WAFER INSPECTION METHOD

Abstract

A wafer inspection method whereby inspection accuracy and operation efficiency is improved. A method for performing electrical inspection by bringing, at one time, a plurality of probes into contact with a plurality of pads in chips on a wafer. A chuck step S1 for heating the wafer to an inspection temperature; a first position recognition step S2 for recognizing all the positions of the pads of the chips; a second position recognition step S3 for re-recognizing, before performing the electrical inspection, the position of the pads for the purpose of recognizing the positional shifts of the pads due to thermal expansion when the wafer chuck is heated; and a correction step S4 for correcting contact positions with respect to the probes, the contact positions being corrected on the basis of pad positions, which have been re-recognized in the second position recognition step S3 on the basis of the pad positions recognized in the first position recognition step S2, and which have been updated.

Claims

1. A wafer inspection method which simultaneously brings a plurality of probes disposed on a probe card into contact with a plurality of pads being on chips on a wafer to perform an electrical inspection, comprising: a chuck step of holding the wafer with a wafer chuck and heating the wafer to an inspection temperature; a first position recognition step of recognizing all the positions of the pads on the basis of pad information of one arbitrary chip being in the wafer; a second position recognition step of re-recognizing the positions of the pads to recognize positional shifts of the pads occurring due to thermal expansion caused by heat of the wafer chuck before electrical inspection is performed; and a correction step of updating position information of the pads recognized in the second position recognition step on the basis of the positions of the pads in the first position recognition step to correct contact positions with respect to the probes.

2. The wafer inspection method according to claim 1, wherein the second position recognition step recognizes some of the pads in the chip.

3. The wafer inspection method according to claim 1; wherein the second position recognition step recognizes all the chips in the chip.

4. The wafer inspection method according to claim 1, wherein the correction step corrects positional shifts from the pads of some of the chips caused by thermal expansion.

5. The wafer inspection method according to claim 1, wherein detection of the positions and shapes of the pads performed in the first position recognition step and the second position recognition step is performed on the basis of information such as pad shapes, pad surface patterns, pad materials being in the arbitrary chip registered in an arithmetic device in advance.

6. A wafer inspection method using probes disposed on a probe card contacting pads on chips on a wafer for performing an electrical inspection, comprising the steps of: holding the wafer with a wafer chuck; heating the wafer to begin approaching a predetermined temperature; recognizing a first position of the pads on the chips on the wafer prior to reaching the predetermined temperature; re-recognizing a second position of at least some of the pads on the chips on the wafer after reaching the predetermined temperature and thermal distortion has stopped; calculating updated position information of the pads based on the first position of the pads and the second position of at least some of the pads due to the thermal distortion; and adjusting the position of the probes relative to the pads based on the updated position information of the pads to obtain a desired contact location of the probes on the pads; whereby position recognition of the pads is capable of being started without waiting for the wafer to reach the predetermined temperature and thermal stability improving operation efficiency.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0025] FIG. 1 is a diagram showing a basic configuration of a wafer inspection device which brings probes of a probe card into contact with pads on a wafer to perform electrical inspection.

[0026] FIG. 2 is a perspective view showing an example of a wafer.

[0027] FIG. 3 is a diagram for explaining an example of pads disposed on a chip and an example of inspection.

[0028] FIG. 4 is a flow chart for explaining an example of an inspection procedure of a wafer according to the present invention.

[0029] FIG. 5 is a graph for explaining elapsed time and X-, Y-, and Z-direction displacements of microscope optical axes caused by a change in temperature.

[0030] FIG. 6 is a diagram for explaining an example of pads disposed on a conventional chip and an example of inspection.

[0031] FIG. 7 is a diagram showing an example of types of pads.

[0032] FIGS. 8A and 8B are diagrams for explaining applications of pad information, and showing cases in which center positions of needle-standing regions are set as different positions, respectively.

DESCRIPTION OF EMBODIMENTS

[0033] In order to achieve an object to provide a wafer inspection method which makes it possible to improve inspection accuracy and operation accuracy, the present invention provides a wafer inspection method which simultaneously brings a plurality of probes disposed on a probe card into contact with a plurality of pads being on chips on a wafer to perform an electrical inspection, includes: a chuck step of holding the wafer with a wafer chuck and heating the wafer to an inspection temperature; a first position recognition step of recognizing all the positions of the pads on the basis of pad information of one arbitrary chip being in the wafer; a second position recognition step of re-recognizing the positions of the pads to recognize positional shifts of the pads occurring due to thermal expansion caused by heat of the wafer chuck; and a correction step of updating position information of the pads recognized in the second position recognition step on the basis of the positions of the pads in the first position recognition step to correct contact positions with respect to the probes.

