Electronic interface apparatus and method and system for manufacturing same

Abstract

A method for manufacture of an electronic interface card including defining a pair of apertures in a substrate layer, associating an antenna with the substrate layer such that opposite ends of the antenna terminate at the apertures, placing a metal element in each of the apertures, connecting the ends of the antenna to the metal elements, laminating the substrate layer together with a top layer and a bottom layer, forming a recess in the top layer and the substrate layer, attaching ends of connection wires to the metal elements, attaching opposite ends of the connection wires to a chip module and sealing the chip module in the recess.

Claims

1. A chip card with an electronic interface assembly, comprising: a substrate having a first inlay layer of an original thickness; at least two metal elements located in penetrations through said first inlay layer, the metal elements having the same thickness as the original thickness of the first inlay layer; a wire antenna embedded in a top surface of said first inlay layer and having ends, each end electrically coupled to a top surface of one of said at least two metal elements; a top layer laminated with said first inlay layer; a chip module mounted in a recess formed in said first inlay layer and said top layer exposing said metal elements, the chip module having at least two pads; and connection wires providing electrical connections between said chip module and said metal elements, wherein each of said connection wires is a single integral piece having a first end attached to one of said metal elements and an opposite end attached to one of the at least two pads of said chip module, and wherein a length of the connection wires from the at least two pads to the metal elements is longer than a distance from the at least two pads to the metal elements in the chip card such that each of said connection wires has sufficient length to extend outside of said recess after connection to said metal elements and said at least two pads.

2. A chip card according to claim 1 and wherein said chip module comprises a packaged smart card chip.

3. A chip card according to claim 1 and wherein said wires are folded underneath said chip module in said recess.

4. A chip card according to claim 1 and wherein said recess in said metal elements is formed by milling.

5. A chip card according to claim 1 and wherein said connection wires are connected to said metal elements by laser bonding.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The present invention will be understood and appreciated more fully from the following detailed description, taken in conjunction with the drawings in which:

(2) FIG. 1 is a simplified pictorial and sectional illustration of an electronic interface card having both contact and contact-less functionalities, constructed and operative in accordance with a preferred embodiment of the present invention;

(3) FIG. 2 is a simplified pictorial illustration of an initial step in the manufacture of the electronic interface card of FIG. 1;

(4) FIGS. 3A and 3B are, respectively, simplified pictorial and sectional illustrations of a further step in the manufacture of the electronic interface card of FIG. 1;

(5) FIGS. 4A and 4B are, respectively, simplified pictorial and sectional illustrations of a yet further step in the manufacture of the electronic interface card of FIG. 1;

(6) FIGS. 5A and 5B are, respectively, simplified pictorial and sectional illustrations of a still further step in the manufacture of the electronic interface card of FIG. 1;

(7) FIGS. 6A and 6B are, respectively, simplified pictorial and sectional illustrations of an additional step in the manufacture of the electronic interface card of FIG. 1;

(8) FIGS. 7A and 7B are, respectively, simplified pictorial and sectional illustrations of a further additional step in the manufacture of the electronic interface card of FIG. 1;

(9) FIGS. 8A and 8B are, respectively, simplified pictorial and sectional illustrations of a yet further additional step in the manufacture of the electronic interface card of FIG. 1;

(10) FIGS. 9A and 9B are, respectively, simplified pictorial and sectional illustrations of a still further additional step in the manufacture of the electronic interface card of FIG. 1; and

(11) FIGS. 10A and 10B are, respectively, simplified pictorial and sectional illustrations of a final step in the manufacture of the electronic interface card of FIG. 1.

DETAILED DESCRIPTION OF A PREFERRED EMBODIMENT

(12) Reference is now made to FIG. 1, which illustrates an electronic interface card 100 having contact and/or contact-less functionalities, constructed and operative in accordance with a preferred embodiment of the present invention. As seen in FIG. 1, electronic interface card 100 preferably comprises a multiple-layer substrate including top and bottom protection layers 102 and 104, typically formed of PVC (PolyVinyl Chloride), each typically of thickness 0.05 mm. Alternatively, protection layers 102 and 104 may be formed of any other suitable material, such as Teslin®, PET-G (PolyEthyleneTerephthalate-Glycol), PET-F (PolyEthyleneTerephthalate-Film), polycarbonate or ABS.

(13) Disposed inwardly of both of protection layers 102 and 104 are preferably artwork layers 106 and 108, typically formed of PVC, each typically of thickness 0.15 mm, typically bearing artwork which is visible through respective protection layers 102 and 104. Alternatively, artwork layers 106 and 108 may be formed of any suitable material, such as Teslin®, PET-G (PolyEthyleneTerephthalate-Glycol), PET-F (PolyEthyleneTerephthalate-Film), polycarbonate or ABS. Alternatively, artwork layers 106 and 108 may be obviated.

