LED module

Abstract

Provided is an LED module which, even when CSP LED devices are arrayed adjacent to each other, emits light at a light emission color of a single LED device and is bright. An LED module includes a module substrate, first LED devices having a lateral surface which is configured of an optically transmissive face, and second LED devices having a lateral surface which is configured of a light blocking face. The first LED devices are mounted upon the module substrate adjacent to the second LED devices such that the translucent faces of the first LED devices and the light blocking faces of the second LED devices are in opposition.

Claims

1. An LED module comprising: a module substrate; a first LED device having a side face formed as an optically transmissive face; and a second LED device having a side face formed as a light blocking face, wherein said first LED device and said second LED device are arranged one adjacent to the other on said module substrate in such a manner that the optically transmissive face of said first LED device and the light blocking face of said second LED device oppose each other.

2. The LED module according to claim 1, wherein of four side faces of said second LED device, only two opposed side faces are light blocking faces.

3. The LED module according to claim 2, wherein said first LED device and said second LED device are arranged in a linear array.

4. The LED module according to claim 1, wherein all four side faces of said second LED device are light blocking faces.

5. The LED module according to claim 4, wherein a plurality of said first LED devices and a plurality of said second LED devices are respectively arranged in a staggered array.

6. The LED module according to claim 1, wherein the light blocking face of said second LED device is formed from a white reflective member.

7. The LED module according to claim 6, wherein said first LED device contains a first LED die having a first electrode disposed on a side thereof that faces said module substrate, said first LED die comprises a first semiconductor layer and a first transparent insulating substrate formed one on top of the other on said first electrode, and said first LED device is constructed by covering an upper face and side face of said first LED die with a phosphor resin, and said second LED device contains a second LED die having a second electrode disposed on a side thereof that faces said module substrate, said second LED die comprises a second semiconductor layer and a second transparent insulating substrate formed one on top of the other on said second electrode, and said second LED device is constructed by covering an upper face of said second LED die with a phosphor resin and the side face thereof with said white reflective member.

8. The LED module according to claim 7, wherein said first electrode of said first LED device and said second electrode of said second LED device are each an external connecting electrode for connecting to an electrode formed on said module substrate.

9. The LED module according to claim 8, wherein a bottom face of said first LED die contained in said first LED device is covered with said phosphor resin everywhere except where said external connecting electrode is formed.

10. The LED module according to claim 8, wherein a bottom face of said second LED die contained in said second LED device is covered with said white reflective member everywhere except where said external connecting electrode is formed.

11. The LED module according to claim 7, wherein said first LED die contained in said first LED device or said second LED die contained in said second LED device is flip-chip mounted on a submount substrate or a lead.

12. The LED module according to claim 11, wherein a side face of said submount substrate or lead is covered with said phosphor resin.

13. The LED module according to claim 7, wherein said phosphor resin used to cover the upper face of said first LED die contained in said first LED device or of said second LED die contained in said second LED device is formed in the shape of a phosphor sheet.

14. The LED module according to claim 1, wherein said first LED device and said second LED device respectively emit light of different colors.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIGS. 1(a) to 1(c) are diagrams showing the external appearance of an LED device 10 contained in an LED module 50.

(2) FIG. 2 is a cross-sectional view taken along line AA′ in FIG. 1(a).

(3) FIGS. 3(a) to 3(c) are diagrams showing the external appearance of an LED device 20 contained in the LED module 50.

(4) FIG. 4 is a cross-sectional view taken along line BB′ in FIG. 3(a).

(5) FIG. 5 is a top plan view of the LED module 50.

(6) FIG. 6 is a cross-sectional view taken along line CC′ in FIG. 5.

(7) FIGS. 7(a) to 7(c) are diagrams showing the external appearance of an LED device 30 contained in an alternative LED module 90.

(8) FIG. 8 is a cross-sectional view taken along line DD′ in FIG. 7(a).

(9) FIG. 9 is a top plan view of the LED module 90.

(10) FIG. 10 is a cross-sectional view of an LED device 30a and an LED device 30b contained in another alternative LED module 91.

(11) FIG. 11 is a cross-sectional view of an LED device 40a and an LED device 40b contained in still another alternative LED module 92.

(12) FIG. 12 is a cross-sectional view of an LED device 50a and an LED device 50b contained in a further alternative LED module 93.

(13) FIG. 13 is a cross-sectional view of an LED device 60a and an LED device 60b contained in a still further alternative LED module 94.

