WIRELESS POWER TRNSFER DEVICE
20170324281 · 2017-11-09
Assignee
Inventors
Cpc classification
H02J50/70
ELECTRICITY
International classification
H02J50/70
ELECTRICITY
Abstract
The present disclosure discloses a wireless power transfer device. A power transmitting coil (or a power receiving coil) is equally divided into N equivalents by configuring a primary-side compensation capacitor (or a secondary side compensation capacitor) to comprise N sub-compensation capacitors which are connected in the power transmitting coil (or the power receiving coil) in an equally distributed manner. With the distributed capacitance connection structure, it is possible to reduce the voltage across each coil segment of the power transmitting coil (or the power receiving coil), thereby reducing the coil-to-ground common mode current of the transmitting coil and the circulating current caused by the receiving coil.
Claims
1. A wireless power transfer device, comprising a power transmitting portion; and a power receiving portion configured to receive energy transmitted from said power transmitting portion to generate a predetermined output voltage driving a load; wherein said power transmitting portion comprises: an inverter circuit configured to receive a DC voltage signal to output an AC voltage signal; a power transmitting coil configured to receiving said AC voltage signal to transmit energy to said power receiving portion; and a primary-side compensation capacitor configured to compensating inductance of said power emitting coil so that a resonant frequency of a circuit comprising said power transmitting coil and said primary-side compensation capacitor coincides with an operating frequency of said wireless power transfer device; wherein said primary-side compensation capacitor comprises N sub-compensation capacitors coupled at different positions in said power transmitting coil in a distributed manner.
2. The wireless power transfer device as claimed in claim 1, wherein said inductance of said power transmitting coil comprises leakage inductance and magnetizing inductance of said power transmitting coil.
3. The wireless power transfer device as claimed in claim 1, wherein said N sub-compensation capacitors are coupled at different positions in said power transmitting coil to divide said power transmitting coil into N coil segments.
4. The wireless power transfer device as claimed in claim 1, wherein said N sub-compensation capacitors are coupled at different positions in said power energy transmitting coil in an equally distributed manner to divide said power transmitting coil into N equivalent coil segments.
5. The wireless power transfer device as claimed in claim 4, wherein said N sub-compensation capacitors have the same capacitance.
6. The wireless power transfer device as claimed in claim 5, wherein each of said N sub-compensation capacitors and a corresponding coil segment of said power transmitting coil are configured to resonate at a frequency coinciding with said operating frequency of said wireless power transfer device.
7. A wireless power transfer device, comprising: a power transmitting portion; and a power receiving portion comprising a power receiving coil and a secondary side compensation capacitor; wherein said secondary side compensation capacitor is configured to compensate inductance of said power receiving coil so that a resonant frequency of a circuit comprising said power receiving coil and said secondary side compensation capacitor coincides with an operating frequency of said wireless power transfer device; wherein said secondary side compensation capacitor comprising N sub-compensation capacitors coupled at different positions in said power receiving coil in a distributed manner.
8. The wireless power transfer device as claimed in claim 7, wherein said inductance of said power receiving coil comprises leakage inductance and magnetizing inductance of said power receiving coil.
9. The wireless power transfer device as claimed in claim 7, wherein said N sub-compensation capacitors of said secondary side compensation capacitor are coupled at different positions in said power receiving coil in an equally distributed manner to divide said power receiving coil into N equivalent coil segments.
10. The wireless power transfer device as claimed in claim 9, wherein said N sub-compensation capacitors of said secondary side compensation capacitor have the same capacitance; and each of said N sub-compensation capacitors of said secondary side compensation capacitor and a corresponding coil segment of said power receiving coil are configured to resonate at a frequency coinciding with said operating frequency of said wireless power transfer device.
11. The wireless power transfer device as claimed in claim 7, wherein said power receiving portion further comprises a shield layer disposed between said power receiving coil and an electronic device.
12. The wireless power transfer device as claimed in claim 11, wherein said shield layer comprises a magnetic shield layer disposed between said power receiving coil and said electronic device.
13. The wireless power transfer device as claimed in claim 11, wherein said shield layer comprises a magnetic shield layer and a copper shield layer sequentially disposed between said power receiving coil and said electronic device.
14. The wireless power transfer device as claimed in claim 12, wherein said magnetic shield layer comprises a hollow area and a solid area.
15. The wireless power transfer device as claimed in claim 13, wherein said magnetic shield layer comprises a hollow area and a solid area.
