COMPOSITIONS FOR BIPOLAR PLATES AND METHODS FOR PREPARING SAME

Abstract

The invention relates to a method for producing a composition comprising the steps of: melt-blending a fluorinated polymer, preferably a polyvinylidene fluoride polymer, with a first conductive filler so as to obtain a conductive fluorinated polymer; grinding to powder said conductive fluorinated polymer; mixing the powder of conductive fluorinated polymer with a second conductive filler. The invention also relates to a composition comprising a second conductive filler and particles of conductive fluorinated polymer, wherein the particles of conductive fluorinated polymer comprise a fluorinated polymer matrix in which a first conductive filler is dispersed The invention also relates to a method for producing a bipolar plate and to a bipolar plate.

Claims

1. A method for producing a composition comprising the steps of: melt-blending a fluorinated polymer with a first conductive filler so as to obtain a conductive fluorinated polymer; grinding to powder said conductive fluorinated polymer; mixing the powder of conductive fluorinated polymer with a second conductive filler.

2. The method according to claim 1, wherein the second conductive filler is graphite.

3. The method according to claim 1, wherein the first conductive filler is selected from the group consisting of electronically conductive polymers, carbon black, carbon nanotubes, graphene, graphite, carbon fibers and a mixture thereof.

4. The method according to claim 1, wherein the step of mixing the powder of conductive fluorinated polymer with a second conductive filler is a step of compounding the powder of conductive fluorinated polymer with the second conductive filler in an extruder.

5. The method according to claim 1, wherein the first conductive filler is present in an amount of from 0.1% to 35% by weight, based on the weight of the conductive fluorinated polymer.

6. The method according to claim 1, wherein the conductive fluorinated polymer is present in an amount of from 10% to 40%, and the second conductive filler is present in an amount of from 60% to 90%, based on the total weight of the composition.

7. The method according to claim 1, wherein the conductive fluorinated polymer is ground to a powder having a volume median diameter Dv50 ranging from 10 μm to 1 mm.

8. The method according to claim 1, wherein the fluorinated polymer has a viscosity measured by capillary rheometry at a shear rate of 100 s.sup.−1 and at 230° C. lower than 3000 Pa.Math.s.

9. A composition obtainable by the method according to claim 1.

10. A composition comprising a second conductive filler and particles of conductive fluorinated polymer, wherein the particles of conductive fluorinated polymer comprise a fluorinated polymer matrix in which a first conductive filler is dispersed.

11. The composition according to claim 10, wherein the fluorinated polymer matrix is a polyvinylidene fluoride matrix and/or the second conductive filler is graphite and/or the first conductive filler is selected from the group consisting of electronically conductive polymers, carbon black, carbon nanotubes, graphene, graphite, carbon fibers and a mixture thereof.

12. The composition according to claim 10, wherein the second conductive filler is present in an amount of from 60% to 90%, based on the total weight of the composition and/or the first conductive filler is present in an amount of 0.01% to 14%, based on the total weight of the composition.

13. The composition according to claim 10, wherein the fluorinated polymer has a viscosity measured by capillary rheometry at a shear rate of 100 s 1 and at 230° C. lower than 3000 Pa.Math.s.

14. A method for producing a bipolar plate, comprising the steps of: producing a composition according to the method of claim 1; compression-molding the composition.

15. A bipolar plate comprising the composition according to claim 10.

16. The method according to claim 1, wherein the fluorinated polymer is a polyvinylidene fluoride polymer.

17. A method for producing a bipolar plate, comprising the steps of: providing the composition of claim 9; compression-molding the composition.

18. A method for producing a bipolar plate, comprising the steps of: providing the composition of claim 10; compression-molding the composition.

19. A bipolar plate obtainable by the method of claim 14.

20. A bipolar plate comprising the composition according to claim 9.

Description

DESCRIPTION OF EMBODIMENTS

[0039] The invention will now be described in more detail without limitation in the following description.

[0040] Unless otherwise mentioned, the percentages in the present application are percentages by weight.

