Solid particle source, treatment system and method

Abstract

The invention relates to various embodiments of a solid particle-source (100a, 100a) that can comprise: a container (104) which comprises an area for receiving solid particles; at least one electron source (106) for introducing electrons into the solid particles such that an electrostatic charge of the solid particles produced by the electrons separates them from each other and accelerates them in a direction out from the container (104); a vibration source (110) which is designed to introduce a vibration in the region in order to loosen the solid particles, the electronic source comprising an emission surface for emitting electrons into a vacuum emission region.

Claims

1. A solid particle source, comprising: a container containing a region for receiving solid particles; at least one electron source for introducing electrons into the solid particles in such a way that an electrostatic charging of the solid particles that is brought about by said electrons separates said solid particles from one another and accelerates them in a direction out of the container; a vibration source configured to couple a vibration into the region in order to loosen the solid particles; wherein the electron source comprises an emission surface for emitting electrons into a vacuum emission region.

2. The solid particle source as claimed in claim 1, wherein the vibration source comprises an electromechanical transducer.

3. The solid particle source as claimed in claim 1, wherein the vibration source comprises an electrical coil.

4. The solid particle source as claimed in claim 1, wherein the vibration source comprises a membrane adjoining the region.

5. The solid particle source as claimed in claim 1, wherein the vibration source is configured to transmit an electromagnetic vibration generated outside the region into the container.

6. The solid particle source as claimed in claim 1, wherein the vibration source is configured to transmit a mechanical vibration generated outside the region into the container and/or onto the container.

7. A treatment system, comprising: the solid particle source of claim 1, and a collecting device for collecting solid particles which are accelerated out of the region.

8. The treatment system as claimed in claim 7, wherein the collecting device comprises a substrate holder for holding a substrate to be coated with a substrate surface of the substrate in the direction of the region.

9. The treatment system as claimed in claim 7, wherein the collecting device comprises an additional container and is configured to collect solid particles by means of the additional container and/or to transport them into the latter.

10. The treatment system as claimed in claim 7, furthermore comprising: a vacuum chamber, in which the region and/or the collecting device are/is arranged.

11. The treatment system as claimed in claim 7, furthermore comprising: a coating region, which is arranged between the collecting device and the solid particle source or in which the collecting device is arranged; a material vapor source configured to emit a material vapor into the coating region.

Description

(1) Exemplary embodiments of the invention are illustrated in the figures and are explained in greater detail below.

(2) In the figures

(3) FIGS. 1A and 1B each show a solid particle source in accordance with various embodiments in a schematic side view or cross-sectional view;

(4) FIGS. 2A and 2B each show a solid particle source in accordance with various embodiments in a schematic side view or cross-sectional view;

(5) FIGS. 3A and 3B each show a solid particle source in accordance with various embodiments in a schematic side view or cross-sectional view;

(6) FIG. 4 shows a diagram in accordance with various embodiments; and

(7) FIGS. 5, 6, 7 and 8 each show a method in accordance with various embodiments in a schematic flow diagram.

(8) In the following detailed description, reference is made to the accompanying drawings, which form part of this description and show for illustration purposes specific embodiments in which the invention may be implemented. In this regard, direction terminology such as, for instance, “at the top”, “at the bottom”, “at the front”, “at the back”, “front”, “rear”, etc. is used with respect to the orientation of the figure(s) described. Since components of embodiments may be positioned in a number of different orientations, the direction terminology serves for illustration and is not restrictive in any way whatsoever. It goes without saying that other embodiments may be used and structural or logical changes may be made, without departing from the scope of protection of the present invention. It goes without saying that the features of the various exemplary embodiments described herein may be combined with one another, unless specifically indicated otherwise. Therefore, the following detailed description should not be interpreted in a restrictive sense, and the scope of protection of the present invention is defined by the appended claims.

(9) In the context of this description, the terms “connected”, “attached” and “coupled” are used to describe both the direction and indirect connection (e.g. resistive and/or electrically conductive, e.g. an electrically conductive connection), a direct or indirect attachment and a direct or indirect coupling. In the figures, identical or similar elements are provided with identical reference signs, insofar as this is expedient.

