Magnetic disc, aluminum alloy substrate for magnetic disc, and production method for aluminum alloy substrate

Abstract

Provided are a magnetic disk and a method of fabricating the magnetic disk. The magnetic disk includes an aluminum alloy plate fabricated by a process involving a CC method and a compound removal process, and an electroless Ni—P plating layer disposed on the surface of the plate. The aluminum alloy plate is composed of an aluminum alloy containing 0.4 to 3.0 mass % (hereinafter abbreviated simply as “%”) of Fe, 0.1% to 3.0% of Mn, 0.005% to 1.000% of Cu, 0.005% to 1.000% of Zn, with a balance of Al and unavoidable impurities. In the magnetic disk, the maximum amplitude of waviness in a wavelength range of 0.4 to 5.0 mm is 5 nm or less, and the maximum amplitude of waviness in a wavelength range of 0.08 to 0.45 mm is 1.5 nm or less.

Claims

1. An aluminum alloy substrate for a magnetic disk, the substrate comprising: an aluminum alloy provided with electroless Ni—P plating, wherein the aluminum alloy comprises 0.4 to 3.0 mass % of Fe, 0.1 to 3.0 mass % of Mn, 0.005 to 1.0 mass % of Cu, and 0.005 to 1.0 mass % of Zn, with a balance of Al and unavoidable impurities, a maximum amplitude of waviness in a wavelength range of 0.4 to 5.0 mm is 5.0 nm or less, and a maximum amplitude of waviness in a wavelength range of 0.08 to 0.45 mm is 1.5 nm or less on a surface of the aluminum alloy substrate, and a yield stress after retention at 300° C. for three hours is 100 MPa or more.

2. The aluminum alloy substrate for a magnetic disk according to claim 1, wherein the aluminum alloy further comprises one or more elements selected from a group comprising 0.1 to 0.4 mass % of Si, 0.1 to 3.0 mass % of Ni, 0.01 to 1.00 mass % of Cr, and 0.01 to 1.00 mass % of Zr.

3. The aluminum alloy substrate for a magnetic disk according to claim 1, wherein the aluminum alloy further comprises one or more elements selected from a group comprising Ti, B, and V at a total content of 0.005 to 0.5 mass %.

4. A method of fabricating an aluminum alloy substrate for a magnetic disk, the method being applied to the aluminum alloy substrate according to claim 1, the method comprising: a casting process to produce an aluminum alloy cast plate; a rolling process of cold rolling the aluminum alloy cast plate to produce an aluminum alloy plate; a pressure annealing process of extracting an annular aluminum alloy plate from the aluminum alloy plate and annealing and flattening the annular aluminum alloy plate under a pressure; a substrate preparing process comprising a grinding step and a stress-relieving heat treatment step in an order mentioned, the substrate preparing process being directed to the annular aluminum alloy plate after the pressure annealing process; a plating pretreatment process comprising an alkaline degreasing step, an acid etching step, and at least one zincate treatment step in an order mentioned, the plating pretreatment process being directed to the annular aluminum alloy plate after the substrate preparing process; and an electroless Ni—P plating process of providing electroless Ni—P plating to a surface of the annular aluminum alloy plate after the plating pretreatment process, wherein the method further comprises a compound removal process at a timing after the grinding step of the substrate preparing process and before a first one of the at least one zincate treatment step of the plating pretreatment process, the casting process involves continuous casting to produce the aluminum alloy cast plate, and the compound removal process involves immersion of the annular aluminum alloy plate for 5 to 60 seconds into an HNO.sub.3/HF mixed solution, the mixed solution being a solution at a temperature of 10° C. to 30° C. having an HNO.sub.3 concentration of 10 to 60 mass % and an HF concentration of 10 to 80 g/L.

5. The method of fabricating an aluminum alloy substrate for a magnetic disk according to claim 4, further comprising a cutting step before the grinding step of the substrate preparing process.

6. A magnetic disk comprising a magnetic medium that is disposed on the aluminum alloy substrate for a magnetic disk according to claim 1 and comprises magnetic layer, wherein, a maximum amplitude of waviness in a wavelength range of 0.4 to 5.0 mm is 5.0 nm or less, and a maximum amplitude of waviness in a wavelength range of 0.08 to 0.45 mm is 1.5 nm or less on a surface of the magnetic disk.

Description

BRIEF DESCRIPTION OF DRAWINGS

(1) FIG. 1 is a diagram for explaining the steps of a plating pretreatment process and an electroless Ni—P plating process for a magnetic disk substrate composed of an aluminum alloy; and

(2) FIG. 2 illustrates SEM images of an electroless Ni—P plated surface.

DESCRIPTION OF EMBODIMENTS

(3) Embodiments of the disclosure will now be described in detail. As described above, a magnetic disk according to the disclosure can be composed of a glass substrate but is advantageous when being composed of an aluminum alloy substrate. This aluminum alloy substrate is composed of an Al—Fe alloy, which may cause generation of compound particles, but the surface state of the aluminum alloy substrate is optimized by the fabrication method. The following description will discus (A) an aluminum alloy substrate according to the disclosure and (B) a method of fabricating the substrate focusing on their configurations and effects with reference to the detailed mechanisms. Based on these discussions, the description is then directed to (C) a magnetic disk according to the disclosure.

(4) A. Aluminum Alloy Substrate for a Magnetic Disk According to the Disclosure

(5) A-1. Composition of an Aluminum Alloy

(6) An aluminum alloy contained in the aluminum alloy substrate according to the disclosure has a composition including essential elements (0.4 to 3.0 mass % of Fe, 0.1 to 3.0 mass % of Mn, 0.005 to 1.000 mass % of Cu, and 0.005 to 1.000 mass % of Zn), with a balance of Al and unavoidable impurities (the unit “mass %” is hereinafter abbreviated as “%”). The aluminum alloy according to the disclosure may further contain one or more optional additive elements selected from a group comprising 0.1% to 0.4% of Si, 0.1% to 3.0% of Ni, 0.1% to 6.0% of Mg, 0.01% to 1.00% of Cr, and 0.01% to 1.00% of Zr (these additive elements may be hereinafter referred to as “first selective elements”). The aluminum alloy according to the disclosure may further contain one or more additive elements selected from a group comprising Ti, B, and V at a total content of 0.005% to 0.5% (these additive elements may be hereinafter referred to as “second selective elements”). The essential elements and the first and second selective elements will now be described.

(7) (i) Essential Additive Elements

(8) Fe: 0.4% to 3.0%

(9) Fe is deposited mainly in the form of second phase particles (for example, Al—Fe compound particles). Fe has effects of improving the strength and the fluttering characteristics of an aluminum alloy substrate. Fe exists partly in the form of a solid solution in the matrix and is capable of improving the strength of the substrate. The second phase particles bring about effects of improving the fluttering characteristics by increasing the strength of the alloy and also by absorbing the vibration energy of fluttering. The effects of improving the fluttering characteristics are provided because a viscous flow at the interface between the second phase particles and the matrix rapidly absorb the vibration energy in response to application of vibration to a magnetic disk substrate.

(10) An Fe content of less than 0.4% cannot achieve sufficient effects of improving the strength or the fluttering characteristics of the magnetic disk substrate. In contrast, an Fe content exceeding 3.0% causes generation of a number of coarse Al—Fe compound particles, which readily cause deficiencies on the electroless Ni—P plated surface. According to the disclosure, compound particles on the surface are removed by a compound removal process to optimize the surface state. This compound removal process can also remove coarse compound particles. It should be noted that the removed coarse compound particles tend to leave excessively large pits, which may impair the smoothness of the electroless Ni—P plated surface and cause peeling of the plating. For these reasons, the Fe content should preferably be within the range of 0.4% to 3.0% and more preferably within the range of 0.8% to 1.8%.

(11) Mn: 0.1% to 3.0%

(12) Mn exists mainly in the form of second phase particles (for example, Al—Mn compound particles). Mn has effects of improving the strength and fluttering characteristics of a magnetic disk substrate. These effects of compound particles are provided by the same mechanisms as the above-described mechanisms of Fe (for example, Al—Fe compound particles).

(13) An Mn content of less than 0.1% cannot achieve sufficient strength or fluttering characteristics of the magnetic disk substrate. In contrast, an Mn content exceeding 3.0% causes generation of a number of coarse Al—Mn compound particles, which may impair the smoothness of the electroless Ni—P plated surface and cause peeling of the plating. For these reasons, the Mn content should preferably be within the range of 0.1% to 3.0% and more preferably within the range of 0.1% to 1.0%.

