SYSTEM AND METHOD FOR TESTING A HEATING SYSTEM

Abstract

A system for determining a resistivity of a heating system for an aerosol generating article, the system including: a receptacle configured to receive a plurality of elements, each element including a heating system to be tested; and a testing assembly including: a plurality of sensors, each sensor including at least a pair of electrical contacts configured to pass an electric current therethrough and being configured to obtain signals related to properties of the heating system of each of the plurality of elements, and a processor configured to receive the signals obtained by the sensors and determine a resistivity of the heating system of each of the plurality of elements, the sensors being biasedly held in the testing assembly.

Claims

1.-15. (canceled)

16. A system for determining a resistivity of a heating system for an aerosol generating article, the system comprising: a receptacle configured to receive a plurality of elements, each element comprising a heating system to be tested; and a testing assembly comprising: a plurality of sensor units, each sensor unit comprising at least a pair of electrical contacts configured to pass an electric current therethrough and being configured to obtain signals related to properties of the heating system of each of the plurality of elements, and a processor configured to receive the signals obtained by the sensor units and determine a resistivity of the heating system of each of the plurality of elements, wherein the sensor units are biasedly held in the testing assembly.

17. The system according to claim 16, wherein the signals related to properties of the heating system of each of the plurality of elements are obtained substantially simultaneously by the sensor units.

18. The system according to claim 16, wherein the testing assembly is configured to obtain the signals when the testing assembly is in a testing configuration.

19. The system according to claim 16, wherein at least one of the plurality of sensor units comprises at least an optical sensor.

20. The system according to claim 16, wherein the signals obtained relate to at least one of current, voltage, or light.

21. The system according to claim 16, wherein the properties of the heating system tested relate to at least one of resistivity of the element, spatial location of the element, or physical condition of the element.

22. The system according to claim 16, wherein the determined resistivity is at least one of integrity of the heating system, conformity of the heating system to a predetermination condition, or functionality of the heating system.

23. The system according to claim 16, wherein the receptacle is a plate with a plurality of cavities, each cavity being configured to receive an element.

24. The system according to claim 16, wherein the heating system of each element comprises a mesh foil.

25. The system according to claim 16, wherein the sensor units are held within channels of the testing assembly under their own weight.

26. The system according to claim 25, wherein the sensor units are configured to be displaced from, or within, their respective channel.

27. A method of determining a state of a heating system for an aerosol generating article, the method comprising: providing a system according to claim 16; populating the receptacle with a plurality of elements, each element comprising a heating system to be tested; actuating the plurality of sensor units to obtain signals related to properties of the heating system of each of the plurality of elements; and determining, with the processor, a resistivity of the heating system of each of the plurality of elements from the obtained signals.

28. The method according to claim 27, further comprising bringing the testing assembly into a testing configuration.

29. The method according to claim 27, further comprising removing the plurality of elements from the receptacle and repopulating the receptacle with a further plurality of elements.

Description

[0100] Embodiments of the invention will now be described by way of example only with reference to the accompanying drawings in which:

[0101] FIG. 1 illustrates a cartridge for use in an aerosol generating device;

[0102] FIG. 2 illustrates another cartridge for use in an aerosol generating device;

[0103] FIG. 3 illustrates a profile view of an example system for determining a state of a heating system;

[0104] FIG. 4 illustrates a sensor unit for use in a system for determining a state of a heating system; and

[0105] FIG. 5 illustrates a cutaway view of the system of FIG. 3.

[0106] Referring now to FIG. 3, a system 100 for determining a state, for example a resistivity of a heating system is illustrated. The system 100 includes a receptacle 102 for receiving a plurality of elements (not shown), each element including a heating system to be tested.

[0107] In this example, the element is a component of an aerosol generating article or device of the ‘heat not burn’ variety, the component incorporating the heating system of the aerosol generating article or device. Specifically, the element corresponds to a cartridge for an aerosol generating device, the cartridge being configured to be connected to the main body of an aerosol generating device. In the described example, the heating system of each element includes a mesh-heater unit. That is, the heating system includes a mesh foil configured to provide a heat output in response to a current flow therethrough. For example, the element may be a cartridge as described in WO 2015/117702 or as otherwise described above.

[0108] In this example, the receptacle 102 is a plate with a plurality of cavities 104, each cavity configured to receive an element. In the example illustrated in FIG. 3, the plate is circular in shape, with the cavities arranged around the circumference of the plate.

