Modular x-ray detector

Abstract

There is provided a detector module (1) for a modular x-ray detector, wherein the detector module (1) includes multiple x-ray detector substrates (10) and associated anti-scatter collimators (20). Each x-ray detector substrate (10) has a number of detector diodes, and each x-ray detector substrate has an associated anti-scatter collimator (20). Each x-ray detector substrate (10) has an integrated circuit (30) for collecting x-ray signals from the diodes attached to the x-ray detector substrate at the bottom of the x-ray detector substrate assuming the top is where the x-rays enter, and the associated anti-scatter collimator (20) is placed above the integrated circuit (30).

Claims

1-20. (canceled)

21. A detector module for a modular x-ray detector, wherein the detector module comprises multiple x-ray detector substrates and associated anti-scatter collimators, wherein each x-ray detector substrate has a number of detector diodes, and each x-ray detector substrate has an associated anti-scatter collimator, wherein each x-ray detector substrate has an integrated circuit for collecting x-ray signals from the diodes attached to the x-ray detector substrate at the bottom of the x-ray detector substrate assuming the top is where the x-rays enter, and the associated anti-scatter collimator is placed above the integrated circuit.

22. The detector module of claim 21, wherein the integrated circuits are Application Specific Integrated Circuits, ASICs.

23. The detector module of claim 22, wherein the ASIC is extending over the edge of the x-ray detector substrate so that part of the ASIC is outside of the silicon detector substrate to enable connection of power and data transfer to the ASIC without having to route this on the silicon detector substrate.

24. The detector module of claim 22, wherein signals are routed from the individual diodes to inputs of the ASIC.

25. The detector module of claim 22, wherein power lines and data transfer lines are wire-bonded to power and data transfer pads at the ASIC outside the substrate, or a redistribution layer on the substrate is used to connect to power, data transfer pads and to input signal pads and redistribute the input signals from the x-ray detector substrate to the ASIC.

26. The detector module of claim 22, wherein a heat conductor is attached to the ASIC as a means for cooling.

27. The detector module of claim 21, wherein the anti-scatter collimators are anti-scatter foils.

28. The detector module of claim 27, wherein the anti-scatter foils are positioned between the x-ray detector substrates.

29. The detector module of claim 27, wherein the anti-scatter foils are made of a heavy material such as Tungsten.

30. The detector module of claim 21, wherein the integrated circuits are Application Specific Integrated Circuits, ASICs, and the anti-scatter collimators are Tungsten foils and the ASICs are placed on the x-ray detector substrate under the Tungsten foils to minimize so-called dead area in the detector and the ASICs will be protected from direct radiation.

31. The detector module of claim 21, wherein a tapered geometry in which, for each x-ray detector substrate, the x-ray detector substrate and the associated anti-scatter collimator are pointing back to the source is provided by means of a spacer placed at the silicon detector substrate or at the anti-scatter collimator.

32. The detector module of claim 21, wherein a number of x-ray detector substrates are tiled with respect to each other to form a detector module.

33. The detector module of claim 21, wherein each x-ray detector substrate and corresponding integrated circuit is formed as a sensor multi-chip module, MCM, assembly, and a multitude of sensor MCM assemblies are connected into the detector module.

34. The detector module of claim 33, wherein the detector module is sub-divided into a number of detector tiles, where each detector tile includes a number of sensor MCM assemblies.

35. The detector module of claim 34, wherein each detector tile includes a circuit for demultiplexing commands from the corresponding detector module to the detector tile to reduce the number of connections between the detector tile and the detector module.

36. The detector module of claim 35, wherein the commands are control commands directed to the sensor MCM assemblies.

37. The detector module of claim 34, wherein the detector module comprises a number of data storage circuits and data processing circuits, wherein each detector tile is managed by a data processing circuit.

38. The detector module of claim 37, wherein the detector module includes a control and communication circuit for distributing control commands for the sensor MCM assemblies and controlling the readout of stored scanning data from the data storage circuits.

39. The detector module of claim 21, wherein the x-ray detector substrates are Silicon detector substrates.

40. A modular x-ray detector having a number of detector modules of claim 21.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0015] FIG. 1 is a schematic diagram illustrating an example of an x-ray detector module and a corresponding modular detector assembly.