(14) Cu: 0.005% to 1.000%

(15) Cu exists mainly in the form of second phase particles (for example, Al—Cu compound particles). Cu has effects of improving the strength and fluttering characteristics of a magnetic disk substrate. Cu also has effects of applying a zincate coating in a uniform, thin, and dense manner to improve the smoothness of the electroless Ni—P plated surface.

(16) A Cu content of less than 0.005% cannot achieve sufficient strength or fluttering characteristics of the magnetic disk substrate. This Cu content also leads to a nonuniform zincate coating, thereby impairing the smoothness of the electroless Ni—P plated surface. In contrast, a Cu content exceeding 1.0% causes generation of a number of coarse Al—Cu compound particles, which may impair the smoothness of the electroless Ni—P plated surface and cause peeling of the plating. For these reasons, the Cu content should preferably be within the range of 0.005% to 1.000% and more preferably within the range of 0.005% to 0.400%.

(17) Zn: 0.005% to 1.000%

(18) Zn has effects of applying a zincate coating in a uniform, thin, and dense manner to improve the smoothness and adhesion of the electroless Ni—P plating. Zn forms second phase particles together with other additive elements and thus brings about effects of improving the fluttering characteristics of the magnetic disk substrate.

(19) A Zn content of less than 0.005% leads to a nonuniform zincate coating, thereby impairing the smoothness of the electroless Ni—P plated surface. In contrast, a Zn content exceeding 1.000% makes the electric potential of the matrix far less noble, resulting in a high rate of dissolution of the matrix during a compound removal process and an electroless Ni—P plating process. This phenomenon increases the unevenness of the surface of the aluminum alloy substrate and thus impairs the smoothness of the electroless Ni—P plated surface. For these reasons, the Zn content should preferably be within the range of 0.005% to 1.000% and more preferably within the range of 0.100% to 0.700%.

(20) (ii) First Selective Elements

(21) Si: 0.1% to 0.4%

(22) Si exists mainly in the form of second phase particles (for example, Si particles). Si has effects of improving the strength and fluttering characteristics of a magnetic disk substrate. These effects of compound particles are provided by the same mechanisms as the above-described mechanisms of Fe (for example, Al—Fe compound particles).

(23) An Si content of less than 0.1% cannot achieve sufficient strength or fluttering characteristics of the magnetic disk substrate. In contrast, an Si content exceeding 0.4% causes generation of a number of coarse Si particles, thereby impairing the smoothness of the electroless Ni—P plated surface and causing peeling of the plating. The Si content exceeding 0.4% also impairs the grinding properties due to Al—Si compound particles on the surface. In addition, the Al—Si compound particles do not readily cause electrochemical reactions with the matrix and thus tend to remain on the surface even after a compound removal process. For these reasons, the Si content should preferably be within the range of 0.1% to 0.4% and more preferably within the range of 0.1% to 0.3%.

(24) Ni: 0.1% to 3.0%

(25) Ni exists mainly in the form of second phase particles (for example, Al—Ni compound particles). Ni has effects of improving the strength and fluttering characteristics of a magnetic disk substrate. An Ni content of less than 0.1% cannot achieve sufficient strength or fluttering characteristics of the magnetic disk substrate. In contrast, an Ni content exceeding 3.0% causes generation of a number of coarse Al—Ni compound particles. For these reasons, the Ni content should preferably be within the range of 0.1% to 3.0% and more preferably within the range of 0.1% to 1.0%.

(26) Mg: 0.1% to 6.0%

(27) Mg exists mainly in the form of second phase particles (for example, Mg—Si compound particles). Mg has effects of improving the strength and fluttering characteristics of a magnetic disk substrate. An Mg content of less than 0.1% cannot achieve sufficient strength or fluttering characteristics of the magnetic disk substrate. In contrast, an Mg content exceeding 6.0% inhibits rolling of the aluminum alloy. For these reasons, the Mg content should preferably be within the range of 0.1% to 6.0% and more preferably within the range of 0.3% to 1.0%.

(28) Cr: 0.01% to 1.00%

(29) Cr exists mainly in the form of second phase particles (for example, Al—Cr compound particles). Cr has effects of improving the strength and fluttering characteristics of a magnetic disk substrate. A Cr content of less than 0.01% cannot achieve sufficient strength or fluttering characteristics of the magnetic disk substrate. In contrast, a Cr content exceeding 1.00% causes generation of a number of coarse Al—Cr compound particles. For these reasons, the Cr content should preferably be within the range of 0.01% to 1.00% and more preferably within the range of 0.10% to 0.50%.

(30) Zr: 0.01% to 1.00%

(31) Zr exists mainly in the form of second phase particles (for example, Al—Zr compound particles). Zr has effects of improving the strength and fluttering characteristics of a magnetic disk substrate. A Zr content of less than 0.01% cannot achieve sufficient strength or fluttering characteristics of the magnetic disk substrate. In contrast, a Zr content exceeding 1.00% causes generation of a number of coarse Al—Zr compound particles. For these reasons, the Zr content should preferably be within the range of 0.01% to 1.00% and more preferably within the range of 0.10% to 0.50%.

(32) (iii) Second Selective Elements

(33) Ti, B, and V: 0.005% to 0.500% in Total

(34) Ti, B, and V form second phase particles (for example, particles of boride, such as TiB.sub.2, or Al.sub.3Ti or Ti—V—B) during a solidification process of casting, which serve as nuclei of crystal grains, and can thus produce finer crystal grains. These finer crystal grains increase the size uniformity of the second phase particles, thereby reducing the variations in the strength and fluttering characteristics of magnetic disk substrates.

(35) These effects cannot be achieved at a total content of Ti, B, and V of less than 0.005%. In contrast, the effects are saturated and not significantly enhanced at a total content of Ti, B, and V exceeding 0.500%. For these reasons, the total content of Ti, B, and V should preferably be within the range of 0.005% to 0.500% and more preferably within the range of 0.005% to 0.100%. It should be noted that the total content of Ti, B, and V indicates the sum of the amounts of three elements for the alloy containing all the three elements, the sum of the amounts of two elements for the alloy containing only the two elements, and the amount of one element for the alloy containing only the one element.

(36) Other Elements

(37) The rest of the aluminum alloy contained in the aluminum alloy substrate according to the disclosure is composed of Al and unavoidable impurities. Examples of the unavoidable impurities include Sr, Pb, Ga, and Sn. If the content of each element is less than 0.1% and if the total content is less than 0.2%, the unavoidable impurities do not impair the properties of the aluminum alloy substrate according to the disclosure.

(38) A-2. Surface State (Waviness) of the Aluminum Alloy Substrate According to the Disclosure

(39) The aluminum alloy substrate for a magnetic disk according to the disclosure is composed of an Al—Fe alloy, which may cause generation of compound particles, but has reduced surface deficiencies after electroless Ni—P plating. Such a reduction in deficiencies is achieved by removing compound particles from the substrate surface by a compound removal process (explained in detail below) for optimizing the surface state. In addition, the aluminum alloy substrate according to the disclosure has surface waviness within a predetermined range. The following explanation is directed to mechanisms of generation of the waviness and the waviness of the substrate surface according to the disclosure.

(40) The surface of the aluminum alloy substrate after the electroless Ni—P plating is polished. This surface appears to be smooth but actually has fine waviness. The waviness can be measured using a device, such as the μ-XAM. Specifically, when the profile of the surface roughness is divided into waves having mutually different wavelengths, the amplitude of each wavelength corresponds to the level of waviness. This amplitude is in the order of several nanometers. In other words, irregularities in the order of several nanometers remain on the polished surface of the magnetic disk substrate.

(41) The waviness is related to irregularities called nodules on the surface of the aluminum alloy substrate after the electroless Ni—P plating. Most of these nodules have a shape of hemispherical protrusion. The number of nodules is increased in response to nonuniform plating reactions (in particular, substitution reactions between Zn and Ni—P on the substrate surface at the first stage) in the electroless Ni—P plating. The nodules can be removed by polishing after plating. A height difference is however generated between areas having nodules and the other areas having no nodule, and causes a difference in polishing amount, resulting in fine irregularities that constitute the waviness.

(42) The generation of nodules is affected by the existence of compound particles on the substrate surface before the electroless Ni—P plating. Although the substrate according to the disclosure is composed of an Al—Fe alloy, which may cause generation of compound particles, compound particles on the substrate surface are removed before the electroless Ni—P plating process. The substrate surface after the electroless Ni—P plating therefore has waviness within a predetermined range. Specifically, the maximum amplitude of waviness in a wavelength range of 0.4 to 5.0 mm is 5 nm or less, and the maximum amplitude of waviness in a wavelength range of 0.08 to 0.45 mm is 1.5 nm or less.

