Protective Cover for an Acoustic Wave Device and Fabrication Method Thereof

Abstract

A protective cover for an acoustic wave device and a fabrication method thereof, for protecting an acoustic wave device having a resonant area on a surface of a substrate during a packaging operation so as to avoid molding compound flowing onto the resonant area of the acoustic wave device, wherein at least one electrical device is provided on the surface of the substrate and the at least one electrical device includes a temperature sensor. The acoustic wave device protection structure comprising: a metal covering layer, having a concave surface and a bottom rim, the bottom rim connected to the acoustic wave device and forming at least one opening between the bottom rim and the acoustic wave device, and the concave surface covering over the resonant area to form a cavity between the concave surface and the resonant area.

Claims

1. An acoustic wave device protection structure for protecting an acoustic wave device having a resonant area on a surface of a substrate during a packaging operation so as to avoid molding compound flowing onto the resonant area of the acoustic wave device, wherein at least one electrical device is provided on the surface of the substrate and the at least one electrical device includes a temperature sensor, the acoustic wave device protection structure comprising: a metal covering layer, having a concave surface and a bottom rim, the bottom rim connected to the acoustic wave device and forming at least one opening between the bottom rim and the acoustic wave device, and the concave surface covering over the resonant area to form a cavity between the concave surface and the resonant area.

2. The acoustic wave device protection structure according to claim 1, further comprising a protective layer formed on the metal covering layer and covering the bottom rim and the opening between the bottom rim and the acoustic wave device.

3. The acoustic wave device protection structure according to claim 2, wherein the protective layer is made of polymer.

4. The acoustic wave device protection structure according to claim 2, wherein the metal covering layer is made of a metallic material containing Cu, W, Al, or Au.

5. The acoustic wave device protection structure according to claim 1, wherein the acoustic wave device comprises a bulk acoustic wave device or a surface acoustic wave device.

6. The acoustic wave device protection structure according to claim 1, wherein the bottom rim of the metal covering layer is formed in a polygonal shape, and at least two sides of the bottom rim form openings between the bottom rim and the acoustic wave device.

7. The acoustic wave device protection structure according to claim 6, wherein the bottom rim of the metal covering layer has at least two opposite sides, and the at least two opposite sides form openings between the bottom rim and the acoustic wave device.

8. The acoustic wave device protection structure according to claim 1, wherein the temperature sensor is located inside the acoustic wave device protection structure.

9. The acoustic wave device protection structure according to claim 8, wherein the temperature sensor is a sensing capacitance variation type sensor, a sensing resistance variation type sensor or a sensing inductance variation type sensor.

10. The acoustic wave device protection structure according to claim 9, wherein the temperature sensor is an acoustic wave resonator, an interdigital transducer capacitance, a thermal sensitive inductor sensor, a thermal sensitive transistor sensor, a thermal sensitive resistance or a thermal sensitive diode sensor.

11. The acoustic wave device protection structure according to claim 1, wherein the temperature sensor is a sensing resistance variation type sensor or a sensing inductance variation type sensor.

12. The acoustic wave device protection structure according to claim 11, wherein the temperature sensor is a thermal sensitive inductor sensor, a thermal sensitive transistor sensor, a thermal sensitive resistance or a thermal sensitive diode sensor.

13. The acoustic wave device protection structure according to claim 1, wherein the temperature sensor is located outside the acoustic wave device protection structure.

14. A method for forming an acoustic wave device protection structure, for protecting an acoustic wave device having a resonant area on a surface of a substrate during a packaging operation so as to avoid molding compound flowing onto the resonant area of the acoustic wave device, wherein at least one electrical device is provided on the surface of the substrate and the at least one electrical device includes a temperature sensor, the method comprising steps of: defining a sacrificial area on the acoustic wave device; forming a sacrificial layer on the sacrificial area; covering a metal covering layer on the sacrificial layer by electroplating method, connecting a bottom rim of the metal covering layer to the acoustic wave device and forming an opening between the bottom rim of the metal covering layer and the acoustic wave device; and removing the sacrificial layer to form a cavity between the metal covering layer and the resonant area by using a chemical solution, wherein the chemical solution enters from the opening between the metal covering layer and the acoustic wave device.

15. The method for forming an acoustic wave device protection structure according to claim 14, further comprising forming a protective layer on the metal covering layer, so that the protective layer covers the opening between the bottom rim of the metal covering layer and the acoustic wave device.

16. The method for forming an acoustic wave device protection structure according to claim 15, wherein the protective layer is made of polymer.

17. The method for forming an acoustic wave device protection structure according to claim 14, wherein the metal covering layer is made of a metallic material containing Cu, W, Al, or Au.

