ENCAPSULATION OF ELECTRONIC COMPONENTS ON SUBSTRATE FOR HEARING DEVICE

Abstract

Disclosed is a system, a hearing device and a method for encapsulating one or more electronic components on a substrate. The method comprises providing a dam on the substrate, the dam is provided around the one or more electronic components, the dam comprises a dam material comprising an electrically conducting material. The method comprises providing a liquid fill encapsulation material within the dam on the substrate, the fill encapsulation material encapsulates the one or more electronic components, the fill encapsulation material is configured to solidify, the solidified fill encapsulating material comprises a first surface exposed to surroundings. The method comprises applying a cover material on the first surface of the solidified fill encapsulation material, the cover material comprising an electrically conducting material, whereby the one or more electronic components are encapsulated and electromagnetically shielded.

Claims

1. A method for covering one or more electronic components on a substrate, the method comprising: providing a dam on the substrate, wherein the dam is provided around the one or more electronic components, the dam comprising a dam material, wherein the dam material comprises an electrically conductive material; providing a liquid encapsulation material within the dam, wherein the liquid encapsulation material is provided to encapsulate the one or more electronic components, the liquid encapsulation material configured to solidify to form a solidified encapsulating material having a first surface; and applying a cover material over the first surface of the solidified fill encapsulation material, wherein the one or more electronic components are at least partly electromagnetically shielded by the cover material.

2. The method of claim 1, wherein the cover material is provided on the first surface of the solidified fill encapsulation material.

3. The method of claim 1, wherein the cover material, and/or the solidified encapsulation material and/or the dam material are configured to connect to each other.

4. The method of claim 1, wherein the dam material, and/or the liquid encapsulation material, and/or the cover material comprise(s) an epoxy-based material, an acrylic based material and/or a polymer-based material.

5. The method of claim 1, wherein the dam material comprises a first material, which is a mixture of an epoxy-based material and the electrically conductive material.

6. The method of claim 1, wherein the dam material comprises at least a primary material and a secondary material, wherein the primary material comprises an epoxy-based material, and wherein the secondary material comprises the electrically conductive material.

7. The method of claim 1, wherein the substrate comprises a conductive track interconnected with a ground plane of the substrate, and wherein the dam is on at least a part of the conductive track.

8. The method of claim 1, wherein the dam material is cured before the liquid encapsulation material is provided.

9. The method of claim 1, wherein the dam material and the liquid encapsulation material are cured together.

10. The method of claim 1, wherein the one or more electronic components comprise surface mounted component(s) or discrete component(s).

11. The method of claim 1, wherein the one or more electronic components comprise integrated circuit chip(s).

12. The method of claim 1, wherein the one or more electronic components comprise a system-in-a-package.

13. The method of claim 1, wherein the substrate is a printed circuit board (PCB).

14. The method of claim 1, wherein the substrate is a carrier printed circuit board (PCB).

15. The method of claim 1, wherein the substrate is a panel configured to be mounted on a printed circuit board.

16. The method of claim 1, wherein the one or more electronic components are a subset of components on the substrate.

17. The method of claim 1, wherein at least some of the liquid encapsulation material is provided on the substrate.

18. The method of claim 1, wherein the one or more electronic components are at least partly electromagnetically shielded by the dam.

19. The method of claim 1, wherein the first surface of the solidified encapsulating material is exposed to a surrounding before the cover material is applied.

20. The method of claim 1, wherein the cover material is electrically conductive.

21. A system comprising: a substrate; one or more electronic components on the substrate; a dam on the substrate, the dam surrounding the one or more electronic components, the dam comprising a dam material, wherein the dam material comprises an electrically conductive material; an encapsulation material within the dam, the encapsulation material encapsulating the one or more electronic components, the encapsulating material comprising a first surface; a cover material disposed over the first surface of the encapsulation material, the cover material configured to at least partly electromagnetically shield the one or more electronic components.

22. The system of claim 21, wherein the system is a hearing device.

23. The system of claim 21, wherein the dam material comprises a mixture of an epoxy-based material and the electrically conductive material.

24. The system of claim 21, wherein the substrate comprises a conductive track interconnected with a ground plane of the substrate, and wherein the dam is on at least a part of the conductive track.

25. The system of claim 21, wherein the one or more electronic components comprise surface mounted component(s) or discrete component(s).

