Method of Laser Treatment of a Semiconductor Wafer Comprising AlGaInP-LEDs to Increase their Light Generating Efficiency

Abstract

Embodiments provide a method for treating a semiconductor wafer comprising a set of aluminum gallium indium phosphide light emitting diodes (AlGaInP-LEDs) to increase a light generating efficiency of the AlGaInP-LEDs, wherein each AlGaInP-LED includes a core active layer for light generation sandwiched between two outer layers, the core active layer having a central light generating area and a peripheral edge surrounding the central light generating area, wherein the method includes treating the peripheral edge of the core active layer of each AlGaInP-LED with a laser beam thereby increasing a minimum band gap in each peripheral edge to such an extent that, during operation of the AlGaInP-LED, an electron-hole recombination is essentially confined to the central light generating area.

Claims

1.-11. (canceled)

12. A method for treating a semiconductor wafer comprising a set of aluminum gallium indium phosphide light emitting diodes (AlGaInP-LEDs) to increase a light generating efficiency of the AlGaInP-LEDs, wherein each AlGaInP-LED includes a core active layer for light generation sandwiched between two outer layers, the core active layer having a central light generating area and a peripheral edge surrounding the central light generating area, the method comprising: treating the peripheral edge of the core active layer of each AlGaInP-LED with a laser beam thereby increasing a minimum band gap in each peripheral edge to such an extent that, during operation of the AlGaInP-LED, an electron-hole recombination is essentially confined to the central light generating area.

13. The method of claim 12, wherein the laser beam treatment involves scanning the wafer with the laser beam according to a predefined pattern.

14. The method of claim 13, wherein a photon energy of the laser beam is higher than the minimum band gap of the core active layer and lower than band gaps of the two outer layers such that, during the laser beam treatment, a laser beam energy is primarily transferred to the core active layer's peripheral edge.

15. The method of claim 12, wherein each AlGaInP-LED is a red light LED.

16. The method of claim 12, wherein a wavelength of the laser beam is chosen within a range of 550 to 640 nm.

17. The method of claim 12, wherein the laser beam comprises a Gaussian profile.

18. The method of claim 12, wherein the laser beam is generated by a pulsed laser.

19. The method of claim 12, further comprising, prior to the laser beam treatment, heating the wafer to a background temperature to reduce power requirements of the laser beam treatment.

20. The method of claim 12, wherein a laser beam power density is between 0.1 and 100 mJ/mm2, inclusive.

21. The method of claim 12, wherein a laser beam power density is between 1 and 10 mJ/mm2, inclusive.

22. The method of claim 12, further comprising: after the laser beam treatment, etching the wafer thereby obtaining, for each AlGaInP-LED, a chip preform; and after etching, dicing the wafer into individual AlGaInP-LED chips.

23. The method of claim 22, wherein dicing comprises laser cutting.

24. The method of claim 12, wherein a duration of the laser beam treatment is between 1 s and 10 min.

25. The method of claim 12, wherein a duration of the laser beam treatment is between 10 s and 2 min.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present disclosure will now be described in detail with reference to the accompanying drawings, in which:

[0023] FIG. 1 is a schematic representation of a semiconductor wafer prior to being subjected to the method of the present disclosure;

[0024] FIG. 2 is a cross-sectional view according to the arrows II of FIG. 1 of one AlGaInP-LED, which is part of the wafer of FIG. 1;

[0025] FIG. 3 is a flow diagram showing the steps of obtaining individual AlGaInP-LED chips, starting from the wafer shown in FIG. 1, and involving the process of the present disclosure; and

[0026] FIG. 4 shows the effects of the method of the present disclosure on the bandgap shape of the peripheral edge of the core active layer of an AlGaInP-LED.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

[0027] With reference to FIG. 1, there is shown a semiconductor wafer 10 comprising a set of aluminum gallium indium phosphide light-emitting diodes (AlGaInP-LEDs) 12. In the example of FIG. 1, there are twenty LEDs 12 arranged in the wafer 10. Each LED is a PN junction, which has been formed in the wafer 10 according to well-known methods.

[0028] FIG. 2 is a cross section of one of the LEDs 12. Each LED 12 includes a core active layer 14 for light generation sandwiched between two outer layers 16 and 18. The core active layer 14 has a central light generating area 20. This area 20 is identified by the dotted region. The central light generating area 20 is surrounded by a peripheral edge 22.

