Insert-moulded lead frame and method for the production thereof
09808973 ยท 2017-11-07
Assignee
Inventors
Cpc classification
B29K2705/00
PERFORMING OPERATIONS; TRANSPORTING
H01L2924/0002
ELECTRICITY
H01L2924/0002
ELECTRICITY
H01L2924/00
ELECTRICITY
H01L21/4821
ELECTRICITY
B29L2031/3493
PERFORMING OPERATIONS; TRANSPORTING
B29C45/14639
PERFORMING OPERATIONS; TRANSPORTING
International classification
H01L21/48
ELECTRICITY
B29C45/14
PERFORMING OPERATIONS; TRANSPORTING
Abstract
An encapsulated lead frame has a core element with multiple elongated conductor tracks arranged next to one another. The lead frame also has first partial encapsulations formed by a first encapsulation of the core element in first sub-regions and second partial encapsulations formed by a second encapsulation of the core element in second sub-regions. The first and second partial encapsulations enclose the core element as an overall encapsulation. The first partial regions are spaced apart from one another and each of the first partial encapsulations respectively surrounds only one single conductor track. This configuration avoids gaps that may form at interfaces between a first and second partial encapsulation, may extend between two adjacent conductor tracks, and may allow conductive fluid to accumulate therein and form short-circuits between adjacent conductor tracks. The encapsulated frame is used in a transmission control device. A method for producing an encapsulated lead frame is disclosed.
Claims
1. An insert-molded lead frame, comprising: a core element with a plurality of elongate conductor tracks arranged next to one another; first partial insert-moldings formed by a first insert molding of the core element on first partial regions of the core element; second partial insert-moldings formed by a second insert molding of the core element on second partial regions of the core element; wherein the first partial insert-moldings and the second partial insert-moldings together form a complete insert-molding that completely encases the core element, wherein the first partial insert-moldings are outwardly exposed through an uppermost outer surface of the complete insert-molding, wherein adjacent first partial regions are spaced apart from one another, and wherein each of the first partial insert-moldings surrounds only one individual conductor track.
2. The insert-molded lead frame as claimed in claim 1, wherein the first partial insert-moldings are coextensive with the uppermost outer surface of the complete insert-molding.
3. A method for the production of a lead frame, comprising: forming first partial insert-moldings on first partial regions of a core element, the core element including a plurality of elongate conductor tracks arranged next to one another; forming second partial insert-moldings on second partial regions of the core element, wherein the first partial insert-moldings and the second partial insert-moldings together form a complete insert-molding that completely encases the core element, wherein adjacent first partial regions are spaced apart from one another, and each of the first partial insert-moldings surrounds only one individual conductor track, and wherein the first partial insert-moldings are formed on the first partial regions of the core element by local insert molding of a plurality of adjacent conductor tracks and subsequent interruption of a retaining insert-molding formed in such a manner in regions between adjacent conductor tracks.
4. The method as claimed in claim 3, wherein the retaining insert-molding is interrupted in regions between adjacent conductor tracks before the second partial insert-moldings are formed.
5. The method as claimed in claim 3, wherein the retaining insert-molding is interrupted in regions between adjacent conductor tracks after the second partial insert-moldings are formed.
6. The method as claimed in claim 3, wherein a stabilizing insert-molding connecting a plurality of conductor tracks of the core element is formed on end regions of the core element before the second partial insert-moldings are formed.
7. A transmission control device, comprising: an insert-molded lead frame including: a core element with a plurality of elongate conductor tracks arranged next to one another; first partial insert-moldings formed by a first insert molding of the core element on first partial regions of the core element; and second partial insert-moldings formed by a second insert molding of the core element on second partial regions of the core element, wherein the first partial insert-moldings and the second partial insert-moldings together form a complete insert-molding that completely encases the core element, and wherein adjacent first partial regions are spaced apart from one another, wherein the first partial insert-moldings are outwardly exposed through an uppermost outer surface of the complete insert-molding, and wherein each of the first partial insert-moldings surrounds only one individual conductor track.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) Embodiments of the disclosure are described below with reference to the attached drawings, wherein neither the description nor the drawings should be interpreted as restricting the disclosure.
(2)
(3)
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(5)
(6) The figures are merely schematic and are not to scale. Identical reference signs refer in the various figures to identical features or features with like effect.
DETAILED DESCRIPTION
(7) Features of a conventional lead frame and a method for the production thereof are first of all described with respect to
(8) First of all, in a first production step, conductor tracks 5 of the lead frame 1 are formed by means of punching methods, for example by punching from a metal sheet. The individual conductor tracks 5 are joined here to one another at a number of points by webs 4, and therefore it is not necessary for each individual conductor track 5 to be inserted into a corresponding die during a subsequent insert-molding operation.
(9) The conductor tracks 1 are subsequently insert-molded with a plastic in order to form first partial insert-moldings 2. Said first partial insert-moldings 2 fix the therefore connected conductor tracks 5 with respect to one another after the previously connecting webs 4 have been removed by being punched free.
(10) The conductor tracks 5 provided in such a manner and retained by first partial insert-moldings 2 are then inserted into a suitable insert-molding die in which said conductor tracks are insert molded with a second partial insert-molding 8 composed of electrically insulating plastic (
(11)
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(13) Such operations may have a disadvantageous effect in particular in regions 15 between adjacent conductor tracks 1 such that, for example, conductive reaction products may form an electrical connection between the adjacent conductor tracks 1, and therefore local short circuits may occur.
(14) Embodiments of a method according to the disclosure for the production of a lead frame according to the disclosure will now be described with reference to
(15) As illustrated in
(16) In the following method step, as illustrated in
(17) In a subsequent method step, the webs 4 are removed, for example by local punching away, as shown in
(18) Subsequently, in a second injection-molding process, the core element 3 together with the first partial insert-moldings 2 formed thereon is placed into a suitable injection-molding die and second partial insert-moldings 8, as shown in
(19) Finally, the stabilizing insert-moldings 10 can be removed, for example by punching off, as shown in
(20) In the finished, insert-molded lead frame 1 produced in such a manner, the elongate conductor tracks 5 are completely accommodated in the complete insert-molding. It is true that gaps into which fluids may penetrate may form, for example due to thermal expansion, at boundary surfaces between the first partial insert-moldings 2 and the second partial insert-moldings 8. Since, however, each of the first partial regions 2 is only in contact with an individual conductor track 5, said gaps cannot extend between adjacent conductor tracks 5 and therefore short circuits cannot be caused via conductive fluid brought about in said gaps.
(21) In the exemplary embodiments illustrated in
(22) As illustrated in
(23) Alternatively, as shown in the configuration illustrated in
(24) In the production sequence illustrated in