FLOOR PANEL AND METHOD FOR MANUFACTURING FLOOR PANELS
20220042322 · 2022-02-10
Inventors
Cpc classification
B32B29/00
PERFORMING OPERATIONS; TRANSPORTING
E04F15/02038
FIXED CONSTRUCTIONS
E04F2201/0153
FIXED CONSTRUCTIONS
B32B21/02
PERFORMING OPERATIONS; TRANSPORTING
E04F15/107
FIXED CONSTRUCTIONS
E04F2201/0552
FIXED CONSTRUCTIONS
B32B27/28
PERFORMING OPERATIONS; TRANSPORTING
E04F15/102
FIXED CONSTRUCTIONS
B44C5/0476
PERFORMING OPERATIONS; TRANSPORTING
E04F15/02033
FIXED CONSTRUCTIONS
International classification
E04F15/10
FIXED CONSTRUCTIONS
B32B21/02
PERFORMING OPERATIONS; TRANSPORTING
B32B27/28
PERFORMING OPERATIONS; TRANSPORTING
B32B29/00
PERFORMING OPERATIONS; TRANSPORTING
B32B3/06
PERFORMING OPERATIONS; TRANSPORTING
B44C5/04
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A method for manufacturing a floor panel with a substrate and a top layer of laminate, which floor panel, at one or more edges, is provided with a lower edge region, where the laminate extends in one piece from the actual upper surface of the substrate over the lower edge region at least up to a point. The laminate surface is situated at a level in a horizontal plane which intersects the substrate and that the substrate material, at the location of the lower edge region, has the same or a lower density than at the actual upper surface of the substrate material.
Claims
1. A method for manufacturing floor panels, wherein the floor panels have at least a substrate and a top layer including at least one material sheet, wherein the method comprises at least the following steps: providing a basic board of the material of the substrate; composing a stack which comprises at least the basic board and the at least one material sheet; pressing said stack in a heated press, wherein said at least one material sheet forms a top layer adhered onto the substrate; subdividing the pressed whole into semi-finished panels, from which said panels can be formed; finishing the semi-finished panels to form said floor panels; wherein the at least one material sheet consists of material strips situated next to each other.
2. The method for manufacturing panels according to claim 1, wherein said subdividing takes place at least at a location of the edges of adjacent material strips.
3. The method for manufacturing panels according to claim 1, wherein one or more of the at least one material sheet is a paper layer, such that said material strips are paper strips.
4. The method for manufacturing panels according to claim 1, wherein the at least one material sheet extends in the stack continuously over the substrate material of at least two of the finally envisaged panels and that the press element and/or the basic board are provided with means for concentrating tears in said at least one material sheet in the zone extending between the edges of the substrate material of the envisaged panels.
5. The method for manufacturing panels according to claim 4, wherein said means for concentrating tears in said at least one material sheet in the zone extending between the edges of the substrate material of the envisaged panels, comprises one or more of the following; a local protrusion on the upper surface of the basic board in said zone; a pair of cooperating, substantially vertical walls of the basic board, the press element, respectively, which during the step of pressing engage behind each other and punch the at least one material sheet present in between them.
6. The method for manufacturing panels according to claim 1, wherein the at least one material sheet concerns melamine resin layers.
7. The method for manufacturing panels according to claim 1, wherein the at least one material sheet concerns veneer layers.
8. The method for manufacturing panels according to claim 1, wherein the finally obtained panels have a surface which comprises at least structural portions with a depth larger than the thickness of the top layer.
9. The method for manufacturing floor panels according to claim 1, wherein the floor panels, at one or more edges, are provided with a lower edge region in the form of a bevel or other chamfer, wherein the method comprises the step of providing a basic board of the material of the substrate and of structuring the upper surface of said basic board, wherein the structure consists at least of a recess in the upper surface of the basic board at the location of said lower edge region and in that said top layer extends in one piece from the actual upper surface of the basic board up to into said recess, at least up to a point, wherein the top layer surface is situated at a level in a horizontal plane intersecting the substrate, and in that an edge of said recess forms the lower edge region.
10. The method for manufacturing floor panels according to claim 1, wherein the substrate substantially consists of an HDF board having an average density of more than 800 kilograms per cubic meter.
11. The method for manufacturing floor panels according to claim 10, wherein the HDF board forms at least an actual upper surface of the substrate.
12. The method for manufacturing floor panels according to claim 1, wherein the top layer is adhered to the substrate without any intermediate glue or resin layers.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0058] With the intention of better showing the characteristics of the invention, herein below, as an example without any limitative character, some preferred embodiments are described, with reference to the accompanying drawings, wherein:
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DETAILED DESCRIPTION OF THE INVENTION
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[0075] It is noted that for clearness' sake, the mutual thicknesses of the paper sheets and intermediate resin layers are represented only schematically. So, for example, the resin layer 27 between the lower side of the decor paper 23 and the substrate 8 in practice shall be hardly visible, and the decor paper does contact or almost contact the substrate 8. Here, in the example this namely concerns a resin layer 27 which is provided by means of the decor paper 23 and provides for the connection to the substrate 8. During the press treatment forming the DPL laminate 7, this resin substantially penetrates into the substrate material 8. Concerning the resin layer 28 between the overlay 25 and the decor paper 23, it is noted that this layer partially is provided via the overlay 25 and partially via the decor paper 23.
