Device and method for baking substrate

Abstract

The present disclosure relates to a device and a method for baking a substrate. The device includes a hot plate, and a supporting member for supporting a substrate to be processed, wherein the supporting member is located between the hot plate and the substrate to be processed, and can move relative to the hot plate so as to adjust the contacting position of the supporting member with the substrate to be processed. With the device, the yield of the substrate can be increased.

Claims

1. A device for baking a substrate, including: a hot plate, and a supporting member for supporting a substrate to be processed, wherein the supporting member is located between the hot plate and the substrate to be processed, and movable relative to the hot plate so as to adjust the contacting position of the supporting member with the substrate to be processed, and wherein the supporting member includes a plurality of elongated strip bases, and on the side of each elongated strip base facing away from the hot plate there is provided with a plurality of lift pins, which are arranged at intervals and configured to support the substrate to be processed.

2. The device for baking a substrate according to claim 1, wherein the width of the elongated strip base is not greater than that of a spacer area between two adjacent rows of display areas partitioned from the substrate to be processed.

3. The device for baking a substrate according to claim 2, wherein the elongated strip base is longer than the substrate to be processed.

4. A method for baking a substrate comprising a device for baking the substrate, which includes a hot plate, and a supporting member for supporting a substrate to be processed, wherein the supporting member is located between the hot plate and the substrate to be processed, and can be moved relative to the hot plate so as to adjust the contacting position of the supporting member with the substrate to be processed, and wherein the supporting member includes a plurality of elongated strip bases, and on the side of each elongated strip base facing away from the hot plate there is provided with a plurality of lift pins, which are arranged at intervals and configured to support the substrate to be processed, the method including the following steps: placing the supporting member in a baking oven for baking the substrate to be processed, and supporting the supporting member at two ends thereof; fixing the substrate to be processed in the baking oven; moving the supporting member so that the supporting member is located within non-display areas of the substrate to be processed; and heating the substrate to be processed with the hot plate.

5. The method for baking a substrate according to claim 4, wherein the non-display areas indicate areas of the substrate to be processed except display areas.

6. The method for baking a substrate according to claim 5, wherein the non-display areas include spacer areas and/or edge areas.

7. The method for baking a substrate according to claim 4, wherein the temperature in the baking oven can be selected as from 120° C. to 240° C.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 schematically shows the structure of a device for baking a substrate according to the present disclosure.

(2) FIG. 2 schematically shows a top view of the structure of an embodiment according to FIG. 1.

(3) FIG. 3 schematically shows a top view of the structure of another embodiment according to FIG. 1.

(4) FIG. 4 schematically shows the structure of a device for baking a substrate in the prior art.

(5) FIG. 5 schematically shows a top view of the device of an embodiment according to FIG. 4.

(6) FIG. 6 schematically shows the heating condition of a glass substrate in FIG. 4.

LIST OF REFERENCE SIGNS

(7) In FIG. 1 to FIG. 3: 1—hot plate, 2—supporting member, 2.1—base, 2.2—lift pin, 3—substrate to be treated, 3.1—display area, 3.2—spacer area, and 3.3—edge area; and In FIG. 4 to FIG. 6: 1′—hot plate, 2′—lift pin, 3′—glass substrate, and 3.1′—display area.

DETAILED DESCRIPTION OF THE EMBODIMENTS

(8) The present disclosure will be further illustrated below in conjunction with the accompanying drawings and specific embodiments.

(9) FIG. 1 shows a structural schematic view of a device for baking a substrate according to the present disclosure. The device includes a hot plate 1 and a supporting member 2 for supporting a substrate 3 to be processed, wherein the supporting member 2 is located between the hot plate 1 and the substrate 3, and can be moved relative to the hot plate 1 so as to adjust the contacting positions thereof with the substrate 3.

(10) In some specific embodiments of the present disclosure, the substrate 3 to be processed can be a glass substrate, but not limited to the glass substrate in the present disclosure. The substrate 3 can include all type of substrates available for liquid crystal displays.

(11) FIG. 2 and FIG. 3 show two specific embodiments according to the present disclosure, respectively.

(12) As shown in FIG. 2, the glass substrate to be heated is divided into 12 display areas 3.1, which are distributed in four rows and two columns. The supporting member 2 includes five elongated strip-like bases 2.1 capable of moving horizontally and vertically. On the side of each elongated strip-like base 2.1 facing the hot plate 1, there are provided with a plurality of lift pins 2.2, which are arranged at intervals and configured to support the substrate 3 to be processed. In this arrangement, two elongated strip-like bases 2.1 with the lift pins 2.2 are located in edge areas 3.3 at the front and rear sides of the glass substrate, and the other three strip bases 2.1 with the lift pins 2.2 abut against spacer areas 3.2 between adjacent rows of display areas 3.1.

(13) As shown in FIG. 3, the glass substrate is divided into 6 display areas 3.1, which are distributed in three rows and two columns. The movable supporting member 2 includes four elongated strip-like bases 2.1, on each of which a plurality of lift pins 2.2 are arranged. The lift pins 2.2 abut against the edge areas 3.3 at the front and rear sides of the glass substrate, and also against the spacer areas 3.2 between adjacent rows of display areas 3.1, respectively.

(14) Preferably, the width of the elongated strip-like base 2.1 is not greater than the width of the spacer areas 3.2 between two adjacent rows of display areas 3.1 partitioned from the substrate 3 to be processed. That is to say, as shown in FIG. 2 and FIG. 3, the width of the base 2.1 is preferably smaller than the width of the spacer areas 3.2 between two adjacent rows of display areas 3.1. In FIG. 2 and FIG. 3, the term “width” indicates the dimensions measured along the vertical position shown in the drawings.

(15) Preferably, the elongated strip-like bases 2.1 are longer than the substrate 3 to be processed.

(16) In an embodiment not shown, the supporting member 2 includes a base 2.1 formed by one single plate as a whole. On the side of the base 2.1 facing the hot plate 1 there are provided with a plurality of lift pins 2.2, which are arranged at intervals and configured to support the substrate 3 to be processed.

(17) Preferably, the length and width of the base 2.1 are not smaller than those of the hot plate 1 respectively.

(18) The present disclosure further discloses a method for baking a substrate with the device for baking the substrate according to the present disclosure, including the following steps:

(19) placing the supporting member 2 in a baking oven for baking the substrate 3 to be processed, and supporting the supporting member 2 at two ends thereof by corresponding supporting mechanisms located at two sides of the baking oven;

(20) fixing the substrate 3 to be processed in the baking oven;

(21) moving the supporting member 2 so that the supporting member 2 is located within non-display areas of the substrate 3 to be processed; and

(22) heating the substrate 3 to be processed with a hot plate.

(23) The non-display areas indicate areas of the substrate 3 to be processed except the display areas 3.1. The non-display areas include spacer areas 3.2 and/or edge areas 3.3. The temperature in the baking oven can be selected as from 120° C. to 240° C.

(24) Although the present disclosure has been described in conjunction with the preferred embodiments, it could be understood that various modifications or substitutes could be made to the present disclosure without departing from the scope of the present disclosure. Particularly, as long as structural conflicts do not exist, all features in all the embodiments may be combined together, and the formed combined features are still within the scope of the present disclosure. The present disclosure is not limited to the specific embodiments disclosed in the description, but includes all technical solutions falling into the scope of the claims.