[0034] A preferred embodiment of wafer inspection method according the present invention will be described below in detail with reference to the accompanying drawings.

Embodiment

[0035] FIG. 1 is a diagram showing a basic configuration of a wafer inspection device which brings pads on a wafer into contact with probes on a probe card to perform electrical inspection for a chip. As showing in the drawing, a wafer inspection device 10 includes, a base 11, a moving base 12 disposed on the base 11, a Y-axis moving unit 13, an X-axis moving unit 14, a Z-axis moving unit 15, a Z-axis moving table 16, a 9 rotating unit 17, a stage 18, a probe positioning camera 19, support posts 20 and 21, a head stage 22, a wafer alignment camera 23 disposed on a support post (not shown), a card holder 24 disposed on a head stage 22, a probe card 25 mounted on the card holder 24, and a control unit 27 controlling the wafer inspection device 10 as a whole.

[0036] FIG. 2 shows an example of a wafer W used in the wafer inspection device 10, and a plurality of chips 40 are disposed on the wafer W. As shown in FIG. 3, a plurality of pads 41 serving as electrodes are disposed on each of the chips 40. The shapes and arrangements of the pads 41 change depending on wafer types.

[0037] In FIG. 1, the control unit 27 is to control the wafer inspection device 10 as a whole according to a predetermined procedure, and is, for example, a computer.

[0038] The probe card 25 includes a probe 26 of a cantilever type, a spring pin type, a vertical needle type, or a crown pin type disposed thereon. The moving base 12, the Y-axis moving unit 13, the X-axis moving unit 14, the Z-axis moving unit 15, the Z-axis moving table 16, and the 0 rotating unit 17 constitute a moving/rotating mechanism moving the stage 18 in the three axis directions and rotating the stage 18 around the Z axis. The operations are driven by a stage moving control unit 33 controlled by the control unit 27.

[0039] The probe card 25 has the probes 26 arranged to correspond to the arrangement of the pads 41 of the chip 40 to be inspected, and is replaced depending on the types of the chips 40 to be inspected.

[0040] In the stage 18, a heater/coolant path 28 to set the stage 18 at a high temperature or a low temperature is disposed, and a temperature control unit 29 controlled by the control unit 27 adjusts an electric power supplied to the heater and the temperature of a coolant circulated in the coolant path. In this manner, the temperature of the stage 18 can be adjusted to a desired temperature ranging from a high temperature to a low temperature, and, depending on the temperature, the wafer W held on the stage 18 can be inspected at a desired temperature.

[0041] The tester 30 includes a tester main body 31 and a contact ring 32 disposed on the tester main body 31. A terminal (not shown) coupled to each of the probes 26 is disposed on the probe card 25, and the contact ring 32 has a spring probe disposed to be in contact with the terminal. The tester main body 31 is held by a support mechanism (not shown) with respect to the wafer inspection device 10.

[0042] When the chip 40 on the wafer W is to be inspected, the Z-axis moving table 16 is moved to located the probe positioning camera 19 at a position below the probe 26, and the probe positioning camera 19 detects a distal end position of the probe 26. The detection and correction/adjustment of the distal end position of the probe 26 must be performed each time the probe card 25 is replaced and the wafer type is changed.

[0043] When the wafer type is changed, on the basis of pad position information in which the positions of the pads 41 of the wafer type are registered in advance, contact positions between the probes 26 of the probe card 25 and the pads 41 are calculated. Thus, the positions of the pads 41 of the wafer type are detected in advance by the wafer alignment camera 23, and the positions are calculated as pad position information.

[0044] FIG. 4 is a flow chart for explaining a procedure of registering the pads 41 in units of types of the wafer W to register pad position information. When the pad position information is to be registered, the control unit 27 controls the X-axis moving unit 14 to dispose the stage 18 holding the wafer W to a position on the lower side of the wafer alignment camera 23 indicated by a dotted line in FIG. 1 and increases the temperature of the stage 18 to an inspection temperature (for example, −55° C. to 200° C.) (step S1: chuck step).

[0045] Subsequently, on the lower side of the wafer alignment camera 23, the stage 18 holding the wafer W is moved from a reference position in X and Y directions with respect to the wafer alignment camera 23. At the same time, an operator manually registers the positions of the pads 41 displayed on a monitor (not shown) of the wafer alignment camera 23 and sequentially records the registered positions in the control unit 27. This operation is performed to all or some of the pads 41 of one chip 40 (step S2: first position recognition step). A direction in which the recognition progresses is, for example, an X direction or a Y direction in an arbitrary area of the chip, the four sides of the chip, a direction of zigzag scanning for the entire chip, or the like, and may be arbitrary.