[0016] FIG. 2 is a schematic diagram illustrating an example of a detector module for a modular x-ray detector.

[0017] FIG. 3 is a schematic diagram illustrating a close-up of the example module shown in FIG. 2.

[0018] FIG. 4 is a schematic diagram illustrating an example of how to get a tapered geometry where anti-scatter collimators and detector substrate are pointing back to the source to provide an overall curved detector geometry.

[0019] FIG. 5 is a schematic diagram illustrating an example of how the ASIC can be flip chipped to the silicon detector substrate where input signals are routed from the individual diodes to the ASIC inputs.

[0020] FIG. 6 is a schematic diagram illustrating an example of a view from the side showing that there is space for wire-bonds, passive components and cabling below the detector substrate.

[0021] FIG. 7 is a schematic diagram illustrating an example of an architecture for electronic readout of data and for distributing control commands to detector modules.

DETAILED DESCRIPTION

[0022] An illustrative, non-limiting example of the present invention is illustrated in FIG. 1 where an x-ray detector module and a corresponding modular detector assembly 100 is displayed where modules can be tiled to achieve any area of the full detector assembly as long as boundary conditions of maximum power and data transfer rates can be handled.

[0023] FIG. 2 is a schematic diagram illustrating an example of a detector module for a modular x-ray detector. In this example, the detector module 1 comprises multiple x-ray detector substrates 10 and associated anti-scatter collimators 20.

[0024] Each x-ray detector substrate 10 has a number of detector diodes, and each x-ray detector substrate 10 has an associated anti-scatter collimator 20. Further, each x-ray detector substrate 10 has an integrated circuit 30 for collecting x-ray signals from the diodes attached to the x-ray detector substrate at the bottom of the x-ray detector substrate 10 assuming the top is where the x-rays enter, and the associated anti-scatter collimator 20 is placed above the integrated circuit 30.

[0025] This type of detector module enables an efficient way of building a modular x-ray detector. Embodiments of the modular x-ray detector have several structural advantages, as will be appreciated from the examples described herein.

[0026] In a second aspect of the proposed technology, there is thus provided a modular x-ray detector 100 comprising a number of detector modules 1 of the first aspect.

[0027] The detector module may be embodied in many different variations.

[0028] By way of example, the integrated circuits may be Application Specific Integrated Circuits, ASICs.

[0029] For example, the ASIC may be extending over the edge of the x-ray detector substrate so that part of the ASIC is outside of the silicon detector substrate to enable connection of power and data transfer to the ASIC without having to route this on the silicon detector substrate.

[0030] The signals may for example be routed from the individual diodes to inputs of the ASIC.

[0031] Optionally, power lines and data transfer lines are wire-bonded to power and data transfer pads at the ASIC outside the substrate, or a redistribution layer on the substrate is used to connect to power, data transfer pads and to input signal pads and redistribute the input signals from the x-ray detector substrate to the ASIC.

[0032] As a complement, a heat conductor may be attached to the ASIC as a means for cooling.

[0033] By way of example, the anti-scatter collimators may be anti-scatter foils or plates.

[0034] For example, anti-scatter foils may positioned between the x-ray detector substrates.

[0035] The anti-scatter foils may be made of a heavy material such as Tungsten.

[0036] In a particular example, the integrated circuits are Application Specific Integrated Circuits, ASICs, and the anti-scatter collimators are Tungsten foils and the ASICs are placed on the x-ray detector substrate under the Tungsten foils to minimize so-called dead area in the detector and the ASICs will be protected from direct radiation.

[0037] Preferably, a tapered geometry in which, for each x-ray detector substrate, the x-ray detector substrate and the associated anti-scatter collimator are pointing back to the source may be provided for by means of a spacer placed at the silicon detector substrate or at the anti-scatter collimator.

[0038] Normally, a number of x-ray detector substrates are tiled with respect to each other to form a detector module.

[0039] As an example, each x-ray detector substrate and corresponding integrated circuit may be formed as a sensor multi-chip module, MCM, assembly, and a multitude of sensor MCM assemblies may then be connected into the detector module.

[0040] For example, the detector module may be sub-divided into a number of detector tiles, where each detector tile includes a number of sensor MCM assemblies, for example as illustrated in FIG. 7.

