Substrate for organic electronic device

Abstract

Provided are a substrate for an organic electronic device (OED), an organic electronic system, a method of manufacturing the substrate or the system, a light source for a display, and a lighting device. The substrate for an OED may form an organic electronic system having enhanced durability by preventing penetration of a foreign material such as moisture or oxygen, and thus having excellent performance including light extraction efficiency.

Claims

1. A substrate for an organic electronic device (OED), comprising: a first polymer base layer having a refractive index with respect to light with a wavelength of 633 nm of 1.6 or more; an optical functional layer having a haze of 10 to 50% formed on the first polymer base layer; a high refractive layer including a planarization layer having a refractive index with respect to light of a wavelength of 633 nm of 1.7 or more formed on the optical functional layer and a second polymer base layer having a refractive index with respect to light with a wavelength of 633 nm of 1.6 or more and formed on the planarization layer; and a barrier layer formed on one or both surfaces of the first polymer base layer or the high refractive layer, and having a refractive index with respect to light with a wavelength of 633 nm of 1.45 or more.

2. The substrate according to claim 1, wherein the first polymer base layer satisfies Equation 1:
15 μm≦n×d≦200 μm  [Equation 1] where n is a refractive index of the first polymer base layer with respect to light with a wavelength of 633 nm, and d is a thickness of the first polymer base layer.

3. The substrate according to claim 1, wherein the first polymer base layer includes a poly(amic acid), polyimide, polyethylene naphthalate, polyether ether ketone, polycarbonate, polyethylene terephthalate, polyether sulfide, polysulfone acryl resin, polystyrene, or epoxy resin.

4. The substrate according to claim 1, wherein the barrier layer includes at least one selected from the group consisting of TiO, TiO.sub.2, Ti.sub.3O.sub.3, Al.sub.2O.sub.3, MgO, SiO, SiO.sub.2, GeO, NiO, CaO, BaO, Fe.sub.2O.sub.3, Y.sub.2O.sub.3, ZrO.sub.2, Nb.sub.2O.sub.3 and CeO.sub.2.

5. The substrate according to claim 1, wherein the optical functional layer is a light scattering layer.

6. The substrate according to claim 5, wherein the light scattering layer includes a matrix material and scattering particles having a refractive index different from that of the matrix material.

7. The substrate according to claim 5, wherein the light scattering layer has an uneven structure.

8. The substrate according to claim 1, wherein the planarization layer includes a poly(amic acid), polyimide, polysiloxane, or epoxy resin.

9. The substrate according to claim 8, wherein the planarization layer further includes particles having a refractive index with respect to light with a wavelength of 633 nm of 1.8 or more and an average particle size of 50 nm or less.

10. The substrate according to claim 1, further comprising: a carrier substrate, wherein a side of the first polymer base layer opposite to the optical functional layer is in contact with the carrier substrate.

11. A method of manufacturing a substrate for an organic electronic device (OED), comprising: forming a first polymer base layer having a refractive index with respect to light with a wavelength of 633 nm of 1.6 or more on a carrier substrate; forming an optical functional layer having a haze of 10 to 50% on the first polymer base layer; forming a high refractive layer including a planarization layer having a refractive index with respect to light of a wavelength of 633 nm of 1.7 or more on the optical functional layer and a second polymer base layer having a refractive index with respect to light with a wavelength of 633 nm of 1.6 or more and formed on the planarization layer; and forming a barrier layer having a refractive index with respect to light with a wavelength of 633 nm of 1.45 or more on one or both surfaces of the first polymer base layer or the high refractive layer.

12. The method according to claim 11, wherein the first polymer base layer is formed by laminating a polymer film or coating a coating solution including a polymer, on the carrier substrate.

13. An organic electronic system, comprising: the substrate for the organic electronic device of claim 1; a first electrode formed on the substrate; a functional organic layer formed on the first electrode; and a second electrode formed on the functional organic layer.

14. A method of manufacturing an organic electronic system, comprising: sequentially forming a first electrode, a functional organic layer, and a second electrode on the substrate for the organic electronic device manufactured by the method of claim 11.

15. A light source for a display, comprising: the organic electronic system of claim 13.

16. A lighting device, comprising: the organic electronic system of claim 13.

Description

DESCRIPTION OF DRAWINGS

(1) FIG. 1 shows a schematic diagram of an exemplary substrate for an OED;

(2) FIGS. 2 and 3 show schematic diagrams of exemplary optical functional layers; and

(3) FIGS. 4 and 5 show schematic diagrams of exemplary organic electronic system.

