Method for Bonding Two Plates Together for a Fuel Cell, Especially Gluing Bipolar Plates in a Fuel Cell
20210408560 · 2021-12-30
Inventors
- Denys Gromadskyi (Aalborg Øst, DK)
- Søren Andreasen (Vadum, DK)
- Morten Sørensen (Gistrup, DK)
- Jakob Bork (Støvring, DK)
Cpc classification
H01M8/0297
ELECTRICITY
C09J127/16
CHEMISTRY; METALLURGY
Y02E60/50
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
International classification
H01M8/0297
ELECTRICITY
C09J127/16
CHEMISTRY; METALLURGY
Abstract
A method for bonding two plates together for a fuel cell, wherein the method comprises applying an adhesive to the surface of at least one of the plates and pressing the two plates together with the adhesive in between. The adhesive contains a mixture in the range of 0.01% to 30% PVDF and a solvent, and optionally a surfactant.
Claims
1. A method for bonding two plates together for a fuel cell, wherein the method comprises applying an adhesive to the surface of at least one of the plates and pressing the two plates together with the adhesive in between until the adhesive bonds the plates together, wherein the adhesive contains a mixture of PVDF and a solvent, wherein the method comprises providing the adhesive by mixing PVDF and solvent and heating and stirring the mixture for dissolution of the PVDF in the solvent at a PVDF concentration in the adhesive; wherein the method comprises mixing PVDF in the solvent to a concentration in the range of 0.01% to 30% by weight PVDF relatively to the weight of the solvent for providing the adhesive
2. A method according to claim 1, wherein the method comprises mixing non-ionic surfactant to the PVDF and solvent at a volume concentration in the range of 0.1% to 10% relatively to the solvent volume.
3. A method according to claim 1, wherein the method comprises adding water to the adhesive while the adhesive is on the surface and by the water causing precipitation of PVDF.
4. A method according to to claim 1, wherein the method comprises applying the adhesive to the surface at room temperature for evaporation of the solvent from the glue at room temperature.
5. A method according to to claim 1, wherein the method comprises pressing the two plates together with a pressure in the range of 1 kPa to 10 kPa.
6. A method according to to claim 1, wherein the method comprises hot-pressing the two plates together at a temperature above the melting temperature of the PVDF and then reducing the temperature while still pressing until the temperature is below the crystallization temperature of the PVDF.
7. A method according to to claim 1, wherein the method comprises mixing the adhesive by adding solvent that comprises more than 50% dimethyl acetamide.
8. A method according to to claim 1, wherein the method comprises mixing the adhesive by adding surfactant that comprises more than 50% octyl phenol ethoxylate.
9. A method according to to claim 1, wherein the method comprises mixing solvent with PVDF and surfactant at a volume concentration in the range of 0.1% to 10% relatively to the solvent volume to obtain the adhesive, wherein the solvent comprises more than 50% dimethyl acetamide and the surfactant comprises more than 50% octyl phenol ethoxylate; after the mixing applying the adhesive to the surface; after application of the adhesive to the surface, adding water to the adhesive and causing precipitation of PVDF by the addition of water; awaiting evaporation of the solvent at room temperature and then bonding the plates to each other by hot-pressing the plates together with a pressure in the range of 1 kPa to 10 kPa and at a temperature above the melting temperature of the PVDF and then reducing the temperature while still pressing until the temperature is below the crystallization temperature of the PVDF.
10. A method according to to claim 1, wherein the plates are a cathode plate and an anode plate, and the method comprises bonding the plates to each other to form a bipolar plate for the fuel cell or bonding the plates to either side of a cooling plate to form a bipolar plate assembly with a central cooling plate sandwiched between the anode plate and the cathode plate.
Description
SHORT DESCRIPTION OF THE DRAWING
[0030] The invention will be explained in more detail with reference to the drawing, where
[0031]
[0032]
[0033]
[0034]
[0035]
[0036]
[0037]
[0038]
DETAILED DESCRIPTION/PREFERRED EMBODIMENT
[0039] Reference is made to fuel cell stacks and plates therefore as well as their production, for example production using polymer and carbon powder, as described in WO2018/071803 by SerEnergy. Taking offset in
[0040] For the assembly in
[0041] The cathode plate 34 and the anode plate 36 are glued together with an adhesive, optionally with the cooling plate 38 in between as part of the glued assembly.
[0042] In some embodiments a cathode plate 34 and an anode plate 36 are glued together back-to-back without a cooling flow in between these two plates, which is illustrated in
[0043] The adhesive 2 can also be used for gluing other components together in the fuel cell stack.
[0044]
[0045]
[0046] To assemble a cathode plate 34 and an anode plate 36 into a bipolar plate 12, the adhesive 2 layer must cover at least one of the plates, but covering both plates is often leading to improved adhesion. In
[0047] However, the principle of gluing applies equally well to plate components of other type of fuel cells, as already mentioned above.
[0048] The fuel cell as illustrated and explained in detail is an illustrative example for which the adhesive and gluing methods described herein has been found especially useful.