Composition for Bipolar Plate

[0041] In a first aspect, the invention relates to a composition suitable for making bipolar plates. The composition comprises a mixture of particles of a (preferably carbon-based) conductive filler, designated herein as the “second conductive filler” and particles of a conductive fluorinated polymer, which comprise a conductive filler, designated herein as the “first conductive filler” which is dispersed in a matrix of fluorinated polymer.

[0042] The composition may be in the form of a powder, in which case the particles of conductive fluorinated polymer are simply present in admixture with the particles of the second conductive filler.

[0043] Alternatively, the composition may be in a solid, agglomerated form, in which case the particles of the second conductive filler are bound to the particles (or domains) of conductive fluorinated polymer. When the composition is shaped into a bipolar plate, it is in such an agglomerated form.

[0044] The dispersion of the first conductive filler in the fluorinated polymer makes it possible to render the fluorinated polymer conductive. A fluorinated polymer is conductive when the resistance of a strand such polymer is lower than 10.sup.6 Ohm. Preferably, the loading of the first conductive filler is such that the percolation threshold throughout the fluorinated polymer matrix is reached.

[0045] Preferably, the second conductive filler and the first conductive filler dispersed in the fluorinated polymer are different from each other, in average size or size distribution and/or in nature.

[0046] The second conductive filler is advantageously graphite.

[0047] The Dv50 of the second conductive filler may be equal to or lower than 2500 μm, preferably equal to or lower than 1000 μm, more preferably equal to or lower than 500 μm. In some embodiments, the Dv50 of the second conductive filler is from 10 μm to 50 μm, or from 50 to 100 μm, or from 100 to 150 μm, or from 150 to 200 μm, or from 200 to 250 μm, or from 250 to 300 μm, or from 300 to 350 μm, or from 350 to 400 μm, or from 400 to 450 μm, or from 450 to 500 μm, or from 500 to 600 μm, or from 600 to 700 μm, or from 700 to 800 μm, or from 800 to 900 μm, or from 900 to 1000 μm, or from 1000 to 1100 μm, or from 1100 to 1200 μm, or from 1200 to 1300 μm, or from 1300 to 1400 μm, or from 1400 to 1500 μm, or from 1500 to 1600 μm, or from 1600 to 1700 μm, or from 1700 to 1800 μm, or from 1900 to 2000 μm, or from 2000 to 2100 μm, or from 2100 to 2200 μm, or from 2200 to 2300 μm, or from 2300 to 2400 μm, or from 2400 to 2500 μm.

[0048] The Dv50 is the particle size at the 50.sup.th percentile (in volume) of the cumulative size distribution of particles. This parameter may be determined by laser granulometry. This applies to all Dv50 recited in the present description.

[0049] The composition may for instance comprise from 60 to 90% by weight of second conductive filler, based on the total weight of the composition. In some embodiments, the composition comprises from 60 to 65% by weight, or from 65 to 70% by weight, or from 70 to 75% by weight, or from 75 to 80% by weight, or from 80 to 85% by weight, or from 85 to 90% by weight, of second conductive filler, based on the total weight of the composition.

[0050] The particles of conductive fluorinated polymer may have a Dv50 of from 0.1 μm to 1 mm, in particular of from 0.1 μm to 5 μm, or from 5 μm to 50 μm, or from 50 μm to 100 μm, or from 100 μm to 200 μm, or from 200 μm to 300 μm, or from 300 μm to 400 μm, or from 400 μm to 500 μm, or from 500 μm to 600 μm, or from 600 μm to 700 μm, or from 700 μm to 800 μm, or from 800 μm to 900 μm, or from 900 μm to 1 mm.

[0051] The first conductive filler dispersed in the fluorinated polymer may be an electronically conductive polymer. Suitable electronically conductive polymers are polyacetylene polymer, polyphenylene vinylene polymer, polythiophene polymer, polyaniline polymer, polypyrrole polymer, polyphenylene sulfide polymer or a mixture thereof. Alternatively, or in addition, the first conductive filler may comprise conductive carbon particles, for example carbon black, carbon nanotubes, graphene, graphite, carbon fibers or a combination thereof.