(43) In an HDD, a reading head is suspended while maintaining a distance of several tens of nanometers (several nanometers in the latest techniques) from the magnetic disk surface. In the case of a large amplitude of waviness, the head cannot follow the waviness of the rapidly rotating magnetic disk. The distance between the head and the disk surface varies and thus causes fluctuations in output, leading to unstable reading and writing operations. The head's ability to follow the surface waviness of the magnetic disk also depends on the wavelength of waviness. That is, the head can readily follow the waviness having a long wavelength but cannot readily follow the waviness having a short wavelength. As described above, the amplitude and wavelength of waviness affects the following ability of the reading head, which may inhibit development of high-speed HDDs.

(44) An aluminum alloy substrate having surface waviness within the range according to the disclosure can achieve a magnetic disk capable of preferable operations and can be applied to high-speed HDDs and the like. Specifically, the head can follow the waviness of the magnetic disk, if the maximum amplitude of waviness in a wavelength range of 0.4 to 5.0 mm is 5 nm or less, and if the maximum amplitude of waviness in a wavelength range of 0.08 to 0.45 mm is 1.5 nm or less. More preferable waviness is defined such that the maximum amplitude of waviness in a wavelength range of 0.4 to 5.0 mm is 2.5 nm or less, and the maximum amplitude of waviness in a wavelength range of 0.08 to 0.45 mm is 1 nm or less.

(45) The waviness of the aluminum alloy substrate before spattering of a magnetic material, or the waviness of the substrate after the Ni—P plating before spattering of a magnetic material, is the governing factor of the waviness of the magnetic disk. The magnetic material is merely spattered on the surface of the aluminum alloy substrate and does not affect the original waviness of the aluminum alloy substrate.

(46) A-3. Fluttering Characteristics of the Aluminum Alloy Substrate According to the Disclosure

(47) As described above, unstable airflows generated between the rapidly rotating magnetic disks cause fluttering of a magnetic disk. At a high level of fluttering, the head cannot follow the displacement of the magnetic disk.

(48) The level of fluttering is measured as a displacement at a certain frequency. Since the maximum displacement decreases according to an increase in frequency, a reduction in maximum displacement at a low frequency directly leads to a reduction in fluttering. Although the fluttering can also be reduced by filling an HDD with a helium gas having low viscosity, but this configuration requires higher costs. Required is a procedure to reduce fluttering in the air.

(49) The aluminum alloy substrate for a magnetic disk according to the disclosure is composed of an Al—Fe alloy, which may cause generation of compound particles that can increase the strength and absorb the vibration energy of fluttering. The aluminum alloy substrate can thus provide a preferable strength and certain fluttering characteristics. Specifically, in the aluminum alloy substrate according to the disclosure, the maximum displacement in the air at a frequency of 100 Hz or more should preferably be 200 nm or less. This level of fluttering characteristics is considered to be sufficient. The maximum displacement can be smaller in the disclosure. Specifically, the level of fluttering characteristics should more preferably 150 nm or less.

(50) A-4. Yield Stress of the Aluminum Alloy Substrate According to the Disclosure

(51) The method of fabricating the substrate for a magnetic disk involves a pressure annealing process (explained below). A high annealing temperature in this process leads to an improvement in flatness of the magnetic disk. A good flatness of the disk causes an improvement in flatness of the plating. In order to stably obtain the good flatness, the pressure annealing should preferably be conducted at approximately 300° C. However, as the annealing temperature increases, the yield stress of the aluminum alloy substrate decreases.

(52) If the aluminum alloy substrate after the pressure annealing at 300° C. has a yield stress of less than 100 MPa, the substrate may be deformed when its inner edge is fixed during transportation between the subsequent processes. The possibility of deformation can be reduced at a yield stress exceeding 100 MPa and can be eliminated at a yield stress of 120 MPa or more. Accordingly, the yield stress of the aluminum alloy substrate according to the disclosure after a heat treatment at 300° C. for three hours should preferably be 120 MPa or more and more preferably 150 MPa.

(53) B. Method of Fabricating the Aluminum Alloy Substrate According to the Disclosure

(54) A method of fabricating the aluminum alloy substrate according to the disclosure will now be explained. The method of fabricating the aluminum alloy substrate according to the disclosure is basically the same as existing methods of fabricating aluminum alloy substrates. Specifically, the method involves: a casting process of casting a molten alloy adjusted to have a certain composition to produce an aluminum alloy cast plate; and a rolling process of homogenizing and hot rolling the cast plate as required and cold rolling the cast plate to produce an aluminum alloy plate. These processes are followed by a process of extracting an annular aluminum alloy plate from the aluminum alloy plate and then annealing and flattening the annular aluminum alloy plate under a pressure. The annular aluminum alloy plate after the pressure annealing process is subject to a substrate preparing process, which includes a grinding step and a stress-relieving heat treatment step in the order mentioned, and a plating pretreatment process, which includes an alkaline degreasing step, an acid etching step, a desmutting step, and at least one zincate treatment step in the order mentioned. The annular aluminum alloy plate after the plating pretreatment process is then provided with electroless Ni—P plating on its surfaces, thereby completing an aluminum alloy substrate for a magnetic disk.

(55) The disclosure should preferably be directed to a magnetic disk having an outer diameter of 95 to 97 mm. This magnetic disk having such a large outer diameter particularly tends to suffer from the problem of fluttering.

(56) The method of fabricating the aluminum alloy substrate according to the disclosure has two features for obtaining a preferable strength and surface state. The two features include: the casting process that involves continuous casting to produce an aluminum alloy cast plate; and a predetermined compound removal process conducted at a timing between the grinding step and the zincate treatment step. The following explanation will discuss the method of fabricating the aluminum alloy substrate according to the disclosure with reference to these features in detail.

(57) B-1. Casting Process

(58) First, an aluminum alloy having a certain range of composition is heated and melted by a general method to prepare a molten aluminum alloy. The resulting molten aluminum alloy is cast to produce an aluminum alloy cast plate in the casting process.

(59) According to the disclosure, the casting process involves a continuous casting method (CC method) of casting an aluminum alloy in order to ensure the strength and yield stress of an aluminum alloy substrate to be yielded. In detail, the inventors have conducted studies on aluminum alloys having the above-described composition, some of which are produced by a continuous casting method and the others are produced by a semi-continuous casting method (DC method). As a result, the inventors have confirmed that some of the aluminum alloy substrates produced by the DC method have an insufficient strength and yield stress and are therefore not effective for reducing disk fluttering and suppressing deformation during operation. The inventors have attributed this problem to the upper limit of the amounts of the elements dissolved in the aluminum alloy due to the upper limit of the cooling rate of the DC method in the casting process.

(60) The inventors have considered that the CC method can be performed at a higher cooling rate than that of the DC method and thus increase the amounts of the elements dissolved in the aluminum alloy. The inventors have then confirmed that the CC method can yield an aluminum alloy having a sufficient strength and thus causing a low level of disk fluttering.

(61) In the case of the CC method, a molten metal is supplied between a pair of rollers (alternatively, belt casters or block casters) through a casting nozzle, and is cooled by the rollers, to directly produce an aluminum alloy cast plate. In the CC method, the temperature of the aluminum alloy cast plate after the elapse of one minute from the casting is defined to be within the range of 230° C. to 350° C. Furthermore, the temperature of the cast plate after the elapse of ten minutes from the casting is defined to be 150° C. or more and less than 230° C. These definitions (the temperature of the cast plate after the elapse of one minute from the casting to be 230° C. to 350° C. and the temperature after the elapse of ten minutes to be 150° C. or more and less than 230° C.) can achieve distribution of a number of fine second phase particles (mainly Al—Fe compound particles) to increase the strength. This CC method yields an aluminum alloy cast plate having a thickness of approximately 2.0 to 10.0 mm.

(62) Exemplary procedures of cooling the cast plate in the CC method include fan cooling, mist cooling, shower cooling, and water cooling.

(63) As explained above, the casting process involves the CC method according to the disclosure. When aluminum alloys having a range of composition according to the disclosure are compared between the applied casting methods, for example, in terms of yield stress after a heat treatment at 300° C. for three hours, the yield stress provided by the DC method is approximately 60 MPa while the yield stress provided by the CC method exceeds 100 MPa and potentially exceeds 150 MPa.

(64) B-2. Rolling Process

(65) Second, the resulting aluminum alloy cast plate is homogenized as required and is cold rolled to produce an aluminum alloy plate.