16. The wireless power transfer device as claimed in claim 7, wherein said N sub-compensation capacitors are coupled with coil pins of said power receiving coil.
17. The wireless power transfer device as claimed in claim 14, wherein said N sub-compensation capacitors are coupled in said power receiving coil in a distributed manner, and said N sub-compensation capacitors are disposed in said hollow area of said magnetic shield layer.
18. The wireless power transfer device as claimed in claim 15, wherein said N sub-compensation capacitors are coupled in said power receiving coil in a distributed manner, and said N sub-compensation capacitors are disposed in said hollow area of said magnetic shield layer.
19. The wireless power transfer device as claimed in claim 14, wherein said power receiving portion further comprises a rectifying circuit and a DC-DC voltage convertor, wherein, electronic components of said rectifying circuit and said DC-DC voltage convertor are disposed in said hollow area of said magnetic shield layer; and said N sub-compensation capacitors are coupled with coil pins of said power receiving coil; wherein part of said coil pins is coupled to said electronic components.
20. The wireless power transfer device as claimed in claim 15, wherein said power receiving portion further comprises a rectifying circuit and a DC-DC voltage convertor, wherein, electronic components of said rectifying circuit and said DC-DC voltage convertor are disposed in said hollow area of said magnetic shield layer; and said N sub-compensation capacitors are coupled with coil pins of said power receiving coil; wherein part of said coil pins is coupled to said electronic components.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0026]
[0027]
[0028]
[0029]
[0030]
[0031]
[0032]
[0033]
[0034]
[0035]
DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION
[0036] Some preferable embodiments of the present disclosure will be described in conjunction with the drawings as below in details, but the present disclosure is not limited thereto.
[0037] Referring to
[0038] The power transmitting coil portion further comprises a power emitting coil and a primary-side compensation capacitor for compensating the inductance of the power emitting coil so that the resonance frequency of a circuit comprising the power transmitting coil and the primary-side compensation capacitor coincides with an operating frequency of the system. Here, the inductance of the power transmitting coil comprises leakage inductance and magnetizing inductance in the power transmitting coil structure, the inductance of the power transmitting coil is substantially a constant value, the impedance of the compensation capacitor and the inductive reactance consisting of the magnetizing inductance and leakage inductance are configured to resonate for operation. The operating frequency of the system is the operating frequency of the wireless power transfer device, denoted as ω0, the operating frequency of the wireless power transfer device is configured in advance according to the circuit structure and efficiency requirements, for example, the frequency is preferably set to 6.78 MHz.
[0039] In the present embodiment, the primary-side compensation capacitor comprises N sub-compensation capacitors which are coupled at different positions in the power transmitting coil in a distributed manner, where N is a positive integer greater than 1. As shown in
[0040] Further, as shown in
[0041]
[0042] In this way, the voltage across the coil Ls1 becomes VLs1=VLs/3. Since the sub-compensation capacitor Cs1 and the coil segment Ls1 resonate at the operating frequency, the equivalent impedance across the compensation capacitor Cs1 and the coil segment Ls1 is zero,
[0043] i.e., 1/jωCs1+jωLs1=0,
[0044] The sum of the voltage across the compensation capacitor Cs1 and the voltage across the coil Ls1 is 0 (i.e., VLs1+VCs1=0), the power through the coil can be transmitted to the maximum extent, and the transmission efficiency is high.
[0045] Similarly, the voltage across the coil Ls2 is VLs2=VLs/3. Similarly, the sub-compensation capacitor Cs2 and the coil segment Ls2 resonate at the operating frequency, and the sum of the voltage across the compensation capacitor Cs2 and the voltage across the coil Ls2 is zero. Similarly, the voltage across the coil Ls3 is VLs3=VLs/3. Similarly, the sub-compensation capacitor Cs3 and the coil segment Ls3 resonate at the operating frequency point, and the sum of the voltages across the compensation capacitor Cs3 and the voltage across the coil segment Ls3 is zero.
[0046] As can be seen from the above, compared with compensation the entire coil, by adopting a distributed compensation manner, the voltage across each piece of coil segment is reduced from original VLs to VLs/N in the distributed manner, then, according to the equation for common mode current mentioned in Background of the Invention, the coil-to-ground common mode current is also reduced to 1/N of the original value. The embodiment of the present disclosure is very suitable for the situation where the size of the transmitting coil is large. As the size of the transmitting coil is large, the common mode capacitance to the ground is large. The common mode current can be well reduced by reducing the leaping voltage in the coil by segmentally connecting the capacitors in series, which reduces EMC conduction interference.