[0109] A proximal end of the cartridge (i.e. the end of the cartridge proximal to the heating system, for example a mouthpiece end of the cartridge) is received by the receptacle. The heating system is exposed upwardly.

[0110] The system 100 further includes a testing assembly 106. The testing assembly 106 includes sensor means, for example sensor units, configured to obtain signals related to properties of the heating system of each of the plurality of elements. The testing assembly 106 further includes a processor configured to receive the signals obtained by the sensor means, for example sensor units, and determine a state, for example a resistivity, of the heating system of each of the plurality of elements.

[0111] As a first step of a method for determining a state, for example a resistivity, of a heating system using a system 100 in its most general form, the receptacle 102 is populated with a plurality of elements, each element comprising a heating system to be tested. In embodiments, the receptacle 102 is populated by a linear feed of elements to the receptacle. That is, the receptacle 102 is configured to be rotated, with respect to a feed point. In this example the receptacle 102 is mounted to the shaft 120 via mounting 150. As the receptacle is rotated, elements are introduced into each cavity in turn. In embodiments, the elements may be carried in pucks.

[0112] Secondly, the sensor means, for example sensor units, is actuated to obtain signals related to properties of the heating system of each of the plurality of elements. In embodiments, the signals obtained relate to at least one of current, voltage or light. In such cases, the properties tested relate to at least one of resistivity of the heating system of the element, spatial location of the element or physical condition of the heating system of the element.

[0113] For example, a signal relating to a current or voltage within the heating system may be used as an indication/measurement of resistivity of the heating system of the element. Such a signal may result from the application of a potential difference across two points of the heating system.

[0114] Similarly, a signal relating to light may be used as an indication/measurement of the spatial location of the element (or the heating system within the element) or the physical condition of the heating system of the element. For example, the light signal may be used to form an image of the heating system or element, from which the position, orientation or physical condition of the heating system or element may be determined. In embodiments, the measured/monitored light may be at the infra-red frequency, such that the temperature of the heating system may be monitored (for example, the temperature response may be measured in response to an applied voltage), or UV frequency. Alternatively (or in addition), the light signal may be a magnitude of light passing between two points. As an example, a correctly positioned heating system may prevent passage of light passing between the two points.

[0115] Thirdly, the processor determines a state, for example a resistivity, of the heating system of each of the plurality of elements from the obtained signals. In embodiments, the determined state, for example the resistivity, is at least one of integrity of the heating system of an element, conformity of the heating system of an element to a predetermined condition, or functionality of the heating system of an element. In other words, the determined state may relate to the fitness of the heating system for purpose. For example, the obtained signals may indicate that one or more properties of the heating system of an element are symptomatic of an abnormality or quality problem with the manufacture of the heating system (for example, a loss of integrity, failure to conform to resistivity performance etc).

[0116] In embodiments, the determined state may relate to the ability of the testing assembly to test the required properties of the heating system of an element. For example, the predetermined condition to which the heating system must conform may be its location within the receptacle. This may be important as if the heating system of an element (or the element itself) is not correctly located within receptacle, the required tests (for example electrical tests) cannot be undertaken.

[0117] The processor may determine the state, for example the resistivity, of the heating system of an element in any suitable way. For example, the processor may determine the state, for example the resistivity, of the heating system by comparing the obtained signals to a given set of data. That is, if the signal indicates that a property of a heating system (for example resistivity) is above a threshold value, the processor may conclude that the state of the heating system is a first state (for example, the heating system conforms to a predetermined condition). In the same manner, if the signal indicates that a property of the heating system is below the threshold value, the processor may conclude that the state of the heating system is a second state (for example, the heating system does not conform to a predetermined condition). In alternative examples, the processor may conclude that the state of the heating system is a first state if the signal indicates that a property is equal to a value (for example a spatial location) and is a second state if the signal indicates that the property is not equal to the value. The given set of data may be provided by a server, connected within a network to the processor.

[0118] In embodiments, the processor may determine the state, for example the resistivity, of the heating system from signals relating to multiple properties. For example, a state (for example a resistivity or e.g. conformity to a predetermined condition) may only be assigned once multiple properties of the heating system of an element are above/below (or equal/not equal to) a predetermined threshold.

[0119] In embodiments, the processor may manipulate the obtained signals prior to the comparison to a given set of data. That is, the obtained signals in their raw state may not directly correspond to a property of the heating system of an element. In such cases, the processor may use the obtained signals to calculate a further metric or value, which corresponds to the desired property.