(14) FIG. 14 is a cross-sectional view of an LED device 100 according to a first prior art example.

(15) FIG. 15 is a cross-sectional view of an LED device 200 according to a second prior art example.

DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION

(16) Preferred embodiments of the present invention will be described in detail below with reference to the drawings. It will, however, be noted that the technical scope of the present invention is not limited by any particular embodiment described herein but extends to the inventions described in the appended claims and their equivalents. Further, throughout the drawings, the same or corresponding component elements are designated by the same reference numerals, and the description of such component elements, once given, will not be repeated thereafter. It will also be noted that the scale of the component elements is changed as necessary for illustrative purposes.

(17) FIG. 1 shows the external appearance of an LED device 10 (first LED device) contained in an LED module 50 (see FIGS. 5 and 6); more specifically, FIG. 1(a) shows a top plan view, FIG. 1(b) shows a front view, and FIG. 1(c) shows a bottom view.

(18) As shown in FIG. 1(a), when the LED device 10 is viewed from the top, a rectangular frame formed from a phosphor resin 12 and a phosphor sheet 11 enclosed therein are seen. The phosphor sheet 11 is a form of phosphor resin, but it is distinguished from the phosphor resin 12 by the position where it is attached to the LED die 16 (see FIG. 2) and by the way how it is attached or formed (the same applies hereinafter). As shown in FIG. 1(b), when the LED device 10 is viewed from the front, the phosphor resin 12 and two electrodes 15 protruding therebelow are seen. As shown in FIG. 1(c), when the LED device 10 is viewed from the bottom, the rectangular frame formed from the phosphor resin 12 is seen along with a semiconductor layer 14 enclosed therein, and the two electrodes 15 are seen inside the semiconductor layer 14.

(19) FIG. 2 is a cross-sectional view taken along line AA′ in FIG. 1(a).

(20) As shown in FIG. 2, in the LED device 10, the top of the LED die 16 is covered with the phosphor sheet 11, and the sides of the LED die 16 as well as the sides of the phosphor sheet 11 are covered with the phosphor resin 12. The LED die 16 comprises a sapphire substrate 13 (transparent insulating substrate) in addition to the semiconductor layer 14 and the two electrodes 15, and the semiconductor layer 14 and the sapphire substrate 13 are formed one on top of the other on the electrodes 15. An adhesive member 17 is interposed between the sapphire substrate 13 and the phosphor sheet 11. The phosphor sheet 11 and the phosphor resin 12 both have the function of wavelength-converting the blue light of the LED die 16 into white light. The phosphor resin 12 forms optically transmissive faces as the side faces of the LED device 10.

(21) The phosphor sheet 11 is formed by mixing fine phosphor particles into a phenyl-based silicone resin and kneading the mixture into the shape of a sheet, and has a thickness of about 100 to 300 μm. If it is desired to reduce loss due to concentration quenching, the phosphor sheet 11 is formed thicker. The phosphor resin 12 is formed by mixing fine phosphor particles into a silicone resin and by kneading and thermally curing the mixture, and has a width of about 100 μm. The adhesive member 17 is formed from a thermosetting silicone adhesive material and has a thickness of about 100 μm. Because of the provision of the frame formed from the phosphor resin 12, if the area size of the LED die 16 is 0.8 mm×0.3 mm, for example, then the area size of the LED device 10 is 1.0 mm×0.5 mm, thus making the overall size easy to handle by a surface mounter.

(22) The sapphire substrate 13 of the LED die 16 is about 80 to 120 μm in thickness. The semiconductor layer 14 formed on the lower surface of the sapphire substrate 13 is about 10 μm in thickness and includes a p-type semiconductor layer and an n-type semiconductor layer, and the junction between them serves as the light-emitting layer. An interlayer insulating film and a protective film are formed on the underside of the semiconductor layer 14, and the electrodes 15 are formed on the protective film. The two electrodes 15 are an anode and a cathode, respectively, and are connected to the p-type semiconductor layer and the n-type semiconductor layer via interconnections formed on the interlayer insulating film. The electrodes 15 are external connecting electrodes for connecting to a mother substrate on which other electronic components such as resistors and capacitors are mounted or to a module substrate 51 (see FIGS. 5 and 6), and each electrode has a gold layer on its surface for soldering. The electrodes 15 are each chosen to have a thickness of several hundreds of nanometers to several tens of micrometers.