[0052] The first conductive filler dispersed in the matrix of fluorinated polymer may have a specific surface area measured by the BET method under nitrogen according to ASTM D3037 of from 0.1 m.sup.2/g to 2000 m.sup.2/g and preferentially from 10 m.sup.2 to 1000 m.sup.2/g. In some embodiments, the first conductive filler may have a BET surface area of from 0.1 to 1 m.sup.2/g, or from 1 to 10 m.sup.2/g, or from 10 to 50 m.sup.2/g, or from 10 to 50 m.sup.2/g, or to 50 to to 200 m.sup.2/g, or from 200 to 400 m.sup.2/g, or from 400 to 600 m.sup.2/g, or from 600 to 800 m.sup.2/g, or from 800 to 1000 m.sup.2/g, or from 1000 to 1200 m.sup.2/g, or from 1200 to 1400 m.sup.2/g, or from 1400 to 1600 m.sup.2/g, or from 1600 to 1800 m.sup.2/g, or from 1800 to 2000 m.sup.2/g.

[0053] The first conductive filler dispersed in the fluorinated polymer may be present in the composition, based on the total weight of the composition, in an amount of from 0.01% to 0.10% by weight, from 0.10 to 0.20% by weight, from 0.20 to 0.25% by weight, from 0.25 to 0.30% by weight, from 0.30 to 0.35% by weight, from 0.35 to 0.40% by weight, from 0.40 to 0.45% by weight, from 0.45 to 0.50% by weight, from 0.50 to 0.55% by weight, from 0.55 to 0.60% by weight, from 0.60 to 0.65% by weight, from 0.65 to 0.70% by weight, from 0.70 to 0.75% by weight, from 0.75 to 0.80% by weight, from 0.80 to 0.85% by weight, from 0.85 to 0.90% by weight, from 0.90 to 0.95% by weight, from 0.95 to 1% by weight, from 1 to 2% by weight, from 2 to 3% by weight, from 3 to 4% by weight, from 4 to 5% by weight, from 5 to 6% by weight, from 6 to 7% by weight, from 7 to 8% by weight, from 8 to 9% by weight, from 9 to 10% by weight, from 10 to 11% by weight, from 11 to 12% by weight, from 12 to 13% by weight, from 13 to 14% by weight.

[0054] The fluorinated polymer may comprise within its backbone at least one unit from a monomer chosen among vinyl monomers containing at least one fluorine atom, vinyl monomers comprising at least one fluoroalkyl group and vinyl monomers comprising at least one fluoroalkoxy group. As an example, this monomer can be vinyl fluoride; vinylidene fluoride; trifluoroethylene (VF3); chlorotrifluoroethylene (CTFE); 1,2-difluoroethylene; tetrafluoroethylene (TFE); hexafluoropropylene (HFP); a perfluoro(alkyl vinyl) ether such as perfluoro(methyl vinyl)ether (PMVE), perfluoro(ethyl vinyl) ether (PEVE) or perfluoro(propyl vinyl) ether (PPVE); perfluoro(1,3-dioxole); perfluoro(2,2-dimethyl-1,3-dioxole) (PDD); the product of formula CF.sub.2═CFOCF.sub.2CF(CF.sub.3)OCF.sub.2CF.sub.2X in which X is SO.sub.2F, CO.sub.2H, CH.sub.2OH, CH.sub.2OCN or CH.sub.2OPO.sub.3H; the product of formula CF.sub.2═CFOCF.sub.2CF.sub.2SO.sub.2F; the product of formula F(CF.sub.2).sub.nCH.sub.2OCF═CF.sub.2 in which n is 1, 2, 3, 4 or 5; the product of formula R.sub.1CH.sub.2OCF═CF.sub.2 in which R.sub.1 is hydrogen or F(CF.sub.2).sub.m and m is 1, 2, 3 or 4; the product of formula R.sub.2OCF═CH.sub.2 in which R.sub.2 is F(CF.sub.2).sub.p and p is 1, 2, 3 or 4; perfluorobutyl ethylene (PFBE); 3,3,3-trifluoropropene or 2-trifluoromethyl-3,3,3-trifluoro-1-propene.