[0120] The state, for example the resistivity, of the heating system of an element as determined by the processor may be used to decide how the element (or the heating system thereof) is further processed within a production line. That is, the arrangement allows for real-time data processing and feedback within the production line.

[0121] For example, it may be required that an element with a heating system having a state, for example resistivity, that indicates that the heating system is not fit for purpose (for example the heating system has a lack of integrity, does not conform to a pre-determined condition or does not function as intended) should be removed from the production line. In such examples, the processor may be configured to actuate a means for removal of the deficient element/elements from the production line (either directly from the receptacle or further down the production line).

[0122] In further examples, the processor may store the state, for example the resistivity, (or an assigned value related thereto, for example a 1 or a 0) in a memory to allow the state, for example the resistivity, of the element to be used in a decision-making process further down the production line, for example removal of a deficient element from the production line. The state, for example the resistivity, may be stored on a server. For example, the processor may send the state, for example resistivity, to a server, connected within a network to the processor. In further examples, the decision-making process may be undertaken on the server.

[0123] In a further example, the determined state, for example resistivity, may be that the heating system is in an incorrect position and hence other properties of the heating system cannot be suitably tested. In such examples, the element may be rejected, or its position within the receptacle may be corrected by a suitable actuation means.

[0124] Once the testing operations have been completed, the plurality of elements may then be removed from the receptacle. The receptacle may then be repopulated with a further plurality of elements, for which testing is required.

[0125] In this example, the testing assembly 106 is configured to obtain the signals when the testing assembly is in a testing configuration. That is, the testing assembly has a testing, or active, configuration and a non-testing, or non-active, configuration. In other words, a further step of the method may include the step of bringing the testing assembly 106 into a testing configuration prior to actuating the sensor means, for example sensor units.

[0126] The testing assembly 106 is moveable relative to the receptacle 102 to bring the sensor means, for example sensor units, into the testing configuration. The testing configuration is a configuration for which the sensor means, for example sensor units, is close enough to the plurality of elements for the required signals to be obtained. In specific embodiments, the testing configuration may require the sensor means, for example sensor units, to be in contact with the heating system or the element (i.e. where contact is required for a signal to be obtained, for example where the sensors are a pair of electrical contacts). In alternative examples, the testing configuration may only require that the sensor means, for example sensor units is close enough to collect the desired signal or information to take an image or reading of a surrounding field, in which case no contact between the sensor means, for example sensor units, and the elements is required.

[0127] In specific embodiments, the testing assembly 106 is vertically moveable with respect to the receptacle 102 to bring the testing assembly 106 into the testing configuration. In this example, the testing assembly 106 and the receptacle 102 are mounted on shaft 120. The testing assembly 106 is mounted on shaft 120 via a mounting assembly 122. The testing assembly 106 is slidably mounted on the mounting assembly 122. Prior to a testing operation, the testing assembly 106 is actuated to slide on the mounting assembly 122 towards the receptacle 102 to bring the testing assembly 106 into the testing configuration.

[0128] In addition, or alternatively in specific embodiments, the testing assembly 106 may be rotatably mounted on shaft 120 to allow relative rotation between the testing assembly 106 and the receptacle 102 to bring the testing assembly 106 into the testing configuration.

[0129] Once in the testing configuration, the testing assembly 106 can perform a testing operation on the heating systems received within the receptacle 102. That is, the sensor means, for example sensor units, can obtain signals related to the required properties from the elements/heating systems of the elements within the receptacle 102. In embodiments, the signals related to properties of the heating system of each of the plurality of elements are obtained substantially simultaneously by the sensor means, for example sensor units.

[0130] Following the testing operation, the testing assembly 106 may then be moved out of the testing configuration, back to a non-testing configuration. The elements may then be removed from the receptacle and then optionally repopulated for further testing operations.

[0131] The non-testing configuration may be defined as a relative configuration between the testing assembly 106 and the receptacle 102 that allows the receptacle 102 to be populated, or de-populated, with elements as required.