(23) FIG. 3 shows the external appearance of an LED device 20 (second LED device) contained in the LED module 50 (see FIGS. 5 and 6); more specifically, FIG. 3(a) shows a top plan view, FIG. 3(b) shows a front view, and FIG. 3(c) shows a bottom view.

(24) As shown in FIG. 3(a), when the LED device 20 is viewed from the top, a rectangular frame formed from a white reflective member 23 and a phosphor sheet 21 enclosed therein are seen. As shown in FIG. 3(b), when the LED device 20 is viewed from the front, the white reflective member 23 and two electrodes 15 protruding therebelow are seen. As shown in FIG. 3(c), when the LED device 20 is viewed from the bottom, the rectangular frame formed from the white reflective member 23 is seen along with a semiconductor layer 14 enclosed therein, and the two electrodes 15 are seen inside the semiconductor layer 14.

(25) FIG. 4 is a cross-sectional view taken along line BB′ in FIG. 3(a).

(26) As shown in FIG. 4, in the LED device 20, the top of the LED die 16 is covered with the phosphor sheet 21, and the sides of the LED die 16 as well as the sides of the phosphor sheet 21 are covered with the white reflective member 23. The LED die 16 is the same as the LED die 16 contained in the LED device 10 shown in FIGS. 1 and 2, and an adhesive member 27 is interposed between the sapphire substrate 13 and the phosphor sheet 21. The phosphor sheet 21 has the function of wavelength-converting the blue light of the LED die 16 into white light. The white reflective member 23 forms light blocking faces as the side faces of the LED device 20.

(27) The phosphor sheet 21 and the adhesive member 27 are respectively the same as the phosphor sheet 11 and the adhesive member 17 used in the LED device 10 shown in FIGS. 1 and 2. The white reflective member 23 is formed by mixing fine reflective particles such as titanium oxide or alumina into a silicone resin and by kneading and thermally curing the mixture, and has a width of about 100 μm. Since the frame formed from the white reflective member 23 is provided around the LED die 16, the LED device 20 is identical in area size and height to the LED device 10.

(28) FIG. 5 is a top plan view of the LED module 50.

(29) As shown in FIG. 5, in the LED module 50, a plurality of LED devices 10 and 20 are mounted on the module substrate 51. The LED devices 10 are arranged alternately with the LED devices 20 on the module substrate 51. More specifically, on the module substrate 51, no two LED devices 10 are adjacent to each other, nor are any two LED devices 20 adjacent to each other. In other words, any one LED device 10 is located adjacent to at least one of the LED devices 20. The LED devices 10 and the LED devices 20 are respectively arranged in a staggered array, forming as a whole a checkerboard pattern. Other electronic components such as resistors and capacitors may be mounted on the module substrate 51.

(30) FIG. 6 is a cross-sectional view taken along CC′ in FIG. 5.

(31) As shown in FIG. 6, the LED devices 10 and 20 mounted on the module substrate 51 emit light rays 61 and 62 upward. The LED devices 10, whose side faces are covered with the optically transmissive phosphor resin 12 (see FIGS. 1 and 2), emit light rays 63 and 64 in lateral directions as well. The light ray 63 is reflected by the light blocking face of the white reflective member 23 (see FIGS. 3 and 4) formed on the side of the adjacent LED device 20, and is thus directed upward. On the other hand, the light ray 64 is first reflected downward by the light blocking face of the white reflective member 23 of the adjacent LED device 20 and is then reflected upward by the surface of the module substrate 51. There are other light rays emitted from the side faces of the LED devices 10 and reflected upward by the surface of the module substrate 51, but these light rays are not shown here.

(32) As described above, when the LED devices 10 and 20 are driven to emit light, the LED devices 10 emit light not only in the upward direction but also in lateral directions, while on the other hand, the LED devices 20 emit light only in the upward direction. Since the LED devices 10 alternate with the LED devices 20, most of the light emitted in lateral directions from each LED device 10 is reflected by the surface of the module substrate 51 or by the white reflective member 23 of its adjacent LED device 20, and a portion of the reflected light is directed directly upward, while the remainder of the light travels upward while undergoing further reflection.