[0055] The fluorinated polymer can be a homopolymer or a copolymer. It may also comprise units from non-fluorinated monomers like ethylene.

[0056] Advantageously, the fluorinated polymer is a polyvinylidene fluoride polymer.

[0057] The polyvinylidene fluoride polymer is preferably a homopolymer.

[0058] In other embodiments, the polyvinylidene fluoride polymer may be a copolymer comprising vinylidene fluoride units and units from one or more other monomers. Examples of other monomers are vinyl fluoride; trifluoroethylene; chlorotrifluoroethylene (CTFE); 1,2-difluoroethylene, tetrafluoroethylene (TFE); hexafluoropropylene (HFP); perfluoro(alkyl vinyl)ethers such as perfluoro(methyl vinyl)ether (PMVE), perfluoro(ethyl vinyl)ether (PEVE) or perfluoro(propyl vinyl)ether (PPVE); perfluoro(1,3-dioxole); perfluoro(2,2-dimethyl-1,3-dioxole) (PDD); the product of formula CF.sub.2═CFOCF.sub.2CF(CF.sub.3)OCF.sub.2CF.sub.2X in which X is SO.sub.2F, CO.sub.2H, CH.sub.2OH, CH.sub.2OCN or CH.sub.2OPO.sub.3H; the product of formula CF.sub.2═CFOCF.sub.2CF.sub.2SO.sub.2F; the product of formula F(CF.sub.2).sub.nCH.sub.2OCF═CF.sub.2 in which n is 1, 2, 3, 4 or 5; the product of formula R′CH.sub.2OCF═CF.sub.2 in which R′ is hydrogen or F(CF.sub.2).sub.z and z is 1, 2, 3 or 4; the product of formula R″OCF═CH.sub.2 in which R″ is F(CF.sub.2).sub.z and z is 1, 2, 3 or 4; perfluorobutylethylene (PFBE); 3,3,3-trifluoropropene or 2-trifluoromethyl-3,3,3-trifluoro-1-propene. Hexafluoropropylene is preferred. The polyvinylidene fluoride copolymer may also comprise units from ethylene monomer. Preferably, when the polyvinylidene fluoride polymer is a copolymer, it contains at least 50% by weight, more preferably at least 60% by weight, even more preferably at least 70% by weight, even more preferably at least 80% by weight, of vinylidene fluoride units.

[0059] The fluorinated polymer may be a mixture of two or more of the abovementioned polymers.

[0060] In the composition, the fluorinated polymer may be present in an amount of from 6.5% to 39.96% by weight, preferably from 8% to 39.6% by weight, more preferably from 8.5% to 39%, based on the total weight of the composition. In some embodiments, the fluorinated polymer may be present in an amount of from 6.5% to 10% by weight, from 10% to 15% by weight, from 15% to 20% by weight, from 20% to 25% by weight, from 25% to 30% by weight, from 30% to 35% by weight, from 35% to 39.96% by weight, based on the total weight of the composition.

[0061] The fluorinated polymer may have a viscosity measured by capillary rheometry according to ASTMD3835 at a shear rate of 100 s.sup.−1 and at 230° C. lower than 3000 Pa.Math.s and more preferably lower than 1500 Pa.Math.s. For example, the fluorinated polymer may have a viscosity measured by capillary rheometry according to ASTMD3835 at a shear rate of 100 s−1 and at 230° C. lower than 2800 Pa.Math.s, or lower than 2500 Pa.Math.s, or lower than 2000 Pa.Math.s, or lower than 1800 Pa.Math.s, or lower than 1500 Pa.Math.s, or lower than 1200 Pa.Math.s, or lower than 1000 Pa.Math.s.

