FLUID FLOW SENSING AND BUBBLE DETECTING APPARATUS AND METHOD FOR IMPROVING A FLUID FLOW SENSING AND BUBBLE DETECTING APPARATUS
20220040391 · 2022-02-10
Inventors
Cpc classification
A61M2205/0238
HUMAN NECESSITIES
A61M2205/3375
HUMAN NECESSITIES
H05K9/0081
ELECTRICITY
International classification
A61M1/36
HUMAN NECESSITIES
Abstract
A fluid flow sensing and bubble detecting apparatus, comprising:—housing provided with a cavity configured to receive a tube through which conductive fluid flows;—a fluid flow sensing and bubble detecting electrical sensor assembly supported by the housing and configured to sense the flow of the fluid flowing through the tube and to detect bubbles in the fluid; and—an electrically grounded Electro-Magnetic Interference (EMI) shielding arranged between at least a part of the sensor assembly and the cavity such that the EMI shielding protects the sensor assembly from unwanted EMI emanating from a tube received within the cavity, which might otherwise cause the fluid flow sensing and bubble detecting apparatus to generate false bubble detection signals.
Claims
1. A fluid flow sensing and bubble detecting apparatus, comprising: a housing provided with a cavity configured to receive a tube through which conductive fluid flows; a fluid flow sensing and bubble detecting electrical sensor assembly supported by the housing and configured to sense the flow of conductive fluid flowing through the tube and to detect bubbles in the conductive fluid; and an electrically grounded Electro-Magnetic Interference (EMI) shielding arranged between at least a part of the sensor assembly and the cavity such that the EMI shielding protects the sensor assembly from EMI emanating from the tube while received within the cavity.
2. The apparatus of claim 1, wherein the EMI shielding is separate from the fluid flow sensing and bubble detecting electrical sensor assembly.
3. The apparatus of claim 1, wherein the EMI shielding is an electrically conductive layer.
4. The apparatus of claim 3, wherein the electrically conductive layer is connected via an electrically conductive path with an electrically grounded portion of the housing.
5. The apparatus of claim 3, wherein the electrically conductive layer is a metal foil, a vapor deposited metal or a crosshatch pattern of metallic traces.
6. The apparatus of claim 3, wherein the electrically conductive layer is covered with a dielectric protective coating.
7. The apparatus of claim 1, wherein the sensor assembly comprises at least one pair of ultrasonic transducer elements, wherein each transducer element is electrically isolated from the apparatus's electrical ground and thus is electrically floating.
8. The apparatus of claim 1, wherein the sensor assembly further comprises a temperature sensor.
9. The apparatus of claim 8, wherein the EMI shielding has a temperature sensor gap allowing unimpeded temperature measurements by the temperature sensor.
10. A method of protecting a fluid flow sensing and bubble detecting apparatus against Electro-Magnetic Interference (EMI), wherein the fluid flow sensing and bubble detecting apparatus: is configured to receive a tube through which conductive fluid flows; and includes a fluid flow sensing and bubble detecting electrical sensor assembly configured to sense the flow of conductive fluid flowing through a tube received in the fluid flow sensing and bubble detecting apparatus and to detect bubbles in the conductive fluid, the method comprising the steps of: fitting the fluid flow sensing and bubble detecting apparatus with a dedicated EMI shielding to protect the sensor assembly from substantial EMI emanating from a tube received in the fluid flow sensing and bubble detecting apparatus, which EMI shielding is separate from the fluid flow sensing and bubble detecting electrical sensor assembly; and grounding the EMI shielding so as to prevent the fluid flow sensing and bubble detecting apparatus from generating EMI-induced false bubble detection signals.
11. (canceled)
12. A fluid flow sensing and bubble detecting apparatus, comprising: a housing, in which a first side wall, a second side wall and a bottom wall constitute three walls of a channel, which is configured to receive a tube that serves as a conduit for an electrically conductive fluid flow; a first window located in the first side wall; a second window located in the second side wall; a first ultrasonic transducer, operable as an ultrasonic transmitter and as an ultrasonic receiver, placed in the housing behind the first window; a second ultrasonic transducer, operable as an ultrasonic transmitter and as an ultrasonic receiver, placed in the housing behind the second window; a circuit board in electrical connection and in signal transferring connection with the first and second ultrasonic transducers, wherein the circuit board is configured to control the first and second ultrasonic transducers as ultrasonic transmitters and receivers, wherein the circuit board is located under the bottom wall; a first electrically conductive layer located on the side of the first window facing the channel, wherein the first electrically conductive layer is electrically grounded; and a second electrically conductive layer located on the side of the second window facing the channel, wherein the second electrically conductive layer is electrically grounded.
