that throughout the appended drawings, like features are identified by like reference numerals.
DETAILED DESCRIPTION
[0021] Embodiments are described below, by way of example only, with reference to
[0022] In order to provide the performance desired for next generation wireless networks such as 5G, networks may include phased array antennas in transmitters and receivers to allow transmission beams to steered and to allow receivers to be directed in both an azimuth plane as well as an elevation plane. The antenna structure described utilizes a vertically stacked combiner to combine two millimeter wave signals in a strip-line (SLIN) environment provided on different layers of the antenna structure. Based on the phases of the incoming signals a combined output signal is provided to an antenna element. The combiner structures described can also be used as a phase shifter in a phased array design. The vertical vector combiner structure for overlapped linear sub-array enables unique wideband SLIN fed antenna elements which uses symmetrical feed and power combined in three different SLIN substrate layers. Multiple ground layers are provided in the antenna structure which enhances the both bandwidth and directivity of an antenna element.
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[0024] An antenna element substrate layer 102, having a top metal layer 103, is positioned within an opening 104 in a ground plane 112 of substrate 110. SLIN1 150 and SLIN3 160 enter the antenna structure on respective layers 120 and 140. A combiner 170 is provided on intermediary layer 130 which receives an electrical signals from SLIN1 via a vertical transition 152 and an electrical signal from SLIN3 via vertical transition 162 between the respective ground planes disposed between the layers. The combiner 170 on the intermediary layer 130 combines the SLIN1 150 and SLIN3 160 to generate a combined electrical signal with desired phase from SLIN2 by combiner 170.
[0025] The combiner 170 terminates in a short 172 which is centre aligned with an ‘H’ slot 156 forming an opening in the ground plane 122. The short 172 fed the antenna by radiating up through the ‘H’ slot 156 which is centered underneath the antenna element 102. A stepped ground is provided by coupling the ground layers on the substrates within the antenna structure. The antenna element substrate layer 102 dimensions can be determined in reference to two ground references ‘Ref d’ and ‘Ref d.sup.1’ defining the distance required for two resonance frequencies of the antenna. The bandwidth of the antenna is a function of distance between the antenna element and its reference ground, which may for example be approximately 300 μm in thickness, whereas each substrate may be approximately 100 μm in thickness although other dimensions may be utilized depending on the frequency characteristics of the antenna.
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[0030] The graph 1000 in
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[0033] It would be appreciated by one of ordinary skill in the art that the system and components shown in
[0034] The present disclosure provided, for the purposes of explanation, numerous specific embodiments, implementations, examples and details in order to provide a thorough understanding of the invention. It is apparent, however, that the embodiments may be practiced without all of the specific details or with an equivalent arrangement. In other instances, some well-known structures and devices are shown in block diagram form, or omitted, in order to avoid unnecessarily obscuring the embodiments of the invention. The description should in no way be limited to the illustrative implementations, drawings, and techniques illustrated, including the exemplary designs and implementations illustrated and described herein, but may be modified within the scope of the appended claims along with their full scope of equivalents.
[0035] While several embodiments have been provided in the present disclosure, it should be understood that the disclosed systems and components might be embodied in many other specific forms without departing from the spirit or scope of the present disclosure. The present examples are to be considered as illustrative and not restrictive, and the intention is not to be limited to the details given herein. For example, the various elements or components may be combined or integrated in another system or certain features may be omitted, or not implemented.