Bipolar Plate

[0062] The invention also relates to a bipolar plate comprising the composition as described above, in agglomerated form. A bipolar plate is a plate that works as a partition between elementary cells in fuel cells and Redox-Flow batteries. Generally, it is in the shape of a parallelepiped having a thickness of a few millimeters (typically between 0.2 and 6 mm) and comprises on each of its faces a network of channels for the circulation of gases and fluids. Its functions are usually to supply the fuel cell with gas fuel, to discharge the reaction products and to collect the electric current produced in the cell.

[0063] Advantageously, the bipolar plate exhibits one or more, and preferably all, of the following properties: [0064] an in-plane resistivity equal to or lower than 0.01 Ohm.Math.cm; [0065] a through-plane resistivity equal to or lower than 0.03 Ohm.Math.cm; [0066] a thermal conductivity equal to or higher than 10 W/m/K; [0067] a flexural strength equal to or higher than 25 N/mm.sup.2; [0068] a compressive strength equal to or higher than 25 N/mm.sup.2.

[0069] The flexural strength is measured according to standard DIN EN ISO 178. The compressive strength is measured according to ISO 604. The thermal conductivity is measured according the laser flash method of DIN EN ISO 821. In-plane resistivity is measured using a four-point probe setup samples on milled samples with a thickness of 4 mm. Through-plane resistivity was measured with a two-electrode installation and a contact pressure of 1 N/mm.sup.2 on milled samples with a diameter of 13 mm and a thickness of 2 mm.

[0070] In some embodiments, the bipolar plate has an in-plane resistivity equal to or lower than 0.008 Ohm.Math.cm, or equal to or lower than 0.005 Ohm.Math.cm, or equal to or lower than 0.003 Ohm.Math.cm.

[0071] In some embodiments, the bipolar plate has a through-plane resistivity equal to or lower than 0.025 Ohm.Math.cm, or equal to or lower than 0.02 Ohm.Math.cm, or equal to or lower than 0.015 Ohm.Math.cm.

[0072] In some embodiments, the bipolar plate has a thermal conductivity equal to or higher than 15 W/m/K, or equal to or higher than 20 W/m/K.

[0073] In some embodiments, the bipolar plate has a flexural strength equal to or higher than 30 N/mm.sup.2, or equal to or higher than 35 N/mm.sup.2.

Processes

[0074] In another aspect, the invention relates to a method for producing the above composition comprising the steps of: [0075] melt-blending the fluorinated polymer with the first conductive filler so as to obtain the conductive fluorinated polymer; [0076] grinding to powder said conductive fluorinated polymer; [0077] mixing the powder of conductive fluorinated polymer with the second conductive filler.

[0078] In this method, the first conductive filler, the fluorinated polymer and the second conductive filler may have any optional or preferred feature described above in relation with the composition for bipolar plate.

[0079] The process of the invention comprises a step of melt-blending the fluorinated polymer with the first conductive filler so as to obtain the conductive fluorinated polymer. This step makes it possible to prepare an intimate mixture of the fluorinated polymer and the first conductive filler, called “conductive fluorinated polymer”. Preferably, the first conductive filler is dispersed in the fluorinated polymer.

[0080] Preferably, the fluorinated polymer and the first conductive filler to be melt-blended are in a powdered form.

[0081] The first conductive filler to be melt-blended with the fluorinated polymer may have a BET surface area measured by the BET method under nitrogen according to ASTM D3037 of from 0.1 m.sup.2/g to 2000 m.sup.2/g, and preferentially from 10 m.sup.2 to 1000 m.sup.2/g. In some embodiments, the first conductive filler may have a BET surface area of from 0.1 to 1 m.sup.2/g, or from 1 to 10 m.sup.2/g, or from 10 to 50 m.sup.2/g, or from 10 to 50 m.sup.2/g, or to 50 to to 200 m.sup.2/g, or from 200 to 400 m.sup.2/g, or from 400 to 600 m.sup.2/g, or from 600 to 800 m.sup.2/g, or from 800 to 1000 m.sup.2/g, or from 1000 to 1200 m.sup.2/g, or from 1200 to 1400 m.sup.2/g, or from 1400 to 1600 m.sup.2/g, or from 1600 to 1800 m.sup.2/g, or from 1800 to 2000 m.sup.2/g. In an advantageous variant, the melt-blending step is carried out by extrusion, for example by using a kneader or a twin-screw extruder. In order to achieve a good dispersion of the first conductive filler within the fluorinated polymer, a screw profile leading to a dispersive mixing thanks to high shear rate will be preferred.