(10) In accordance with various embodiments, the term “coupled” or “coupling” may be understood in the sense of an (e.g. mechanical, hydrostatic, thermal and/or electrical), e.g. direct or indirect, connection and/or interaction. A plurality of elements may be coupled to one another for example along an interaction chain (e.g. the vibration source to the solid particles), wherein energy is transmitted for example along the interaction chain. In accordance with various embodiments, “coupled” may be understood in the sense of a mechanical (e.g. magnetic and/or physical) coupling, e.g. by means of a direct physical contact and/or by means of a magnetic interaction. A coupling may be configured, for example, to transmit a mechanical interaction (e.g. force, torque, etc.), e.g. by means of the magnetic interaction.

(11) Vibration (e.g. oscillation) may be understood to mean a repeated temporal fluctuation of a state variable of a system, e.g. of a mechanical force, of a spatial location and/or of an electric and/or magnetic field (e.g. the field strength and/or field direction thereof). The vibration may take place for example as a deviation from a mean value.

(12) Coupling in a vibration may be understood as excitation to carry out a vibration, e.g. by energy (also referred to as a vibrational energy) being transmitted. By way of example, the vibration of the vibration source may be coupled into the solid particles and excite them to carry out a mechanical vibration.

(13) In accordance with various embodiments, an (e.g. high-frequency) vibratory crucible is provided as FPD and FPC component for the improved emission of particles by carrying out (e.g. multiaxial) vibrations or oscillations for the temporal and spatial separation of the contact points of adjacent solid particles (e.g. of a powder medium) in the vacuum.

(14) In accordance with various embodiments, it has been recognized that a small average particle spacing (corresponds to a high densification) may lead to a reduction of the ohmic resistance in the particle supply (e.g. powder or bed), which is disadvantageous for the emission process during FPD or FPC. In accordance with various embodiments, an (e.g. high-frequency) vibration (e.g. in the kHz range) is coupled into a container (e.g. a vessel), e.g. in the form of a crucible, via mechanical contact with a piezo-crystal or else some other vibration source. At the surface of the particle supply, the vibration may bring about an increase in the average particle spacing (particulate separation or illustratively loosening) of the solid particles in the particle supply, i.e. a reduction of the particle density. By altering the parameters of the vibration, such as, for example, electrical voltage or frequency present at the vibration source, it is possible to vary the vibration of the vibration source (e.g. of the piezo-crystal) here in terms of frequency (e.g. in a range of approximately 10 kHz to approximately 100 kHz) and amplitude (less than 1 mm), such that the contact places of the particles experience a systematic influencing. Optionally, it is possible to effect an electrostatic decoupling between particle container, that is to say the application zone of the primary and secondary electrons, and surrounding components. Here, in the case of an insulated particle container, locally high voltages in the kV range (but e.g. less than the acceleration voltage of the electron beam source) may arise. Alternatively or additionally, the solid particles to be emitted (e.g. in the form of powder) may also be arranged onto a membrane (e.g. configured in an electrically conductive or electrically insulating fashion) that is to be caused actively to vibrate. In this case, an electrical decoupling between the membrane and the (e.g. inductive) vibration source may optionally be effected.

(15) In accordance with various embodiments, a continuous, long-term-stable and/or material-independent emission of solid particles (also referred to as solid particle emission) is provided, e.g. for use in FPD and FPC methodology. This increases the economic viability of the solid particle emission.

(16) In accordance with various embodiments, the region for receiving solid particles and/or the coating region may be arranged in a vacuum chamber. A vacuum chamber may be provided by means of a chamber housing in which one chamber or a plurality of chambers may be provided. The chamber housing, for example, for providing a reduced pressure or a vacuum (vacuum chamber housing), may be coupled (e.g. in a gas-conducting manner) to a pump arrangement, e.g. a vacuum pump arrangement, and be configured stably such that this withstands the action of air pressure in the evacuated state. The pump arrangement (including at least one vacuum pump, e.g. a high-vacuum pump, e.g. a turbomolecular pump) may make it possible to pump part of the gas out of the interior of the vacuum chamber, e.g. out of the region and/or the coating region. Accordingly, one vacuum chamber or a plurality of vacuum chambers may be provided in a chamber housing. In other words, the chamber housing may be configured as a vacuum chamber housing or a coating chamber may be configured as a vacuum chamber.

