OPTICAL SYSTEM
20220236652 · 2022-07-28
Inventors
Cpc classification
G03F7/70833
PHYSICS
G03F7/70316
PHYSICS
G03F7/70258
PHYSICS
G03F7/70241
PHYSICS
G03F7/70275
PHYSICS
International classification
Abstract
The disclosure provides an optical system, having a first optical control loop, which is set up to regulate a position and/or spatial orientation of a first optical element relative to a first module sensor frame, and a first module control loop, which is set up to regulate a position and/or spatial orientation of the first module sensor frame relative to a base sensor frame. Related components and methods are also provided
Claims
1.-23. (canceled)
24. An optical system, comprising: a first module, comprising: a first mirror; and a first actuator configured to position and/or orient the first mirror; a force frame connected to the first module so that the first mirror is removable from the optical system; a sensor frame decoupled from the force frame; and a first sensor configured to capture a position and/or spatial orientation of the first mirror relative to the sensor frame, wherein: the force frame encloses a volume; and the sensor frame is at least partially arranged within the volume.
25. The optical system of claim 24, wherein the first module comprises a first holding frame, and the force frame is connected to the first holding frame so that the first module is removable from the optical system.
26. The optical system of claim 25, further comprising: a second module, comprising: a second mirror; and a second actuator configured to position and/or orient the second mirror; and a second sensor configured to capture a position and/or spatial orientation of the second mirror relative to the sensor frame, wherein the force frame is connected to the second module so that the second mirror is removable from the optical system.
27. The optical system of claim 26, wherein the second module comprises a second holding frame, and the force frame is connected to the second holding frame so that the second module is removable from the optical system.
28. The optical system of claim 24, wherein the force frame is connected to the first module so that the first module is removable from the optical system.
29. The optical system of claim 28, further comprising: a second module, comprising: a second mirror; and a second actuator configured to position and/or orient the second mirror; and a second sensor configured to capture a position and/or spatial orientation of the second mirror relative to the sensor frame, wherein the force frame is connected to the second module so that the second mirror is removable from the optical system.
30. The optical system of claim 29, wherein the force frame is connected to the second module so that the second module is removable from the optical system.
31. The optical system of claim 24, further comprising: a second module, comprising: a second mirror; and a second actuator configured to position and/or orient the second mirror; and a second sensor configured to capture a position and/or spatial orientation of the second mirror relative to the sensor frame, wherein the force frame connected to the second module so that the second mirror is removable from the optical system.
32. The optical system of claim 31, wherein the force frame is connected to the second module so that the second module is removable from the optical system.
33. The optical system of claim 31, wherein: the first actuator is configured to position and/or orient the first mirror based on the position and/or spatial orientation of the first mirror captured by the first sensor; and the second actuator is configured to position and/or orient the second mirror based on the position and/or spatial orientation of the second mirror captured by the second sensor.
34. The optical system of claim 24, wherein the first actuator is configured to position and/or orient the first mirror based on the position and/or spatial orientation of the first mirror captured by the first sensor.
35. The optical system of claim 34, wherein: the first sensor comprises a unit; the first mirror supports a measurement object; the unit is configured to transmit a first signal to the measurement object so that a second signal is sent from the measurement object to the unit to determine the position and/or spatial orientation of the first mirror.
36. The optical system of claim 35, wherein the first signal is the same as the second signal.
37. The optical system of claim 36, wherein the unit comprises an interferometer configured to generate the first signal.
38. The optical system of claim 24, wherein: the first sensor comprises a unit; the first mirror supports a measurement object; the unit is configured to transmit a first signal to the measurement object so that a second signal is sent from the measurement object to the unit to determine the position and/or spatial orientation of the first mirror.
39. The optical system of claim 38, wherein the first signal is the same as the second signal.
40. The optical system of claim 39, wherein the unit comprises an interferometer configured to generate the first signal.
41. The optical system of claim 24, further comprising a device configured to capture a change in position, a change in spatial orientation, and/or a deformation of the sensor frame or parts thereof with respect to a reference outside the sensor frame.
42. The optical system of claim 41, wherein the device comprises an interferometer.
43. The optical system of claim 24, wherein the system comprises a lithography projection system.
44. The optical system of claim 24, wherein the sensor frame is mechanically decoupled from the force frame.
45. An inspection system, comprising: an optical system according to claim 24, wherein the inspection system is configured to inspect a photomask.