[0082] As an example, in a classical extrusion process for melt-blending the fluorinated polymer with the first conductive filler, pellets of polymer are melted by conveying them along the screw that is heated up to temperatures ranging from Tm+20° C. and Tm+70° C. (Tm being the melting temperature (in ° C.) of the fluorinated polymer). Conductive filler is preferably fed with a dosing unit. Preferably, after extrusion process, pellets are obtained by cutting strand method or under water pelletizing.

[0083] The conductive fluorinated polymer may contain from 0.1% to 1% by weight, or from 1% to 2.5% by weight, or from 2.5% to 5% by weight, or from 5% to 10% by weight, or from 10% to 15% by weight, or from 15% to 20% by weight, or from 20% to 25% by weight, or from 25% to 30% by weight, or from 30% to 35% by weight, of first conductive filler, based on the weight of the conductive fluorinated polymer.

[0084] The conductive fluorinated polymer may be made in the form of pellets.

[0085] The process of the invention also comprises a step of grinding to powder the conductive fluorinated polymer. Any grinding technologies may be used to perform this step, for example a hammer mill. In some embodiments, the powder retrieved from the grinding step has a Dv50 of from 0.1 μm to 1 mm, in particular of from 0.1 μm to 5 μm, or from 5 μm to 50 μm, or from 50 μm to 100 μm, or from 100 μm to 200 μm, or from 200 μm to 300 μm, or from 300 μm to 400 μm, or from 400 μm to 500 μm, or from 500 μm to 600 μm, or from 600 μm to 700 μm, or from 700 μm to 800 μm, or from 800 μm to 900 μm, or from 900 μm to 1 mm.

[0086] The powder of conductive fluorinated polymer is then mixed with the second conductive filler.

[0087] The second conductive filler may be in a powdered form. The Dv50 of the second conductive filler may be equal to or lower than 2500 μm, preferably equal to or lower than 1000 μm, more preferably equal to or lower than 500 μm. In some embodiments, the Dv50 of the second conductive filler is from 10 μm to 50 μm, or from 50 to 100 μm, or from 100 to 150 μm, or from 150 to 200 μm, or from 200 to 250 μm, or from 250 to 300 μm, or from 300 to 350 μm, or from 350 to 400 μm, or from 400 to 450 μm, or from 450 to 500 μm, or from 500 to 600 μm, or from 600 to 700 μm, or from 700 to 800 μm, or from 800 to 900 μm, or from 900 to 1000 μm, or from 1000 to 1100 μm, or from 1100 to 1200 μm, or from 1200 to 1300 μm, or from 1300 to 1400 μm, or from 1400 to 1500 μm, or from 1500 to 1600 μm, or from 1600 to 1700 μm, or from 1700 to 1800 μm, or from 1900 to 2000 μm, or from 2000 to 2100 μm, or from 2100 to 2200 μm, or from 2200 to 2300 μm, or from 2300 to 2400 μm, or from 2400 to 2500 μm.

[0088] The mixing step may be carried out for instance by compounding the powder of conductive fluorinated polymer with the second conductive filler. Advantageously, the compounding of the powder of conductive fluorinated polymer with the second conductive filler takes place in an extruder, for example in a twin-screw extruder.

[0089] The conductive fluorinated polymer is preferably in an amount of from 10% to 15% by weight, or from 15% to 20% by weight, or from 20% to 25% by weight, or from 25% to 30% by weight, or from 30% to 35% by weight, or from 35% to 40% by weight, based on the total weight of the composition for bipolar plate. The second conductive filler is preferably in an amount of from 60% to 65% by weight, or from 65% to 70% by weight, or from 70% to 75% by weight, or from 75% to 80% by weight, or from 80% to 85% by weight, or from 85% to 90% by weight, based on the total weight of the composition for bipolar plate.