(66) The homogenization, which is an optional step, involves heating at a temperature of 300° C. to 450° C. for a period of 0.5 to 24 hours. The homogenization can increase the size uniformity of second phase particles, thereby reducing the variations in the strength and fluttering characteristics of aluminum alloy substrates.

(67) The cast plate after the CC method or after the homogenization is then cold rolled to have a certain thickness required as a product. This cold rolling step yields an aluminum alloy plate having a thickness of approximately 0.45 to 1.8 mm.

(68) The conditions of the cold rolling step are not particularly defined but can be determined depending on the strength and thickness required as a product. The reduction ratio should preferably be within the range of 10% to 95%. The process may include an annealing step before or during the cold rolling, in order to ensure the cold rolling process ability. In the case of a process including the annealing, such as annealing in a batch system, preferable conditions include a temperature of 200° C. or more and less than 380° C. and a period of 0.1 to 10 hours.

(69) B-3. Pressure Annealing Process

(70) The resulting aluminum alloy plate is then punched into an annular shape to produce an annular aluminum alloy plate. This annular aluminum alloy plate is annealed and flattened under a pressure. The pressure annealing process involves a heat treatment at a temperature of 200° C. to 350° C. for a period of 30 minutes or more in a pressurized state to flatten the annular aluminum alloy plate. This flattened annular aluminum alloy plate after the pressure annealing process is also called a disk blank in some cases.

(71) B-4. Substrate Preparing Process

(72) The flattened annular aluminum alloy plate is then subject to a substrate preparing process including a grinding step and a stress-relieving heat treatment step. The grinding step involves fine adjustment of the shape and size by processing. At this stage, an optional cutting step may be performed as required. It should be noted that this cutting step has no effect on the properties, such as disk fluttering and waviness.

(73) The grinding step is followed by the stress-relieving heat treatment step. Preferable conditions of the heat treatment include a temperature of 250° C. to 400° C. and a period of 5 to 15 minutes.

(74) B-5. Plating Pretreatment Process

(75) The annular aluminum alloy plate after the substrate preparing process is then subject to a plating pretreatment process that precedes an electroless Ni—P plating process. At any timing between the substrate preparing process and this plating pretreatment process, a compound removal process that characterizes the disclosure is conducted.

(76) In order to facilitate understanding of the relation between the respective processes and steps, FIG. 1 illustrates preferable configurations of the plating pretreatment process. In FIG. 1, an unprocessed sample in Step 0 indicates an annular aluminum alloy plate (disk blank) after the substrate preparing process. This unprocessed sample has been subject to the pressure annealing process, the grinding step, and the stress-relieving heat treatment step, as explained above. The unprocessed sample usually has dirt adhering to its surface and has a thickness different from other unprocessed samples.

(77) Steps 1 to 6 in FIG. 1 correspond to the plating pretreatment process according to the disclosure. The plating pretreatment process involves an alkaline degreasing step (Step 1), an acid etching step (Step 2), a desmutting step (Step 3), and zincate treatment steps (Steps 4 to 6) in the order mentioned. It should be noted that the exemplary method illustrated in FIG. 1 include two times of zincate treatments (first and second zincate treatments).

(78) In the alkaline degreasing step (Step 1), the dirt adhering to the substrate surface is removed. The alkaline degreasing is conducted using a commercially available degreasing solution (for example, the degreasing solution AD-68F manufactured by C.Uyemura & Co., Ltd.). Preferable degreasing conditions include a temperature of 40° C. to 70° C., a treatment period of three to ten minutes, and a concentration of 200 to 800 mL/L.

(79) In the acid etching step (Step 2), the oxidized film on the surface of the aluminum alloy substrate is removed. The acid etching is conducted using a commercially available etchant (for example, the etchant AD-107F manufactured by C. Uyemura & Co., Ltd.). Preferable conditions of acid etching include a temperature of 50° C. to 75° C., a treatment period of 0.5 to 5 minutes, and a concentration of 20 to 100 mL/L.

(80) In the desmutting step (Step 3), a thin oxidized film is generated on the surface of the aluminum alloy plate to substantially equalize the thicknesses of the oxidized films on the respective samples. The desmutting is conducted using an HNO.sub.3 solution as in a typical desmutting procedure. Preferable desmutting conditions include a temperature of 15° C. to 40° C., a treatment period of 10 to 120 seconds, and a concentration of 10% to 60%.

(81) The desmutting step may be omitted in some cases depending on the timing of the compound removal process. Specifically, if a substrate has already undergone the compound removal process at the time of completion of the acid etching step, the substrate is desmutted. In contrast, if a substrate has not yet undergone the compound removal process at the time of completion of the acid etching step, the substrate is subject to the compound removal process instead of the desmutting step, thereby omitting the desmutting step. It should be noted that these process and step may be redundantly conducted, that is, the compound removal process may be conducted in addition to the desmutting step. The preceding steps can adjust the surface of the aluminum alloy plate to a preferable state. The steps can also equalize the surface states of all the samples.

(82) The aluminum alloy plate after the desmutting step receives at least one zincate treatment, which provides a zincate coating on the plate surface. The aluminum alloy plate may receive two or more zincate treatments. Multiple zincate treatments cause deposition of fine Zn particles and thus provide a uniform zincate coating.

(83) In a first zincate treatment step (Step 4) in FIG. 1, deposition of fine Fe particles on the surface of the aluminum alloy plate is followed by dissolution of the aluminum alloy caused by cell reactions between the Fe particles and the aluminum alloy plate. The substitution reactions then occur and cause Zn to be deposited, thereby providing a zincate coating. The first zincate treatment is conducted using a commercially available zincate solution (for example, the zincate solution AD-301F-3X manufactured by C. Uyemura & Co., Ltd.). Preferable conditions of first zincate treatment include a temperature of 10° C. to 35° C., a treatment period of 0.1 to 5 minutes, and a concentration of 100 to 500 mL/L.

(84) In a Zn peeling step (Step 5), the Zn deposited in the first zincate treatment step is dissolved while leaving the Fe particles. The Zn peeling is conducted using an HNO.sub.3 solution. Preferable conditions of Zn peeling include a temperature of 15° C. to 40° C., a treatment period of 10 to 120 seconds, and a concentration of 10% to 60%.

(85) A second zincate treatment step (Step 6) is then conducted. Although the second zincate treatment causes the same reactions as those in the first zincate treatment, deposition of another Fe particles increases the sites of cell reactions, so that finer Zn are deposited to provide a uniform zincate coating. The second zincate treatment should preferably be conducted in the same conditions as those of the first zincate treatment.

(86) The aluminum alloy plate after the above-explained plating pretreatment process including the last zincate treatment step is then subject to an electroless Ni—P plating process (Step 7) and thus converted into an aluminum alloy substrate for a magnetic disk. The disclosure is characterized by the compound removal process, which is not included in existing methods, to reduce deficiencies on the electroless Ni—P plated surface, as shown in FIG. 1. The compound removal process will now be explained in detail.

(87) B-6. Compound Removal Process

(88) The following explanation is directed to the technical significance of this process. The compound removal process indicates a process of removing compound particles in the vicinity of the surface of an aluminum alloy plate using a certain solution. An objective of this process is to reduce surface deficiencies after electroless Ni—P plating. The compound particles on the surface of the aluminum alloy plate and the deficiencies on the electroless Ni—P plated surface are considered to have a relationship explained below:

(89) The electroless Ni—P plating to the aluminum alloy plate is proceeded by substitution reactions with Zn, which constitutes the zincate coating provided in the plating pretreatment process. That is, the deficiencies on the electroless Ni—P plated surface are derived from the nonuniform zincate coating. The above-explained zincate treatment is proceeded by cell reactions between fine Fe particles deposited on the surface of the aluminum alloy plate and the matrix (aluminum alloy). If compound particles exist on the surface of the aluminum alloy plate, local cell reactions occur also between the compound particles and the matrix. These phenomena make the reactions on the entire aluminum alloy plate nonuniform, thereby causing nonuniform deposition of Zn. This configuration leads to extremely nonuniform initial reactions in the subsequent electroless Ni—P plating process, resulting in generation of deficiencies.

(90) The deficiencies on the electroless Ni—P plated surface emerge in the form of irregularities (nodules) on the plated surface. A high density of compound particles causes generation of a number of nodules. The nodules affect the waviness of the aluminum alloy substrate and the magnetic disk, as described above. For these reasons, required is a reduction in compound particles remaining on the surface of the aluminum alloy substrate.