(33) Since the light emitted from any LED device 10 or 20 does not enter its adjacent LED device 20 or 10, the shift (variation) in color emission does not occur which would occur if the phosphors in the phosphor resin were excited by extraneous light. Each LED device 10, whose side faces are optically transmissive due to the absence of a light blocking member or reflective member, has a good light emission efficiency, and the LED module 50 containing such LED devices 10 emits bright light. The side faces of each LED device 20, which are capable of both blocking and reflecting light, efficiently reflect some of the light emitted from the side faces of its adjacent LED devices 10 and thus contribute to increasing the brightness of the LED module 50.

(34) In the LED module 50, the LED devices 10 (first LED devices) and the LED devices 20 (second LED devices) are arranged in a repeating fashion in the order of LED device 10, LED device 20, LED device 10, LED device 20, and so on in vertical and horizontal directions in FIG. 5. However, to prevent the shift (variation) in color emission, each LED device 10 need only be flanked by an LED device 20. Therefore, the LED devices may be arranged on the module substrate 11, for example, in a repeating fashion in the order of LED device 10, LED device 20, LED device 20, LED device 10, LED device 20, LED device 20, LED device 10, and so on in vertical and horizontal directions in FIG. 5.

(35) The phosphor sheets 11 and 21 can be chosen to have the characteristics that match the light emission characteristics (peak wavelengths, etc.) of the respective LED dies 16. Since the phosphor sheets 11 and 21 are inexpensive and are easy to store, and their wavelength conversion characteristics can be adjusted easily, a plurality of phosphor sheets 11 and 21 having different wavelength conversion characteristics may be prepared in advance, and phosphor sheets having wavelength conversion characteristics that match the light emission characteristics (peak wavelengths, etc.) of the respective LED dies 16 may be selected as desired. This makes it easy to manage the color of emission of the LED module 50.

(36) In the LED module 50, the phosphor sheets 11 and 21 have been described as being formed from the same material, but the phosphors contained in the phosphor sheet 11 may be made different from the phosphors contained in the phosphor sheet 21 so that the LED device 10 and the LED device 20 respectively emit light of different colors. For example, the LED device 10 may be tuned to emit daylight having a higher color temperature, and the LED device 20 may be tuned to emit warm light having a lower color temperature. In this case, it is more preferable if the LED module 50 has an operation mode in which both the LED devices 10 and 20 are lighted simultaneously and an operation mode in which only the LED device 20 is lighted. In this way, when both of the LED devices 10 and 20 are lighted simultaneously, active and bright lighting having a wide illumination range can be obtained, and when only the device 20 is lighted, lighting having a narrow illumination range and giving a warm impression can be obtained.

(37) In the LED device 20, the white reflective member 23 directly covers the side face of the LED die 16. As a result, the light emitted from the side face of the LED die 16 is reflected by the white reflective member 23 back into the LED die 16. Since, in this case, the loss due to reabsorption in the semiconductor layer 14 occurs in addition to the loss due to the reflection, the light emission efficiency of the LED device 20 may drop. To address this, it is preferable to add an optically transmissive layer between the white reflective member 23 and the side face of the LED die 16, and it is more preferable to provide a sloping face on the inner wall of the white reflective member 23. By such provisions, if a portion of the light emitted from the side face of the LED die 16 is reflected back into the LED die 16, most of the light reflected back is transmitted upward through the optically transmissive layer, thus serving to prevent the light emission efficiency of the LED device 20 from dropping.

(38) In the LED device 20, the frame formed from the white reflective member 23 is provided around the outer periphery to form light blocking faces on the side faces. However, the light blocking faces for preventing the color shift from occurring due to the intrusion of extraneous light are not limited to those formed from the white reflective member. For example, the light blocking faces may be formed, for example, from a black resin or a metal. However, when the light blocking faces are formed using the white reflective member, an improvement in light emission efficiency and a reduction in size can be achieved efficiently, compared with the case where the light blocking faces are formed using a black resin or a, metal.

(39) FIG. 7 is a diagram showing the external appearance of an LED device 30 contained in an alternative LED module 90 (see FIG. 9); more specifically, FIG. 7(a) shows a top plan view, FIG. 7(b) shows a front view, and FIG. 7(c) shows a bottom view.

(40) In the LED module 50 shown in FIGS. 1 to 6, the LED devices 10 and 20 have been arranged in a two-dimensional array (see FIG. 5). By contrast, the LED module 90 is a linear module in which the LED devices 10 and 30 are arranged in a linear array (see FIG. 9). Similarly to the LED module 50, the LED module 90 contains the LED device 10 (first LED device, see FIGS. 1 and 2) and the LED device 30 (second LED device, see FIGS. 3 and 4). The LED device 10 is identical to the LED device 10 contained in the LED module 50, and therefore will not be further described herein.