[0090] The invention also pertains to a composition for bipolar plates produced according to the process described above.

[0091] In another aspect, the invention relates to a method for producing a bipolar plate, comprising the steps of: [0092] producing a composition for bipolar plate according to a method as described above; [0093] compression-molding of the composition for bipolar plate.

[0094] Preferably, the composition for bipolar plate to be subjected to compression-molding is in a powdered form. The process according to the invention may comprise a step of grinding to powder the composition for bipolar plate, for example with a disc mill.

[0095] The compression-molding of compositions for producing bipolar plates is well known by the skilled person. For example, the compression-molding step may be carried out according to the following manner: the composition for bipolar plate is put into a mold, for example a stainless-steel mold, which is then closed and the mold containing the composition is heated to a temperature of from 200° C. to 350° C., preferably from 250° C. to 300° C. Then, a compression of from 300 t to 800 t, preferably from 400 t to 600 t, is applied to the mold, for a mold size of from 100000 to 150000 mm.sup.2. Typically, a compression force of 500 t is applied when the mold size is 130000 mm.sup.2 and a compression force of 300 t is applied when the mold size is 44000 mm.sup.2. The mold is cooled down to a temperature of from 50° C. to 120° C., preferably from 60° C. to 100° C., and the plate is demolded.

[0096] In some embodiments, the bipolar plate exhibits one or more, and preferably all, of the following properties: [0097] an in-plane resistivity equal to or lower than 0.01 Ohm.Math.cm; [0098] a through-plane resistivity equal to or lower than 0.03 Ohm.Math.cm; [0099] a thermal conductivity equal to or higher than 10 W/m/K; [0100] a flexural strength equal to or higher than 25 N/mm.sup.2; [0101] a compressive strength equal to or higher than 25 N/mm.sup.2.

[0102] The flexural strength is measured according to standard DIN EN ISO 178. The compressive strength is measured according to ISO 604. The thermal conductivity is measured according the laser flash method of DIN EN ISO 821. Through-plane resistivity is measured using a four-point probe setup

[0103] In some embodiments, the bipolar plate has an in-plane resistivity equal to or lower than 0.008 Ohm.Math.cm, or equal to or lower than 0.005 Ohm.Math.cm, or equal to or lower than 0.003 Ohm.Math.cm.

[0104] In some embodiments, the bipolar plate has a through-plane resistivity equal to or lower than 0.025 Ohm.Math.cm, or equal to or lower than 0.02 Ohm.Math.cm, or equal to or lower than 0.015 Ohm.Math.cm.

[0105] In some embodiments, the bipolar plate has a thermal conductivity equal to or higher than 15 W/m/K, or equal to or higher than 20 W/m/K.

[0106] In some embodiments, the bipolar plate has a flexural strength equal to or higher than 30 N/mm.sup.2, or equal to or higher than 35 N/mm.sup.2.

[0107] Compared to the bipolar plates produced as described above or comprising the composition as described above, a bipolar plate produced by a compression molding process using particles of fluorinated polymer that has not been made conductive will comprise much more isolating domains, made of insulating fluorinated polymer.

EXAMPLES

[0108] The following example illustrates the invention without limiting it.

Raw Materials

[0109] The materials used in the compositions for producing bipolar plates are the following: [0110] PVDF 1: Homopolymer of vinylidene fluoride commercialized by Arkema under the trade name of Kynar® and characterized by a viscosity measured by capillary rheometry at a shear rate of 100 s.sup.−1 and 230° C. of 300 Pa.Math.s and a melt flow rate measured at 230° C. under 2.16 kg of 30 g/10 minutes; [0111] PVDF 2: Homopolymer of vinylidene fluoride commercialized by Arkema under the trade name of Kynar® and characterized by a viscosity measured by capillary rheometry at a shear rate of 100 s.sup.−1 and 230° C. of 1900 Pa.Math.s and a melt flow rate measured at 230° C. under 3.8 kg of 15 g/10 minutes; [0112] First conductive filler: conductive carbon black commercialized by IMERYS and having a BET surface area of 70 m.sup.2/g measured under nitrogen according to ASTM D3037; [0113] Second conductive filler: synthetic graphite commercialized by IMERYS and having a purity of more than 99% carbon content.