(17) In accordance with various embodiments, a chamber housing, e.g. a vacuum chamber provided therein, may be configured in such a way that it is possible to provide therein a pressure in a range of approximately 10 mbar to approximately 1 mbar (in other words low vacuum), and/or a pressure in a range of approximately 1 mbar to approximately 10.sup.−3 mbar (in other words fine vacuum), and/or a pressure in a range of approximately 10.sup.−3 mbar to approximately 10.sup.−7 mbar (in other words high vacuum) and/or a pressure of less than high vacuum, e.g. less than approximately 10.sup.−7 mbar.

(18) FIG. 1A and FIG. 1B each illustrate a solid particle source 100a, 100b in accordance with various embodiments in a schematic side view or cross-sectional view.

(19) The solid particle source 100a, 100b may include a container 104 (also referred to as particle container 104) including a region 104b (also referred to as receiving region) configured for receiving solid particles 104p.

(20) By way of example, the solid particles 104p may include or be formed from at least one material of the following materials: a metal; a transition metal, an oxide (e.g. a metal oxide or a transition metal oxide); a dielectric; a polymer (e.g. a carbon-based polymer or a silicon-based polymer); an oxynitride; a nitride; a carbide; a ceramic; a semimetal (e.g. carbon); a perovskite; a glass or vitreous material (e.g. a sulfidic glass); a semiconductor; a semiconductor oxide; a semiorganic material, and/or an organic material.

(21) The solid particle source 100a, 100b may furthermore include at least one electron source 106 configured for introducing electrons into the region. The electron source 106 may be for example part of an electron beam gun configured to emit an electron beam 106s, e.g. into the solid particles and/or onto the container 104. The electrons introduced by means of the electron source 106 may bring about an electrostatic charging of the solid particles, which emits the latter in a direction 104e (also referred to as emission direction 104e) out of the container 104 (also referred to as solid particle emission), e.g. out of an opening of the container 104. The space into which the solid particle emission takes place may include a coating region 111 and/or, during operation of the solid particle source 100a, 100b, a vacuum. By way of example, a vacuum may be formed in the coating region 111 during operation of the solid particle source 100a, 100b.

(22) In the emission direction 104e the container 104 may include the opening (also referred to as container opening).

(23) The solid particle source 100a, 100b may optionally include a collecting device 108 for collecting the solid particles that are emitted 104e out of the region.

(24) The solid particle source 100a, 100b may optionally include a material vapor source 114. The material vapor source 114 of the solid particle source 100a, 100b may be configured to vaporize 114e a coating material into the coating region 111 (also referred to as emitting 114e the material vapor). The material vapor source 114 may include for example a region 114b (e.g. provided by means of a crucible 114) in which the coating material 114p may be arranged. The vaporization may be effected for example by means of a or the electron beam 106s.

(25) By way of example, the coating material 114p may include or be formed from at least one material of the following materials: a metal; a transition metal, an oxide (e.g. a metal oxide or a transition metal oxide); a dielectric; a polymer (e.g. a carbon-based polymer or a silicon-based polymer); an oxynitride; a nitride; a carbide; a ceramic; a semimetal (e.g. carbon); a perovskite; a glass or vitreous material (e.g. a sulfidic glass); a semiconductor; a semiconductor oxide; a semiorganic material, and/or an organic material.

(26) The solid particle source 100a may be configured to coat a substrate with the solid particles 104p and with the coating material 114p. The coating formed on the substrate may include the solid particles 104p and the coating material 114p (e.g. a connector material).

(27) In accordance with various embodiments, the substrate may include a plate, a film, a membrane, fibers, a braiding, a tangle and/or a fabric, which include or are formed from at least one of the following materials, for example: a ceramic, a glass, a semiconductor (e.g. amorphous, polycrystalline or monocrystalline semiconductor, such as silicon), a metal, and/or a polymer (e.g. plastic).

(28) The solid particle source 100b may alternatively or additionally be configured to coat the solid particles 104p with the coating material 114p. The coating formed on the solid particles 104 may include the coating material 114p (e.g. a functional material). The coated solid particles 104p may subsequently be collected in a container and/or be transported into the latter (e.g. present as a loose bed therein). Optionally, a substrate may be coated with the coated solid particles 104p.

(29) By way of example, the collecting device 108 of the solid particle source 100a, 100b may be configured for holding and/or transporting (e.g. along a transport path) a substrate, e.g. in the coating region 111. The material vapor source 114 may then be configured, for example, to emit the material vapor in the direction 114e of the substrate and/or of the transport path.