18. The method for forming an acoustic wave device protection structure according to claim 14, wherein the acoustic wave device comprises a bulk acoustic wave device or a surface acoustic wave device.

19. The method for forming an acoustic wave device protection structure according to claim 14, wherein the sacrificial layer is made of polymer, ceramic material, or metallic material.

20. The method for forming an acoustic wave device protection structure according to claim 14, wherein the bottom rim of the metal covering layer is formed in a polygonal shape, and at least two sides of the bottom rim form openings between the bottom rim and the acoustic wave device.

21. The method for forming an acoustic wave device protection structure according to claim 20, wherein the bottom rim of the metal covering layer has at least two opposite sides, and the at least two opposite sides form openings between the bottom rim and the acoustic wave device.

22. The method for forming an acoustic wave device protection structure according to claim 14, wherein the temperature sensor is located inside the acoustic wave device protection structure.

23. The method for forming an acoustic wave device protection structure according to claim 22, wherein the temperature sensor is a sensing capacitance variation type sensor, a sensing resistance variation type sensor or a sensing inductance variation type sensor.

24. The method for forming an acoustic wave device protection structure according to claim 23, wherein the temperature sensor is an acoustic wave resonator, an interdigital transducer capacitance, a thermal sensitive inductor sensor, a thermal sensitive transistor sensor, a thermal sensitive resistance or a thermal sensitive diode sensor.

25. The method for forming an acoustic wave device protection structure according to claim 14, wherein the temperature sensor is a sensing resistance variation type sensor or a sensing inductance variation type sensor.

26. The method for forming an acoustic wave device protection structure according to claim 25, wherein the temperature sensor is a thermal sensitive inductor sensor, a thermal sensitive transistor sensor, a thermal sensitive resistance or a thermal sensitive diode sensor.

27. The method for forming an acoustic wave device protection structure according to claim 14, wherein the temperature sensor is located outside the acoustic wave device protection structure.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0026] FIG. 1 is perspective view of an embodiment of an acoustic wave device protection structure provided by the present invention.

[0027] FIG. 2A is a top view of an embodiment of an acoustic wave device protection structure provided by the present invention, and FIGS. 2B and 2C are cross-sectional views respectively along lines BB′ and CC′ shown in FIG. 2A.

[0028] FIGS. 3A and 3B are cross-sectional views of another embodiment of a method for forming a through wafer via hole in a semiconductor device provided by the present invention.

[0029] FIG. 4 is a flow chart of an embodiment of a method for forming an acoustic wave device protection structure provided by the present invention.

[0030] FIGS. 5A-5E are schematic views of another embodiment of the method for forming an acoustic wave device protection structure provided by the present invention.

[0031] FIG. 6 is a flow chart of another embodiment of the method for forming an acoustic wave device protection structure provided by the present invention.

[0032] FIG. 7A is a top view of an embodiment of an acoustic wave device protection structure provided by the present invention, in which the temperature sensor is located inside the acoustic wave device protection structure, and FIG. 7B is a cross-sectional view along line BB′ shown in FIG. 7A.

[0033] FIG. 8A is a top view of an embodiment of an acoustic wave device protection structure provided by the present invention, in which the temperature sensor is located outside the acoustic wave device protection structure, and FIG. 8B is a cross-sectional view along line BB′ shown in FIG. 8A.

DETAILED DESCRIPTIONS OF PREFERRED EMBODIMENTS

[0034] FIGS. 1A and 2A-2C show an embodiment of an acoustic wave device protection structure provided by the present invention. As shown in the figures, an acoustic wave device 100 comprises a substrate 110 and an interdigital transducer (IDT) on a surface of the substrate 110. The area on the substrate containing the IDT is defined as a resonant area 112. An acoustic wave device protection structure 200 is formed on the acoustic wave device 100 and comprises a metal covering layer 210. The metal covering layer 210 has a concave surface 212 and a bottom rim 214. The bottom rim 214 is connected to the substrate 110 of the acoustic wave device 100 and forms at least one opening 216 between the bottom rim 214 and the acoustic wave device 100. The concave surface 212 covers over the resonant area 112 to form a cavity 218 between the concave surface 212 and the resonant area 112. The formed acoustic wave device protection structure 200 is for protecting the acoustic wave device 100, so as to avoid molding compound flowing onto the resonant area 112 of the acoustic wave device 100 during a packaging operation.

[0035] In another embodiment, the acoustic wave device protection structure 200 may further comprises a protective layer 220, as shown in FIGS. 3A and 3B. The protective layer 220 is formed on the metal covering layer 210 and covers the bottom rim 214 and the opening 216 between the bottom rim 214 and the acoustic wave device 100, so as to further reduce the probability that the molding compound flowing onto the surface of the device.