46. A projection system, comprising: an optical system according to claim 24, wherein the projection system is a lithography projection system.
47. An apparatus, comprising: an optical system according to claim 24, wherein the apparatus is a lithography apparatus.
48. An apparatus, comprising: an illumination system; and a projection system comprising an optical system according to claim 24, wherein the apparatus is a lithography apparatus.
49. The apparatus of claim 25, wherein the apparatus is an EUV lithography apparatus.
50. A method of using a lithography apparatus comprising an illumination system and a projection system, the method comprising: using the illumination system to illuminate a structure of a photomask; and using the projection system to project image the structure onto a light-sensitive material, wherein the projection system comprises an optical system according to claim 24.
51. An optical system, comprising: a subsystem, comprising: a mirror; a actuator configured to position and/or orient the first mirror; a first frame connected to the subsystem so that the mirror is removable from the optical system; a second frame mechanically decoupled from the first frame; and a sensor configured to capture a position and/or spatial orientation of the mirror relative to the second frame, wherein: the first frame encloses a volume; and the second frame is at least partially arranged within the volume.
52. An optical system, comprising: a subsystem, comprising: a mirror; a actuator configured to position and/or orient the mirror; a first frame connected to the subsystem so that the mirror is removable from the optical system; a second frame mechanically decoupled from the first frame, the second frame comprising a sensor configured to capture a position and/or spatial orientation of the first mirror, wherein: the first frame encloses a volume; and the second frame is at least partially arranged within the volume.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0096] In the text that follows, the disclosure is explained in more detail on the basis of preferred embodiments with reference to the accompanying figures, in which:
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DETAILED DESCRIPTION
[0109] Unless otherwise indicated, the same reference signs in the figures denote elements that are the same or functionally the same. It should also be noted that the illustrations in the figures are not necessarily to scale.
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[0111] The beam shaping system 102 has an EUV light source 108, a collimator 110 and a monochromator 112. A plasma source or a synchrotron, which emit radiation in the EUV range (extreme ultraviolet range), that is to say for example in the wavelength range from 0.1 nm to 30 nm, may for example be provided as the EUV light source 108. The radiation emitted by the EUV light source 108 is first focused by the collimator 110, after which the desired operating wavelength is filtered out by the monochromator 112. Consequently, the beam shaping system 102 adapts the wavelength and the spatial distribution of the light emitted by the EUV light source 108. The EUV radiation 114 generated by the EUV light source 108 has a relatively low transmissivity through air, for which reason the beam guiding spaces in the beam shaping system 102, in the illumination system 104 and in the projection system 106 are evacuated.
[0112] In the depicted example, the illumination system 104 includes a first mirror 116 and a second mirror 118. These mirrors 116, 118 may for example be formed as facet mirrors for pupil shaping and conduct the EUV radiation 114 to a photomask 120.
[0113] The photomask 120 is likewise formed as a reflective optical element and may be arranged outside the systems 102, 104, 106. The photomask 120 has a structure which is imaged onto a wafer 122 or the like in a reduced fashion via the projection system 106. For this purpose, the projection system 106 has in the beam guiding space for example a third mirror 124 and a fourth mirror 126. It should be noted that the number of mirrors of the EUV lithography apparatus 100 is not restricted to the number represented. A greater or lesser number of mirrors can also be provided. Furthermore, the mirrors, as a rule, are curved on their front side for beam shaping.
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[0115] The optical system 200 has a holding frame 202 (in the present case also “base holding frame”), a sensor frame 204 (in the present case also “base sensor frame”) and, by way of example, optical elements in the form of the two mirrors 124, 126. The optical system 200 furthermore has two sensors 206a, 206b. A corresponding modular sensor frame 208a, 208b and a corresponding modular holding frame 210a, 210b are provided for each of the two mirrors 124, 126.
[0116] A sensor 206a, 206b has a transmitting and receiving unit 212 and a corresponding measurement object 214, which sends an optical signal back to the transmitting and receiving unit 212. The position and/or spatial orientation of one of the mirrors 124, 126 can be determined on the basis of the signal that is sent back. The transmitting and receiving unit 212 of the sensor 206a, 206b is preferably attached to the sensor frame 204. In this case, the measurement object 214, which sends the signal back to the transmitting and receiving unit 212, is arranged at the respective modular sensor frame 208a, 208b, which is associated with the corresponding mirror 124, 126. Alternatively, the measurement object 214 can also be attached to the sensor frame 204. The transmitting and receiving unit 212 is then attached to the modular sensor frame 208a, 208b, which is associated with the corresponding mirror 124, 126. At least part of a respective sensor 206a, 206b is accordingly attached to the sensor frame 204.