(91) The above-described relationship between compound particles and plating deficiencies have already been acknowledged also in existing aluminum alloy substrates (for example, the JIS 5086 Al—Mg alloy and the alloy disclosed in Patent Literature 1). It should be noted that the existing aluminum alloy substrates are composed of aluminum alloys having extremely low Fe and Si contents in consideration of adverse effects of compound particles. In these aluminum alloy substrates, compound particles are small and exist at a low density. These compound particles can be sufficiently removed by the above fabrication processes, in particular, the acid etching step (Step 2) in the existing aluminum alloy substrates. The acid etching dissolves and removes the oxidized film on the aluminum alloy surface, and simultaneously dissolves a slight amount of the matrix and thus removes a small amount of compound particles. That is, the existing aluminum alloy substrates do not require a process dedicated to removal of compound particles.

(92) In contrast, the aluminum alloy substrate according to the disclosure is composed of an Al—Fe alloy having a relatively high content of Fe. Because of this Fe content, relatively large compound particles may be generated at a high density. The compound particles according to the disclosure indicate Al—Fe intermetallic compound particles, such as Al—Fe and Al—Fe—Mn. Al—Mn intermetallic compound particles and Al—Cu intermetallic compound particles may be generated depending on the composition of the aluminum alloy.

(93) According to the disclosure, the casting process involves the CC method in order to ensure the strength and yield stress of the aluminum alloy substrate. The aluminum alloy plate fabricated by the CC method tends to have a nonuniform distribution of compound particles and may have a dense distribution of compound particles in the vicinity of the plate surface.

(94) As explained above, the aluminum alloy substrate according to the disclosure is expected to have compound particles having a large size and a high density, due to both of the composition and fabrication method of the aluminum alloy. In this aluminum alloy plate, an acid etching step at a level of dissolving a small amount of the matrix cannot remove compound particles. The fabrication method according to the disclosure therefore includes a process aimed at removal of compound particles. FIG. 2 illustrates images of an electroless Ni—P plated surface with and without the compound removal process, which clearly show a difference in generated nodules.

(95) Then, the details of the compound removal process will be explained. The compound removal process removes compound particles remaining on the surface of the aluminum alloy plate using a solution. The used solution is an HNO.sub.3/HF mixed solution (hereinafter abbreviated simply as “mixed solution”), which is a solution at a temperature of 10° C. to 30° C. having an HNO.sub.3 concentration of 10 to 60 mass % (hereinafter abbreviated as “%”) and an HF concentration of 10 to 80 g/L. This mixed solution has a high etching power and increases the rate of dissolution of the aluminum alloy substrate especially around compound particles. The dissolution of the aluminum alloy substrate around compound particles can achieve removal of the compound particles, so as to selectively remove only the compound particles on the surface of the aluminum alloy substrate.

(96) A mixed solution having an HF concentration of less than 10 g/L and an HNO.sub.3 concentration of less than 10% has a low etching power and cannot sufficiently remove the compound particles on the surface of the aluminum alloy substrate. In contrast, a mixed solution having an HF concentration exceeding 80 g/L and an HNO.sub.3 concentration exceeding 60% has an excessively high etching power and significantly dissolves the matrix of the aluminum alloy plate. This phenomenon increases the sizes of irregularities on the surface of the aluminum alloy substrate, thereby impairing the smoothness of the electroless Ni—P plated surface and increasing the waviness. The HF concentration should preferably be within the range of 20 to 60 g/L, and the HNO.sub.3 concentration should preferably be within the range of 25% to 50%.

(97) The temperature of the mixed solution is defined to be within the range of 10° C. to 30° C. At a temperature of less than 10° C., compound particles on the surface of the aluminum alloy substrate cannot be sufficiently removed due to a low rate of reaction. In contrast, at a temperature exceeding 30° C., the matrix of the aluminum alloy plate is significantly dissolved due to an excessively high rate of reaction, thereby increasing the sizes of irregularities on the surface of the aluminum alloy substrate and thus increasing the level of waviness. The temperature of the mixed solution should preferably be within the range of 15° C. to 25° C. In addition, the treatment period in the compound removal process is defined to be within the range of 5 to 60 seconds. With a treatment period of less than five seconds, compound particles on the surface of the aluminum alloy substrate cannot be sufficiently removed due to an excessively short reaction time. In contrast, with a treatment period exceeding 60 seconds, the matrix of the aluminum alloy plate is significantly dissolved due to an excessively long reaction time, thereby increasing the sizes of irregularities on the surface of the aluminum alloy substrate and thus increasing the level of waviness. The treatment period should preferably be within the range of 10 to 30 seconds.

(98) The compound removal process is conducted at a timing after the grinding step of the substrate preparing process and before the zincate treatment step of the plating pretreatment process. In the case of two or more zincate treatment steps, the timing is before the first one of the zincate treatment steps. Exemplary timings of the compound removal process will now be explained with reference to FIG. 1. For example, the compound removal process may be conducted after the desmutting step (Step 3) before the first zincate treatment step (Step 4). Alternatively, the compound removal process may be conducted instead of the desmutting step. Alternatively, the compound removal process may be conducted at any timing after the grinding step that precedes the plating pretreatment process, and before the alkaline degreasing step (Step 1). In this case, an optional step (not essential) that is the same as the acid etching step may be added before the compound removal process to remove the oxidized film on the surface of the aluminum alloy plate.

(99) B-7. Electroless Ni—P Plating Process

(100) The aluminum alloy plate after the above-explained compound removal process and the zincate treatment steps is subject to the electroless Ni—P plating process, which provides base plating of a magnetic disk (Step 7 in FIG. 1). In this electroless Ni—P plating process, substitution reactions between Zn and Ni—P proceed on the surface of the aluminum alloy plate at the first stage until the surface is covered with Ni—P. Then, Ni—P is deposited on the Ni—P layer by autocatalytic reactions at the second stage.

(101) The electroless Ni—P plating process should preferably be conducted using a commercially available plating solution (for example, the plating solution NIMUDEN HDX manufactured by C. Uyemura & Co., Ltd.) at a temperature of 80° C. to 95° C., for a treatment period of 30 to 180 minutes, and at an Ni concentration of 3 to 10 g/L.

(102) This electroless Ni—P plating process can yield an aluminum alloy substrate for a magnetic disk according to the disclosure. The Ni—P plated aluminum alloy substrate is then polished. Although the conditions of polishing are not particularly limited, the amount of polishing should preferably be 1 μm or more per one surface. A typical abrasive material used in this process is colloidal silica, for example.

(103) C. Magnetic Disk According to the Disclosure

(104) Based on the above-explained aluminum alloy substrate for a magnetic disk according to the disclosure, the magnetic disk according to the disclosure has a low level of disk fluttering and a low level of waviness.

(105) Specifically, the aluminum alloy substrate according to the disclosure has reduced deficiencies on the Ni—P plated surface, so that the maximum amplitude of waviness in a wavelength range of 0.4 to 5.0 mm is 5.0 nm or less, and the maximum amplitude of waviness in a wavelength range of 0.08 to 0.45 mm is 1.5 nm or less. The magnetic disk according to the disclosure includes this substrate and a magnetic medium thereon composed of layers, such as a magnetic layer. The magnetic disk provides waviness having the same wavelengths and amplitudes as this aluminum alloy substrate.

(106) Furthermore, the aluminum alloy substrate according to the disclosure is composed of an Al—Fe alloy having a high strength, so that the maximum displacement (level of disk fluttering) at a frequency of 100 Hz or more is 200 nm or less. The magnetic disk according to the disclosure provides the same fluttering characteristics as this aluminum alloy substrate.

(107) The magnetic disk according to the disclosure is fabricated by spattering a magnetic medium on the surface of the aluminum alloy substrate according to the disclosure. The magnetic medium includes a foundation layer, a magnetic layer, a protective film, and a lubricating layer. The surface of the aluminum alloy substrate may be polished before spattering of the magnetic medium.

First Embodiment

(108) Examples and comparative examples of the disclosure will now be described in more detail but should not be construed as limiting the disclosure.

(109) First, each of the aluminum alloys having the compositions shown in Tables 1 and 2 was melted by a general method to prepare a molten aluminum alloy. Second, the molten aluminum alloy was cast by a CC method to produce a thin plate (cast plate) having a thickness of 6 mm. This thin plate was then cold rolled into a final rolled plate having a thickness of 0.8 mm. The resulting aluminum alloy plate was punched into an annular shape to yield an annular aluminum alloy plate having an outer diameter of 96 mm and an inner diameter of 24 mm.