[0049] For example, the adhesive is applied by spraying, printing, or painting, It should be mentioned that forming of the adhesive layer on the plate's surface is typically not limited by the specific design of the plate, including its dimensions or the presence or absence of gas flow channels.
[0050] A scheme of a useful process in illustrated as consecutive steps I, II, and III in
[0051] In the first step, as illustrated in
[0052] The adhesive contains homopolymers of PVDF or copolymers of PVDF. Especially useful are PVDF homopolymers with high molecular weight, for example a product as Solef® 6020 from Solvay®. The polymer with PVDF polymer is completely dissolved in a polar nonaqueous solvent or mixtures of such solvents.
[0053] Examples of solvents used alone or in combination include acetone, dimethyl acetamide, dimethyl formamide, dimethyl sulfoxide, hexamethylphosphoramide, methyl ethyl ketone, N-Methyl-2-pyrrolidone, tetrahydrofuran, tetramethyl urea, tributyl phosphate, tricresyl phosphate, triethyl phosphate, trimethyl phosphate. Good results have been obtained with dimethyl acetamide.
[0054] Advantageously, non-ionic surfactants are also added to the solvent or solvent mix. For example, Hypermer™, Tween® from Croda International and Triton™ from Dow Chemical families are possibilities for such additives, typically in concentration up to 10 vol. % based on amount of the solvent. A useful concentration of Triton™ X-100, also known as octyl phenol ethoxylate, in the solvent has been found in the range of 2 vol. %. The surfactants help forming homogeneous liquid mixture with PVDF, reduce surface tension and improve bonding of the adhesive layer with surface of the plate due to easier penetration of the polymer into top layers of the plate using its natural micro-roughness and porosity, especially for plates molded according to WO2018/071803. Optionally, for better adhesion, the surface roughness of the plate can be increased via surface treatment with sand paper or other abrasive materials.
[0055] Advantageously, the concentration of PVDF is varied from 0.01 to 30 wt. % based on amount of the solvent. This is much lower than the concentration of 60% PVDF in propylene carbonate as disclosed in US2007/0207364, where it is disclosed for coating and forming PVDF gaskets on outer area of bipolar plates or membrane-electrode assemblies. A concentration of 15 wt. % has been found useful in order for the adhesive not to be highly viscous, which can cause difficulties when applying the adhesive.
[0056] It should be mentioned that dissolution of polymer in the solvent or solvent mix typically occurs slowly, why it can be useful to add the polymer in small portions to the solvent already containing the surfactant while simultaneously stirring and heating, for example till 100° C. When a required concentration is achieved, the PVDF-containing mixture is cooled-down to room temperature.
[0057] As illustrated in
[0058] Printing processes are carried out at temperature which does not exceed the boiling point of the solvent that is used in the adhesive, for example below 165° C. for dimethyl acetamide. Generally, it has been found useful to work at room temperature due to slower evaporation of the solvent from the glue.
[0059] In some experiments, after covering the plate with PVDF/dimethyl acetamide/surfactant (Triton™ X-100) mixture, there have been used two options for crystallizing the PVDF in the adhesive layer.
[0060] In one option, liquid is removed from the adhesive mixture via heating to temperature no higher than T.sub.0, where T.sub.0 is boiling point of the solvent used, for example 165° C. for dimethyl acetamide.
[0061] In another option, which is also illustrated in
[0062] A possible gluing method is explained in the following. When crystallization is complete, one or more pairs of the plates are placed in a pressing tool, for example hot-pressing tool, at position providing contact of the entire area coated with an adhesive layer. Connected in such way inside the press, the plates are compressed, for example as illustrated in
[0063]
[0064] A useful compression value that is sufficient for proper for gluing has been found in the range of 1 kPa to 10 kPa, for example around 5 kPa.
[0065] If the plate is made of a composite with a thermoplastic polymer, the temperature T of the adhesive layer is kept between the melting point T.sub.1 of the PVFD and the meting point T.sub.2 of the polymer binder of the plate material, as also illustrated in
[0066] The value of T.sub.2 is the melting point of main polymer binder of the plate. For example, polyphenylene sulfide is a typical one for application in HTPEM fuel cells and it has melting point from 272° C. to 290° C. depending on its morphology and degree of crystallinity, as also explained in the article Rahate A S, Nemade K R, Waghuley S A. Polyphenylene sulfide (PPS): state of the art and applications, Rev Chem Eng 29 (2013) 471-489. Consequently, for this particular example, it T.sub.2 is set to 272° C.
[0067] The values of T.sub.1, T.sub.2 and T.sub.3 are varied in dependence of the PVDF type and the plate material.
[0068] Finally, the bipolar plates are taken out from the pressing tool and verified with respect to their leak tightness at required conditions.
[0069] In experiments, a HTPEM fuel cell stack was assembled based on these glued bipolar plates and its electrochemical performance was recorded with respect to their voltage drop with time. The measurements are illustrated in
[0070] As observed in