METHOD FOR PREPARING COPPER-BASED GRAPHENE/ALUMINUM COMPOSITE WIRE WITH HIGH ELECTRICAL CONDUCTIVITY

Abstract

A method for preparing a copper-based graphene/aluminum composite wire with high electrical conductivity is disclosed. An electrodeposition solution for the wire includes the following components, in mass percentage: 20 wt % of CuSO.sub.4, 0.005 wt % to 0.020 wt % of benzalacetone, 2 wt % to 5 wt % of NaCl, 0.08 wt % to 0.5 wt % of graphene, 0.003 wt % to 0.016 wt % of N,N-dimethylformamide (DMF), and the balance of deionized water. The preparation process of the wire is composed of: electrodeposition, drawing, and annealing. The obtained wire has excellent electrical conductivity and tensile strength, which can effectively improve the electric power transmission efficiency and reduce the electrical power loss. By the above electrodeposition solution and simple preparation method, a utility model wire with high transmission efficiency can be prepared, where the comprehensive performance and microstructure of the composite can be ensured by controlling process parameters.

Claims

1. A method for preparing a copper-based graphene/aluminum composite wire with a high electrical conductivity, comprising the following steps: (1) preparing an electrodeposition solution for a copper-based graphene composite; (2) conducting an electrodeposition on an aluminum wire or an aluminum alloy wire with the electrodeposition solution in step (1) to obtain a first copper-based graphene/aluminum composite wire product, wherein the electrodeposition used refers to a pulse electrodeposition; (3) drawing the first copper-based graphene/aluminum composite wire product obtained in step (2) at a high temperature to obtain a second copper-based graphene/aluminum composite wire product with a diameter of 0.8 mm to 1.4 mm; and (4) subjecting the second copper-based graphene/aluminum composite wire product obtained in step (3) to an annealing treatment in a nitrogen atmosphere to obtain the copper-based graphene/aluminum composite wire with the high electrical conductivity; wherein the electrodeposition solution for the copper-based graphene composite in step (1) comprises the following components in mass percentage: 20 wt % of CuSO.sub.4, 0.005 wt % to 0.020 wt % of benzalacetone, 2 wt % to 5 wt % of NaCl, 0.08 wt % to 0.5 wt % of graphene, 0.003 wt % to 0.016 wt % of N,N-dimethylformamide (DMF), and a balance of deionized water.

2. (canceled)

3. The method for preparing the copper-based graphene/aluminum composite wire with the high electrical conductivity according to claim 1, wherein the electrodeposition in step (2) is conducted under the following sinusoidal pulse parameters: 2:1 to 5:1 of pulse width ratio (positive/negative), 2 v to 3 v/0.5 v to 1 v of pulse voltage, and 400 Hz to 800 Hz of pulse current frequency.

4. The method for preparing the copper-based graphene/aluminum composite wire with the high electrical conductivity according to claim 1, wherein copper-based graphene has a volume percentage of 10% to 30% in the first copper-based graphene/aluminum composite wire product prepared in step (2).

5. The method for preparing the copper-based graphene/aluminum composite wire with the high electrical conductivity according to claim 1, wherein the drawing in step (3) is conducted at a temperature of 130° C. to 330° C. and a drawing speed of 10 mm/min to 30 mm/min.

6. The method for preparing the copper-based graphene/aluminum composite wire with the high electrical conductivity according to claim 1, wherein the annealing treatment in step (4) is conducted at 30° C. to 130° C., with a temperature-holding time of 2 h to 4 h.

7. A copper-based graphene/aluminum composite wire with a high electrical conductivity prepared by the method according to claim 1, wherein the copper-based graphene/aluminum composite wire has an electrical conductivity of no less than 75% IACS and a tensile strength of 500 MPa.

8. An application of the copper-based graphene/aluminum composite wire with the high electrical conductivity prepared by the method according to claim 1 in technical fields of wires and cables.

Description

DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] The present disclosure will be described in further detail below in conjunction with examples, but these examples are used only to illustrate the present disclosure rather than limit the scope of the present disclosure. In the examples, pulse voltage of 2.5 v/0.8 v and electrodeposition frequency of 500 Hz are adopted for illustration.