[0036] Moreover, the present invention provides a method 400 for forming the acoustic wave device protection structure 200. FIG. 4 is a flow chart of an embodiment of the method 400, which comprises steps of: in step 401, defining a sacrificial area 102 on the acoustic wave device 100; in step 402, forming a sacrificial layer 120 on the sacrificial area 102; in step 403, covering a metal covering layer 210 on the sacrificial layer 120 by electroplating method, connecting a bottom rim 214 of the metal covering layer 210 to the acoustic wave device 100 and forming an opening 216 between the bottom rim 214 of the metal covering layer 210 and the acoustic wave device 100; and in step 404, removing the sacrificial layer 120 to form a cavity 218 between the metal covering layer 210 and the resonant area 112 by using a chemical solution, wherein the chemical solution enters from the opening 216 between the metal covering layer 210 and the acoustic wave device 100.

[0037] FIGS. 5A to 5E show an embodiment of an embodiment of the method 400 for forming an acoustic wave device protection structure. First, a SiN.sub.x or SiO.sub.2 layer is deposited on the substrate 110 of the acoustic wave device 100 as a device protection layer 130. Then, the sacrificial area 102 is defined on the resonant area 112 of the acoustic wave device by a mask 140 and forming the sacrificial layer 120 on the sacrificial area 102. The mask 140 is then removed and the substrate 110 is heated to make the surface of the sacrificial layer 120 in an arc shape for the subsequent bridging. A metal covering layer 210 is then electroplated on the sacrificial layer 120 to bridge the two sides of the resonant area and forms the opening 216. The size and shape of the opening 216 is controlled by the mask pattern. Finally, the chemical solution enters from the opening 216 between the metal covering layer 210 and the substrate 110 to remove the sacrificial layer 120, such that the cavity 218 is formed above the resonant area of the acoustic wave device.

[0038] In an embodiment, the sacrificial layer 120 is made preferably of polymer, ceramic material, or metallic material.

[0039] In an embodiment, the method 400 for forming an acoustic wave device protection structure 200 may further comprise a step 405. As shown in the embodiment of FIG. 6, in step 405, a protective layer 220 is formed on the metal covering layer 210, so that the protective layer 220 covers the opening 216 between the bottom rim 214 of the metal covering layer 210 and the acoustic wave device 100.

[0040] In an embodiment, after finishing the foregoing acoustic wave device protection structure, copper pillars may be formed on the electrical connection area of the device for the copper pillar reflow processes in the flip chip bonding of the device.

[0041] The acoustic wave device 100 protected by the protection structure provided by the present invention may be a bulk acoustic wave device or a surface acoustic wave device. The substrate 110 of the acoustic wave device 100 is made preferably of piezoelectric material, for example, LiTaO.sub.3, LiNbO.sub.2, quartz, piezoelectric ceramics, such as Lead zirconate titanate (PZT), and the like.

[0042] In an embodiment, the metal covering layer 210 is made preferably of a metallic material containing Cu, W, Al, or Au, in which a metallic material containing Cu is more preferred. The protective layer 220 is made preferably of polymeric materials, such as SU8 photoresist, acrylic, polymers.

[0043] The bottom rim 214 of the metal covering layer 210 may be formed in a polygonal shape, such as a rectangle or square, or a non-polygonal shape, such as a circle or oval. In an embodiment, the metal covering layer 210 has a concave surface 212 and a rectangular bottom rim 214. The rectangular bottom rim 214 has two pairs of opposite sides. One pair of opposite sides 214c and 214d are connected to the substrate 110 of the acoustic wave device, and the other pair of opposite sides 214a and 214b respectively form openings 216 between themselves and the substrate 110. A cavity is formed between the concave surface 212 and the resonant area 112, such that the metal covering layer 210 forms a protection bridge structure covering over the resonant area of the acoustic wave device. In one embodiment, the largest width of the opening 216 between the metal covering layer 210 and the substrate 110 is 10 μm, so that flowing of the molding compound onto the resonant area of the acoustic wave device can be avoided.

