Electronic Module and Drive
20210408874 · 2021-12-30
Inventors
Cpc classification
H05K7/14329
ELECTRICITY
H02K11/30
ELECTRICITY
H02K7/006
ELECTRICITY
H02K5/22
ELECTRICITY
H05K1/028
ELECTRICITY
International classification
H02K11/30
ELECTRICITY
Abstract
An electronic module includes a first supporting element, a second supporting element, and a plurality of components arranged on the first supporting element and the second supporting element. The first supporting element and the second supporting element are electrically conductively connected, and the second supporting element forms an intermediate chamber in which the first supporting element is arranged.
Claims
1-15. (canceled)
16. An electronic module, comprising: a first carrier element; a second carrier element; and a plurality of components arranged on the first carrier element and on the second carrier element, wherein the first carrier element and the second carrier element are connected in an electrically conductive manner, and the second carrier element forms an intermediate space in which the first carrier element is arranged.
17. The electronic module according to claim 16, wherein the second carrier element is at least in regions malleable or flexible, and the second carrier element is formed such that the intermediate space is created when the malleable or flexible regions are bent.
18. The electronic module according to claim 17, wherein the second carrier element is U-shaped.
19. The electronic module according to claim 18, wherein the second carrier element includes two main segments spaced apart from one another in a parallel manner and a connecting segment connecting the main segments, and the first carrier element is arranged between the main segments.
20. The electronic module according to claim 19, wherein at least one of the main segments and the connecting segment is electrically connected to the first carrier element.
21. The electronic module according to claim 20, wherein the first carrier element includes a cooling arrangement configured to cool ones of the plurality of components arranged on the first carrier element.
22. The electronic module according to claim 16, wherein the first carrier element includes a cooling arrangement configured to cool ones of the plurality of components arranged on the first carrier element.
23. The electronic module according to claim 21, wherein the ones of the plurality of components arranged on the first carrier element include power electronic components, and ones of the plurality of components arranged on the second carrier element include at least a logic component, at least one control component or at least one of a logic component and a control component.
24. The electronic module according to claim 16, wherein the ones of the plurality of components arranged on the first carrier element include power electronic components, and ones of the plurality of components arranged on the second carrier element include at least a logic component, at least one control component or at least one of a logic component and a control component.
25. The electronic module according to claim 16, wherein the first carrier element is more rigid than the second carrier element.
26. The electronic module according to claim 16, further comprising: a carrier structure configured to provide a mechanical connection between the first carrier element and the second carrier element.
27. The electronic module according to claim 26, wherein the carrier structure is fixedly connected to the first carrier element or to the second carrier element.
28. The electronic module according to claim 27, wherein the carrier structure includes at least one of a positive-locking arrangement, a non-positive locking arrangement or at least one positive-locking arrangement and at least one of a non-positive locking arrangement configured to connect the at least one of the first and second carrier elements.
29. The electronic module according to claim 26, wherein the first carrier element includes a cooling arrangement configured to cool ones of the plurality of components arranged on the first carrier element. the carrier structure is configured as a frame for an electrically insulating casting material over the ones of the plurality of components arranged on the first carrier element to be cooled.
30. The electronic module according to claim 20, wherein the first carrier element is configured to provide electrical contact with the second carrier element.
31. A drive, comprising: a traction motor; and at least one electronic module configured to control the traction motor, the at least one electronic module including a first carrier element; a second carrier element; and a plurality of components arranged on the first carrier element and on the second carrier element, wherein the first carrier element and the second carrier element are connected in an electrically conductive manner, and the second carrier element forms an intermediate space in which the first carrier element is arranged.
32. The drive according to claim 31, wherein the traction motor is an electric machine, and the first carrier element is connected in a positive and non-positive locking manner to a field connection or phase connection of the electric machine.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0025]
[0026]
DETAILED DESCRIPTION OF THE DRAWINGS
[0027]
[0028]
LIST OF REFERENCE NUMERALS
[0029] 1 Electronic module [0030] 2 Protective element [0031] 10 First carrier element [0032] 12 Intermediate space [0033] 14 Conductor track contacts [0034] 16 Flexible region [0035] 20 Second carrier element [0036] 22 Main segment [0037] 24 Connecting segment [0038] 26 Intermediate space, arrangement space [0039] 40 Component(s) [0040] 42 Components that are to be cooled [0041] 50 Contact pin [0042] 60 Insert-push contact [0043] 62 Control connection [0044] 64 Signal contact [0045] 70 Stator [0046] 72 Field connection [0047] 74 Phase connections [0048] 76 Connection for cooling medium