13. The apparatus of claim 12, further comprising: a third ultrasonic transducer, operable as an ultrasonic transmitter and as an ultrasonic receiver, placed in the housing behind the first window; and a fourth ultrasonic transducer, operable as an ultrasonic transmitter and as an ultrasonic receiver, placed in the housing behind the second window; wherein the first ultrasonic transducer is located diagonal to the fourth ultrasonic transducer, and the second ultrasonic transducer is located diagonal to the third ultrasonic transducer; and wherein the circuit board is in electrical connection and in signal transferring connection with the third and fourth ultrasonic transducers, wherein the circuit board is configured to control the third and fourth ultrasonic transducers as ultrasonic transmitters and receivers.
14. The apparatus of claim 12, further comprising: a bottom window located in the bottom wall.
15. The apparatus of claim 14, further comprising: a third electrically conductive layer located on the side of the bottom window facing the channel, wherein the third electrically conductive layer is electrically grounded.
16. The apparatus of claim 15, wherein the first electrically conductive layer, the second electrically conductive layer, and the third electrically conductive layer are conductively connected to an electrically grounded portion of the housing.
17. The apparatus of claim 15, wherein the first electrically conductive layer is a first metal foil, a first vapor deposited metal or a first crosshatch pattern of metallic traces; wherein the second electrically conductive layer is a second metal foil, a second vapor deposited metal or a second crosshatch pattern of metallic traces; and wherein the third electrically conductive layer is a third metal foil, a third vapor deposited metal or a third crosshatch pattern of metallic traces.
18. The apparatus of claim 15, wherein the first electrically conductive layer, the second electrically conductive layer, and the third electrically conductive layer are covered with a dielectric protective coating.
19. The apparatus of claim 12, wherein the circuit board is essentially planar and oriented parallel to the bottom wall.
20. The apparatus of claim 12, further comprising an infrared temperature sensor mounted on the circuit board, wherein a light sensitive side of the infrared temperature sensor faces the bottom wall.
21. The apparatus of claim 17, further comprising an infrared temperature sensor mounted on the circuit board, wherein a light sensitive side of the infrared temperature sensor faces the bottom wall.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0034] The disclosure will now be described by way of example only, with reference to the accompanying drawings, in which:
[0035]
[0036]
[0037]
[0038]
[0039]
[0040]
[0041]
[0042]
DETAILED DESCRIPTION OF THE DISCLOSURE
[0043]
[0044] A sensor cover 7 is adapted to enclose the tube 8. The sensor cover 7 may be made from, for example, metal or plastic material (such as polycarbonate (e.g., LEXAN)). In the non-limiting embodiment shown in
[0045]
[0046] The windows 13 and 15 may be completely or substantially made of a plastic material such as polymethylmethacrylate (PMMA), or other suitable acrylic or plastic, allowing ultrasonic waves to pass from ultrasonic transducers 14 and 16 through the windows 13, 15 and into the fluid flow 10 in the tube 8. Although this disclosure speaks of individual transducers 14 and 16, there may be an array or plurality of transducers on each side of the channel 6. For example, in the non-limiting embodiment shown in
[0047] The ultrasonic transducers 14 and 16 may be operated in a multiplexed manner to sense the fluid flow 10 and detect bubbles therein. Electronic components on a circuit board 17 control the operation of the transducers 14 and 16. The circuit board 17 is placed in the housing 2 under the bottom window 18 (which is located in the bottom wall 5), preferably parallel to the bottom wall 5.
[0048] The transducers 14 and 16 and the circuit board 17 together form a fluid flow sensing and bubble detecting electrical sensor assembly supported by the housing 2.
[0049] In a way not shown in the drawings, the apparatus 1 may be utilized to sense fluid flow and detect bubbles in an extracorporeal tube bypassing, for instance, the heart and/or lungs of a patient. The patient may be operated on with an electrosurgical unit generating a radio frequency at, for example, around 500 KHz. There may be peaks at an overlaying higher frequency getting close to the frequency of the ultrasonic transducers. Electric currents induced by the electro-surgery travel through the blood in the tube and may cause Electro-Magnetic Interference (or EMI). This is prevented by an EMI shielding 21. In the non-limiting embodiments shown in
[0050] The conductive layer 21 is grounded. In one embodiment, grounding can be achieved by extending the layer 21 over a portion of the housing 2 that is electrically grounded, thus establishing an electrical grounding path 20. In this case, the path 20 of the layer 21 is a portion of the layer 21, which overlaps the bottom window 18, and also extends over a grounded portion of the housing 2 that is electrically conductive and connected with the rest of the housing 2.
