MEMS SENSOR INCLUDING A DIAPHRAGM AND METHOD FOR MANUFACTURING A MEMS SENSOR

Abstract

A MEMS sensor including a diaphragm, a base surface area of the diaphragm being delimited with the aid of a peripheral wall structure, and the base surface area including at least two subareas, of which at least one of the subareas is deflectably situated, and the at least two subareas being separated from one another with the aid of at least one separating structure or being delimited by the latter. The separating structure includes at least one fluid through-opening for the passage of fluid.

Claims

1-13. (canceled)

14. A MEMS sensor, comprising: a diaphragm, a base surface area of the diaphragm being delimited using a peripheral wall structure, and the base surface area including at least two subareas of which at least one of the subareas is deflectably situated, the at least two subareas being separated from one another using at least one separating structure or being delimited by the at least one separating structure, the separating structure including at least one fluid through-opening for the passage of a fluid, and a first electrode structure for forming a first capacitance and a second electrode structure for forming a second capacitance being situated in at least one subarea of the at least two subareas, the first and second electrode structures being spaced apart from one another using the separating structure, and at least one of the at least two subareas being configured as a reference capacitance.

15. The MEMS sensor as recited in claim 14, wherein the at least two subareas are situated symmetrically relative to one another on the base surface area and are identically designed.

16. The MEMS sensor as recited in claim 14, wherein the separating structure includes at least one pillar.

17. The MEMS sensor as recited in claim 14, wherein the separating structure includes multiple pillars, which are situated at a respectively identical distance from one another.

18. The MEMS sensor as recited in claim 16, wherein the at least one pillar has an at least partially round and/or angular cross section.

19. The MEMS sensor as recited in claim 18, wherein the cross section is trapezoidal and/or triangular and/or square and/or oval.

20. The MEMS sensor as recited in claim 16, wherein the at least one pillar includes at least two sections which are differently designed.

21. The MEMS sensor as recited in claim 17, wherein at least two of the pillars have a different diameter.

22. The MEMS sensor as recited in claim 14, wherein the at least two subareas have a rectangular design.

23. The MEMS sensor as recited in claim 14, wherein the wall structure and/or the separating structure is manufactured from two different materials.

24. The MEMS sensor as recited in claim 23, wherein the separating structure and/or the wall structure is manufactured from diaphragm material and/or from insulation material and/or from electrically conductive material.

25. A method for manufacturing a MEMS sensor, comprising the following steps: providing a diaphragm on a base structure, the diaphragm being spaced apart from the base structure via a wall structure; providing a base surface area of the diaphragm that includes at least two subareas, at least one of the subareas being deflectably situated; separating and/or delimiting the at least two subareas using at least one separating structure; and providing at least one fluid through-opening in the separating structure for the passage of a fluid; wherein: a first electrode structure for forming a first capacitance and a second electrode structure for forming a second capacitance are situated in at least one subarea, the first and second electrode structures being spaced apart from one another using the separating structure, and at least one of the at least two subareas is configured as a reference capacitance.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0030] FIG. 1 shows a MEMS sensor in cross section according to one specific embodiment of the present invention.

[0031] FIG. 2 shows a top view of a MEMS sensor according to one specific embodiment of the present invention.

[0032] FIG. 3 shows a top view and a cross section through a portion of a MEMS sensor according to one specific embodiment of the present invention.

[0033] FIG. 4 shows a MEMS sensor according to specific embodiments of the present invention.

[0034] FIG. 5 shows a method according to one specific embodiment of the present invention.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

[0035] FIG. 1 shows a MEMS sensor in cross section according to one specific embodiment of the present invention.