[0044] In one embodiment, at least one electrical device is provided on the surface of the substrate and the at least one electrical device may include a temperature sensor. In one embodiment, the temperature sensor is located inside the acoustic wave device protection structure. FIGS. 7A and 7B show an embodiment of an acoustic wave device protection structure provided by the present invention, in which a temperature sensor 160 is located inside the acoustic wave device protection structure 210. In the embodiment, there are two types of temperature sensors. For the first type of temperature sensors, temperature sensor is a sensing capacitance variation type sensor, such as an acoustic wave resonator or an interdigital transducer capacitance. When the molding compound flowing onto the acoustic wave resonator (or the interdigital transducer capacitance), it will negatively impact the performance of the acoustic wave resonator (or the interdigital transducer capacitance) such that the temperature measured by the acoustic wave resonator (or the interdigital transducer capacitance) is not accurate. For the second type of the temperature sensors, the temperature sensor is a sensing inductance variation type sensor, such as a thermal sensitive inductor sensor, or a sensing resistance variation type sensor, such as a thermal sensitive transistor sensor, a thermal sensitive resistance, or a thermal sensitive diode sensor. The second type of the temperature sensors may still work properly even if the molding compound flowing onto the second type of the temperature sensors. It will not impact the performance of the second type of the temperature sensors. In the embodiment shown in FIGS. 7A and 7B, the temperature sensor 160 is located inside the acoustic wave device protection structure 210 to prevent contacting the molding compound. Therefore, no matter the temperature sensor 160 is the first type of temperature sensors or the second type of the temperature sensors, the temperature sensor 160 still works properly and the temperature measured by the temperature sensor 160 should be accurate. In some embodiments, the temperature sensor 160 may be the first type of temperature sensors, such as an acoustic wave resonator or an interdigital transducer capacitance. In some other embodiments, the temperature sensor 160 may be the second type of temperature sensors, such as a thermal sensitive inductor sensor, a thermal sensitive transistor sensor, a thermal sensitive resistance or a thermal sensitive diode sensor. The temperature sensor 160 is very useful in some applications. The performance of an acoustic wave device (surface or bulk) is very sensitive to temperature variation. The temperature sensor 160 provided close to the acoustic wave device 100 is capable to measure the temperature near the acoustic wave device 100. The measurement of the temperature near the acoustic wave device 100 may be used as the feedback for controlling or minimizing the temperature variation of the temperature near the acoustic wave device 100.

[0045] In one embodiment, the temperature sensor is located outside the acoustic wave device protection structure. FIGS. 8A and 8B show an embodiment of an acoustic wave device protection structure provided by the present invention, in which the temperature sensor 160 is located outside the acoustic wave device protection structure 210. In the embodiment, because the temperature sensor 160 is not protected by the acoustic wave device protection structure 210, the temperature sensor 160 may not be the first type of temperature sensors, such as an acoustic wave resonator or an interdigital transducer capacitance. On the other hand, the temperature sensor 160 may be the second type of temperature sensors, such as a thermal sensitive inductor sensor, a thermal sensitive transistor sensor, a thermal sensitive resistance or a thermal sensitive diode sensor.

[0046] The present invention has the following advantages:

[0047] 1. The acoustic wave device protection structure provided by the present invention can cover the resonant area of the acoustic wave device, so as to effectively avoid molding compound flowing onto the resonant area of the acoustic wave device during a packaging operation.

[0048] 2. The acoustic wave device protection structure provided by the present invention is made of metal. The high hardness of metal can prevent collapse of the acoustic wave device protection structure, and therefore the yield of the packaging operation is improved.

[0049] 3. In the method for forming an acoustic wave device protection structure provided by the present invention, the protection structure and the opening for removing the sacrificial layer can be formed in one step rather than two steps, and therefore the fabrication process can be simplified.

[0050] 4. In the acoustic wave device protection structure provided by the present invention, the opening for removing the sacrificial layer are provided on the lateral sides of the protection structure, and the position and size of the opening can be controlled by a mask, so that the molding compound can not flow onto the resonant area of the acoustic wave device easily during a packaging operation. There is no need to cover the opening after removing the sacrificial layer, and therefore the fabrication process can be simplified.

[0051] 5. The acoustic wave device protection structure provided by the present invention can be applied in a wide variety of applications, like flip chip bonding or wire bonding packaging process.

[0052] To sum up, the protective cover for an acoustic wave device and the fabrication method thereof provided by the present invention can indeed meet its anticipated objective to avoid molding compound flowing onto the resonant area of the acoustic wave device during a packaging operation. The process of the fabrication method provided by the present invention is simple. The protective cover produced by the fabrication method is hard and does not collapse easily, and therefore the yield of the packaging operation is improved. Moreover, the protection structure provided by the present invention can be applied in a wide variety of applications, like flip chip bonding or wire bonding packaging process.

[0053] The description referred to in the drawings and stated above is only for the preferred embodiments of the present invention. Many equivalent local variations and modifications can still be made by those skilled at the field related with the present invention and do not depart from the spirit of the present invention, so they should be regarded to fall into the scope defined by the appended claims.