VEHICLE PANE

Abstract

A vehicle pane includes a first substrate, at least one antenna structure and a connection region, wherein the antenna structure is arranged on a flexible film, wherein, additionally, a first line region is provided on the flexible film, wherein the connection region is arranged on a carrier, wherein, additionally, a second line region is provided on the carrier, wherein the flexible film has a first contact region and the carrier has a second contact region for the reciprocal connection of the first line region to the second line region, wherein the flexible film is routed around one end of the first substrate.

Claims

1. Vehicle pane comprising a first substrate, at least one antenna structure and a connection region, wherein the antenna structure is arranged on a flexible film, wherein, additionally, a first line region is provided on the flexible film, wherein the connection region is arranged on a carrier, wherein, additionally, a second line region is provided on the carrier, wherein the flexible film has a first contact region and the carrier has a second contact region for a reciprocal connection of the first line region to the second line region, wherein the flexible film is routed around one end of the first substrate.

2. The vehicle pane according to claim 1, wherein the carrier is rigid.

3. The vehicle pane according to claim 1, wherein the first contact region and the second contact region each have three or more electrical contact points.

4. The vehicle pane according to claim 1, wherein the first contact region and the second contact region each have five or more electrical contact points.

5. The vehicle pane according to claim 1, wherein the flexible film and the carrier are arranged substantially overlappingly in the region of the first contact region and the second contact region.

6. The vehicle pane according to claim 1, wherein the flexible film has a first patterned conductor layer and a second patterned conductor layer, wherein the first line region is designed as a grounded coplanar waveguide.

7. The vehicle pane according to claim 6, wherein the flexible film has at least one via.

8. Vehicle pane according to claim 1, wherein the flexible film comprises polyimide.

9. The vehicle pane according to claim 1, wherein the carrier comprises FR4.

10. The vehicle pane according to claim 1, wherein the carrier has at least one via.

11. The vehicle pane according to claim 1, wherein the antenna structure is designed to receive high-frequency signals.

12. A method comprising receiving signals for satellite-based navigation with the vehicle pane according to claim 1.

13. The method according to claim 12, wherein the signals are GNSS signals of Navstar GPS, Galileo, GLONASS, BeiDou, NaviC, or QZSS.

Description

[0048] They depict:

[0049] FIG. 1 a schematic overview relative to the arrangement of films, glass layer(s), to clarify aspects according to prior art and the invention,

[0050] FIG. 2 a schematic sectional view through embodiments of a film according to embodiments of the invention,

[0051] FIG. 3 a schematic sectional view through embodiments of a carrier according to embodiments of the invention,

[0052] FIG. 4 a schematic perspective view of line regions according to embodiments of the invention,

[0053] FIG. 5 a schematic perspective view of contact regions according to embodiments of the invention, and

[0054] FIG. 6 a schematic sectional view through embodiments of a carrier and a film according to embodiments of the invention

[0055] In the following, the invention will be presented in more detail with reference to the figures. It should be noted that different aspects that can be used individually or in combination are described. In other words, any aspect can be used with different embodiments of the invention unless explicitly presented as a pure alternative.

[0056] Furthermore, in the following, for the sake of simplicity, reference is generally made to only one entity. However, unless explicitly noted, the invention can also have several of the entities in question. Thus, the use of the words “a” and “an” is to be understood only as an indication that at least one entity is used in a simple embodiment.

[0057] Insofar as processes are described in the following, the individual steps can be arranged in any order and/or combined, unless the context explicitly indicates otherwise. Furthermore, the processes can be combined with one another—unless expressly indicated otherwise.

[0058] Indications with numerical values are generally not to be understood as exact values, but also include a tolerance from ±1% up to ±10%.

[0059] Insofar as standards, specifications, or the like are mentioned in this application, at least the standards, specifications, or the like applicable on the filing date are always referred to. I.e., if a standard/specification, etc. is updated or replaced by a successor, the invention is also applicable thereto.

[0060] Various embodiments are depicted in the figures.

[0061] According to embodiments of the invention, a vehicle pane 1 with a first substrate GS1 and with at least one antenna structure ANT and a connection region AB is provided.

[0062] The antenna structure ANT is arranged on a flexible film F. Moreover, a first line region GCPW1 is provided on the flexible film F.

[0063] The flexible (dielectric) film F can comprise at least one material selected from the group consisting of polyimide, polyurethane, polymethyl methacrylic acid, polycarbonate, polyethylene terephthalate, polyvinyl butyral, FR6, acrylonitrile-butadiene-styrene copolymer, polyethylene, polypropylene, polyvinyl chloride, polystyrene, polybutylene terephthalate, polyamide.

