Thermal module

Abstract

A thermal module includes a first heat transfer member and a second heat transfer member. The first heat transfer member has a first chamber in which a first capillary structure is disposed. The second heat transfer member has a second chamber and a conduction section. A second capillary structure is disposed in the second chamber. The conduction section is received in the first chamber. A third capillary structure is disposed on outer surface of the conduction section. A working fluid is respectively filled in the first and second chambers. The third capillary structure is disposed on the outer surface of the conduction section to enhance the heat transfer effect of the second heat transfer member so as to enhance the heat transfer efficiency of the entire thermal module.

Claims

1. A thermal module comprising: a first heat transfer member being a vapor chamber and having a first chamber in which a first capillary structure is disposed on an inner wall; and a second heat transfer member being a heat pipe and having a U-shape and a second chamber and a conduction section formed by or disposed between free ends of the U-shape wherein said conduction section of said second heat transfer member is inserted in the first chamber of the first heat transfer member, the second chamber and the first chamber being not communicable with each other, a second capillary structure being disposed in the second chamber, the conduction section being received in the first chamber, a third capillary structure being fixed on an outer surface of the second heat transfer member and extending beyond the conduction section itself and including the conduction section being in contact with the first capillary structure on the inner wall of the first chamber, wherein the third capillary structure remains fixed on the outer surface of the second heat transfer member, and the first capillary structure is different from the third capillary structure, a working fluid being respectively filled in the first and second chambers and isolated; and wherein the first capillary structure disposed on the inner wall of the first chamber and the third capillary structure attached to the outer surface of the second heat transfer member itself are selected from a group consisting of fiber bodies, sintered powder bodies, channeled structures, hydrophilic coatings and mesh bodies, each of the first and third capillary structures being the same kind of capillary structure or a combination of different kinds of capillary structures.

2. The thermal module as claimed in claim 1, wherein the first heat transfer member has a heat absorption side disposed on one side of the first heat transfer member opposite to the first chamber.

3. The thermal module as claimed in claim 1, wherein the conduction section is disposed at two ends of the second heat transfer member.

4. The thermal module as claimed in claim 1, wherein the conduction section is disposed between two ends of the second heat transfer member.

5. The thermal module as claimed in claim 1, further comprising a heat dissipation member, the heat dissipation member being connected with the second heat transfer member, the heat dissipation member being a heat sink or a radiating fin assembly.

6. The thermal module as claimed in claim 1, wherein the conduction section is disposed at two ends of the second heat transfer member and inserted in the first chamber of the first heat transfer member, the first and second heat transfer members being perpendicular to each other.

7. The thermal module as claimed in claim 1, wherein the conduction section is disposed between two ends of the second heat transfer member and received in the first chamber of the first heat transfer member, the first and second heat transfer members being normal to each other.

8. The thermal module as claimed in claim 1, wherein the third capillary structure is partially or completely disposed on the outer surface of the conduction section.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:

(2) FIG. 1 is a perspective view of a first embodiment of the thermal module of the present invention;

(3) FIG. 2 is a sectional assembled view of the first embodiment of the thermal module of the present invention;

(4) FIG. 2a is an enlarged view of circled area of FIG. 2;

(5) FIG. 3 is a sectional assembled view of a second embodiment of the thermal module of the present invention;

(6) FIG. 4 is a perspective assembled view of a third embodiment of the thermal module of the present invention;

(7) FIG. 5 is a sectional assembled view of a fourth embodiment of the thermal module of the present invention;

(8) FIG. 6 is a sectional assembled view of a fifth embodiment of the thermal module of the present invention;

(9) FIG. 7 is a perspective assembled view of a sixth embodiment of the thermal module of the present invention; and

(10) FIG. 8 is a perspective assembled view of a seventh embodiment of the thermal module of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

(11) Please refer to FIGS. 1, 2 and 2a. FIG. 1 is a perspective view of a first embodiment of the thermal module of the present invention. FIG. 2 is a sectional assembled view of the first embodiment of the thermal module of the present invention. FIG. 2a is an enlarged view of circled area of FIG. 2. According to the first embodiment, the thermal module 1 of the present invention includes a first heat transfer member 11 and a second heat transfer member 12.

(12) The first heat transfer member 11 has a first chamber 111 in which a first capillary structure 112 is disposed. The second heat transfer member 12 has a second chamber 121 and a conduction section 122. A second capillary structure 123 is disposed in the second chamber 121. The conduction section 122 is received in the first chamber 111. A third capillary structure 114 is disposed on outer surface of the conduction section 122. A working fluid 2 is respectively filled in the first and second chambers 111, 121.