[0132] In the example illustrated in the Figures, the receptacle 102 is configured to receive more elements than the testing assembly 106 can test in a given moment. That is, the number of cavities 104 in the receptacle 102 is greater than the number of sensor units 108 (as described below) in the sensor means for example sensor units. In this manner, the receptacle may be fully populated at a given moment, with more than one plurality of elements. In other words the receptacle may be populated with one or more testing batches of elements. The testing assembly 106 may descend into its testing configuration, to perform a testing operation on a first plurality of elements. The testing assembly 106 and/or the receptacle 102 may then rotate to allow the testing assembly 106 to perform a testing operation on a second plurality of elements. In further examples, the number of sensor units 108 within the testing assembly 106 may correspond to the elements received within the receptacle 102. In such cases, the receptacle contains a single plurality of elements that can be tested simultaneously by the testing assembly.

[0133] In this example, the sensor means, for example sensor units, includes a plurality of sensor units 108, each sensor unit 108 being configured to obtain signals related to properties of the heating system of at least one of the plurality of elements.

[0134] FIG. 4 illustrates an example of a sensor unit 108. In this example, the sensor unit 108 includes a housing 116. The housing 116 is configured to house at least some of the sensing components for the sensor unit 108. In this example, the sensor unit 108 includes a shoulder portion 118.

[0135] The testing assembly 106 is configured to receive the sensor units 108 therein. FIG. 5 illustrates a cut-away view of the testing assembly 106 with a plurality of sensor units 108 received therein.

[0136] In this example, the testing assembly 106 includes a plate portion 128, covered by an optional cover portion 130. The cover portion 130, when used, may provide protection to the hardware (for example wiring) within the testing assembly 106. The plate portion 128 includes holes or channels arranged therethrough, each hole configured to receive a sensor unit 108. Each hole within the plate portion 128 includes a flange portion (not shown), which engages with the shoulder portion 118 of the corresponding sensor unit 108, to allow the sensor unit 108 to sit within the hole. This may prevent the sensor unit from rotating within the corresponding hole of the plate portion 128.

[0137] In this example, the position of holes in the plate portion 128, and hence the subsequent position of each sensor unit 108, corresponds to the position of the elements (i.e. heating systems to be tested) located within the receptacle 102. That is, the sensor units 108 are positioned such that when the testing assembly 106 is brought into its testing configuration, the sensor units 108 are able to obtain signals from the corresponding element as required.

[0138] The hardware of the sensor units 108 are coupled to the processor by any suitable connection to allow transfer of the obtained signals to the processor.

[0139] In the example shown in FIG. 4, the plurality of sensor units each include at least a pair of electrical contacts 110. The sensor unit 108 is configured such that when in the testing configuration, the pair of electrical contacts 110 are both in contact with a portion of the heating system of the corresponding element. For example, for a mesh heating system, in the testing configuration, the electrical contacts 110 may be in contact with portions of the mesh.

[0140] In this example the electrical contacts 110 are supported by a support structure 114 that extends from the housing 116 to prevent damage to the contacts 110. In embodiments, the end of the support structure 114, from which the contacts 110 extend, allows a degree of movement of the contacts 110 (for example lateral movement) without damage thereto.

[0141] In embodiments, the electrical contacts 110 (which in this example are electrical pins) can obtain electrical signals from the heating system. That is, a potential difference may be applied between the electrical contacts 110 and the resulting current that passes from a first of the contacts to the second of the contacts through the heating system may be measured. In this manner electrical properties, e.g. resistivity, of the heating system may be determined as described previously. The electrical contacts are coupled via connection points 132 (as shown in FIG. 5) to a wiring system (not shown), which allows transfer of the electrical signals to the processor.

[0142] From the electrical property, the processor can determine a state, for example a resistivity, of the heating system, for example, if the heating system can function as required, if the heating system conforms to a pre-determined condition, or if the integrity of the heating system has not been compromised. Sensor units including electrical contacts are particularly useful for testing mesh-heater systems, which require a given resistivity to operate effectively.

[0143] In embodiments, the contact areas 112 of the contacts 110 may be configured with different shapes depending on the surfaces/materials of the heating systems being tested, or the specific properties being tested.

[0144] In other examples, each sensor unit 108 may include an optical sensor. The optical sensor may include an imaging device, for example a camera. The imaging device may be configured to obtain signals related to any required frequency, for example visual frequencies, UV or infra-red frequencies.

[0145] The optical sensor may be used to test for properties, such as spatial location of the element or physical condition of the heating system of the element. For example, the optical sensor may be used to determine if the element is in a required location for further testing. In another example, the optical sensor may be used to check the position of the testing arrangement with respect to the element (for example to indicate if the element is too close to the testing arrangement). In another example, the optical sensor may be used to check if contact was made between a part of the testing arrangement (for example the electrical contacts of the sensor units) and the heating system, which may be used as an indication of a successful test operation. In such an example, the optical sensor may be used to check if there are any marks resulting from said contact.