(110) TABLE-US-00001 TABLE 1 CONSTITUENT ELEMENTS (mass %) Al + ALLOY Ti + UNAVOIDABLE No. Fe Mn Cu Zn Si Ni Mg Cr Zr Ti B V B + V IMPURITIES A1 1.4 0.7 0.020 0.500 0.2 — — — — — — — — Bal. A2 0.4 0.7 0.020 0.500 — — — — — — — — — Bal. A3 3.0 0.7 0.020 0.500 — — — — — — — — — Bal. A4 1.4 0.1 0.020 0.500 — — — — — — — — — Bal. A5 1.4 3.0 0.020 0.500 — — — — — — — — — Bal. A6 1.4 0.7 0.005 0.500 — — — — — — — — — Bal. A7 1.4 0.7 1.000 0.500 — — — — — — — — — Bal. A8 1.4 0.7 0.020 0.005 — — — — — — — — — Bal. A9 1.4 0.7 0.020 1.000 — — — — — — — — — Bal. A10 1.4 0.7 0.020 0.500 0.1 — — — — — — — — Bal. A11 1.4 0.7 0.020 0.500 0.4 — — — — — — — — Bal. A12 1.4 0.7 0.020 0.500 — 0.1 — — — — — — — Bal. A13 1.4 0.7 0.020 0.500 — 3.0 — — — — — — — Bal. A14 1.4 0.7 0.020 0.500 — — 0.1 — — — — — — Bal. A15 1.4 0.7 0.020 0.500 — — 6.0 — — — — — — Bal. A16 1.4 0.7 0.020 0.500 — — — 0.01 — — — — — Bal. A17 1.4 0.7 0.020 0.500 — — — 1.00 — — — — — Bal. A18 1.4 0.7 0.020 0.500 — — — — 0.01 — — — — Bal. A19 1.4 0.7 0.020 0.500 — — — — 1.00 — — — — Bal. A20 1.4 0.7 0.020 0.500 — — — — — 0.002 0.002 0.001 0.005 Bal. A21 1.4 0.7 0.020 0.500 — — — — — 0.200 0.200 0.100 0.500 Bal. A22 1.4 0.7 0.020 0.500 0.3 — 2.0 — — — — — — Bal. A23 1.4 0.7 0.020 0.500 — 1.0 — — 0.10 — — — — Bal. A24 1.4 0.7 0.020 0.500 0.3 — — 0.10 — 0.020 0.020 0.010 0.050 Bal. A25 1.4 0.7 0.020 0.500 — 1.2 0.5 — — — — — — Bal. A26 1.4 0.7 0.020 0.500 0.2 — — 0.10 0.20 — — — — Bal. A27 1.4 0.7 0.020 0.500 0.2 0.3 1.0 0.20 0.20 — — — — Bal. A28 1.4 0.7 0.020 0.500 0.2 0.3 1.0 0.20 0.20 0.003 0.003 0.003 0.009 Bal. A29 1.3 1.0 0.500 0.800 — — — — — — — — — Bal. A30 2.2 2.5 0.700 0.700 — — — — — — — — — Bal.

(111) TABLE-US-00002 TABLE 2 CONSTITUENT ELEMENTS (mass %) Al + ALLOY Ti + UNAVOIDABLE No. Fe Mn Cu Zn Si Ni Mg Cr Zr Ti B V B + V IMPURITIES B1 0.2 0.7 0.020 0.500 — — — — — — — — — Bal. B2 3.5 0.7 0.020 0.500 — — — — — — — — — Bal. B3 1.4 0.07 0.020 0.500 — — — — — — — — — Bal. B4 1.4 3.5 0.020 0.500 — — — — — — — — — Bal. B5 1.4 0.7 0.002 0.500 — — — — — — — — — Bal. B6 1.4 0.7 1.500 0.500 — — — — — — — — — Bal. B7 1.4 0.7 0.020 0.002 — — — — — — — — — Bal. B8 1.4 0.7 0.020 1.500 — — — — — — — — — Bal. B9 1.4 0.7 0.020 0.500 0.7 — — — — — — — — Bal. B10 1.4 0.7 0.020 0.500 — 3.5 — — — — — — — Bal. B11 1.4 0.7 0.020 0.500 — — 6.2 — — — — — — Bal. B12 1.4 0.7 0.020 0.500 — — — 1.50 — — — — — Bal. B13 1.4 0.7 0.020 0.500 — — — — 1.50 — — — — Bal. B14 3.3 0.7 0.020 0.500 0.3 — 0.3 — — — — — — Bal. B15 3.3 0.7 1.500 0.500 0.2 0.3 1.0 0.20 0.20 0.003 0.003 0.003 0.009 Bal. B16 1.4 0.7 0.020 0.500 0.8 3.5 6.2 1.50 1.50 — — — — Bal. B17 1.4 0.7 0.020 0.500 0.8 — — 1.50 — — — — — Bal. B18 1.4 4.0 0.020 0.500 0.2 0.3 — — 0.20 — — — — Bal. B19 3.3 3.5 1.500 1.500 — — — — — — — — — Bal.

(112) The resulting annular aluminum alloy plate was heated at 300° C. for three hours under a pressure of 1.5 MPa in the pressure annealing process, thereby producing a disk blank. The end faces of the disk blank were cut such that the disk blank had an outer diameter of 95 mm and an inner diameter of 25 mm. The surfaces of the disk blank were then ground at an amount of 10 μm per one surface.

(113) This grinding step was followed by the compound removal process in this embodiment. The compound removal process was conducted at 25° C. for 20 seconds using a mixed solution having an HF concentration of 40 g/L and an HNO.sub.3 concentration of 50%.

(114) After the compound removal process, the disk blank underwent the plating pretreatment process. The disk blank was degreased at 60° C. for five minutes using the degreasing solution AD-68F (manufactured by C. Uyemura & Co., Ltd.) in the alkaline degreasing step. The disk blank was then subject to acid etching at 65° C. for three minutes using the etchant AD-107F (manufactured by C. Uyemura & Co., Ltd.) in the acid etching step. The disk blank was then desmutted for 50 seconds using the 30% HNO.sub.3 aqueous solution (at a room temperature) in the desmutting step.

(115) The resulting disk blank received a zincate treatment for 50 seconds using the zincate solution AD-301F (manufactured by C. Uyemura & Co., Ltd.) at 25° C. in the first zincate treatment step. The first zincate treatment was followed by peeling of the zincate coating (Zn peeling) for 60 seconds using a 30% HNO.sub.3 aqueous solution (at a room temperature). The disk blank then received another zincate treatment for 60 seconds using the zincate solution AD-301F (manufactured by C. Uyemura & Co., Ltd.) at 25° C. in the second zincate treatment step.

(116) The disk blank after completion of the plating pretreatment process including the second zincate treatment was then provided with electroless plating of Ni—P at a thickness of 17 μm for 150 minutes using the electroless Ni—P plating solution NIMUDEN HDX (manufactured by C. Uyemura & Co., Ltd.) at 90° C. This process was followed by polish finishing (at an amount of 4 μm per one surface) with a fabric, and thus completed an aluminum alloy substrate for a magnetic disk according to the embodiment.

(117) In this embodiment, the yield stress of each of the above-described aluminum alloys and the waviness, plating smoothness, and level of fluttering characteristics of each of the fabricated aluminum alloy substates were measured and evaluated. Methods of measuring and evaluating these properties will be explained below:

(118) [Evaluation 1: Yield Stress]

(119) The yield stress of each of the aluminum alloys was measured by annealing (heating for simulating pressure annealing) an aluminum alloy plate after cold rolling at 300° C. for three hours and then sampling JIS 5 test specimens (n=2) extending in the rolling direction, in accordance with JIS Z 2241. As the grades of strength, a yield stress of 120 MPa or more was evaluated as “A”, 100 MPa or more and less than 120 MPa as “B”, and less than 100 MPa as “C”.

(120) [Evaluation 2: Waviness]

(121) Each of the fabricated aluminum alloy substrates was analyzed in five areas having a size of 2.5 mm×3.3 mm using the device μ-XAM (manufactured by KLA Tencor), to calculate the maximum amplitude of waviness for each wavelength.

(122) Based on the measurement results, if the maximum amplitude of waviness in a wavelength range of 0.4 to 5.0 mm was 2.5 nm or less and if the maximum amplitude of waviness in a wavelength range of 0.08 to 0.45 mm was 1 nm or less, the aluminum alloy substrate was evaluated as “A”. If the maximum amplitude of waviness in a wavelength range of 0.4 to 5.0 mm was 5 nm or less and if the maximum amplitude of waviness in a wavelength range of 0.08 to 0.45 mm was 1.5 nm or less, the substrate was evaluated as “B”. If the maximum amplitude of waviness in a wavelength range of 0.4 to 5.0 mm was more than 5 nm or if the maximum amplitude of waviness in a wavelength range of 0.08 to 0.45 mm was more than 1.5 nm, the substrate was evaluated as “C”.