(30) Alternatively, the collecting device 108 of the solid particle source 100b may include an additional container and be configured to collect solid particles by means of the additional container (also referred to as collecting container) and/or to transport them into the latter (e.g. by means of a transport device and/or out of the vacuum). In that case, the collecting device 108 may be arranged outside the coating region (e.g. behind the latter in the emission direction 104e) e.g. in a collecting region 113. The material vapor source 114 may be configured to emit 114e the material vapor past the collecting region 113, e.g. through between the collecting region 113 and the coating region 111.

(31) Optionally, a substrate may be coated with the collected solid particles, e.g. by means of renewed solid particle emission (i.e. in the vacuum) or by means of liquid coating (e.g. admixed in a binder).

(32) Furthermore, the solid particle source 100a, 100b may include a vibration source 110 configured to couple a vibration into the receiving region 114b. As an alternative or in addition to the vibration source 110, an organic material may be arranged in the region, which organic material spatially separates at least some of the solid particles from one another.

(33) A spatial and/or electrostatic loosening of the solid particles may be effected by means of the vibration source 110 and/or the organic material. By way of example, the particle density (number of solid particles per volume) may be reduced by means of the vibration source 110 and/or the organic material.

(34) The vibration source 110 may generally be operated electrically and implemented in various ways and/or effect coupling-in on the basis of various interactions. By way of example, a mechanical vibration may be coupled in, e.g. a repeatedly temporally fluctuating mechanical force. Alternatively or additionally, a vibrating electric and/or magnetic field may be coupled in.

(35) Exemplary configurations of the vibration source 110 are described below.

(36) FIG. 2A and FIG. 2B each illustrate a solid particle source 200a, 200b in accordance with various embodiments in a schematic side view or cross-sectional view.

(37) The vibration source 110 of the solid particle source 200a, 200b may include or be formed from an electromechanical transducer 110w (e.g. including or formed from an electromechanical actuator). The electromechanical transducer 110w may for example couple the container 104 to a carrier 204 (e.g. in a manner arranged between them). The carrier 204 may have for example a greater inertia than the container 104. The carrier 204 may for example include or be formed from a baseplate and/or be part of a vacuum chamber.

(38) Optionally, an electrical insulator 202 (e.g. a ceramic layer) may be arranged between the vibration source 110 and the container 104. By means of the insulator 202, the vibration source 110 may be galvanically isolated from the container 104, which reduces the influence of electrical charge introduced for the solid particle emission on the vibration source 110. Alternatively or additionally, the insulator 202 facilitates a conversion between a grounded container 104 and a container 104 mounted in an electrically floating fashion.

(39) The electromechanical transducer 110w may be coupled to the container 104 by means of the electrical insulator 202, for example.

(40) Optionally, the vibration source 110 may include a rod mechanism 110g, which transmits the mechanical vibration generated outside the container into or onto the container 104.

(41) Optionally, the container 104, e.g. the container base thereof, may include a membrane coupled to the vibration source 110, e.g. the rod mechanism thereof. The membrane 104m (also referred to as vibratory membrane) may for example be configured in a spring-elastic fashion and/or be mounted in a spring-elastic fashion. By way of example, the membrane 104m may have a lower spring constant than a wall of the container 104 that adjoins the membrane 104m (also referred to as container wall).

(42) Referring to FIG. 2A, the electromechanical transducer 110w of the solid particle source 200a may include a piezoelectric material, for example. The piezoelectric material may be arranged between two electrodes (first and second electrodes), for example, to which an electrical signal (e.g. an electrical oscillation) may be applied in order to excite the piezoelectric material. The piezoelectric material and the two electrodes may together be part of a piezoelectric actuator or form this.

(43) The two electrodes may include electrical terminals and/or be connected to an electrical power source (e.g. an electrical vibration generator).

(44) Optionally, the first electrode of the two electrodes may be provided by means of the carrier 204 and/or the second electrode of the two electrodes may be provided by means of the container 104 (e.g. if the latter or at least the container base is electrically conductive). This simplifies the solid particle source 200a. Alternatively, the electrical insulator 202 (e.g. a ceramic layer) may be arranged between the second electrode and the container 104.

(45) Referring to FIG. 2B, the electromechanical transducer 110w of the solid particle source 200b may include a kinetic vibrator 110v (also referred to as a shaker), for example. The vibrator 110v may include for example an unbalance motor, a ball vibrator, a Lorentz force vibrator, an eccentric vibrator or the like.