(41) As shown in FIG. 7(a), when the LED device 30 is viewed from the top, there are seen a rectangular phosphor sheet 31 and a phosphor resin 32 sandwiching the phosphor sheet 31 from the top and bottom thereof, and there is also seen a white reflective member 33 sandwiching the phosphor sheet 31 and the phosphor resin 32 from the left and right sides thereof. As shown in FIG. 7(b), when the LED device 30 is viewed from the front, the phosphor resin 32 and the white reflective member 33 sandwiching the phosphor resin 32 from the left and right sides thereof are seen along with two electrodes 15 protruding therebelow. As shown in FIG. 7(c), when the LED device 30 is viewed from the bottom, a semiconductor layer 14 and the two electrodes 15 located inside it are seen along with the phosphor resin 32 sandwiching the semiconductor layer 14 from the top and bottom thereof and the white reflective member 33 sandwiching the semiconductor layer 14 and the phosphor resin 32 from the left and right sides thereof.

(42) FIG. 8 is a cross-sectional view taken along DD′ in FIG. 7(a).

(43) As shown in FIG. 8, in the LED device 30, the top of the LED die 16 is covered with the phosphor sheet 31, and the sides of the LED die 16 as well as the sides of the phosphor sheet 31 are covered with the white reflective member 33. The sapphire substrate 13 of the LED die 16 and the phosphor sheet 31 are bonded together by an adhesive member 37.

(44) The LED die 16, phosphor sheet 31, and adhesive member 37 contained in the LED device 30 are the same as the LED die 16, phosphor sheet 11 or 21, and adhesive member 17 or 27 contained in the LED device 10 or 20 shown in FIG. 2 or 4, respectively. The phosphor resin 32 and the white reflective member 33 are respectively formed from the same materials as the phosphor resin 12 and the white reflective member 23 shown in FIGS. 2 and 4. Similarly to the LED device 20 (see FIGS. 3 and 4), the LED device 30 is provided on its sides with light blocking faces formed from the white reflective resin 33. However, in the LED device 30, the light blocking faces are formed only on the two opposed sides.

(45) FIG. 9 is a top plan view of the LED module 90.

(46) In the LED module 90, a plurality of LED devices 10 and 30 are mounted on a module substrate 95. The LED devices 10 and the LED devices 30 are arranged alternately with each another in a linear array on the module substrate 95. As a result, on the module substrate 95, no two LED devices 10 are adjacent to each other, nor are any two LED devices 30 adjacent to each other. The cross-sectional view taken along EE′ in FIG. 9 is the same as the cross-sectional view shown in FIG. 6 (only the reference numeral is changed from 20 to 30).

(47) The distribution of light in the lengthwise direction in FIG. 9 is the same as that shown in FIG. 6. In FIG. 9; however, not only the LED device 10 but the LED device 30 also emits light in the widthwise direction. The distribution of light in the widthwise direction of the LED module 90 becomes wide because the light emitted in the widthwise direction in FIG. 9 is only blocked by the module substrate 95. In the LED module 90, it would be possible to use the LED device 20 shown in FIGS. 3 and 4 instead of the LED device 30. The LED device 20 is simpler in structure and therefore easier to fabricate than the LED device 30, but the amount of emitted light decreases compared with the LED device 30. Accordingly, a linear LED module using the LED device 20 would become darker than the LED module 90.

(48) FIG. 10 is a cross-sectional view of an LED device 30a (first LED device) and an LED device 30b (second LED device) contained in another alternative LED module 91. The top plan view of the LED module 91 is substantially the same as that of the LED module 50 and is therefore not shown here.

(49) In the LED devices 10, 20, and 30 used in the LED modules 50 and 90, the upper face of the LED die 16 is covered with the phosphor sheet 11, 21, 31. However, the member that covers the upper face of the LED die 16 need not necessarily be limited to the phosphor sheet, but any other suitable member capable of wavelength-converting the emitted light can be used. Therefore, in the LED device 30a used in the LED module 91, the upper and side faces of the LED die 16 are covered with a phosphor resin 31a. In the LED device 30b used in the LED module 91, on the other hand, the upper face of the LED die 16 is covered with a phosphor resin 31b, and the side faces of the LED die 16 including the phosphor resin 31b are covered with a white reflective member 33b. In the LED device 30a, the side faces formed from the phosphor resin 31a are optically transmissive faces, and in the LED device 30b, the side faces formed from the white reflective member 33b are light blocking faces. In the case of the LED device 30a, the fabrication process can be simplified because the phosphor resin 31a is formed to cover both the top and side faces simultaneously.