(123) [Evaluation 3: Plating Smoothness]

(124) Each of the fabricated aluminum alloy substrates was immersed in 50 vol % HNO.sub.3 at 50° C. for seven minutes to etch the Ni—P plated surface. The Ni—P plated surface after the etching was observed using an optical microscope at a magnification of 1,000× in 30 fields. Then, the arithmetic average of the number of plating deficiencies was calculated. An arithmetic average of less than three per field was evaluated as “A”, three or more and less than ten per field as “B”, and ten or more per field as “C”. The grades A and B were acceptable while the grade C was unacceptable.

(125) [Evaluation 4: Fluttering Characteristics]

(126) Each of the fabricated aluminum alloy substrates was installed in a commercially available hard disk drive in the presence of air and evaluated in terms of fluttering characteristics. The used hard disk drive was ST2000 (commercial name, manufactured by Seagate Technology LLC). The motor was directly coupled to and driven by the driver SLD102 (commercial name, manufactured by Tekunoaraibu kabushikigaisha). The rotational speed of aluminum alloy substrates was set to 7,200 rpm. A plurality of aluminum alloy substrates was installed all the time, and the upper one of the substrates was provided with the laser Doppler vibrometer LDV1800 (commercial name, manufactured by Ono Sokki Co., Ltd.) on the substrate surface to observe vibration of the surface. The observed vibration was subject to spectrum analysis using the FFT analyzer DS3200 (commercial name, manufactured by Ono Sokki Co., Ltd.). The surface of the substrate was observed through an opening preliminarily formed in the cover of the hard disk drive. The squeeze plate of the commercially available hard disk drive was preliminarily removed for evaluation.

(127) The level of fluttering characteristics was evaluated based on the maximum displacement (level of disk fluttering (nm)) of a broad peak near the range of 300 to 1,500 Hz in which fluttering emerges. This broad peak is called non-repeatable run out (NRRO) and has been known as significantly affecting the occurrence of errors in positioning of the head. The level of fluttering characteristics of 150 nm or less in the air was evaluated as “A”, the level of more than 150 nm and equal to or less than 200 nm as “B”, and the level of more than 200 nm as “C”. The grades A and B were acceptable while the grade C was unacceptable.

(128) The results of measurement and evaluation on the above properties are shown in Tables 3 and 4. The following description will discuss each of the examples and comparative examples based on Tables 1 to 4.

(129) TABLE-US-00003 TABLE 3 WAVINESS MAXIMUM AMPLITUDE FLUTTERING SURFACE 0.4-5.0 0.08-0.45 EVALU- PLATING CHARACTER- ALLOY CASTING PROCESSING mm mm ATION STRENGTH SMOOTHNESS ISTICS EXAMPLE 1 A1 CC GRINDING C1 2.0 0.6 A A A EXAMPLE 2 A2 CC GRINDING C1 1.1 0.4 A B B EXAMPLE 3 A3 CC GRINDING C1 2.8 1.3 B A B EXAMPLE 4 A4 CC GRINDING C1 1.5 0.8 A B A EXAMPLE 5 A5 CC GRINDING C1 3.2 1.3 B A B EXAMPLE 6 A6 CC GRINDING C1 2.0 1.0 A A B EXAMPLE 7 A7 CC GRINDING C1 2.4 1.5 B A B EXAMPLE 8 A8 CC GRINDING C1 3.0 0.9 B A B EXAMPLE 9 A9 CC GRINDING C1 2.2 0.9 A A B EXAMPLE 10 A10 CC GRINDING C1 2.4 0.7 A A A EXAMPLE 11 A11 CC GRINDING C1 2.9 1.3 B A B EXAMPLE 12 A12 CC GRINDING C1 2.2 0.8 A A A EXAMPLE 13 A13 CC GRINDING C1 4.1 1.4 B A B EXAMPLE 14 A14 CC GRINDING C1 2.1 0.6 A A A EXAMPLE 15 A15 CC GRINDING C1 3.4 1.4 B A A EXAMPLE 16 A16 CC GRINDING C1 1.9 0.7 A A A EXAMPLE 17 A17 CC GRINDING C1 3.0 1.3 B A A EXAMPLE 18 A18 CC GRINDING C1 2.2 0.5 A A A EXAMPLE 19 A19 CC GRINDING C1 2.8 1.2 B A A EXAMPLE 20 A20 CC GRINDING C1 2.0 0.9 A A A EXAMPLE 21 A21 CC GRINDING C1 3.7 1.4 B A B EXAMPLE 22 A22 CC GRINDING C1 2.5 1.1 B A B EXAMPLE 23 A23 CC GRINDING C1 3.1 1.1 B A A EXAMPLE 24 A24 CC GRINDING C1 3.0 1.3 B A B EXAMPLE 25 A25 CC GRINDING C1 4.2 1.4 B A A EXAMPLE 26 A26 CC GRINDING C1 2.8 1.1 B A B EXAMPLE 27 A27 CC GRINDING C1 2.8 1.4 B A B EXAMPLE 28 A28 CC GRINDING C1 4.0 1.4 B A B EXAMPLE 29 A29 CC GRINDING C1 1.7 0.8 A A A EXAMPLE 30 A30 CC GRINDING C1 2.4 1.0 B A A

(130) TABLE-US-00004 TABLE 4 WAVINESS MAXIMUM AMPLITUDE FLUTTERING SURFACE 0.4-5.0 0.08-0.45 EVALU- PLATING CHARACTER- ALLOY CASTING PROCESSING mm mm ATION STRENGTH SMOOTHNESS ISTICS COMPARATIVE B1 CC GRINDING C1 1.2 0.3 A B A EXAMPLE 1 COMPARATIVE B2 CC GRINDING C1 5.3 2.0 C A C EXAMPLE 2 COMPARATIVE B3 CC GRINDING C1 2.0 0.8 A B A EXAMPLE 3 COMPARATIVE B4 CC GRINDING C1 4.8 2.0 C A C EXAMPLE 4 COMPARATIVE B5 CC GRINDING C1 2.3 1.2 B A C EXAMPLE 5 COMPARATIVE B6 CC GRINDING C1 5.0 1.8 C A C EXAMPLE 6 COMPARATIVE B7 CC GRINDING C1 2.2 1.5 B A C EXAMPLE 7 COMPARATIVE B8 CC GRINDING C1 2.2 1.8 C A C EXAMPLE 8 COMPARATIVE B9 CC GRINDING C1 5.3 2.3 C A C EXAMPLE 9 COMPARATIVE B10 CC GRINDING C1 4.9 2.0 C A C EXAMPLE 10 COMPARATIVE B11 CC GRINDING C1 — — — — — EXAMPLE 11 COMPARATIVE B12 CC GRINDING C1 4.0 1.8 C A C EXAMPLE 12 COMPARATIVE B13 CC GRINDING C1 3.8 2.1 C A C EXAMPLE 13 COMPARATIVE B14 CC GRINDING C1 3.8 2.2 C A C EXAMPLE 14 COMPARATIVE B15 CC GRINDING C1 3.4 1.7 C A C EXAMPLE 15 C'OMPARATIVE B16 CC GRINDING C1 — — — — — EXAMPLE 16 COMPARATIVE B17 CC GRINDING C1 5.2 2.1 C A C EXAMPLE 17 C'OMPARATIVE B18 CC GRINDING C1 6.0 2.7 C A C EXAMPLE 18 COMPARATIVE B19 CC GRINDING C1 6.1 3.2 C A C EXAMPLE 19

(131) In this embodiment, the examples and comparative examples (Examples 1 to 30 and Comparative Examples 1 to 22) have mutually different compositions of aluminum alloys. The embodiment contributes to studies on the relationship between alloy composition and each property. As shown in Table 2, Examples 1 to 30 (Alloys A1 to A30), in which the aluminum alloys contain preferable amounts of constituent elements, were evaluated as acceptable regarding waviness, strength, and fluttering characteristics. These examples also provided good plating smoothness.

(132) In contrast, Comparative Examples 1 to 19 (Alloys B1 to B19) were evaluated as unacceptable regarding any of the properties, as described below:

(133) Comparative Example 1 was evaluated as unacceptable regarding fluttering characteristics. The insufficient fluttering characteristics seemed to be caused by few second phase particles due to the low Fe content of the alloy (B1).

(134) Comparative Example 2 was evaluated as unacceptable regarding plating smoothness. The poor plating smoothness resulted in a high level of waviness. The alloy (B2) had a high Fe content and thus caused generation of a number of coarse Al—Fe compound particles. The plating deficiencies seemed to be caused by the pits generated after removal of these compound particles in the compound removal process.