Conductive PVDF 1 Preparation

[0114] PVDF 1 was blended with 10% by weight of conductive carbon black (based on the weight of the blend of PVDF and carbon black) in the melt state with a kneader from BUSS corporation. After compounding, pellets were cryo-grinded with a Mikropul D2H hammer mill. The average particle size was characterized by a Dv50 of 150 μm.

Conductive PVDF Resistance Measurement

[0115] Strands of non-conductive PVDF 1 (i.e. PVDF 1 without conductive filler) and conductive PVDF 1 (i.e. PVDF 1 which was melt-blended with 10% by weight of conductive carbon as described above) were produced by means of capillary rheometer 2000 Göttfert equipped with a die of 10 mm in diameter and 30 mm in length at a shear rate of 10 s.sup.−1 and at 230° C.

[0116] The resistance of the strands thus obtained was measured by means of an Ohm-meter M1500P from Sefelec by applying a voltage of 10 V with a gap of 10 mm between both electrodes.

[0117] Results are summarized in the following table.

TABLE-US-00001 Resistance (Ohm) Non conductive PVDF 1 >10.sup.12 Conductive PVDF 1   5.10.sup.3

Compound Preparation

[0118] The conductive PVDF powder was mixed with 80% by weight of graphite (based on the weight of the mixture of conductive PVDF and graphite). The premix was compounded in a twin-screw extruder. The received pellets were grinded to powder with a disc mill. The particle size was smaller than 500 μm.

Bipolar Plate Preparation

[0119] The powder was filled into the cavity of a stainless-steel mold having a size of 130000 mm.sup.2 and subsequently flattened with a doctor blade. The mold was closed, heated up to at least 280° C. and compressed with at most 500 t while the mold was cooled down to the demolding temperature of at least 80° C. The mold was opened and the raw plate was demolded.

[0120] A comparative bipolar plate was produced in the same manner, except that PVDF 2 instead of conductive PVDF 1 was mixed with graphite (i.e. the PVDF 2 was directly mixed with 80% by weight of graphite, without being previously melt-blended with a conductive filler).

[0121] The bipolar plate according to the invention and the comparative bipolar plate were assessed for in-plane and through-plane resistivities, flexural and compressive strengths and flexural modulus.

Characterization Methods

[0122] In-plane resistivity was measured with a Loresta GP T600 equipped with an ASP 4-point probe. The samples were milled to a constant thickness of 4 mm.

[0123] Through-plane resistivity was measured with a two-electrode installation and a contact pressure of 1 N/mm.sup.2 on milled samples with a diameter of 13 mm and a thickness of 2 mm.

[0124] Flexural strength was measured according to DIN EN ISO 178.

[0125] Compressive strength was measured according to ISO 604.

[0126] Flexural modulus was measured according to DIN EN ISO 178.

Results

[0127] The results are summarized in the following table.

TABLE-US-00002 In-plane Through-plane Flexural Flexural Compressive resistivity resistivity strength modulus strength (Ohm .Math. cm) (Ohm .Math. cm) (N/mm.sup.2) (N/mm.sup.2) (N/mm.sup.2) Bipolar plate 0.003 0.015 35 11000 45 according to the invention (with conductive PVDF 1) Comparative 0.007 0.025 40 12000 46 bipolar plate (with non- conductive PVDF 2)

[0128] The bipolar plate according to the invention exhibits a lower in-plane resistivity (i.e. a higher in-plane conductivity) and a lower through-plane resistivity (i.e. a higher through-plane conductivity) while maintaining good flexural and compressive strengths.