[0051]
[0052] The protective coating 22 may be thicker than the vapor deposited layer 21, for instance, the protective coating 22 may be 7 to 30 micrometers thick when the conductive layer 21 is no more than around 5 micrometers thick. This is still relatively thin, even when considering both layers, so the layer 21 and the protective coating 22 do not noticeably affect ultrasonic waves travelling through the side windows 13 and 15 to reach piezo transducers 14 and 16. The layer 21 and protective coating 22 may be applied to the side windows 13, 15, as well as the bottom window 18. The layer 21 may be made of aluminum. The coating 22 may be made of acrylic, silicone, polyurethane, or a combination of dielectric materials.
[0053] The electrically conductive layer 21 shields the transducers 14 and 16 from EMI, and, in particular, Electro-Surgical Interference (ESI). Without the ESI shielding 21, the ESI can interfere with the operation of the transducers 14, 16, which can cause false bubble detections, that is, detections of bubbles that do not exist. Various tests conducted by the applicant have proven this. In other words, application of ESI shielding 21 to a Loderer-type sensor (i.e., a flow measuring and bubble detecting sensor employing paired ultrasonic transducers and a multiplexing circuit) substantially mitigates and/or eliminates false bubble detection signals due to ESI.
[0054] Alternatively, still referring to the bottom portion of
[0055] In a further variant, the windows 13, 15, 18 may be laminated structures. In this case, the EMI shielding 21 could be embedded within the windows 13, 15, 18 as a grounded conductive layer within the laminate.
[0056] In another further variant, the electrically conductive layer 21 is located on the inside of the windows 13, 15, 18 (opposite the channel 6) and in front of the transducers 14, 16, while being properly grounded (e.g., in electrical connection with a grounded portion of the housing 2).
[0057]
[0058] The aperture 24 may be, for example, 1 to 5 mm, in particular 1 to 4 mm, and in one embodiment 2 to 3 mm in diameter. Within these ranges, the aperture 24 is sufficiently large to enable proper operation of the infrared temperature sensor 23 but also sufficiently small to maintain efficient EMI shielding of the electrical components.
[0059] The infrared temperature sensor 23 may be mounted on the circuit board 17, wherein a light sensitive side 25 of the infrared temperature sensor 23 faces the bottom window 18. The aperture 24 may be covered with the protective coating 22, if it allows IR light transmission. Such a protective coating 22 that allows IR light transmission may be made of, for example, acrylic, silicone, polyurethane or a combination of dielectric materials.
[0060] The conductive layer 21 (foil or vapor deposit) may be applied in the shape of an orthogonal crosshatch, comprising a first plurality of parallel metallic traces that intersect at right angles with a second plurality of parallel metallic traces. Alternatively, the conductive layer 21 may be applied in the shape of a diagonal crosshatch comprising a first plurality of parallel metallic traces that intersect diagonally with a second plurality of parallel metallic traces as shown in
[0061]
[0062]
[0063]
[0064] In one embodiment, the electrically conductive layer 21 can take a different form over one or more of the windows 13, 15 and 18. That is, the electrically conductive layer 21 over window 13 is a metal foil, a vapor deposited metal or a crosshatch pattern of metallic traces, the electrically conductive layer 21 over window 15 is a metal foil, a vapor deposited metal or a crosshatch pattern of metallic traces, and the electrically conductive layer 21 over window 18 is a metal foil, a vapor deposited metal or a crosshatch pattern of metallic traces. For example, in one embodiment, the electrically conductive layer 21 over windows 13 and 15 is a vapor deposited metal, and the electrically conductive layer 21 over window 18 is a crosshatch pattern of metallic traces.
[0065]
[0066] In embodiments where the layer is a foil, the foil is applied in the second step 27 and the method is finished. In embodiments where the layer is a vapor deposited material deposited in step 27, a third step 28 may consist of applying a protective coating onto the electrically conductive layer.
[0067] Those of skill in the art will appreciate that embodiments not expressly illustrated herein may be practiced within the scope of the claims, including that features described herein for different embodiments may be combined with each other and/or with currently known or future-developed technologies while remaining within the scope of the claims. Those of skill in the art will also be enabled to practice various other embodiments of concepts for assessing and/or identifying compatible patient support and patient support mounting devices combinations from the embodiments disclosed herein. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation. It is therefore intended that the foregoing detailed description be regarded as illustrative rather than limiting. Furthermore, the advantages described above are not necessarily the only advantages of the disclosure, and it is not necessarily expected that all of the described advantages will be achieved with every embodiment.