INDUCTIVE PROXIMITY SENSOR OF INTEGRATED DESIGN

Abstract

A front end for an inductive proximity sensor includes a coil for detecting an approaching metal object and a circuit board, wherein the coil is designed as a circuit board coil disposed in the circuit board, wherein a metal influencing element which is disposed in or on the circuit board has an opening to receive at least one electrical connecting element, wherein a through connection of the circuit board to an electrical connection plane, which serves for electrical connection of the circuit board to a control electronics of the proximity sensor, is made by the at least one electrical connecting element.

Claims

1. Front end for an inductive proximity sensor, having a coil for detecting an approaching metal object and having a circuit board (105), wherein the coil is formed as a circuit board coil, wherein a sheet-shaped metallic influencing element (115) which is integrally arranged in or on the circuit board (105) is provided which provides at least one opening to receive at least one electrical connection element, wherein a through contact of the circuit board (105) to an electric connection plane (120), which preferably serves to electrically connect the circuit board (105) to a control electronics of the proximity sensor, takes place by means of the at least one electric connection element.

2. Front end according to claim 1, wherein the coil is arranged in an insulator, wherein the electric connection of the circuit board (105) takes place through the metal influencing element (115).

3. Front end according to claim 1, wherein the metal influencing element (115) is bound to the circuit board coil in the form of a sheet metal (101) formed as an “insulated metal substrate”.

4. Front end according to claim 3, wherein at least one electric insulating layer, in particular a prepreg layer (113), is bound to the influencing element (115).

5. Front end according to claim 3, wherein the metal influencing element (115) is covered with at least one insulating layer, in particular a prepreg layer (120).

6. Front end according to claim 1, wherein an electric contact surface (126) is electrically connected to an electronic assembly group (125).

7. Front end according to claim 6, wherein the electronic assembly group is mechanically fixed to the front end.

8. Front end according to claim 6, wherein the connection plane (120) has at least one soldering surface (226) for solder-connecting receiving of the electronic assembly group and, where appropriate, further electronic components.

9. Front end according to claim 8, wherein, as the opening, at least one recess (180, 280) is arranged having at least one contact hole (130, 230) for through contacting the circuit plate coil (160) to the electric connection plane (120) by means of at least one via (135, 140, 145, 230, 235, 240 245).

10. Front end according to claim 3, wherein the metal sheet (101) is electrically connected to the circuit board coil in the circuit board (105) by means of at least one via (165) that forms the opening.

11. Front end according to claim 3, wherein the metal sheet (101) is connected to the influencing element (115) via through contacting by means of at least one via (170) that forms the opening.

12. Front end (400) according to claim 1, wherein the circuit board (405) is substantially firmly bonded to a metal sheet (401) of a metal housing (410).

13. Circuit board (105, 405 515) for a front end (100, 200, 300, 400) according to claim 1, comprising a coil formed as a circuit board coil and a metal influencing element (115) which is arranged in or on the circuit board (105, 405, 515), said metal influencing element providing a through contact of the circuit board (105, 405, 515) to an electric connection plane (120), which serves to electrically connect the circuit board (105, 405, 515) to an electronic assembly group of the proximity sensor.

14. Inductive proximity sensor, comprising a front end (100, 200, 300, 400) according to claim 1 and/or a circuit board (105, 405, 515).

15. Inductive proximity switch, comprising a front end according to claim 1 and/or a circuit board (105, 405, 515).

Description

SHORT DESCRIPTION OF THE FIGURES

[0013] FIG. 1 shows a schematic lateral view of a front end according to the invention for an inductive proximity sensor or switch.

[0014] FIG. 2 shows a schematic top view of a first exemplary embodiment of a circuit board according to the invention for a front end shown in FIG. 1.

[0015] FIG. 3 shows a schematic top view of a second exemplary embodiment of a circuit board according to the invention for a front end shown in FIG. 1.

[0016] FIG. 4 shows a lateral sectional view of a metal housing having a front end according to the invention, according to a first exemplary embodiment.

[0017] FIG. 5a, b show a top view (a.) and a lateral sectional view (b.) of a metal housing having a front end according to the invention, according to a second exemplary embodiment.

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

[0018] The front end 100 shown in FIG. 1 comprises a circuit board 105 applied to a metal sheet 101. A metal influencing element 115 that is covered by a first prepreg layer 110 is arranged on the side of the circuit board 105 opposing the metal sheet 101. A second prepreg layer 113 is arranged on the transition side of the circuit board 105 to the metal sheet 101 in this exemplary embodiment. The material “prepreg” is a glass fibre fabric, as is known, which is impregnated with epoxy resin. Electric contact surfaces (126, 226-229, 326-329) are arranged on this side of the circuit board 105 which serve to electrically connect the front end 100 to an electronic assembly group (125) of the proximity sensor or proximity switch. It should be noted that the connection plane 120 can similarly be formed from prepreg. In this case, said electric contact surfaces are arranged on the connection plane 120.

[0019] A recess 180 is arranged in the influencing element 115, said recess being filled with an electric insulator, resin in this case. The recess 180 enables the arrangement of a through contact, which is subsequently described, of the connection plane 120 to the circuit board 105, by means of at least one via (via=vertical interconnect access) 135, 140.

[0020] In the exemplary embodiment, the circuit board 105 is formed to have many layers and has several (in this case three) conductor track planes 150, 155, 160, wherein a circuit board coil (“print coil”) that cannot be seen in this depiction is arranged in the third conductor track plane 160. To operate this print coil, vias 135, 140 arranged or ending in a region 146 shown dashed of the third conductor track plane 160 are provided with the connection plane 120 or contact surfaces (or “soldering pads”) 126 arranged there. It should be noted that every conductor track plane can be a print coil. The through contact by means of the vias 130-145 connect these layers among themselves. In addition, the vias also connect the electric contact surfaces, e.g. according to reference numeral 126, to the conductor track planes or the circuit board 105.