[0036] A MEMS sensor is shown in detail in FIG. 1, which has been manufactured, for example, in the following manner: in a first step, an oxide layer 3 has been initially applied to a silicon wafer 2. In this case, substrate 2 may optionally be doped in order to improve the electrical shielding effect. A layer 4, in particular, a diaphragm layer made of silicon-rich nitride—SiRiN—has subsequently been deposited and, together with oxide layer 3 subsequently structured, so that a substrate contact has been facilitated. A lower electrode 5 has subsequently been manufactured via deposition of polycrystalline silicon, which has subsequently been structured. In the process, the substrate contact is filled with a conductive polycrystalline silicon. A lower, first sacrificial layer in the form of an oxide layer 6 has then been deposited and subsequently structured and, in particular, additionally planarized by chemical-mechanical polishing. A second oxide layer 7 has then been deposited and structured in order to create stop structures. Polycrystalline silicon 8 has been subsequently deposited and subsequently structured in order to manufacture an upper electrode 8. Thereafter, a third oxide layer 9 has been deposited and planarized. Subsequently, a structuring for posts, i.e., support elements in the form of pillars 22 and for walls 23 has been created. Diaphragm material 10 in the form of silicon-rich nitride—SiRiN—has then been deposited. Thereafter, a fourth oxide layer 11 has been deposited and planarized via chemical-mechanical polishing in order to create an oxide filling in posts or pillars 22 and in walls 23. Final diaphragm material 12 has subsequently been deposited and structured together with upper electrode layer 8 in order to obtain one or multiple etching accesses to sacrificial layers 6, 7, 9. Thereafter, sacrificial layers 6, 7, 9 have then been stripped by gas phase etching or with the aid of a stiction-free wet release process and diaphragm 10, 12 has been exposed. It is advantageous if no metal surfaces have to be impacted by the exposure process, so that undesired effects, for example, deposit formation on metal pads during gas phase etching or etching of metal pads in the wet release process, provided no gold pads are used or the like, are avoided. A stress-adapted SiN layer 13 has subsequently been deposited at a correspondingly predefined process pressure. This has subsequently been structured for contact pads. A further thin polysilicon layer, having a film thickness of approximately 100 nm may subsequently optionally be deposited on the upper side of SiN layer 13 and structured. This may optionally provide an electrical shield similar to that of substrate 2. A metal plane has been subsequently deposited and subsequently structured for manufacturing contact pads 14. The manufacture of MEMS sensor 1 including a deflectable diaphragm is thereby essentially completed.

[0037] Here, stop structures are identified with reference numeral 20, one electrode pair each including a lower and upper electrode in respective subarea A, B, C are identified with reference numeral 21a, 21b, 21c, corresponding connection elements or pillars are identified with reference numeral 22 and walls of cavity 30 produced by stripping the sacrificial layers are identified with reference numeral 23. The guiding of the electrical contact through walls 23 is depicted to the right in FIG. 1 only for lower electrode 5. In area 24 to the right of diaphragm 8, 10, a contacting of substrate 2 is made possible via contact pads 14. For a 350×350 μm base surface area 41, for example, the following division into subareas and/or sub-shapes of base surface area 41 may be provided overall for diaphragm 40. Other sizes of base surface area 41 are equally possible. [0038] 1. Square large diaphragm 40 having a side length up to 350×350 μm. [0039] 2. Multiple square sub-diaphragms having side lengths up to approximately 160×160 μm. [0040] Here, the usable surface area for diaphragm 40 in relation to the square base surface area 41 is reduced, since additional circuitry complexity and separations between the sub-diaphragms reduce the usable surface area for diaphragm 40. [0041] 3. Round diaphragm 40 having a diameter of up to 350 μm [0042] 4. Multiple round sub-diaphragms having diameters up to approximately 160 μm [0043] 5. Multiple rectangular sub-diaphragms having side lengths up to approximately 320 μm and a side length ratio greater than 2:1.

[0044] FIG. 2 shows a top view of a MEMS sensor according to one specific embodiment of the present invention.

[0045] In FIG. 2, a MEMS sensor 1 is shown including a diaphragm 40, which has a square base surface area 41. Four subareas A, B, C, D of diaphragm 40 are also shown, each of which has a rectangular and deflectable design. Rectangular areas A, B, C, D are situated in the interior of square base surface area 41 and separated from one another within base surface area 41 by punctiform pillars 22 situated on lines. Square base surface area 41 is delimited by extended peripheral walls 23 which, like punctiform pillars 22 as well, may in particular, be made of an oxide-filled diaphragm material. Punctiform pillars 22 in this case may have a round, angular and/or square cross section and may be situated at a distance in each case between 10 μm and 50 μm in parallel to the long side of rectangular areas A, B, C, D. Openings or fluid through-openings 80 between subareas A, B, C, D are made possible with the aid of pillars 22, so that a fluid connection is made possible between the spaces below respective subareas A, B, C, D. One electrode pair 21 each is situated in the interior of subareas A, B, C, D.

[0046] FIG. 3 shows a top view and a cross section through a portion of a MEMS sensor according to one specific embodiment of the present invention.

[0047] A top view of a subarea A of a diaphragm 40 is shown in detail in the upper area in FIG. 3, a cross section is shown in the lower area of FIG. 3. Diaphragm 40 is spaced apart from a base structure 2′ via a wall structure 23. Base structure 2′, wall structure 23 and diaphragm 40 enclose in this case a cavity 30. An electrode pair 21a for forming a first capacitance 50 is situated on the upper side of base structure 2′ and on the lower side of diaphragm 40. Electrode pair 21a in this case is situated essentially in the center between the left and right portions of wall structure 23. Two laterally vertical support structures 22 each are situated between first electrode pair 21a and the left and right portion of wall structure 23. One second electrode pair 21b each is situated on the upper side of base structure 2′ and the lower side of diaphragm 40 between the two support structures 22 and the respective left and right portion of wall structure 23. This forms a second capacitance 60, for example, a reference capacitance. In this case, dimensions 71, 72 of subarea A are approximately 320 micrometers as length 72 and approximately 70 to 80 micrometers as width 71.