(50) FIG. 11 is a cross-sectional view of an LED device 40a (first LED device) and an LED device 40b (second LED device) contained in still another alternative LED module 92. The top plan view of the LED module 92 is substantially the same as that of the LED module 50 and is therefore not shown here.

(51) In the LED devices 10, 20, and 30 used in the LED modules 50 and 90, the bottom face of the LED die 16 is exposed. However, the bottom face of the LED die 16 need not necessarily be exposed. Therefore, in the first LED device 40a and the second LED device 40b used in the LED module 92, the bottom face is covered with a phosphor resin 41 or a white reflective member 43, respectively. That is, the LED devices 40a and 40b differ from the LED devices 10 and 20 (see FIGS. 2 and 4) in that the bottom face of the LED die 16 contained in the LED device 40a and the bottom face of the LED die 16 contained in the LED device 40b are covered with the phosphor resin 41 and the white reflective member 43, respectively, everywhere except where the electrodes 15 are formed. When the bottom face of each LED die 16 is covered with the phosphor resin 41 or the white reflective member 43 everywhere except where the electrodes 15 are formed, the lower surface of the semiconductor layer 14 of the LED die 16 can be protected from contamination. Further, in the case of the LED device 40a, the light emission efficiency can be improved by wavelength-converting any light leaking from the bottom face of the LED die 16 to the module substrate side. On the other hand, in the case of the LED device 40b, unwanted light leakage can be eliminated by blocking light. In the LED device 40a, the side faces formed from the phosphor resin 41 are optically transmissive faces, and in the LED device 40b, the side faces formed from the white reflective member 43 are light blocking faces.

(52) FIG. 12 is a cross-sectional view of an LED device 50a (first LED device) and an LED device 50b (second LED device) contained in a further alternative LED module 93. The top plan view of the LED module 93 is substantially the same as that of the LED module 50 and is therefore not shown here.

(53) In the LED devices 10, 20, and 30 used in the LED modules 50 and 90, the electrodes 15 formed on the bottom face of the LED die 16 are external connecting electrodes for connecting to the module substrate 51, 91 (see FIGS. 6 and 9). However, the electrodes on the bottom face of the LED die 16 need not necessarily be formed as external connecting electrodes. Therefore, the LED devices 50a and 50b used in the LED module 93 employ a submount substrate 52. That is, the LED devices 50a and 50b differ from the LED devices 10 and 20 (see FIGS. 2 and 4) in that the LED devices 50a and 50b are each flip-chip mounted on the submount substrate 52, as shown in FIG. 12. The submount substrate 52 is provided on its upper surface with internal connecting electrodes 54 and on its lower surface with external connecting electrodes 55, and the internal connecting electrodes 54 are connected to the external connecting electrodes 55 via plated-through holes not shown. By considering thermal conduction, etc., the base material of the submount substrate is selected, for example, from among a resin, a metal whose surface is treated for insulation in order to prevent short circuiting between interconnect elements such as the electrodes 54 and 55 and plated-through holes, and a ceramic material. In the LED devices 50a and 50b, a phosphor resin 51a and a white reflective member 53 are each formed so as to also lie on the bottom face of the LED die 16. In the LED device 50a, the side faces formed from the phosphor resin 51a are optically transmissive faces, and in the LED device 50b, the side faces formed from the white reflective member 53 are light blocking faces.

(54) In the LED devices 50a and 50b, although the area size of the LED device is substantially identical with the area size of the LED die 16, not only is the LED die 16 protected from external contamination but any light leaking from the bottom of the LED die 16 is wavelength-converted or blocked, as in the LED devices 40a and 40b shown in FIG. 11. Furthermore, in the LED devices 50a and 50b, any external stress acting toward the LED die 16 can be alleviated.

(55) FIG. 13 is a cross-sectional view of an LED device 60a (first LED device) and an LED device 60b (second LED device) contained in a still further alternative LED module 94. The top plan view of the LED module 94 is substantially the same as that of the LED module 50 and is therefore not shown here.