(14) Disposed inwardly of both of artwork layers 106 and 108 there is preferably provided an inlay 110 including a wire antenna 112, preferably of wire diameter 0.1 mm, embedded in a first inlay layer 114, typically formed of PVC, preferably of thickness 0.15 mm. Inlay 110 also includes second and third inlay layers 116 and 118, also preferably formed of PVC, of respective thicknesses 0.1 mm and 0.15 mm, respectively. Alternatively, first, second and third inlay layers 114, 116 and 118 may be formed of any other suitable material, such as Teslin®, PET-G (PolyEthyleneTerephthalate-Glycol), PET-F (PolyEthyleneTerephthalate-Film), polycarbonate or ABS.

(15) A chip module 120 is mounted in a recess 122 formed in electronic interface card 100. The chip module preferably includes a packaged smart card chip 124 having pads 126 and an array 128 of contacts, preferably of thickness 0.06 mm. Alternatively, contacts 128 may be obviated and smart card chip 124 may provide contactless functionality.

(16) Electrical connections between the chip module 120 and the embedded antenna 112 are provided by wires 130, preferably of thickness 0.1 mm, which are preferably soldered at first ends thereof to pads 126 and laser bonded at opposite ends thereof to metal elements 132 which are bonded to respective ends of wire antenna 112. It is a particular feature of the present invention that the length of wires 130 between pads 126 and respective metal elements 132 is substantially longer than the distance between pads 126 and metal elements 132 in the assembled card. This feature provides enhanced reliability.

(17) A layer 134 of hot melt adhesive, disposed at the periphery of the underside of array 128 of contacts, retains the chip module 120 in recess 122, by engaging a corresponding recessed peripheral facing surface 136 of layer 106.

(18) Reference is now made to FIG. 2, which is a simplified pictorial illustration of an initial step in the manufacture of the electronic interface card of FIG. 1 in which layer 114 is punched to define a pair of apertures 150. As see in FIGS. 3A and 3B, antenna 112 is associated with layer 114, as by known embedding techniques, typically employing an ultrasonic head commercially available from PCK Technology, Inc. of Islip, N.Y., U.S.A. Opposite ends 152 of antenna 112 terminate at apertures 150, as seen in FIGS. 3A and 3B.

(19) Alternatively, antenna 112 may be a printed antenna formed on substrate 114 by suitable printing techniques or may be an antenna attached to substrate 114 by any suitable attachment method.

(20) Turning now to FIGS. 4A and 4B, it seen that adhesive pads 154 are mounted onto layer 114 at corresponding edges 156 of apertures 150. As seen in FIGS. 5A and 5B, metal elements 132 are placed in apertures 150 and are retained in position therein by adhesive pads 154. Preferably the ends 152 of antenna 112 are connected to metal elements 132 by thermal-compression bonding or any other suitable technique. Following this connecting step, the adhesive pads 154 are no longer needed to retain the metal elements 132 in place and the pads 154 are removed. It is appreciated that alternatively adhesive pads 154 need not be removed.

(21) At this stage, as seen in FIGS. 6A and 6B, layers 116 and 118 are provided onto the underside of layer 114 and layers 102, 104, 106 and 108 are all laminated together therewith, with the resulting laminated structure appearing as shown in FIGS. 7A and 7B.

(22) Turning now to FIGS. 8A and 8B, it is seen that recess 122 is formed in layers 102, 106 and 114 and metal elements 132 and recessed peripheral facing surface 136 of layer 106 is exposed, preferably by milling. It is appreciated that alternatively the recess may be formed on the opposite surface of the card. As seen in FIGS. 9A and 9B, thin wires 130 are attached, preferably by laser bonding, to metal elements 132. The wires 130 are trimmed and preferably arranged to extend generally perpendicularly to layer 102.

(23) Turning now to FIGS. 10A and 10B, it is seen that following attachment of wires 130 to corresponding pads 126 of the chip module 120, and placement of hot melt adhesive 134 on the periphery of the underside of array 128, the chip module 120 is inserted into recess 122 such that the periphery of array 128 sealingly engages recessed peripheral facing surface 136 of layer 106. The insertion method is such that wires 130 are folded underneath the chip module 120, as seen in FIG. 1.

(24) It is appreciated that the methodology described hereinabove with respect to FIGS. 1-10B is preferably highly automated.

(25) It is appreciated that while the illustrated embodiment described herein includes substrate layers 102, 104, 106, 108, 114, 116 and 118, the multiple-layer substrate of electronic interface card 100 may include any suitable number of layers of any suitable thickness.

(26) It is also appreciated that any or all of the layers of the multi-layer substrate of electronic interface card 100 may be formed of any of the materials described hereinabove, or any other suitable material, such as a composite material. Additionally, the layers of the multi-layer substrate of electronic interface card 100 need not be formed of the same material and each layer may be formed of a different material or different materials.

(27) It will be appreciated by persons skilled in the art that the scope of the present invention is not limited by what has been particularly shown and described hereinabove. Rather, the invention includes both combinations and subcombinations of the various features described hereinabove as well modifications and variations thereof which would occur to persons skilled in the art upon reading the foregoing description together with the drawings and which are not in the prior art.