26. The system of claim 21, wherein the one or more electronic components comprise integrated circuit chip(s).

27. The system of claim 21, wherein the one or more electronic components comprise a system-in-a-package.

28. The system of claim 21, wherein the substrate is a printed circuit board (PCB).

29. The system of claim 21, wherein the substrate is a carrier printed circuit board (PCB).

30. The system of claim 21, wherein the substrate is a panel configured to be mounted on a printed circuit board.

31. The system of claim 21, wherein at least some of the encapsulation material is on the substrate.

32. The system of claim 21, wherein the one or more electronic components are at least partly electromagnetically shielded by the dam.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0070] The above and other features and advantages will become readily apparent to those skilled in the art by the following detailed description of exemplary embodiments thereof with reference to the attached drawings, in which:

[0071] FIGS. 1a) and 1b) schematically illustrates an example of method 100 for encapsulating one or more electronic components on a substrate.

[0072] FIGS. 2a), 2b), 2c) and 2d) schematically illustrate an example of a substrate 4 with encapsulated electronic components 2 and a method or process for encapsulating the one or more electronic components 2 on the substrate 4.

[0073] FIGS. 3a), 3b), 3c), 3d) and 3e) schematically illustrate an example of a substrate 4 with encapsulated electronic components 2 and a method or process for encapsulating the one or more electronic components 2 on the substrate 4.

[0074] FIG. 4 schematically illustrates an example of a hearing device 20.

[0075] FIGS. 5a) and 5b) schematically illustrate an example of a block-diagram of an embodiment of a hearing device 200.

DETAILED DESCRIPTION

[0076] Various embodiments are described hereinafter with reference to the figures. Like reference numerals refer to like elements throughout. Like elements will, thus, not be described in detail with respect to the description of each figure. It should also be noted that the figures are only intended to facilitate the description of the embodiments. They are not intended as an exhaustive description of the claimed invention or as a limitation on the scope of the claimed invention. In addition, an illustrated embodiment needs not have all the aspects or advantages shown. An aspect or an advantage described in conjunction with a particular embodiment is not necessarily limited to that embodiment and can be practiced in any other embodiments even if not so illustrated, or if not so explicitly described.

[0077] Throughout, the same reference numerals are used for identical or corresponding parts.

[0078] FIGS. 1a) and 1b) schematically illustrates an example of method 100 for encapsulating one or more electronic components on a substrate.

[0079] In FIG. 1a), the method 100 comprises providing 102 a dam on the substrate. The dam is provided around the one or more electronic components. The dam comprises a dam material comprising an electrically conducting material. The method 100 comprises providing 106 a liquid fill encapsulation material within the dam on the substrate. The fill encapsulation material encapsulates the one or more electronic components. The fill encapsulation material is configured to solidify. The solidified fill encapsulating material comprises a first surface exposed to surroundings. The method 100 comprises applying 110 a cover material on the first surface of the solidified fill encapsulation material. The cover material comprises an electrically conducting material. Thereby the one or more electronic components are encapsulated and electromagnetically shielded.

[0080] In FIG. 1b), the method 100 comprises providing 102 a dam on the substrate. The dam is provided around the one or more electronic components. The dam comprises a dam material comprising an electrically conducting material. The method 100 comprises curing 104 the dam material. The method 100 comprises providing 106 a liquid fill encapsulation material within the dam on the substrate. The fill encapsulation material encapsulates the one or more electronic components. The fill encapsulation material is configured to solidify. The solidified fill encapsulating material comprises a first surface exposed to surroundings. The method 100 comprises curing 108 the fill encapsulation material. The method 100 comprises applying 110 a cover material on the first surface of the solidified fill encapsulation material. The cover material comprises an electrically conducting material. The method 100 comprises performing a final curing 112 of the materials. Thereby the one or more electronic components are encapsulated and electromagnetically shielded. The method 100 may further comprise applying an environmental protection on the cover material and the outside walls of the dam.

[0081] FIG. 2 schematically illustrates an example of a substrate 4 with encapsulated electronic components 2 and a method or process for encapsulating the one or more electronic components 2 on the substrate 4. The substrate 4 is seen from above, in a top view, in FIG. 2.

[0082] In FIG. 2a), a substrate 4 is shown. The substrate 4 comprises one or more electronic components 2. The substrate 4 may be a printed circuit board. The electronic components 2 may be assembled on the substrate 4 as surface mounted components. The electronic components may be transistors, capacitors, signal processing units etc. The electronic components may be different components or the same components. The electronic components may have different sizes and shapes, such as different height, different volumes etc.

[0083] In FIG. 2b), a dam 6 is provided around the one or more electronic components 2. The dam 2 comprises a dam material comprising an electrically conducting material. The dam 6 is provided around some of the electronic components 2 on the substrate 4, and some of the electronic components 2′ are not surrounded by the dam 6. The dam 2 may be arranged at least partly on or in connection with a ground ring of the substrate 4.