[0117] The optical system 200 has a module control loop 216a, 216b for each of the two mirrors 124, 126. Each of the module control loops 216a, 216b depicted in
[0118] The optical system 200 depicted in
[0119] The sensor 224a, 224b has a transmitting and receiving unit 226 and a corresponding measurement object 228, which sends a signal back to the transmitting and receiving unit 226. The position and/or spatial orientation of one of the mirrors 124, 126 relative to the modular sensor frame 208a, 208b can be determined on the basis of the signal that is sent back. The transmitting and receiving unit 226 is preferably attached to the modular sensor frame 208a, 208b. In this case, the measurement object 228 is arranged at the mirror 124, 126. Alternatively, the arrangement can also be the other way around. At least part of the sensor 224a, 224b is accordingly attached to the modular sensor frame 208a, 208b.
[0120] One of the mirrors 124, 126, the corresponding modular sensor frame 208a, 208b and/or the corresponding modular holding frame 210a, 210b can in each case form a module 232a, 232b. The respective module 232a, 232b can be installed and removed from the optical system 200 as a component.
[0121] Alternatively, the optical system 200 does not have a modular holding frame 210a, 210b and/or a modular sensor frame 208a, 208b for each mirror 124, 126 (or for no mirror 124, 126). Positioning and/or spatial orientation of the mirrors 124, 126 is performed for the mirrors 124, 126 without associated modular holding frame 210a, 210b and modular sensor frame 208a, 208b only via the optical control loops 233a, 233b.
[0122] The mirrors 124, 126 are always capable of being positioned and spatially oriented in six degrees of freedom. This ability to be positioned and spatially oriented can be achieved by way of the module and/or optical control loop 216a, 216b, 233a, 233b. In the sum, the ability to be positioned and spatially oriented in six degrees of freedom, i.e. the ability to be positioned and spatially oriented in three spatial directions and at three angles, is always achieved by way of the control loops 216a, 216b, 233a, 233b.
[0123] The actuators 218a, 218b and the actuators 222a, 222b form a cascaded system. By way of example, the module control loop 216a, 216b can increase the actuation range of the mirror 124, 126 and thus ideally complement the optical control loop 233a, 233b, which is highly precise but in turn limited in the actuation range. This permits both coarse and fine adjustment.
[0124] The sensor frame 204 is arranged partially or completely within a volume V (see
[0125] The respective modular sensor frame 208a, 208b can be connected to the respective modular holding frame 210a, 210b via in particular oscillation-decoupling connecting elements 230 (see
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[0127] The sensor frame 204 has a base body 301 and, projecting therefrom, a first arm 302, a second arm 304, and a third arm 306. Consequently, the sensors 206a, 206b can be arranged near the modular sensor frames 208a, 208b. Alternatively, the sensor frame can also be configured in the form of a scaffold. In a further alternative, a plurality of arms of the sensor frame 204 can form a star shape. The arms 302, 304, 306 and the base body 301 are configured in one part or in one piece.
[0128] The measurement distance, or the measurement section, 308 is the distance between the transmitting and receiving unit 212 and the measurement body 214 and is less than 8 mm, preferably less than 4 mm and with further preference less than 1 mm. A small measurement distance 308 permits very accurate measurement of the position and/or of the spatial orientation of the modular sensor frame 208 and thus of the mirror 124, 126. The small measurement distance 308 is achieved by way of the arms 302, 304, 306 having the sensors 206a, 206b and reaching to the modular sensor frames 208a, 208b.
[0129] The sensor frame 204 shown in
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[0132] The measurement mirror 506 and the optical component 508 are fixedly connected to the sensor frame 204. The optical component 508 has, on its side facing the measurement mirror 506, a reference surface 518. The reference surface 518 is inclined relative to the measurement mirror 506. The radiation reflected at the measurement mirror 506, illustrated by way of a third ray 520 and a fourth ray 522, is directed via the deflection mirror 516 and through the opening 510 back into the interferometer component 504. In the process, the radiation passes for a second time through the optical component 508. Owing to the reference surface 518 being inclined relative to the measurement mirror 506, the third and fourth rays 520, 522 have different optical paths and phases. As a consequence, an interferogram 524 can be seen in the interferometer component 504. The different optical paths and phases of the third and fourth rays 520, 522 are symbolized by way of the returning fourth ray 522 starting only at the reference surface 518.
