ELECTRICAL STORAGE SYSTEM COMPRISING A DISC-SHAPED DISCRETE ELEMENT, DISCRETE ELEMENT, METHOD FOR THE PRODUCTION THEREOF, AND USE THEREOF
20170263973 · 2017-09-14
Assignee
Inventors
- Ulrich Peuchert (Bodenheim, DE)
- Rainer Liebald (Nauheim, DE)
- Miriam KUNZE (Neustadt am Ruebenberge, DE)
- Thorsten DAMM (Nieder-Olm, DE)
- Clemens Ottermann (Hattersheim, DE)
- Nikolaus Schultz (Essenheim, DE)
Cpc classification
C03C3/087
CHEMISTRY; METALLURGY
Y02P70/50
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H01M10/0585
ELECTRICITY
Y02E60/10
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H01M10/0436
ELECTRICITY
H01M10/0525
ELECTRICITY
International classification
H01M10/0585
ELECTRICITY
C03C3/087
CHEMISTRY; METALLURGY
H01M10/0525
ELECTRICITY
Abstract
An electrical storage system is provided that has a thickness of less than 2 mm, which includes at least one sheet-type discrete element. The sheet-type discrete element exhibits high resistance against an attack of transition metals or transition metal ions, in particular titanium, wherein the sheet-type discrete element contains titanium. The invention also relates to a sheet-type discrete element for use in an electrical storage system, which exhibits high resistance to the attack of transition metals or of transition metal ions, in particular titanium.
Claims
1. A sheet-type discrete element comprising a composition, in wt %, of: SiO.sub.2 30 to 85 B.sub.2O.sub.3 3 to 20 Al.sub.2O.sub.3 0 to 15 Na.sub.2O 3 to 15 K.sub.2O 3 to 15 ZnO 0 to 12 TiO.sub.2 greater than or equal to 2 to 10, and CaO 0 to 0.1.
2. The sheet-type discrete element as claimed in claim 1, further comprising a thickness variation of not more than 25 μm based on wafer or substrate sizes in a range of >100 mm in diameter.
3. The sheet-type discrete element as claimed in claim 1, further comprising a thickness of less than 2 mm.
4. The sheet-type discrete element as claimed in claim 1, further comprising a thickness of not more than 100 μm.
5. The sheet-type discrete element as claimed in claim 1, further comprising a water vapor transmission rate (WVTR) of <10.sup.−3g/(m.sup.2.Math.d).
6. The sheet-type discrete element as claimed in claim 1, further comprising a specific electrical resistance at a temperature of 350° C. and at alternating current with a frequency of 50 Hz of greater than 1.0*10.sup.6 Ohm.Math.cm.
7. The sheet-type discrete element as claimed in claim 1, further comprising a maximum load temperature θ.sub.Max of at least 400° C.
8. The sheet-type discrete element as claimed in claim 1, further comprising a coefficient of linear thermal expansion a in a range from 2.0*10.sup.−6/K to 10*10.sup.−6/K.
9. The sheet-type discrete element as claimed in claim 1, further comprising a coefficient of linear thermal expansion a in a range from 3.0*10.sup.−6/K to 8.0*10.sup.−6/K.
10. The sheet-type discrete element as claimed in claim 1, comprising a product of maximum load temperature (θ.sub.Max) and a coefficient of linear thermal expansion (α) of 600.Math.10.sup.−6≦θ.sub.Maxα8000.Math.10.sup.−6.
11. The sheet-type discrete element as claimed in claim 1, comprising a product of maximum load temperature (θ.sub.Max) and a coefficient of linear thermal expansion (α) of 800.Math.10.sup.−6≦θ.sub.Max.Math.α5000.Math.10.sup.−6.
12. The sheet-type discrete element as claimed in claim 1, further comprising at least one surface that is inert and/or permeable to a reduced degree and/or impermeable with respect to materials coming into contact with the at least one surface.
13. The sheet-type discrete element as claimed in claim 12, wherein the at least one surface is designed as a barrier layer.
14. The sheet-type discrete element as claimed in claim 13, wherein the barrier layer is a barrier against a diffusion of metals.
15. The sheet-type discrete element as claimed in claim 13, wherein the barrier layer is a barrier against a diffusion of transition metals.
16. The sheet-type discrete element as claimed in claim 13, wherein the barrier layer is formed by doping or overdoping with at least one alkali metal and/or transition metals.
17. The sheet-type discrete element as claimed in claim 1, wherein the composition is a glass.
18. The sheet-type discrete element as claimed in claim 1, wherein the sheet-type discrete element is configured for a use elected from the group consisting of a substrate in an electrical storage system, a superstrate in an electrical storage system, and a cover in an electrical storage system.
19. A method for producing a sheet-type discrete element for use in an electrical storage system, comprising: melting a composition, in wt %, of: SiO.sub.2 30 to 85, B.sub.2O.sub.3 3 to 20, Al.sub.2O.sub.3 0 to 15, Na.sub.2O 3 to 15, K.sub.2O 3 to 15, ZnO 0 to 12, TiO.sub.2 greater than or equal to 2 to 10, and CaO 0 to 0.1; and subsequently hot shaping the composition.
20. The method as claimed in claim 19, wherein the hot shaping comprises drawing.
21. An electrical storage system, comprising: at least one sheet-type discrete element having a thickness of less than 2 mm and a composition, in wt %, of: SiO.sub.2 30 to 85, B.sub.2O.sub.3 3 to 20, Al.sub.2O.sub.3 0 to 15, Na.sub.2O 3 to 15, K.sub.2O 3 to 15, ZnO 0 to 12, TiO.sub.2 greater than or equal to 2 to 10, and CaO 0 to 0.1, wherein the at least one sheet-type discrete element exhibits high resistance against an attack of transition metals or transition metal ions, and wherein the sheet-type discrete element contains titanium.
22. The electrical storage system as claimed in claim 21, wherein the transition metals or transition metal ions comprises titanium or titanium ions.
23. The electrical storage system as claimed in claim 21, further comprising at least one surface of the at least one sheet-type discrete element is inert and/or permeable to a reduced degree and/or impermeable to materials coming into contact with the at least one surface.
24. The electrical storage system as claimed in claim 23, wherein the at least one surface is a barrier layer.
25. The electrical storage system as claimed in claim 24, wherein the barrier layer is a barrier against a diffusion of metals.
26. The electrical storage system as claimed in claim 24, wherein the barrier layer is a barrier against a diffusion of transition metals.
27. The electrical storage system as claimed in claim 24, wherein the barrier layer is formed by doping or overdoping with at least one alkali metal and/or a transition metal.
28. The electrical storage system as claimed in claim 24, wherein the barrier layer is a barrier against a diffusion of titanium and/or titanium ions.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION
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[0110] In the context of the present invention, any material which is capable of preventing or greatly reducing the attack of fluids or other corrosive materials on the electrical storage system 1 is considered as an encapsulation or sealing of the electrical storage system 1.
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LIST OF REFERENCE NUMERALS
[0112] 1 Electrical storage system
[0113] 2 Sheet-type discrete element used as a substrate
[0114] 3 Cathode collector layer
[0115] 4 Anode collector layer
[0116] 5 Cathode
[0117] 6 Electrolyte
[0118] 7 Anode
[0119] 8 Encapsulation layer
[0120] 10 Sheet-type discrete element in the form of a sheet-type shaped body