[0047] It can be seen from the structure of the above-mentioned transmitting coil that the voltage-withstanding value of the compensation capacitor across the transmitting coil also changes from VLs to VLs/3, thus, the capacitor with smaller voltage-withstanding value can be adopted, which reduces the cost. And the decrease of the voltage across each coil segment further increases the reliability of the system.
[0048] It is to be noted that even if the parameter configuration of the distributed power transmitting coil does not adopt the above-described optimized equivalent scheme, for example, the N sub-compensation capacitors are connected at different positions in the power transmitting coil to divide the power transmitting coil into N coil segments. However, as long as it satisfies, as a whole, that the N-segment distributed inductors are connected in series: Ls1+Ls2+ . . . Lsn=Ls and N distributed capacitors are connected in series: Cs1=Cs2=Csn=NCs, the power transmitting efficiency of the system will not decrease, and the voltages across the distributed segmented coils will decrease, which reduces EMC conduction interference.
[0049]
[0050]
[0051] In the present embodiment, the secondary side compensation capacitor comprises N sub-compensation capacitors (Cd1 . . . Cdn). The N sub-compensation capacitors are coupled at different positions in the power emitting coil in a distributed manner. Further, the capacitance values of the N sub-compensation capacitors are equal to each other and the N sub-compensation capacitors of the secondary side compensation capacitor are coupled at different positions in the power receiving coil in an equally distributed manner so as to divide the power receiving coil into N equivalent coil segments (e.g., Ld1 . . . Ldn), and each of the N sub-compensation capacitors and a coil segment corresponding thereto of the power receiving coil resonate (e.g., Cd1 and Ld1 resonate), and the resonant frequency thereof coincides with the operating frequency (6.78 MHz) of the system.
[0052] Similarly, for the secondary side, using the manner of above-described segmented receiving coil, the voltage drop across each coil segment of the receiving coil can be reduced, so that the coil-to-ground common mode current is reduced and the EMC interference of the system is reduced.
[0053]
[0054] In a practical application, the shield layer comprises a magnetic shield layer 2 and a copper shield layer 3 which are sequentially disposed between the power receiving coil and the electronic device. The magnetic shield layer 2 may be a piece of magnetic sheet. The copper shield layer 3 may be a piece of copper sheet. As shown in
[0055] It will be readily understood that in applications where the requirements are not harsh, the shield layer may comprise only a magnetic shield disposed between the power receiving coil and the electronic device.
[0056] Since the magnetic shield layer 2 is disposed between the power receiving coil 1 and the copper shield layer 3 (or metal sheet of the electronic device), the dielectric constant of the magnetic shield layer 2 is much higher than that of air (ε>10ε0) and the distance between the power receiving coil 1 and the copper shield layer 3 is short, the parasitic capacitor as generated will be very large, and the circulating current between the power receiving coil 1 and the copper shield layer 3 (or metal sheet) will be very large according to the calculation equation mentioned in the background of the invention. In the present embodiment, by adopting a structure dividing the power receiving coil 1 into multiple coil segments, it can be deduced that the voltage across each coil segment of the power receiving coil 1 will be greatly reduced according to the calculation process for the above-mentioned power transmitting coil, thereby reducing the circulating current caused in the copper sheet or metal by the power receiving coil, which can effectively improve the efficiency of power transmission.
[0057]
[0058]
[0059]
[0060] It should be noted that the above embodiments can be used in combination or separately, for example, the power transmitting coil is a distributed capacitor structure, or the power receiving coil is a distributed capacitor structure, or both the power transmitting coil and the power receiving coil are distributed capacitive structures. Those skilled in the art can choose according to demand.
[0061] The wireless power transfer device according to the preferred embodiment of the present disclosure has been described in detail above, but the circuits and the beneficial effects of the disclosure should not be considered to be only limited to the above description. The disclosed embodiments and the drawings can make a better understanding of the present disclosure. Therefore, the above-disclosed embodiments and the contents of the drawings are for a better understanding of the present disclosure and the present disclosure is not limited to the scope of present disclosure. Any substitution and improvement for the embodiments of the present disclosure made by those skilled in the art shall fall into the protection scope of the present disclosure.