[0064] The connection region AB is arranged on a carrier T that can be produced separately. A second line region GCPW2 is further provided on the carrier T.

[0065] The carrier T can be made from a material corresponding to the film F or can comprise a different material, such as a rigid board, for example, made of FR4.

[0066] The flexible film F has a first contact region C1 and the carrier T has a second contact region C2 for the reciprocal connection of the first line region GCPW1 to the second line region GCPW2.

[0067] The flexible film F is routed around one end of the first substrate GS1.

[0068] The invention makes it possible to integrate an antenna ANT in a vehicle pane 1 while devices for signal processing, such as filters/amplifiers can be provided near the antenna ANT on a separately producible (rigid) carrier T. By providing suitable contact regions C1, C2, transmission can be done with impedance matching to the respective line regions GCPW1, GCPW2. As a result, the signal-to-noise ratio can be largely maintained. In other words, the invention allows extensive integration while at the same time providing an economical production method.

[0069] In one embodiment of the invention, the carrier T is rigid. I.e., the invention can make use of printed circuit boards, for example. Thus, for example, fitting with electronic components EK can be done using conventional technology. This allows economical production of such devices that can be arranged near the antenna ANT such that the attenuation of the useful signal prior to amplification/filtering is minimal. As a result, for example, economical amplifiers can be used.

[0070] In another embodiment of the invention, the first contact region C1 and the second contact region C2 have in each case three or more electrical contact points.

[0071] As a result, for example, a connection for coplanar waveguides can be provided. For example, a connection of a ground potential can be provided with the outer contact points, while the central contact point provides a connection for the useful signal.

[0072] According to another embodiment, the first contact region C1 and the second contact region C2 have, in each case, five (as depicted in FIG. 5) or more electrical contact points. Here, for example, a connection of a ground potential can be provided with the outer contact points, while the central contact point provides a connection for the useful signal. A higher number of contact points can, for example, provide better shieldng in the contact region.

[0073] According to yet another embodiment of the invention, the film F and the carrier T are—as depicted in FIG. 6—substantially overlappingly arranged in the region of the first contact region C1 and the second contact region C2. Structures that require multiple patterned conductor layers can, for example, be implemented in the overlapping region.

[0074] It should be noted that further optional layers are also depicted in the figures.

[0075] Also discernible in FIG. 1 is a first substrate GS1 of a vehicle pane 1. If the vehicle pane 1 is provided as a composite pane, a connecting foil VF and a second substrate GS2 can be provided, for example.

[0076] The substrate GS1, GS2 preferably contains glass, particularly preferably flat glass, float glass, quartz glass, borosilicate glass, soda lime glass, or clear plastics, preferably rigid clear plastics, in particular polyethylene, polypropylene, polycarbonate, polymethyl methacrylate, polystyrene, polyamide, polyesters, polyvinyl chloride, and/or mixtures thereof.

[0077] FIG. 2 depicts a sectional view through a film F. The film F can have a first electrically conductive layer LS1 and a second electrically conductive layer LS2. By patterning, one (or more) antenna(s) and a first line structure GCPW1 can be provided in these two electrically conductive layers. Optionally, the film can also be equipped with a barrier layer B, e.g., a (flexible) solder stop layer. Likewise, one or a plurality of additional layer(s) ZS can be provided, e.g., a (bonded-on) cover layer. The cover layer can, for example, also be made of a film material.

[0078] According to another embodiment of the invention, the (first and/or second) electrically conductive layer has a height h.sub.LS1, h.sub.LS2 of 10 μm-75 μm.

[0079] This enables a thin assembly that can also be integrated into a composite pane or that can also be adapted to a curved surface.

[0080] FIG. 3 depicts a sectional view through a carrier T. The carrier T can have a third electrically conductive layer LS3 and an (optional) fourth electrically conductive layer LS4. By patterning, a connection region AB and the second line structure GCPW2 can be provided in these two electrically conductive layers. Optionally, the carrier T can also be equipped with a barrier layer B, e.g., a (flexible) solder stop layer.

[0081] According to another embodiment of the invention, the (third and/or fourth) electrically conductive layer has a height h.sub.LS3, h.sub.LS4 of 10 μm-75 μm.

[0082] In connection with a likewise thin film F (h.sub.F=25 μm . . . 75 μm), this enables a thin arrangement that can also be integrated into a composite pane or that can also be adapted to a curved surface.

[0083] In yet another embodiment of the invention, the electrically conductive layers LS1, LS2, LS3, LS4 comprise silver and/or copper and/or gold and/or aluminum and/or indium and/or graphenes. Here, it should be noted that the electrically conductive layers LS1, LS2 can comprise different materials. However, they preferably comprise the same materials. In other words, the conductor structures can be adapted to electrical and/or thermal and/or mechanical boundary conditions.