[0133] A measurement section 526 is located between the measurement mirror 506 and the optical component 508. If the length of the sensor frame 204 changes, the length of the measurement section 526 will also change. This change in length can be read in the interferogram 524.
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[0136] The concave mirror 604 is fixedly connected to the sensor frame 204 using a connecting element 616. The grating 606 is likewise fixedly connected to the sensor frame 204. If the sensor frame 204 bends, the concave mirror 604 will be tilted. This is symbolized by way of the curved double-headed arrow 618. As a result, the moiré measurement section 620 is lengthened or shortened, and the image of the left-hand part 610 of the grating 606 will be shifted to the right-hand part 612 of the grating 606. This effects a change in the moiré pattern, which is detected by way of the camera 602.
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[0141] The measurement of the position and/or spatial orientation of the mirror 124, 126 in step S2 can be effected in a contact-free manner. Furthermore, the measurement of the position and/or spatial orientation of the mirror 124, 126 in step S2 can be effected using one or more optical sensors 206a, 206b, 224a, 224b.
[0142] Exemplary embodiments for an optical system 200 of an EUV lithography apparatus with a wavelength of the operating light of between 0.1 and 30 nm have been explained. However, the disclosure is not restricted to EUV lithography apparatuses and may also be applied to other lithography apparatuses. A DUV (deep ultraviolet) lithography apparatus having a wavelength of the operating light of between 30 and 250 nm is mentioned here by way of example. The optical system 200 can furthermore also be used in a photomask inspection system for inspecting a photomask 120.
[0143] Although the disclosure has been described on the basis of various exemplary embodiments, it is not in any way restricted to them but rather can be modified in a wide variety of ways.
LIST OF REFERENCE SIGNS
[0144] 100 EUV lithography apparatus
[0145] 102 Beam shaping system
[0146] 104 Illumination system
[0147] 106 Projection system
[0148] 108 EUV light source
[0149] 110 Collimator
[0150] 112 Monochromator
[0151] 114 EUV radiation
[0152] 116 First mirror
[0153] 118 Second mirror
[0154] 120 Photomask
[0155] 122 Wafer
[0156] 124 Third mirror
[0157] 126 Fourth mirror
[0158] 200 Optical system
[0159] 202 Holding frame
[0160] 204 Sensor frame
[0161] 206a, 206b Sensor
[0162] 208a, 208b Modular sensor frame
[0163] 210a, 210b Modular holding frame
[0164] 212 Transmitting and receiving unit
[0165] 214 Measurement object
[0166] 216a, 216b Module control loop
[0167] 218a, 218b Actuator
[0168] 222a, 222b Actuator
[0169] 224a, 224b Sensor
[0170] 226 Transmitting and receiving unit
[0171] 228 Measurement object
[0172] 230 Connecting element
[0173] 232a, 232b Module
[0174] 233a, 233b Optical control loop
[0175] 300 Hole
[0176] 301 Base body
[0177] 302 First arm
[0178] 304 Second arm
[0179] 306 Third arm
[0180] 308 Measurement distance
[0181] 500 Part
[0182] 501 Reference
[0183] 502 Phase-shifting interferometer
[0184] 504 Interferometer component
[0185] 506 Measurement mirror
[0186] 508 Optical component
[0187] 510 Opening
[0188] 512 First ray
[0189] 514 Second ray
[0190] 516 Deflection mirror
[0191] 518 Reference surface
[0192] 520 Third ray
[0193] 522 Fourth ray
[0194] 524 Interferogram
[0195] 526 Measurement section
[0196] 600 Interferometer with moiré measurement technology
[0197] 602 Camera
[0198] 604 Concave mirror
[0199] 606 Grating
[0200] 608 Light source
[0201] 610 Part of the grating
[0202] 612 Part of the grating
[0203] 614 Observation optical unit
[0204] 616 Connecting element
[0205] 618 Curved double-headed arrow
[0206] 620 Moiré measurement section
[0207] 700 Plane mirror
[0208] V Volume