(46) The vibrator 110v may include a rod mechanism, for example, which is coupled to the container 104, e.g. by said rod mechanism being extended through the insulator 202. The rod mechanism may make it possible to couple the mechanical vibration into the container 104, e.g. the container base thereof.

(47) The Lorentz force vibrator may include a coil and a permanent magnet, which generate a vibration by means of an electrical AC power. The coil (also referred to as plunger coil) may be arranged for example in a gap of the permanent magnet. Alternatively, the permanent magnet (also referred to as plunger magnet), e.g. a permanent-magnetic part of the rod mechanism 110g, may be arranged in the stationary coil. The plunger coil and/or the plunger magnet may for example enable, e.g. in a manner coupled to the membrane 104m, a compact design and/or separately controllable frequency and amplitude of the vibration.

(48) The unbalance motor and/or the eccentric vibrator may enable a simplified electrical supply, e.g. with a DC power.

(49) As an alternative or in addition to the electromechanical transducer, the vibration source 110 may include or be formed from a hydraulic or pneumatic transducer.

(50) The solid particle source 200a, 200b may be configured to provide a physical coupling-in chain (also referred to as coupling-in interaction chain or transmission chain) from the vibration source 110 into the region 104b or the solid particles 104 arranged therein, i.e. a coupling-in chain consisting only of physical coupling-in links. The coupling-in chain may include for example at least the vibration source 110 and the container 104 and/or the solid particles 104.

(51) However, the coupling-in chain need not necessarily be purely physical or include the container, as will be described below.

(52) FIG. 3A and FIG. 3B each illustrate a solid particle source 300a, 300b in accordance with various embodiments in a schematic side view or cross-sectional view.

(53) Referring to FIG. 3A, the vibration source 110 of the solid particle source 300a may include an alternating field source 302. In other words, the vibration source 110 of the solid particle source 300a may be configured to couple an electrical and/or magnetic vibration (generally electromagnetic vibration hereinafter) into the region 104, e.g. to couple an electromagnetic wave into the region 104, e.g. the solid particles 104p arranged therein.

(54) The electrical vibration may be understood for example as a repeated temporal fluctuation of an electric field (e.g. the field strength and/or field direction thereof), as an alternating electric field. The magnetic vibration may be understood for example as a repeated temporal fluctuation of a magnetic field (e.g. the field strength and/or field direction thereof), e.g. as an alternating magnetic field. In other words, the coupling-in chain from the vibration source 110 to the solid particles 104 may include the electric and/or magnetic field. This makes it easier to couple in higher frequencies or to require less energy, since the mass of the container is not necessarily part of the coupling-in chain and therefore does not have to be excited to vibrate. By way of example, the container 104 may be nonmagnetic and/or electrically insulating.

(55) By way of example, the vibration source 110 of the solid particle source 300a may include a coil 302, in which the container 104 is arranged. By way of example, an electric AC current may be coupled into the coil 302. The resultant alternating magnetic field may for example excite the solid particles 104p to effect a mechanical vibration, e.g. on account of the eddy current effect. In an analogous manner, alternatively or additionally, an alternating electric field may be generated, which excites the solid particles 104p to effect a mechanical vibration, e.g. on account of the dielectric displacement.

(56) Referring to FIG. 3A, the vibration source 110 of the solid particle source 300b may also be at least partly (i.e. partly or completely) extended in the region 104b and/or arranged therein, for example the alternating field source 302 and/or the electromagnetic transducer 110w (e.g. at least the rod mechanism thereof). This may make it possible to transmit the vibration directly to the solid particles 104p. In other words, the coupling-in chain from the vibration source 110 to the solid particles 104 need not necessarily include the container 104. This makes it easier to couple in higher frequencies and/or to require less energy, since the mass of the container is not necessarily part of the coupling-in chain and therefore does not have to be excited to vibrate.

(57) FIG. 4 illustrates a diagram 400 in accordance with various embodiments.

(58) The diagram 400 illustrates the ohmic solid particle-to-solid particle resistance 401 (also referred to as resistance hereinafter) against the layer depth 403 in the container for solid particles which were exposed to different densification forces (increasing in the order 417, 415, 413, 411), thus resulting in different particle densities (increasing in the order 417, 415, 413, 411). The layer depth 403 having the value “0” denotes the topmost layer of the particle supply (at the opening of the container).