[0146] The sensor units 108 may optionally include at least one lighting element, for illuminating the corresponding heating system to be tested. The lighting element may emit light at any required frequency, for example UV or light of a visible wavelength to illuminate the heating system. The signals obtained by the corresponding optical sensor may correspond to light reflected form the heating system.

[0147] In specific embodiments, each sensor unit 108 may be configured to obtain signals related to one or more properties (for example each sensor unit 108 may include a pair of electrical contacts and/or an optical sensor and/or further sensor means, for example sensor units, as required.

[0148] In further embodiments, the plurality of sensor units 108 may each be the same, or alternatively may be varied in their configuration (for example the plurality of sensor units may include at least one sensor unit configured to obtain signals related to a first property and at least one sensor unit configured to obtain signals related to a second property). In the alternative example, the sensors may be arranged in any suitable way. For example, the plurality of sensor units 108 may include two or more different ‘types’ of sensor unit (i.e. two or more different groups of sensor units, each group configured to measure a different property or set of properties). An example of this may be a group of sensor units, each including electrical contacts, and a further group of sensor units including an optical sensor. The groups of sensor units may be arranged side-by-side within the testing assembly, or the sensor units may alternate between sensor units of each group. In each case, the testing assembly and/or the receptacle may be rotated between testing operations to allow for each element to be tested by a sensor unit of each group.

[0149] In specific embodiments (for example that shown in the illustrated example), the sensor units are removable from the testing assembly 106. That is, if required the sensor units can be removed from the channels of the testing 106. Such removal allows different testing operations (i.e. obtaining different signals) to be performed, if required. For example, this may be necessary if there is a requirement to test a batch of different elements.

[0150] Various modifications to the detailed arrangements as described above are possible. For example, in alternative examples, the heating system of each element may include a coil and wick heating system.

[0151] It would be understood that the sensor means, for example sensor units, described in the examples above is not exhaustive. For example, the sensor means, for example sensor units, may include temperature sensors (for example to monitor the temperature response to an applied voltage), molecular or gas sensor means.

[0152] A single sensor unit 108 may be configured to obtain signals from one or more of the heating systems of elements. Specifically, a single sensor unit 108 may be located in a way that it can obtain signals from more than one (for example two adjacent heating systems). In such cases, the single sensor unit 108 may include separate sets of sensors to obtain signals from the one or more heating systems simultaneously.

[0153] The sensor units 108 may be fixed within the testing assembly 106 prior to a testing operation. In alternative examples, the sensor units remain free within the testing assembly 106. That is, the sensor units 108 are held within the channels in the testing assembly 106 under their own weight only. In this manner, if, when brought into the testing configuration, the elements (or heating systems thereof) are located in an incorrect position within the receptacle 102, the testing assembly 106 may still arrive into the testing configuration without damaging the testing assembly 106 or the element to be tested. That is, the sensor units 108 can be displaced from (or within) their respective channels to accommodate the incorrectly positioned element. In specific embodiments, the shoulder portion 118 of the sensor unit 108 may prevent rotation of the sensor unit 108 but still allow displacement or movement from the testing assembly, for example vertical movement. This is to prevent damage.

[0154] In embodiments, the sensor units 108 may be biasedly held within the testing assembly 106. For example, the sensor units 108 may be spring actuated, such that the testing configuration is achieved through movement of the sensor units 108 against the bias of a spring, as opposed to movement of the testing assembly 106 as a whole. In this manner, swift ‘reloading’ of the sensor units may be achieved (i.e. a return to a non-testing configuration) once a testing operation is complete. This is of particular relevance for sensor units that require contact with the heating system to obtain a signal (for example sensor units including electrical contacts). In the relevant embodiments, the electrical contacts 110 may be moveable or biased in the same way.

[0155] It will also be appreciated by those skilled in the art that any number of combinations of the aforementioned features and/or those shown in the appended drawings provide clear advantages over the prior art and are therefore within the scope of the invention described herein.

[0156] The schematic drawings are not necessarily to scale and are presented for purposes of illustration and not limitation. The drawings depict one or more aspects described in this disclosure. However, it will be understood that other aspects not depicted in the drawings fall within the scope of this disclosure.