[0029] With reference to the left part of FIG. 4, we will now describe the bandgap structure of the LED 12 shown in FIG. 2. The bandgap diagram in Figure 4 shows the bandgap as a function of the depth T into the LED 12, see FIG. 2. The upper outer layer 16 of the LED 12 is a P-doped layer. The bandgap shape of this P-type doped layer 16 is a P-ramp 24, followed by a P-setback 26. The bandgap of the P-setback 26 is denoted by BG1. The bandgap shape of the active layer 14 is, along the depth T, a series of quantum wells Q separated by barriers B. In the example shown in Figure 4, active layer 14 has two quantum wells Q separated by one barrier B. The quantum wells Q define a bandgap BG2, which is smaller than the bandgap BG1. The bandgap of the quantum wells Q is the minimum bandgap of the core active layer 14. The lower outer layer 18 has a bandgap shape comparable to the one of the upper outer layer 16, with a setback 28, and ramp 30. However, the lower outer layer 18 is N-type doped.

[0030] Turning now to FIG. 3, individual LED chips 38 with increased light generating efficiency are obtained from the wafer 10 as follows:

[0031] In a first step a), a hatched zone Z of the wafer 10 is treated with a laser beam L, as depicted in the small process drawing located right to the flow diagram's first arrow 100. The laser beam treatment involves scanning wafer 10 according to a predefined pattern. More precisely, the laser beam L scans the surface of the wafer 10, which is not taken up by the LEDs 12, and, on top of that, the peripheral edges 22 of the core active layers 14 of the LEDs 12. Different scanning patterns are possible, as long as the pattern involves the scanning of the peripheral edges 22 of the core active layers 14 of the LEDs 12.

[0032] The photon energy of the laser beam L is higher than the minimum bandgap BG2 of the core active layer 14 and lower than the bandgap BG1 of the two outer layers 16 and 18. Hence, during the laser beam treatment, the laser beam energy is primarily transferred to the core active layer's peripheral edge 22.

[0033] The laser beam's wavelength is chosen in particular such that only the quantum wells Q, the barriers Band the setbacks 26, 28 are optically stimulated, as illustrated by the arrows E in FIG. 4. For example, the wavelength of the laser beam may be chosen anywhere within the range of 550 to 640 nm.

[0034] Furthermore, the shape or profile of the laser beam may in particular correspond to a Gaussian profile.

[0035] The laser beam may be a pulsed laser, such as a nano- pico- or femtosecond laser. The power density of the laser beam may be between 0.1 and 100 mJ per mm2, and preferably between 1 and 10 mJ per mm2. The overall duration of the wafer's laser beam treatment may be between 1 second and 10 minutes, and preferably between 10 seconds and 2 minutes.

[0036] The effect of the laser beam treatment on the bandgap structure is shown on the right hand side of FIG. 4. It is apparent that the laser beam L, by locally heating the treated area, effectively destroys the quantum wells Q. Hence, after the laser beam treatment, the peripheral edges 22 no longer have any core active layer 14. The laser beam treatment results in a mixing of the quantum well material with the barrier material (so-called quantum well intermixing), which increases the bandgap.

[0037] After the laser beam treatment 100, the semiconductor wafer 10 may be etched (so-called “Mesa etching”), thus obtaining for each LED 12, a chip preform 32. The etching step 102 is identified by the letter b) in FIG. 3. The etched parts of the wafer 10 are highlighted by a crosshatch pattern Y. Each chip preform 32 has a central zone 34 and a peripheral boundary 36. The peripheral boundary 36 has been laser treated and thus lacks any core active layer 14. In contrast thereto, the central zone 34 still has a core active layer 14.

[0038] In order to obtain individual LED chips 38, wafer 10 is diced, e.g. by laser cutting, as shown in step 104 of FIG. 3.

[0039] The laser treatment step wo may optionally be preceded by a step of heating the semiconductor wafer 10 to a background temperature to reduce the power requirements of the laser beam treatment.

[0040] Thanks to the laser beam treatment of the present disclosure, during operation of the LED chips 38, the electron-hole recombination is essentially confined to the central light generating area 20. This is because of the increased bandgap in the peripheral edges 22, which prevents electron-hole pairs from entering the same.

[0041] The laser treatment method of the present disclosure is especially useful for very small red LEDs, which are e.g. used as part of high resolution monitors and displays.

[0042] Although the invention has been illustrated and described in detail by means of the preferred embodiment examples, the present invention is not restricted by the disclosed examples and other variations may be derived by the skilled person without exceeding the scope of protection of the invention.