(59) Such a densification of the solid particles is effected, for example, in order to increase the amount of solid particles received in the container, such that refilling has to be carried out less frequently. The densification force may be for example in a range of from approximately the weight force of the solid particles (in the case of particle density 417) to approximately 100 grams/square centimeter (in the case of particle density 411).

(60) The solid particle-to-solid particle resistance 401 illustratively describes the electrical conductivity of a contact point of spatially adjacent solid particles (e.g. having a particle diameter in a range of approximately 1 μm to approximately 50 μm, e.g. in a range of approximately 5 μm to approximately 10 μm). The solid particle-to-solid particle resistance 401 may illustratively represent how strongly the solid particles are electrically conductively interlinked. The greater the solid particle-to-solid particle resistance 401, the lower may be the electrical conductivity of the particle supply and thus the ability to transport away the introduced electrons, which in turn increases the emission rate (e.g. amount and/or mass of emitted solid particles per time).

(61) As illustrated in diagram 400, the resulting resistance 401 of the solid particles (e.g. a powder thereof) is dependent on the layer depth 403 and the applied densification force. Firstly, in accordance with various embodiments, it was recognized that the solid particle-to-solid particle resistance 401 decreases continuously with the layer depth 403 and, secondly, that a rising densification force brings about the same. In the case of sufficiently strong densifications, the dependence of the solid particle-to-solid particle resistance 401 on the layer depth 403 is scarcely still measurable.

(62) In accordance with various embodiments, it was recognized that the cause of fluctuations of the emission rate is the dependence of the solid particle-to-solid particle resistance 401 on the layer depth and/or filling level. Illustratively, the solid particle-to-solid particle resistance 401 of the solid particles decreases proceeding from the container opening toward the container base, as a result of which the electrical potential may also be reduced more rapidly (which results in a temporally and spatially lower integration of charges) and as a result the electrostatic charging, that is to say the Coulomb repulsion, in turn decreases, which leads to a reduction of the emission rate.

(63) On account of this correlation, the diagram 400 may also be read as the emission rate 401 against the elapsed time 403 during the solid particle emission.

(64) This has the consequence that even the filling level of the container (at the beginning of the solid particle emission and/or in the course thereof) actually influences the resulting emission rate (also referred to as the degree of particle emission). The emission rate decreases with a lower filling level. In other words, a fluctuation in the filling level (e.g. on account of different preparation technicians) with which the solid particle emission is begun may lead to different emission rates. Alternatively or additionally, a decreasing filling level in the course of the solid particle emission may lead to a decreasing emission rate.

(65) Furthermore, it was recognized that the type of the material of the solid particles (e.g. metal, semiconductor and/or insulator/ceramic) and also the geometric shape (in particular particle size)—that is to say in total the physical properties of the solid particles (e.g. in the powder)—also have a similar influence on the emission rate.

(66) In accordance with various embodiments, the solid particles are loosened by means of the coupled-in vibration (by means of the excitation to effect mechanical vibration) by means of coupling 451 a vibration into the solid particles.

(67) The consequence of the loosening is that the topmost layer of solid particles in the container, independently of the previous densification state 411, 413, 415, 417 thereof, is converted into a densification dependent on the coupled-in vibration, i.e. has a lower particle density 420 (particles per volume). Illustratively, the solid particles in the topmost layer are loosened, such that the emission rate thereof over time decreases less, e.g. remains substantially unchanged.

(68) In the course of the consumption of solid particles (i.e. if the container is emptied) by means of the solid particle emission, subsequently the topmost layer of the current filling level is always loosened, such that even the lower layers of the particle supply are converted into a densification dependent on the coupled-in vibration.

(69) Consequently, by way of example, it is also possible to accommodate more solid particles in the container 104, without having to accept a reduction of the emission rate.

(70) Alternatively or additionally, the loosening may be effected by means of the organic material, as will be described in greater detail below.

(71) FIG. 5 illustrates a method 500 in accordance with various embodiments in a schematic flow diagram.

(72) The method 500 may include, in 501: generating a vacuum in a region in which solid particles are arranged.

(73) The method 500 may furthermore include, in 503: introducing electrons into the solid particles in such a way that an electrostatic charging of the solid particles that is brought about by said electrons separates said solid particles from one another and accelerates them out of the region. Illustratively, the method 500 may include, in 503: emitting solid particles out of the region by electrons being introduced into the solid particles.