(13) The first heat transfer member 11 has a heat absorption side 113 disposed on one side of the first heat transfer member 11 opposite to the first chamber 111. The heat absorption side 113 can be correspondingly attached to at least one heat source (not shown).

(14) The first heat transfer member 11 is a vapor chamber. The second heat transfer member 12 is a heat pipe. In this embodiment, the conduction section 122 is disposed at a middle section of the second heat transfer member 12 between two ends thereof. The conduction section 122 of the second heat transfer member 12 is received in the first chamber 111 of the first heat transfer member 11. The first and third capillary structures 112, 114 are selected from a group consisting of fiber bodies, sintered powder bodies, channeled structures, hydrophilic coatings and mesh bodies. In this embodiment, the first and third capillary structures 112, 114 are, but not limited to, sintered powder bodies for illustration purposes only. The second capillary structure 123 is also selected from a group consisting of fiber bodies, sintered powder bodies, channeled structures, hydrophilic coatings and mesh bodies. The third capillary structure 114 is partially and/or completely disposed on the outer surface of the conduction section 122.

(15) Please now refer to FIG. 3, which is a sectional assembled view of a second embodiment of the thermal module of the present invention. The second embodiment is partially identical to the first embodiment in structure and connection relationship and thus will not be repeatedly described hereinafter. The second embodiment is different from the first embodiment in that the conduction section 122 is disposed at two ends of the second heat transfer member 12. That is, the two ends of the second heat transfer member 12 are inserted in the first chamber 111 of the first heat transfer member 11. The third capillary structure 114 is disposed on outer side of the conduction section 122.

(16) Please now refer to FIG. 4, which is a perspective assembled view of a third embodiment of the thermal module of the present invention. The third embodiment is partially identical to the second embodiment in structure and connection relationship and thus will not be repeatedly described hereinafter. The third embodiment is different from the second embodiment in that the second heat transfer member 12 is further connected with at least one heat dissipation member 3. The heat dissipation member 3 can be a heat sink or a radiating fin assembly. In this embodiment, the heat dissipation member 3 is, but not limited to, a heat sink for illustration purposes only.

(17) Please now refer to FIG. 5, which is a sectional assembled view of a fourth embodiment of the thermal module of the present invention. The fourth embodiment is partially identical to the second embodiment in structure and connection relationship and thus will not be repeatedly described hereinafter. The fourth embodiment is different from the second embodiment in that the conduction section 122 is disposed at two ends of the second heat transfer member 12, which are inserted in the first chamber 111 of the first heat transfer member 11. The first and second heat transfer members 11, 12 are normal to each other.

(18) Please now refer to FIG. 6, which is a sectional assembled view of a fifth embodiment of the thermal module of the present invention. The fifth embodiment is partially identical to the first embodiment in structure and connection relationship and thus will not be repeatedly described hereinafter. The fifth embodiment is different from the first embodiment in that the conduction section 122 is disposed between two ends of the second heat transfer member 12 and received in the first chamber 111 of the first heat transfer member 11. The first and second heat transfer members 11, 12 are normal to each other. The conduction section 122 can be in contact with the wall face of the first chamber 111 or not in contact with the wall face of the first chamber 111. In this embodiment, the conduction section 122 is, but not limited to, in contact with the wall face of the first chamber 111 for illustration purposes only.

(19) Please now refer to FIG. 7, which is a perspective assembled view of a sixth embodiment of the thermal module of the present invention. The sixth embodiment is partially identical to the fourth embodiment in structure and connection relationship and thus will not be repeatedly described hereinafter. The sixth embodiment is different from the fourth embodiment in that the second heat transfer member 12 is further connected with a heat dissipation member 3.

(20) Please now refer to FIG. 8, which is a perspective assembled view of a seventh embodiment of the thermal module of the present invention. The seventh embodiment is partially identical to the fifth embodiment in structure and connection relationship and thus will not be repeatedly described hereinafter. The seventh embodiment is different from the fifth embodiment in that the second heat transfer member 12 is further connected with a heat dissipation member 3.

(21) In the first to seventh embodiments, the first capillary structure 112 disposed in the first chamber 111 and the third capillary structure 114 disposed on the conduction section 122 are selected from a group consisting of fiber bodies, sintered powder bodies, channeled structures, hydrophilic coatings and mesh bodies. However, the first and third capillary structures 112, 114 are not limited to be the same kind of capillary structures. Alternatively, each of the first and third capillary structures 112, 114 can be a combination of different kinds of capillary structures.

(22) The present invention has been described with the above embodiments thereof and it is understood that many changes and modifications in the above embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.