EXAMPLE 1

[0022] An electrodeposition solution for copper-based graphene was prepared, and the electrodeposition solution had the following components, in mass percentage: 20 wt % of CuSO.sub.4, 0.005 wt % of benzalacetone, 2 wt % of NaCl, 0.08 wt % of few-layer graphene, and 0.003 wt % of DMF. Electrodeposition was conducted at 30° C. under the following process parameters: 2:1 of pulse width ratio (positive/negative), 2.5 v/0.8 v of pulse voltage, 500 Hz of pulse current frequency, and 1 h of electrodeposition time.

[0023] After the electrodeposition was completed, a drawing process was conducted that the copper-based graphene/aluminum composite wire was drawn at a high temperature of 130° C. and a drawing speed of 10 mm/min to obtain a wire with a diameter of 1.4 mm.

[0024] The wire was then subjected to annealing treatment in an annealing furnace under the following process parameters: nitrogen atmosphere, 30° C. of annealing temperature, and 2 h of treatment time.

[0025] Under the above conditions, a deposited layer had a volume percentage of 10% and exhibited a prominent binding property with the aluminum core wire; and a prepared material had an electrical conductivity as high as 75.4% IACS and a tensile strength as high as 410±10 MPa.

EXAMPLE 2

[0026] An electrodeposition solution for copper-based graphene was prepared, and the electrodeposition solution had the following components, in mass percentage: 20 wt % of CuSO.sub.4, 0.010 wt % of benzalacetone, 3 wt % of NaCl, 0.2 wt % of few-layer graphene, and 0.008 wt % of DMF. Electrodeposition was conducted at 30° C. under the following process parameters: 3:1 of pulse width ratio (positive/negative), 2.5 v/0.8 v of pulse voltage, 500 Hz of pulse current frequency, and 2 h of electrodeposition time.

[0027] After the electrodeposition was completed, a drawing process was conducted, that is, the copper-based graphene/aluminum composite wire was drawn at a high temperature of 230° C. and a drawing speed of 20 mm/min to obtain a wire with a diameter of 1.0 mm.

[0028] The wire was then subjected to annealing treatment in an annealing furnace under the following process parameters: nitrogen atmosphere, 80° C. of annealing temperature, and 3 h of treatment time.

[0029] Under the above conditions, a deposited layer had a volume percentage of 15% and exhibited a prominent binding property with the aluminum core wire; and a prepared material had an electrical conductivity as high as 83.3% IACS and a tensile strength as high as 445±10 MPa.

EXAMPLE 3

[0030] An electrodeposition solution for copper-based graphene was prepared, and the electrodeposition solution had the following components, in mass percentage: 20 wt % of CuSO.sub.4, 0.015 wt % of benzalacetone, 3 wt % of NaCl, 0.4 wt % of few-layer graphene, and 0.012 wt % of DMF. Electrodeposition was conducted at 30° C. under the following process parameters: 5:1 of pulse width ratio (positive/negative), 2.5 v/0.8 v of pulse voltage, 500 Hz of pulse current frequency, and 4 h of electrodeposition time.

[0031] After the electrodeposition was completed, a drawing process was conducted, that is, the copper-based graphene/aluminum composite wire was drawn at a high temperature of 330° C. and a drawing speed of 30 mm/min to obtain a wire with a diameter of 0.8 mm.

[0032] The wire was then subjected to annealing treatment in an annealing furnace under the following process parameters: nitrogen atmosphere, 130° C. of annealing temperature, and 3.5 h of treatment time.

[0033] Under the above conditions, a deposited layer had a volume percentage of 30% and exhibited a prominent binding property with the aluminum core wire; and a prepared material had an electrical conductivity as high as 90.2% IACS and a tensile strength as high as 490±10 MPa.

EXAMPLE 4

[0034] An electrodeposition solution for copper-based graphene was prepared, and the electrodeposition solution had the following components, in mass percentage: 20 wt % of CuSO.sub.4, 0.020 wt % of benzalacetone, 4 wt % of NaCl, 0.5 wt % of few-layer graphene, and 0.016 wt % of DMF. Electrodeposition was conducted at 30° C. under the following process parameters: 5:1 of pulse width ratio (positive/negative), 2.5 v/0.8 v of pulse voltage, 500 Hz of pulse current frequency, and 4 h of electrodeposition time.