[0076] According to the invention, the floor panel of
[0077] At the location of the lowered edge region 28, the substrate material 8 is almost not or not compressed, such that the substrate material 8 there has the same or a lower density than at the actual upper surface 29. In this case, the laminate 7 extends up to a portion of substrate material 8 underneath the zone 33 with the peak density, namely, up to underneath the level G, where the density of the substrate material 8 corresponds to the average density.
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[0079] The level of the laminate surface 31 continuously diminishes from the actual upper surface 29 of the substrate 8 up to the lower edge region 28 and, in this case, even up the aforementioned point 32 at the edge of the floor panel 1. In dashed line 34, a less desirable situation is represented wherein this is not the case and wherein next to the lower edge region 28 an elevation is present. Such effect will occur when one wants to form the lower edge region by compressing the substrate material 8. In such case namely a portion of the substrate material 8 is pushed away towards the internal edge of the lowered edge region 28. In this manner, an elevation is formed on the surface of the substrate material 8, which then continues towards the laminate surface 31.
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[0081] The depth T over width B ratio of the lower edge region 28 is between 80 and 150 percent and in this case is approximately 137 percent. Herein, the width B is determined starting from the point 36-36A, where the laminate surface 31 starts lowering, onto the edge of the lowered edge region 28, namely, in this case to the point 32.
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[0083] the step S1 of providing a basic board 37 of the material of the substrate 8;
[0084] the step S2 of structuring the upper surface 29 of said basic board 37,
[0085] wherein this structure consists at least of a recess 38 in the surface 29 of the basic board 37 at the location of said lower edge region 28. The recesses 38 may be provided, for example, by means of a sawing and/or milling device, for example, a sawing device with a plurality of parallel positioned rotating saws, wherein each saw preferably forms one of the aforementioned recesses. Such device is not represented here. This can be in-line with the press device 39 of the following step S3, or possibly off-line;
[0086] the step S3 of composing and pressing a stack 40 which comprises at least the structured basic board 37 and one or more melamine resin layers and possibly paper layers. In this case, the stack 40 at the top comprises two paper sheets soaked in melamine resin, namely, a decor paper 23 and an overlay 25. At the bottom, the stack 40 also comprises a paper sheet soaked in resin, which finally has to serve as the balancing layer 11. In the example, both the decor paper 23 and the overlay 25 comprise a plurality of adjacently situated paper strips 23A-23B; 25A-25B, namely, in this case, one paper strip 23A-23B per adjacently situated final floor panel 1. However, it is not excluded that one paper strip per two or more of adjacently situated final floor panels 1 may be applied. The pressing is performed in a heated press device 39. During pressing, the melamine resin 9 hardens, and the resin, together with the decor paper 23 and the overlay 25, forms a laminate layer 7 adhered directly onto the substrate 8. This laminate 7 extends in one piece from the actual upper surface 29 of the basic board 37 up to into said recess 38, at least up to a point 32, wherein the laminate surface 31 is situated at a level L in a horizontal plane intersecting the basic board 37 or the final substrate 8;
[0087] the step S4 of subdividing the pressed whole 41 into panels 42, of which said floor panels 1 can be formed. In this case, this subdividing takes place at the location of the edges 43 of the adjacent paper strips 23A-23B. It can be advantageous to saw as little as possible through the pressed laminate 7 in order to limit the wear of the sawing device. Preferably, there will be no sawing through the pressed laminate 7;
[0088] the step S5 of finishing the aforementioned panels 42 to form said floor panels 1, wherein an edge 44 of said recess 38 forms the substrate material 8 at the location of the lower edge region 28.
[0089] It is clear that the method illustrated by means of
[0090] Further, it is clear that the view represented in
[0091] Preferably, the decor paper 23 and/or the overlay 25 is divided into paper strips in-line with the press device 39 and/or by means of a laser device.
[0092] Preferably, the decor paper 23 and/or the overlay 25 is subdivided only when it is already situated on the basic board 37 and possibly is oriented in accordance with the structured press element 45. In this manner, the dividing of the decor paper and/or the overlay can be performed in a very stable and repeatable manner. Possibly, the decor paper and possibly the overlay, before or after being divided, can be locally adhered to the basic board 37 in order to avoid the risk of shifting or other hindrances when providing the stack 40 in the press device 39. Such adhering can be performed, for example, by locally, for example, in the form of points, hardening the resin 9, such that at the respective places an adherence to the basic board is realized already. Such adherence preferably is performed on the material 46 of the basic board which is intended for removal prior to dividing or to forming of the coupling parts 10.
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[0098] In the example of
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[0103] It is also noted that, although the figures represent embodiments wherein both a first and a second pair of opposite edges are provided with lowered edge regions, it is also possible that only one pair of opposite edges is provided therewith. In such case this preferably concerns the long edges 4-5.
[0104] The present invention is in no way limited to the herein above-described embodiments, on the contrary may such floor panels and methods be realized without leaving the scope of the present invention.