[0046] As the pads 41, for example, pads having various forms as shown in FIG. 7 are supposed. More specifically, as shown in FIG. 7, a pad having a cross-shape is registered as information 1, a hexagonal pad is registered as information 2, an elliptic pad is registered as information 3, and the form information is registered in the control unit 27 in advance. On the basis of the information 1 to information 3 in FIG. 7, the pieces of information are collated with the pads 41 on an image displayed by the microscope 23 to recognize all the pads 41.

[0047] Subsequently, the chip 40 recognized in the first position recognition step 1, for example, the detected chip 40 is subjected to the second recognition inspection, and an inspection result is recorded in the control unit 27 as in the first recognition inspection (step S3: second position recognition step). When the recognition is performed in the second position recognition step S3, only the pads 41 at specific positions indicated by reference numerals 41a, 41b, 41c, and 41d in FIG. 3 in the chip 40 may be extracted and recognized. In this manner, an operation time can be shortened, and operation efficiency can be improved.

[0048] The control unit 27 determines the positions of the pads 41 recognized in the first position recognition step S2 and the positions of the pads 41 recognized in the second position recognition step S3, corrects influences caused by thermal expansion, and registers the positions as pad position information. More specifically, differences between the positions of the pads 41 recognized in the first position recognition step S2 and the positions of the pads 41 recognized in the second position recognition step S3 are changes of the housing, the lenses, and the like of the wafer alignment camera 23 caused by thermal expansion. The probes 26 are brought into contact with the pads 41 by using the pad position information to exclude an influence of thermal deformation, and the probes 26 are brought into contact with the center positions of the pads 41 to make it possible to accurately perform the inspection.

[0049] Thus, in the method according to the present invention, even though the first position recognition is performed in a situation in which a thermal change progresses, by the second position recognition of the pads 41 performed in a state in which the thermal change is stable, the positions of the pads 41 caused by an influence of thermal expansion can be updated. For this reason, in inspection of the next wafer W, the pads 41 can be brought into contact with the probes while contact positions therebetween are corrected. In this manner, the probes 26 are accurately brought into contact with the centers of the pads 41 to make it possible to accurately perform inspection. In the first position recognition step S2, even though position recognition is started before the temperature of the stage 18 reaches an inspection temperature, positions obtained after an influence of heat is received are recognized in the second position recognition step S3, and amounts of correction can be easily recognized on the basis of the differences between the positions obtained in the first position recognition step S2 and the second position recognition step S3. For this reason, the operation need not be waited until the temperature of the stage 18 reaches the inspection temperature, and operation efficiency can be expected to be improved.

[0050] In addition to the information 1 to information 3 shown in FIG. 7 described in the embodiment, for example, pieces of information shown in FIGS. 8A and 8B can be registered. As shown in FIG. 8A, when a needle-standing region 71a is in the same region in the pad 70, a contact position between the needle-standing region 71a and the probe is a needle-standing center position 72a. When information of another region is registered as the needle-standing region 71b in the pad 70, a contact position between the needle-standing region 71b and the probe is a needle-standing center position 72b. Thus, with respect to the region of the pad 70, the needle-standing region and the bonding region can be discriminated from each other, and the probe can be prevented from being brought into contact with an unintended position in a pad region.

[0051] Various modifications of the present invention can be effected without departing from the spirit and scope of the invention, and the present invention includes the modifications, as a matter of course.

INDUSTRIAL APPLICABILITY

[0052] The present invention used when inspection of a chip on a wafer is performed has been described. However, the present invention can also be applied to a case except for the case in which a chip on a wafer is inspected.

REFERENCE SIGNS LIST

[0053] 10 . . . wafer inspection device [0054] 11 . . . base [0055] 12 . . . moving base [0056] 13 . . . Y-axis moving unit [0057] 14 . . . X-axis moving unit [0058] 15 . . . X-axis moving unit [0059] 16 . . . Z-axis moving table [0060] 17 . . . θ rotating unit [0061] 18 . . . stage [0062] 19 . . . probe positioning camera [0063] 20, 21 . . . support post [0064] 22 . . . head stage [0065] 23 . . . wafer alignment camera [0066] 24 . . . card holder [0067] 25 . . . probe card [0068] 26 . . . probe [0069] 27 . . . control unit [0070] 28 . . . heater/coolant path [0071] 30 . . . tester [0072] 31 . . . tester main body [0073] 32 . . . contact ring [0074] 33 . . . stage moving control unit [0075] 40 . . . chip [0076] W . . . wafer