[0021] The metal sheet 101 and the influencing element 115 can additionally be connected to the print coil and/or the connection plane 120 via further vias 165, 175, wherein, according to FIG. 2, at least one continuous contact or conductor 230, 235, 240, 245 can be provided. Additionally or alternatively, it can be provided to connect the influencing element 115 to the metal sheet 101 by means of a via 170.

[0022] It should be noted that the circuit board 105 provided with the influencing element 115, the prepreg layers 110, 113 and the connection plane 120 present a function or construction unit that is able to be marketed separately.

[0023] The presently round front end 200 shown in a top view in FIG. 2 comprises, in the present exemplary embodiment, four electric contact surfaces (so-called “soldering pads”) 226, 227, 228, 229 for solder-connecting receiving of the electronic assembly group (125) and a recess 280 arranged in the influencing element, said recess 280 being filled with resin. In the exemplary embodiment, the recess 280 has four regions for vias 230, 235, 240, 245, i.e. contact holes for through contact of individual metallisation planes. In particular, these contact holes 230-245 are used for the through contacting of the print coil (not shown) to a connection plane shown in FIG. 1.

[0024] It should be noted that the circuit board, depending on usage, can also be formed to be quadratic or rectangular, since in this case it does not depend on the external shape.

[0025] In this exemplary embodiment, the front end 300 also depicted in a top view in FIG. 3 comprises, in turn, four electric contact surfaces 326, 327, 328, 329 for the above-mentioned purpose. In comparison to FIG. 2, four recesses 380, 385, 390, 395 are arranged in the influencing element (which cannot be seen in this depiction). Each of these recesses 380-395 comprises one region 330, 335, 340, 345 for said via, and indeed in turn for through contacting the print coil.

[0026] A described front end can, as shown in FIG. 4, be integrated into a metal housing 410 and is thus protected against any external influences such that it is also able to be safely used in chemically aggressive environments, for example. In this exemplary embodiment, the circuit board 405 that is in turn arranged to be substantially firmly bonded to a metal sheet 401 is arranged on the bottom end of the metal housing 410 according to the view in FIG. 4. The metal sheet 401 depicts said metal front face of a front end concerned here. The arrangement of an influencing element 415 that has already been described is also schematically depicted in FIG. 4.

[0027] FIGS. 5a and 5b show a second exemplary embodiment of a front end integrated into a metal housing 500. The two indentations or holes 505 serve as mounting aids. The sectional view shown in FIG. 5b emerges, according to FIG. 5a, through a cut along the line A-A. In the metal housing 500, a described circuit board 515 is arranged to be substantially firmly bonded directly to a front face 510 as part of the whole housing 500. An influencing element 520 already described is also schematically drawn in FIG. 5b.

[0028] In the production of a circuit board 105, 405, 515 previously described, similar to in the inherently known technology of “Insulated Metal Substrate” (IMS), a metal sheet serving as said influencing element is incorporated into the finishing of the print coil. This sheet is arranged between two said prepreg layers and enables the generation of a through contacting previously described. In contrast to prior art, only one relatively small hole has to be introduced (e.g. drilled) into the influencing element to do this. As a result, a relatively space-saving contacting between the print coil and the connection plan is obtained.

[0029] In the following a preferred method for producing a front end according to the invention of an inductive proximity sensor or switch is described. Initially, a multi-layered, and indeed at least two-layered, print coil is produced on the circuit board in an inherently known manner. Then, the adhesive surfaces between the circuit board and the influencing element are prepared for the subsequent adhesion process, where applicable including one or more cleaning steps. The adhesive partners of the adhesive process are a prepreg layer described and a metal sheet described. Then, the circuit board is joined or pressed to the influencing element under pressure or temperature by introducing a prepreg, for example. This completion takes place by an inherently known process in circuit board finishing, wherein the hole present in the influencing element is filled up with resin. At the same time, pressing of a further prepreg layer takes place. Subsequently, drilling, structuring and galvanising including through contacting of the front end and the final layer takes place, however without the metal sheet 101. Finally, the part packet formed in such a way is pressed to a further prepreg layer by the metal sheet 101.

[0030] The contacting plane is correspondingly produced, wherein the circuit board is pressed to the influencing element and said prepreg layer.

LIST OF REFERENCE NUMERALS

[0031] 101 Metal sheet [0032] 100 Front end [0033] 105 Circuit board [0034] 110, 113 Prepreg layers [0035] 115 Influencing element [0036] 120 Connection plane [0037] 125 Electronic assembly group [0038] 126 Electric contact surfaces [0039] 180 Recess [0040] 130-145 Vias [0041] 146 Region of the third conductor track plane [0042] 150-160 Conductor track planes [0043] 165-175 Vias [0044] 200 Front end [0045] 201 Metal sheet [0046] 226-229 Electric contact surfaces [0047] 280 Recess [0048] 230-245 Vias [0049] 300 Front end [0050] 301 Metal sheet [0051] 326-329 Electric contact surfaces [0052] 380-395 Recesses [0053] 330-345 Vias [0054] 400 Front end [0055] 401 Metal sheet [0056] 410 Metal housing [0057] 415 Influencing element [0058] 500 Metal housing [0059] 505 Indentations [0060] 510 Front face [0061] 515 Circuit board [0062] 520 Influencing element