[0084] In FIG. 2c), a liquid fill encapsulation material 8 is provided within the dam 6 on the substrate 4. The fill encapsulation material 8 encapsulates the one or more electronic components 2. The fill encapsulation material 8 is configured to solidify. The solidified fill encapsulating material 8 comprises a first surface exposed to surroundings. The fill encapsulation material 8 may be dark, such as black, as shown in this figure, or it may have another color.

[0085] In FIG. 2d), a cover material 14 is applied on the first surface of the solidified fill encapsulation material 8. The cover material 14 comprises an electrically conducting material. Due to the electrically conducting dam material and cover material, the one or more electronic components 2 are encapsulated and electromagnetically shielded.

[0086] FIG. 3 schematically illustrates an example of a substrate 4 with encapsulated electronic components 2 and a method or process for encapsulating the one or more electronic components 2 on the substrate 4. The substrate 4 is seen from the side in a cross-section, in a side cross-section view, in FIG. 3.

[0087] In FIG. 3a), a substrate 4 is shown. The substrate 4 comprises one or more electronic components 2. The substrate 4 may be a printed circuit board. The electronic components 2 may be assembled on the substrate 4 as surface mounted components. The electronic components may be transistors, capacitors, signal processing units etc. The electronic components may be different components or the same components. The electronic components may have different sizes and shapes, such as different height, different volumes etc.

[0088] A ground ring 16 or a connection to a ground plane 16 is provided in the substrate 4.

[0089] In FIG. 3b), a dam 6 is provided around the one or more electronic components 2. The dam 2 comprises a dam material comprising an electrically conducting material. The dam 6 is provided around some of the electronic components 2 on the substrate 4, and some of the electronic components 2′ are not surrounded by the dam 6. The dam 6 may be provided on the ground ring 16 or interconnected with a ground plane 16. The height H of the dam 6 may be smaller than the height of the highest of the electronic components. The height H of the dam 6 may be equal to the height of the highest of the electronic components. The height H of the dam 6 may be higher than the height of the highest of the electronic components. The width W of the dam 6 may be smaller than the height of the dam 6. The width W of the dam 6 may be equal to the height of the dam 6. The width W of the dam 6 may be larger than the height of the dam 6.

[0090] In FIG. 3c), a liquid fill encapsulation material 8 is provided within the dam 6 on the substrate 4. The fill encapsulation material 8 encapsulates the one or more electronic components 2. The fill encapsulation material 8 is configured to solidify. The solidified fill encapsulating material 8 comprises a first surface 10 exposed to surroundings 12. The first surface 10 may point upwards in a manufacturing process. The first surface 10 may be parallel to the substrate 4. A vector normal to the first surface 10 may be parallel to the substrate 4. The first surface 10 may be flat and homogenous.

[0091] In FIG. 3d), a cover material 14 is applied on the first surface 10 of the solidified fill encapsulation material 8. The cover material 14 comprises an electrically conducting material. Due to the electrically conducting dam material 6 and cover material 14, the one or more electronic components 2 are encapsulated and electromagnetically shielded.

[0092] In FIG. 3e), an environmental protection 18 is applied on the cover material 14 and the outside walls of the dam 6.

[0093] FIG. 4 schematically illustrates an example of a hearing device 20, such as a hearing aid. The hearing device 20 comprises a microphone 22, for receiving an input signal and converting it into an audio signal. The audio signal is provided to a processing unit 24 for processing the audio signal and providing a processed output signal for compensating a hearing loss of a user of the hearing device 20. A receiver 26 is connected to an output of the processing unit 24 for converting the processed output signal into an output sound signal, e.g. a signal modified to compensate for a user's hearing impairment. Typically, the receiver 26 comprises a transducer, and the receiver 26 is often referred to as a speaker. The processing unit 24 may comprise elements such as amplifiers, compressors, noise reduction systems, etc. The hearing device 20 may further comprise a wireless communication unit 28 for wireless data communication interconnected with an antenna structure 30 for emission and reception of an electromagnetic field. The wireless communication unit 28, such as a radio or a transceiver, connects to the processing unit 24 and the antenna structure 30, for communicating with an electronic device, an external device, or with another hearing device, such as another hearing aid located in/on/at another ear of the user, typically in a binaural hearing system. The hearing device 20 may comprise two or more antenna structures.

[0094] The hearing device 20 may be a behind-the-ear hearing device, and may be provided as a behind-the-ear module. The hearing device 20 may be an in-the-ear hearing device and may be provided as an in-the-ear module. Alternatively, parts of the hearing device 20 may be provided in a behind-the-ear module, while other parts, such as the receiver 26, may be provided in an in-the-ear module.