[0041] In a particular example, each detector tile includes a circuit for demultiplexing commands from the corresponding detector module to the detector tile to reduce the number of connections between the detector tile and the detector module, for example as illustrated in FIG. 7.

[0042] Typically, the commands are control commands directed to the sensor MCM assemblies.

[0043] The detector module may comprise a number of data storage circuits and data processing circuits, wherein each detector tile is managed by a data processing circuit.

[0044] For example, the detector module may include a control and communication circuit for distributing control commands for the sensor MCM assemblies and controlling the readout of stored scanning data from the data storage circuits.

[0045] In a particular example, the x-ray detector substrates are Silicon detector substrates.

[0046] For a better understanding, the proposed technology will now be described with reference to non-limiting illustrative examples.

[0047] In order to avoid any dead area the integrated circuit (ASICs) collecting the x-ray signals from the diodes has been attached to the x-ray detector diode substrate at the bottom side assuming top side is where the x-rays enter. The anti-scatter collimator is e.g. made up of Tungsten foils in between each Silicon detector substrate. In order to minimize so called dead area in the detector (area which is not functioning as a detector such is the mechanical support, the Tungsten foils, air gaps etc.) the ASICs for collecting the x-ray signals from the diodes are placed under the Tungsten foils. This also means the ASICSs will be protected from direct radiation. In order not to be significantly thicker than the Tungsten foils the ASICs are thinned down to 50-100 um.

[0048] In a particular example, the ASIC is flip chipped to the Silicon detector substrate and each diode is connected through a trace to a dedicated ASIC input. Moreover the ASIC is sticking out over the edge of the silicon detector substrate. This gives space for larger components like capacitors that has to be situated close to the ASIC to optimize reliability and noise performance.

[0049] This means that thick traces for power, which would make the silicon substrate more expensive to produce, is not required. The power connections can be provided for by other means to the ASIC. For example power lines could be wire-bonded to supply pads at the ASIC.

[0050] Another solution would be to use a redistribution layer that would connect to power, data transfer pads and to input signal pads and redistribute the signals from the ASIC to the Silicon detector substrate.

[0051] Behind the Silicon detector substrate there will be space for electronic components such as capacitances that should be positioned close to the electronic. It is also possible to put an x-ray absorber in a heavy material such as Tungsten or Molybdenum after the Silicon to avoid that any x-rays transmitted through the silicon is penetrating further into the assembly. It is also possible to put radiation-protected material around the integrated circuit to minimize any radiation damage.

[0052] As a means for cooling a heat conductor, preferably with matching heat expansion co-efficient to Silicon, can be attached to the ASIC and the heat produced by the ASIC power can be transferred to a place where it can easily be taken care of by standard air or liquid cooling means.

[0053] FIG. 1 is a schematic diagram illustrating an example of an x-ray detector module and a corresponding modular detector assembly. FIG. 1 shows an example of a module and how such modules could build up a corresponding modular detector assembly having a full detector area of desired size. Note that the modules are pointing back to the x-ray source.

[0054] FIG. 2 is a schematic diagram illustrating an example of a detector module for a modular x-ray detector. FIG. 2 thus displays an example of a module design. Starting from the top, the anti-scatter foils made of a heavy material like W is displayed, the foils are typically significantly thinner than the silicon detector substrate which is the active detector volume consisting of diodes. The x-ray detector substrate is positioned in-between the foils. The x-ray detector substrate may for example be in the order of 0.5 mm thick. Both foils and x-ray detector substrate is pointing back to the x-ray source to avoid parallax errors and shadowing from the anti-scatter foils. At the bottom the ASICs are indicated, they are typically as thin as the W foils and positioned behind those foils (looking from above)

[0055] FIG. 3 is a close-up of FIG. 2 showing the anti-scatter foils, the silicon detector substrate and the ASICs.

[0056] FIG. 4 shows an example of how to get a tapered geometry when Tungsten and Silicon detector substrate are pointing back to the source by placing a spacer as for example a stud bond at the silicon detector substrate or at the anti-scatter grid.