[0084] Without loss of generality, the carrier T can cover the film F on a partial region or on the full region.

[0085] While a small overlapping region is advantageous for small sizes, a larger overlapping region can be advantageous for better signal transmission and/or increased mechanical stability. Thus, design options are available to the person skilled in the art such that different needs can be satisfied.

[0086] According to another embodiment of the invention, one or a plurality of vias VIA—as indicated in FIG. 4—are arranged at least between one of the lateral conductors L1 and the conductor ground potential plane GP arranged opposite relative to the film F. The vias VIA can be arranged at a predetermined distance from one another. Furthermore, vias VIA can also be provided in an analogous manner relative to the second lateral conductor L2 and the opposite ground potential plane GP. The distance can be based on the wavelength of the signals to be conducted. Furthermore, by means of such vias VIA, the characteristic impedance of the line region GCPW1, GCPW2 can be adapted. In addition, by means of the vias VIA, improved potential equality is achieved over the extent of the arrangement such that the high-frequency properties can be further improved.

[0087] Just like the film F, the carrier T can be equipped with such vias VIA, which can perform the same function.

[0088] According to yet another embodiment of the invention, the arrangement has—as indicated in FIG. 1—a connection region AB for an electromechanical high-frequency connection element S. In particular, the high-frequency connection element S can have or consist of an SMA socket. The SMA socket can, for example, have an angled arrangement such that a low overall height is provided in the connection area. Typically, vehicle panes are equipped with an electromechanical high-frequency connection element S as built-in part/replacement part to enable quick installation and reliable contacting.

[0089] In other words, in contrast to the prior art, the antenna and one or more electronic components can now be brought closer together. As a result, the signal-to-noise ratio can be favorably influenced early on.

[0090] In particular, the possibility of using so-called “grounded coplanar waveguides” for the line regions GCPW1, GCPW2 permits low-interference and/or low-loss transmission.

[0091] According to another embodiment of the invention, a vehicle with a glass pane 1 according to the invention, in particular a land, water, air, or space craft, is provided.

[0092] According to yet another embodiment of the invention, the glass pane 1 according to the invention is used to receive signals for satellite-based navigation, in particular to receive GNSS signals of Navstar GPS, Galileo, GLONASS, BeiDou, NaviC, QZSS. Alternatively or additionally, the glass pane 1 according to the invention is used to receive signals of a mobile communication system, in particular of a 2G, 3G, 4G, or 5G mobile communication system.

[0093] In otherwords, by means of the invention, the integration of antennas for satellite navigation is, in particular, enabled. The amplifier can be arranged near the antenna. The antenna or the antennas can be arranged between substrates GS1, GS2 of a composite glass pane 1. Since the antenna(s) ANT can be arranged on a flexible film F, the antenna ANT can adapt to a curvature of the vehicle pane. By means of the flexible film F, a line structure can be provided, for example, as a (grounded) coplanar waveguide, GCPW1. Since the film F is flexible, the film can, for example, be routed around one end of a substrate GS1.

[0094] The electronics for an amplifier and/or filter can be provided on a carrier T that can be produced separately.

[0095] The carrier T and the film F can be provided as an integrated element—as depicted in FIG. 6—or via contact elements as depicted in FIG. 5.

[0096] In the example of FIG. 6, it is possible, for example, to provide a via VIA from one electrically conductive layer LS3 all the way to the electrically conductive layer LS1. Thus, the via VIA provides a contact region C1/C2.

[0097] Thus, the high-frequency portion can be implemented without substantial geometric changes such that the impedance remains substantially unchanged.

[0098] The connection region AB can also be designed as a contact region C1/C2 (e.g., as depicted in FIG. 5).

LIST OF REFERENCE CHARACTERS

[0099] 1 vehicle pane [0100] GS1, GS2 substrate [0101] F flexible film [0102] T carrier [0103] EK electrical component [0104] LS1, LS2 electrically conductive layer [0105] LS3, LS4 electrically conductive layer [0106] ANT antenna structure [0107] GCPW1 line structure [0108] GCPW2 line structure [0109] h.sub.LS1 h.sub.LS2 height [0110] h.sub.LS3 h.sub.LS4 height [0111] VIA via [0112] VF connecting foil [0113] AB connection region [0114] S connector [0115] C1, C2 contact region [0116] B barrier layer [0117] ZS additional layer(s) [0118] L1, L2 conductor tracks [0119] ML middle track (useful signal) [0120] GP ground potential plane