[0035] After the electrodeposition was completed, a drawing process was conducted, that is, the copper-based graphene/aluminum composite wire was drawn at a high temperature of 330° C. and a drawing speed of 30 mm/min to obtain a wire with a diameter of 0.9 mm.

[0036] The wire was then subjected to annealing treatment in an annealing furnace under the following process parameters: nitrogen atmosphere, 130° C. of annealing temperature, and 4 h of treatment time.

[0037] Under the above conditions, a deposited layer had a volume percentage of 25% and exhibited a prominent binding property with the aluminum core wire; and a prepared material had an electrical conductivity as high as 86.7% IACS and a tensile strength as high as 465±10 MPa.

Comparative Example 1

[0038] An electrodeposition solution for copper-based graphene was prepared, and the electrodeposition solution had the following components, in mass percentage: 20 wt % of CuSO.sub.4, 0.015 wt % of benzalacetone, 3 wt % of NaCl, 0.4 wt % of few-layer graphene, and 0.012 wt % of DMF. Electrodeposition was conducted at 30° C. under the following process parameters: 5:1 of pulse width ratio (positive/negative), 2.5 v/0.8 v of pulse voltage, 500 Hz of pulse current frequency, and 4 h of electrodeposition time. After the electrodeposition was completed, a deposited layer was loose and incompact and exhibited a poor binding force with the substrate.

Comparative Example 2

[0039] An electrodeposition solution for copper-based graphene was prepared, and the electrodeposition solution had the following components, in mass percentage: 20 wt % of CuSO.sub.4, 0.015 wt % of benzalacetone, 3 wt % of NaCl, 0.4 wt % of few-layer graphene, and 0.012 wt % of DMF. Electrodeposition was conducted at 30° C. under the following process parameters: 5:1 of pulse width ratio (positive/negative), 2.5 v/0.8 v of pulse voltage, 500 Hz of pulse current frequency, and 4 h of electrodeposition time.

[0040] After the electrodeposition was completed, a drawing process was conducted, that is, the copper-based graphene/aluminum composite wire was drawn at a high temperature of 330° C. and a drawing speed of 30 mm/min to obtain a wire with a diameter of 0.8 mm.

[0041] Under the above conditions, a deposited layer had a volume percentage of 30% and exhibited a prominent binding property with the aluminum core wire; and a prepared material had an electrical conductivity as high as 86.2% IACS and a tensile strength as high as 450±10 MPa.

Comparative Example 3

[0042] An electrodeposition solution for copper-based graphene was prepared, and the electrodeposition solution had the following components, in mass percentage: 20 wt % of CuSO.sub.4, 3 wt % of NaCl, 0.4 wt % of few-layer graphene, and 0.012 wt % of DMF. Electrodeposition was conducted at 30° C. under the following process parameters: 5:1 of pulse width ratio (positive/negative), 2.5 v/0.8 v of pulse voltage, 500 Hz of pulse current frequency, and 4 h of electrodeposition time.

[0043] After the electrodeposition was completed, a drawing process was conducted, that is, the copper-based graphene/aluminum composite wire was drawn at a high temperature of 330° C. and a drawing speed of 30 mm/min to obtain a wire with a diameter of 0.8 mm.

[0044] The wire was then subjected to annealing treatment in an annealing furnace under the following process parameters: nitrogen atmosphere, 130° C. of annealing temperature, and 3.5 h of treatment time.

[0045] Under the above conditions, a deposited layer had a volume percentage of 28% and exhibited an average binding property with the aluminum core wire and poor surface quality; and a prepared material had an electrical conductivity as high as 84.6% IACS and a tensile strength as high as 440±10 MPa.

[0046] The above examples are preferred implementations of the present disclosure, but the present disclosure is not limited to the above implementations. Any obvious improvement, substitution, or modification made by those skilled in the art without departing from the essence of the present disclosure should fall within the protection scope of the present disclosure.