MODE FOR INVENTION

(4) Hereinafter, the above-described substrate will be explained in more detail with reference to Examples and Comparative Example, but the scope of the liquid crystal alignment film is not limited to the following Examples.

Example 1

(5) Manufacture of Substrate for OED

(6) A substrate for an OED and an OED (OLED) were manufactured using glass as a carrier substrate. First, a coating solution having a molecular weight (Mw) of approximately 50,000 as a coating solution including a poly(amic acid) synthesized by a known method of synthesizing a poly(amic acid) using a compound of Formula A (3,3′-sulfonyldianiline) and a compound of Formula B (3,3′,4,4′-biphenyltetracarboxylic dianhydride) was coated on the carrier substrate to have a thickness of approximately 30 μm and imidized, thereby forming a first polymer base layer having a refractive index with respect to light with a wavelength of 633 nm of approximately 1.7 to 1.8.

(7) A barrier layer was formed by depositing alternatively an Al.sub.2O.sub.3 layer having a refractive index with respect to light with a wavelength of 633 nm of approximately 1.65 to 1.7 to have a thickness of 5 nm and a TiO.sub.2 layer having a refractive index with respect to light with a wavelength of 633 nm of approximately 2.3 to have a thickness of 30 nm on the first polymer base layer through known atomic layer deposition (ALD).

(8) Subsequently, a coating solution for a light scattering layer was prepared by blending scattering particles (titanium oxide particles) having an average particle size of approximately 200 nm in a sol-gel coating layer including tetramethoxy silane as a conductive silane, and sufficiently dispersing the blend. A light scattering layer was formed to have a thickness of approximately 300 nm by coating the coating solution on the polymer base layer, and performing a sol-gel reaction at 200° C. for approximately 30 minutes. When a haze of the formed light scattering layer was evaluated using HM-150 according to JIS K 7105, the haze was measured to be approximately 30%. Afterward, as described above, a high refractive coating solution prepared by blending high refractive titanium oxide particles having an average particle size of approximately 10 nm and a refractive index of approximately 2.5 in a sol-gel coating solution including tetramethoxy silane was coated on the light scattering layer, and a sol-gel reaction was performed to thereby form a planarization layer having a refractive index with respect to light with a wavelength of 633 nm of approximately 1.8 and a thickness of approximately 300 nm.

(9) Afterward, a second polymer base layer was formed of a polyimide to have a thickness of approximately 1 μm on the planarization layer by the same method as used in the formation of the first polymer base layer, and a same barrier layer (a stacked structure of an Al2O3 layer and a TiO2 layer) as the above was formed on the second polymer base layer by the same method as used above, thereby manufacturing a substrate for an OED.

(10) ##STR00003##

(11) Manufacture of OED

(12) A hole injection electrode layer including indium tin oxide (ITO) on the second polymer base layer was formed on the second polymer base layer by a known sputtering method. Subsequently, a hole injection layer, a hole transport layer, an emitting layer, an electron transport layer, and an electron injection electrode layer were formed using known materials and methods. Afterward, the structure was encapsulated with a glass can, thereby manufacturing an organic light emitting system.

Comparative Example 1

(13) A substrate for an OED and an organic light emitting system were manufactured by the same method as described in Example 1, except that scattering particles were not used in preparation of a coating solution for a light scattering layer, and a layer having a haze measured using HM-150 according to JIS K 7105 of less than 1% was formed.

(14) Absolute quantum efficiencies and driving voltages of Example 1 and Comparative Example 1 are shown in Table 1. The evaluation of the absolute quantum efficiency in Table 1 was performed by a known method.

(15) TABLE-US-00001 TABLE 1 Driving Absolute quantum voltage (V) efficiency (%) Example 1 6.2 48.1 Comparative Example 1 6.3 29

REFERENCE NUMERALS OF DRAWINGS

(16) 1: substrate for OED

(17) 101: first polymer base layer

(18) 102: optical functional layer

(19) 103: high refractive layer

(20) 104: first barrier layer

(21) 105: second barrier layer

(22) 1021: matrix material

(23) 1022: scattering region

(24) 1023: light scattering layer having an uneven structure

(25) 401: first electrode layer

(26) 402: organic layer

(27) 403: second electrode layer

(28) 404: encapsulating structure having a can structure

(29) 501: encapsulating structure formed in a film type

(30) 502: second substrate