(56) In the LED devices 50a and 50b shown in FIG. 12, the LED die is flip-chip mounted on the submount substrate 52, but the LED die 16 may be mounted on leads. Therefore, in the LED devices 60a and 60b used in the LED module 94, the LED die 16 is mounted on leads 65. That is, the LED devices 50a and 50b differ from the LED devices 50a and 50b (see FIG. 12) in that, in each of the LED devices 60a and 60b, the LED die 16 is flip-chip mounted on the leads 65, as shown in FIG. 13. Each lead 65 is a metal such as Cu whose surface is plated with tin or the like, and the upper face serves as an internal connecting electrode, while the lower face serves as an external connecting electrode. In the LED devices 60a and 60b used in the LED module 94, the bottom face of the LED die 16 and the side faces of the leads 65 are covered with a phosphor resin 61a or a white reflective member 63a. In the LED device 60a, the side faces formed from the phosphor resin 61a are optically transmissive faces, and in the LED device 60b, the side faces formed from the white reflective member 63a are light blocking faces.

(57) In the LED devices 60a and 60b, as in the LED devices 40a and 40b shown in FIG. 11, not only is the LED die 16 protected from external contamination but any light leaking from the bottom of the LED die 16 is wavelength-converted or blocked. Furthermore, in the LED devices 60a and 60b, any external stress acting toward the LED die 16 can be alleviated.

(58) The LED devices 50a and 50b and the LED devices 60a and 60b shown in FIGS. 12 and 13, respectively, have each been described as being flip-chip mounted on the submount substrate 52 or the leads 65, respectively. However, as is well know in the construction of LED devices, each LED die may be mounted on a submount substrate or leads by die bonding, and the electrodes of the LED die may be connected to the electrodes on the substrate or to the leads by wires. However, flip-chip mounting, which does not require wires for mounting, is advantageous for reducing the overall size and eliminates the need for production equipment for wire bonding.

(59) The LED modules 50 and 90 described above have each been constructed by mounting two kinds of LED devices, the first LED device (LED device 10) and the second LED device (LED device 20 or 30), one adjacent to the other on the module substrate 51, 91 (see FIGS. 5 and 9). Alternatively, only the same kind of LED devices may be mounted on the module substrate in close proximity to one another; in this case also, the arrangement can be made so that light emitted from one LED will not enter adjacent LEDs. For example, based on the LED device 20 shown in FIG. 3(a), an LED device 20′ (not shown) is constructed by forming one pair of adjoining side faces (23a and 23b) as light blocking faces and the other pair of adjoining side faces (23c and 23d) as optically transmissive faces. Then, a plurality of such LED devices 20′ are arranged horizontally and vertically on the module substrate so that the light blocking faces of each LED device face the optically transmissive faces of other LED devices. In this case, the LED module can be constructed using only one kind of LED device, but since the pairs of adjoining side faces of the LED device 20′ have to be formed as light blocking faces and optically transmissive faces, respectively, the complexity of the fabrication process increases.

(60) Similarly, based on the LED device 30 shown in FIG. 7(a), an LED device 30′ is constructed by forming only one side face (33a) as a light blocking face and the other side face (33b) as an optically transmissive face. By just arranging a plurality of such LED devices 30′ in a horizontal direction, a linear module free from any shift in chromaticity can be constructed using only the LED devices 30′.

DESCRIPTION OF THE REFERENCE NUMERALS

(61) 10, 30a, 40a, 50a, 60a . . . FIRST LED DEVICE 11, 21, 31 . . . PHOSPHOR SHEET 12, 32, 31a, 31b, 41, 51a, 61a . . . PHOSPHOR RESIN 13 . . . SAPPHIRE SUBSTRATE (TRANSPARENT INSULATING SUBSTRATE) 14 . . . SEMICONDUCTOR LAYER 15, 54, 55 . . . ELECTRODE 16 . . . LED DIE 17, 27, 37 . . . ADHESIVE MEMBER 20, 30, 30b, 40b, 50b, 60b . . . SECOND LED DEVICE 23, 33, 33b, 43, 53, 63a . . . WHITE REFLECTIVE MEMBER 50, 90, 91, 92, 93, 94 . . . LED MODULE 51, 59 . . . MODULE SUBSTRATE 52 . . . SUBMOUNT SUBSTRATE 61 TO 64 . . . LIGHT RAYS 65 . . . LEAD