(74) The method 500 may furthermore include, in 505: coupling a vibration into the solid particles arranged in the region (e.g. during the process of introducing the electrons into the solid particles). Illustratively, in 505, the solid particles may be excited to vibration (variation of the residence location).

(75) The method 500 may optionally include: coating a substrate with the solid particles and/or coating the solid particles with a coating material.

(76) The method 500 may optionally include: transporting the substrate in or through the vacuum.

(77) The method 500 may optionally include: transporting and/or collecting the coated solid particles into an additional container.

(78) FIG. 6 illustrates a method 600 in accordance with various embodiments in a schematic flow diagram.

(79) The method 600 may include, in 601: generating a vacuum in a region in which solid particles are arranged, wherein an organic material (e.g. an organic connector material) is furthermore arranged in the region, which material spatially separates at least some of the solid particles from one another.

(80) The method 600 may furthermore include, in 603: introducing electrons into the solid particles in such a way that an electrostatic charging of the solid particles that is brought about by said electrons separates said solid particles from one another and accelerates them out of the region.

(81) By way of example, the solid particles may include and/or be formed from an inorganic material and additional solid particles including or formed from the organic material may be arranged in the region. In general, the chemical composition of the solid particles and of the additional solid particles may differ from one another. By way of example, the additional solid particles may include a greater proportion by mass of organic material than the solid particles.

(82) The chemical composition may result for example from the material type of the solid particles. By way of example, the additional solid particles may include an organic material type and the solid particles may include at least one of the following (e.g. inorganic) material types: metallic, ceramic, semiconducting, glassy and/or mineral.

(83) Alternatively or additionally, the solid particles may include an inorganic material and/or the organic material may at least partly envelop at least some of the solid particles. By way of example, the solid particles may be mixed and/or smeared with the organic material. By way of example, the organic material may be viscous.

(84) The method 600 may optionally include: coating a substrate with the solid particles and/or coating the solid particles with a coating material.

(85) The method 600 may optionally include: transporting the substrate in or through the vacuum.

(86) The method 600 may optionally include: transporting and/or collecting the coated solid particles into an additional container.

(87) FIG. 7 illustrates a method 700 in accordance with various embodiments in a schematic flow diagram.

(88) The method 700 may include, in 701: generating a vacuum in a region in which solid particles of a first (e.g. inorganic) material type and of a second (e.g. organic) material type are arranged. The solid particles of the first type may include a greater proportion by mass of organic material than the solid particles of the second type.

(89) The method 700 may furthermore include, in 703: introducing electrons into the solid particles in such a way that an electrostatic charging of the solid particles that is brought about by said electrons separates said solid particles from one another and accelerates them out of the region. Illustratively, the method 700 may include, in 703: emitting solid particles out of the region by electrons being introduced into the solid particles.

(90) The method 700 may optionally include: coating a substrate with the solid particles and/or coating the solid particles with a coating material.

(91) The method 700 may optionally include: transporting the substrate in or through the vacuum.

(92) The method 700 may optionally include: transporting and/or collecting the coated solid particles into an additional container.

(93) FIG. 8 illustrates a method 800 in accordance with various embodiments in a schematic flow diagram.

(94) The method 800 may furthermore include, in 803: generating a vacuum in a region in which solid particles are arranged, at least some solid particles of which include different materials, at least one material of which is organic.

(95) The method 800 may furthermore include, in 803: introducing electrons into the solid particles in such a way that an electrostatic charging of the solid particles that is brought about by said electrons separates said solid particles from one another and accelerates them out of the region. Illustratively, the method 800 may include, in 803: emitting solid particles out of the region by electrons being introduced into the solid particles.

(96) By way of example, the solid particles may include a material composite (also referred to as composite solid particles) including an inorganic part (e.g. particulate core, e.g. the inorganic solid particles) and the organic material surrounding the latter. Alternatively or additionally, additional solid particles including or formed from the organic material may be mixed in. In general, the solid particles may include a plurality of portions which differ in their chemical composition. By way of example, the additional solid particles may include a greater proportion by mass of organic material than the solid particles.

(97) The method 800 may optionally include: coating a substrate with the solid particles and/or coating the solid particles with a coating material.

(98) The method 800 may optionally include: transporting the substrate in or through the vacuum.

(99) The method 800 may optionally include: transporting and/or collecting the coated solid particles into an additional container.