[0095] FIGS. 5a) and 5b) schematically illustrate an example of a block-diagram of an embodiment of a hearing device 200. In FIG. 5a), the hearing device 200 comprises a first transducer, i.e. microphone 202, to generate one or more microphone output signals based on a received an audio signal. The one or more microphone output signals are provided to a signal processor 204 for processing the one or more microphone output signals. A receiver or speaker 206 is connected to an output of the signal processor 204 for converting the output of the signal processor into a signal modified to compensate for a user's hearing impairment, and provides the modified signal to the speaker 206.

[0096] The hearing device signal processor 204 may comprise elements such as an amplifier, a compressor and/or a noise reduction system etc. The signal processor 204 may be implemented in a signal processing chip 204′. The hearing device may further have a filter function, such as compensation filter for optimizing the output signal.

[0097] The hearing device further comprises a wireless communication unit 214 interconnected with magnetic induction antenna 216 such as a magnetic induction coil. The wireless communication unit 214 and the magnetic induction antenna 216 may be configured for wireless data communication using emission and reception of magnetic field. The wireless communication unit may be implemented as a wireless communication chip 214′, such as a magnetic induction control chip 214′. The hearing device 200 further comprises a power source 212, such as a battery or a rechargeable battery. Furthermore, a power management unit 210 is provided for controlling the power provided from the battery 212 to the signal processor 204, the receiver, the one or more microphones, the wireless communication unit (RF) 208, and the wireless communication unit (Ml) 214. The magnetic induction antenna is configured for communication with another electronic device, in some embodiments configured for communication with another hearing device, such as another hearing device located at another ear, typically in a binaural hearing device system.

[0098] The hearing device may furthermore have a wireless communication unit 208, such as a wireless communication circuit, for wireless data communication interconnected with an RF antenna 218 for emission and reception of an electromagnetic field. The wireless communication unit may be implemented as a wireless communication chip 208′. The wireless communication unit 208, including a radio or a transceiver, connect to the hearing device signal processor 204 and the RF antenna 218, for communicating with one or more external devices, such as one or more external electronic devices, including at least one smart phone, at least one tablet, at least one hearing accessory device, including at least one spouse microphone, remote control, audio testing device, etc., or, in some embodiments, with another hearing device, such as another hearing device located at another ear, typically in a binaural hearing device system.

[0099] The signal processor 204, the wireless communication unit (RF) 208, the wireless communication unit (MI) 214 and the power management unit 210 may be implemented as signal processing chip 204′, wireless communication chip (RF) 208′, wireless communication chip (MI) 214′ and power management chip 210′, respectively.

[0100] In FIG. 5b), a hearing device corresponding to the hearing device as shown in FIG. 5a is seen, except that in FIG. 5b, only one wireless communication unit 214 is present being interconnected with the magnetic induction antenna 216, the signal processor 204 and the power management unit 210.

[0101] Likewise, even though not shown, also a hearing device having only one wireless communication unit 208 being interconnected with an RF antenna for reception and emission of an electromagnetic field is envisaged.

[0102] Although particular features have been shown and described, it will be understood that they are not intended to limit the claimed invention, and it will be made obvious to those skilled in the art that various changes and modifications may be made without departing from the scope of the claimed invention. The specification and drawings are, accordingly to be regarded in an illustrative rather than restrictive sense. The claimed invention is intended to cover all alternatives, modifications and equivalents.

LIST OF REFERENCES

[0103] 2 electronic components [0104] 4 substrate [0105] 6 dam [0106] 8 fill encapsulation material [0107] 10 first surface of solidified fill encapsulation material [0108] 12 surroundings [0109] 14 cover material [0110] 16 ground ring or ground plane [0111] 18 environmental protection [0112] 20 hearing device [0113] 22 microphone [0114] 24 processing unit [0115] 26 receiver [0116] 28 wireless communication unit [0117] 30 antenna structure [0118] 200 hearing device [0119] 202 first transducer, e.g. microphone [0120] 204 signal processor [0121] 204′ signal processing chip [0122] 206 receiver or speaker [0123] 208 wireless communication unit (RF) [0124] 210 power management unit [0125] 212 power source [0126] 214 wireless communication unit (MI) [0127] 214′ wireless communication chip [0128] 216 magnetic induction antenna [0129] 218 RF antenna [0130] 100 method [0131] 102 providing a dam on a substrate [0132] 104 curing dam [0133] 106 providing a liquid fill encapsulation material within the dam on the substrate [0134] 108 curing fill encapsulation material (and dam) [0135] 110 applying a cover material on the first surface of the solidified fill encapsulation material [0136] 112 final curing