[0048] FIG. 4 shows MEMS sensors according to specific embodiments of the present invention.

[0049] In FIG. 4, various MEMS sensors 1 are shown in the center of FIG. 4, each of which includes a diaphragm 40 having a base surface area 41, each diaphragm 40 including in each case sub-diaphragm surface areas A, B, C, D. Here, electrode pairs are situated in each case on the lower side of diaphragm 40 and on the upper side of a base structure 2′, as is depicted in the sectional view on the left side of FIG. 4. The four sub-diaphragm surface areas A, B, C, D each have a size of 320 μm×72 μm and the distance between subareas A, B, C, D is 10 μm. Electrodes 101, 102 are now interconnected with one another as upper electrodes via the four sub-diaphragm surface areas A, B, C, D and electrodes 103, 104 as lower electrodes according to the diagram shown on the right side of FIG. 4. Lower electrodes 103, 104 in different subareas A, B, C, D and/or upper electrodes 101, 102 in different subareas A, B, C, D may, in particular, be interconnected with one another to form capacitances and/or reference capacitances. In one of the specific embodiments of FIG. 4, two reference capacitances and two variable capacitances are formed, the two variable capacitances—depicted in each case by diagonal arrows—being formed by the two areas B and C in the center of diaphragm 40.

[0050] It is equally possible that upper electrode areas 101, 102 and lower electrode areas 103, 104 only partially overlap. In such a specific embodiment, these electrode areas may also be designed geometrically asymmetrically relative to one another. One of the advantages, among others, of such a shown interconnection is an electrical symmetrization of pressure-sensitive measuring capacitance and pressure-insensitive reference capacitance. It is possible with an electrically asymmetrical design of pressure-sensitive measuring capacitance and pressure-insensitive reference capacitance, to adapt these to an evaluation circuit.

[0051] A geometric optimization with respect to stray electrical fields or electrical parasites may further also be enabled thereby.

[0052] FIG. 5 shows a method according to one specific embodiment of the present invention.

[0053] A method for manufacturing a MEMS sensor is shown in FIG. 5 with reference numerals of FIG. 1.

[0054] In this method, a diaphragm 40 is provided on a base structure 2, 3, 4 in a first step S1, diaphragm 40 being spaced apart from base structure 2, 3, 4 via a wall structure 23.

[0055] In a second step S2, a base surface area 41 of diaphragm 40 is furthermore provided with at least two subareas A, B, C, D, at least one of subareas A, B, C, D, being deflectably situated.

[0056] In a third step S3a and/or S3b, the at least two subareas are furthermore separated and/or delimited with the aid of at least one separating structure 22.

[0057] In a fourth step S4, at least one fluid through-opening 80 for the passage of a fluid is furthermore provided in separating structure 22.

[0058] On the whole, at least one of the specific embodiments of the present invention enables the following features and/or yields the following advantages: [0059] Concatenation of virtually rectangular individual diaphragms within a square diaphragm surface area, an increase of the ratio of a capacitance arrangement to base capacitance ΔC/C.sub.0 with a reduction of base capacitance C.sub.0 capable of being facilitated, which is advantageous. [0060] Concatenation of polygonal individual diaphragms within a square base surface area. [0061] Concatenation of virtually rectangular individual diaphragms within a square diaphragm surface area, for example, trapezoidal, polygonal, oval with aspect ratios of greater than or equal to 2:1 with respect to edge length to edge width. [0062] Separation of the individual diaphragms by oxide-filled walls made of diaphragm material. [0063] Separation of the individual diaphragms by oxide-filled punctiform pillars made of diaphragm material, for example, round, angled, triangular, polygonal or the like. [0064] Mechanical reinforcement of the pressure-sensitive reference capacitances by pillars in the interior electrically active area of the diaphragm. [0065] Variable mechanical reinforcement of the pressure-sensitive measuring capacitances by pillars or walls. [0066] Variable mechanical support of diaphragms by pillars having a round, polygonal, square or triangular geometry. [0067] Variable mechanical support of diaphragms by pillars and walls having variable diameters of 2 μm to 20 μm. [0068] Peripheral capacitances including another use capacitance in the interior and their separation by support structures.

[0069] The present invention, although it has been described with reference to preferred exemplary embodiments, is not limited thereto, but is modifiable in a variety of ways.