[0057] In order for all Tungsten foils and Silicon detectors to precisely point back to the source a spacer between each element may be used. Due to this spacer the whole detector will be curved. FIG. 4 shows an example of how to achieve a tapered geometry by placing a spacer of for example a stud bump at the silicon detector substrate or at the Tungsten foil

[0058] FIG. 5 displays an example of how the ASIC can be flip chipped to the silicon detector substrate where input signals are routed from the individual diodes to the ASIC inputs. Part of the ASIC is outside of the silicon detector substrate to enable connection of power and data transfer to the ASIC without having to route this on the silicon detector substrate.

[0059] FIG. 6 is a view from the side showing that there is space for wire-bonds, passive components and cabling behind the silicon detector substrate. Heat conductor is not indicated in the image but can be attached to ASIC.

[0060] FIG. 7 is a schematic diagram illustrating an example of the architecture for electronic readout of data.

[0061] A significant challenge is to read out the data for a multitude of x-ray detector modules.

[0062] An example of a possible architecture solution is shown in FIG. 7. In this example a multitude of sensor MCM (Multi-Chip Module) assemblies are connected into one detector module. In this context, a sensor MCM assembly means silicon substrate detector and ASIC assembly.

[0063] For example, each detector module may be managed by a small FPGA (Field Programmable Gate Array) or similar circuit that handles clock distribution, loading of configuration data and distribution of commands to the sensor MCMs.

[0064] By way of example, a full detector can contain several 10:th of thousands ASICs thus connecting and setting up/programming all ASICs in a detector is a particular challenge.

[0065] Each detector module may be based on the sensor MCMs in steps, for example by arranging sensor MCMs on detector tiles and then building a detector module based on a number of detector tiles. In other words, each detector module may include a number of detector tiles, where each detector tile includes a number of sensor MCM assemblies.

[0066] In order to physically fit all connections and meet bandwidth demands a scheme illustrated in FIG. 7 can be used.

[0067] Each tile includes a small FPGA for demultiplexing of low information content signals such as clock and/or commands from the module to the tile. As indicated in FIG. 7 this can for example reduce the number of connections between tile and module from 42+21 to 3+21.

[0068] Local memories (3*DDR in FIG. 7) distributed in the modules stores/buffers data to relax bandwidth demands on downstream connections. All these memories are read out at a lower rate when acquisition is finished. This arrangement can reduce the number of connections from the module to the motherboard, in the example in FIG. 7 the reduction is from 72 (3*24) to 8 connections.

[0069] Local memories and processors/FPGAs are preferably used to handle setup of the circuits, in order to parallelize the task. A single source configuring 10:ths of thousands of ASICs is too slow. A preferred way might be to broadcast common information parts and send specific information separately. Calibration may be handled locally on the module level, including calculation, storage, loading and so forth.

[0070] By way of example, the detector mother board has the control of the complete system, and can be regarded as an overall control system and link to external systems.

[0071] In a particular example, three detector tiles are put together into a detector module. Each detector tile is managed by a processing circuit with associated memory/data storage, e.g. a data storage FPGA or similar circuit. This FPGA/circuit stores all scanning data from one sensor MCM assembly locally and sends control commands intended for the sensor MCM assembly. A control and communication FPGA or similar circuit may also be placed in the detector module. At power up, this unit manages configuration of other FPGAs/circuits in the detector module, using configuration data stored in a local FLASH. When the system is up and running, it distributes the control commands for the sensor MCM assemblies and controls the readout of stored scanning data from the three processing circuits with associated memory/data storage, e.g. data storage FPGAs. The data is sent to the detector mother board.

[0072] By way of example, commands may be broadcast to all detector modules for synchronous execution, or individually addressed for other tasks. It controls the readout of the scanning data from the detector modules, downloading of calibration data to the sensor MCM, etc.

[0073] From the detector mother board the data can be further transmitted to one or more external computers for post-processing and/or image reconstruction.

[0074] The embodiments described above are merely given as examples, and it should be understood that the proposed technology is not limited thereto. It will be understood by those skilled in the art that various modifications, combinations and changes may be made to the embodiments without departing from the present scope as defined by the appended claims. By way of example, it will be appreciated that the arrangements described herein can be implemented, combined and re-arranged in a variety of ways. In particular, different part solutions in the different embodiments can be combined in other configurations, where technically possible.

REFERENCES

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