(135) Comparative Example 3 having a low Mn content was evaluated as unacceptable regarding fluttering characteristics. The insufficient fluttering characteristics seemed to be caused by few second phase particles due to the low Mn content of the alloy (B3).

(136) Comparative Example 4 was evaluated as unacceptable regarding plating smoothness. The poor plating smoothness resulted in a high level of waviness. The plating deficiencies seemed to be caused by the pits generated after removal of a number of coarse Al—Mn compound particles due to the high Mn content of the alloy (B4).

(137) Comparative Example 5 was evaluated as unacceptable regarding fluttering characteristics due to the low Cu content. This example was also evaluated as unacceptable regarding plating smoothness because of deficiencies on the plated surface derived from the nonuniform zincate coating.

(138) Comparative Example 6 was evaluated as unacceptable regarding plating smoothness due to the high Cu content. The poor plating smoothness resulted in a high level of waviness.

(139) Comparative Example 7 was evaluated as unacceptable regarding fluttering characteristics due to the low Zn content. This example was also evaluated as unacceptable regarding plating smoothness because of deficiencies on the plated surface derived from the nonuniform zincate coating.

(140) Comparative Example 8 was evaluated as unacceptable regarding plating smoothness because of deficiencies on the plated surface derived from a number of irregularities, which were generated because the matrix having a far less noble electric potential due to the high Zn content was severely dissolved in the plating process. The poor plating smoothness resulted in a high level of waviness.

(141) Comparative Example 9 was evaluated as unacceptable regarding plating smoothness. The poor plating smoothness resulted in a high level of waviness. The poor plating smoothness seemed to be caused by a number of coarse Si particles due to the high Si content remaining even after the compound removal process.

(142) Comparative Example 10 was evaluated as unacceptable regarding plating smoothness due to the high Ni content. The poor plating smoothness resulted in a high level of waviness. The plating deficiencies seemed to be caused by the pits generated after removal of a number of coarse Al—Ni compound particles.

(143) Comparative Example 11 failed to conduct the rolling process due to the high Mg content and provided no sample for evaluation.

(144) Comparative Example 12 was evaluated as unacceptable regarding plating smoothness due to the high Cr content. The poor plating smoothness resulted in a high level of waviness. The poor plating smoothness seemed to be caused by generation of coarse Al—Cr compound particles.

(145) Comparative Example 13 was evaluated as unacceptable regarding plating smoothness due to the high Zr content. The poor plating smoothness resulted in a high level of waviness. The poor plating smoothness seemed to be caused by generation of coarse Al—Zr compound particles.

(146) Comparative Example 14 was evaluated as unacceptable regarding plating smoothness due to the high Fe content. The poor plating smoothness resulted in a high level of waviness.

(147) Comparative Example 15 was evaluated as unacceptable regarding plating smoothness due to the high Fe and Cu contents. The poor plating smoothness resulted in a high level of waviness.

(148) Comparative Example 16 failed to conduct the rolling process due to the high Mg content and provided no sample for evaluation.

(149) Comparative Example 17 was evaluated as unacceptable regarding plating smoothness due to the high Si and Cr contents. The poor plating smoothness resulted in a high level of waviness. The poor plating smoothness seemed to be caused by generation of coarse compound particles.

(150) Comparative Example 18 was evaluated as unacceptable regarding plating smoothness due to the high Mn content. The poor plating smoothness resulted in a high level of waviness.

(151) Comparative Example 19 was evaluated as unacceptable regarding plating smoothness due to the high Fe, Mn, and Cu contents. In the case of this alloy, the poor plating smoothness was also caused by deficiencies on the plated surface derived from a number of irregularities, which were generated because the matrix having a far less noble electric potential due to the high Zn content was severely dissolved in the plating process. The poor plating smoothness resulted in a high level of waviness.

Second Embodiment

(152) In this embodiment, aluminum alloy substrates composed of an aluminum alloy having the same composition as that of Example 1 (alloy A1) in the first embodiment were fabricated in mutually different conditions. The fabrication conditions in the embodiment are adjusted as below:

(153) [Casting Condition]

(154) Most of the aluminum alloy substrates were composed of aluminum alloy thin plates fabricated by the CC method as in the first embodiment, while the others were composed of aluminum alloy thin plates fabricated by the DC method.

(155) [Surface Processing]

(156) Most of the disk blanks, which had received end face cutting and had the same size as in the first embodiment, were subject to surface processing (grinding) of grinding the surfaces of the disk blank at an amount of 10 μm per one surface as in the first embodiment, or surface processing (cutting+grinding) of cutting a surface of the disk blank at an amount of 5 μm and then grinding the surface at an amount of 5 μm. Some of the disk blanks, which had received end face cutting, were subject to surface processing (cutting) of only cutting a surface of the disk blank at an amount of 10 μm. The others of the disk blanks received only end face cutting without surface processing.

(157) [Timing and Conditions of the Compound Removal Process]

(158) As shown in Table 5, the compound removal process is conducted at different timings between the procedures.

(159) In Procedures No. C1 to C9 and D1 to D8 shown in Table 5, the above-explained surface processing was followed by the compound removal process, the plating pretreatment (alkaline degreasing to zincate treatment), and then the electroless Ni—P plating, as in the first embodiment, thereby yielding an aluminum alloy substrate.

(160) In contrast, in Procedures No. C10 to C18 and D9 to D17 shown in Table 5, the disk blank after the above-explained surface processing was subject to alkaline degreasing, acid etching, and desmutting as in the first embodiment and then underwent the compound removal process. This process was followed by the zincate treatments and the electroless Ni—P plating as in the first embodiment, thereby yielding an aluminum alloy substrate.

(161) In addition, the conditions of compound removal (an HF concentration and an HNO.sub.3 concentration of the mixed solution, a solution temperature, and a treatment period) were adjusted as shown in Table 5.

(162) Some of the aluminum alloy substrates were fabricated by a procedure (Procedure No. D17 in Table 5) without any compound removal process.

(163) TABLE-US-00005 TABLE 5 PROCESSES AND STEPS COMPOUND REMOVAL PROCESS HF HNO.sub.3 SOLUTION CONCEN- CONCEN- TEMPER- TREAT- PROCE- TRATION, TRATION, ATURE, MENT ALKALINE ACID DURE No. g/L mass % ° C. PERIOD, s DEGREASING ETCHING DESMUTTING C1 40 50 25 20 ↑ ↑ ↑ C2 10 50 25 20 ↑ ↑ ↑ C3 80 50 25 20 ↑ ↑ ↑ C4 40 10 25 20 ↑ ↑ ↑ C5 40 60 25 20 ↑ ↑ ↑ C6 40 50 10 20 ↑ ↑ ↑ C7 40 50 30 20 ↑ ↑ ↑ C8 40 50 25  5 ↑ ↑ ↑ C9 40 50 25 60 ↑ ↑ ↑ C10 — — — — ↑ ↑ ↑ C11 — — — — ↑ ↑ ↑ C12 — — — — ↑ ↑ ↑ C13 — — — — ↑ ↑ ↑ C14 — — — — ↑ ↑ ↑ C15 — — — — ↑ ↑ ↑ C16 — — — — ↑ ↑ ↑ C17 — — — — ↑ ↑ ↑ C18 — — — — ↑ ↑ ↑ D1  5 50 25 20 ↑ ↑ ↑ D2 100  50 25 20 ↑ ↑ ↑ D3 40  5 25 20 ↑ ↑ ↑ D4 40 70 25 20 ↑ ↑ ↑ D5 40 50  5 20 ↑ ↑ ↑ D6 40 50 40 20 ↑ ↑ ↑ D7 40 50 25  2 ↑ ↑ ↑ D8 40 50 25 70 ↑ ↑ ↑ D9 — — — — ↑ ↑ ↑ D10 — — — — ↑ ↑ ↑ D11 — — — — ↑ ↑ ↑ D12 — — — — ↑ ↑ ↑ D13 — — — — ↑ ↑ ↑ D14 — — — — ↑ ↑ ↑ D15 — — — — ↑ ↑ ↑ D16 — — — — ↑ ↑ ↑ D17 NONE NONE NONE NONE ↑ ↑ ↑ PROCESSES AND STEPS COMPOUND REMOVAL PROCESS HF HNO.sub.3 SOLUTION CONCEN- CONCEN- TEMPER- TREAT- ZINCATE ELECTRO- PROCE- TRATION, TRATION, ATURE, MENT TREAT- LESS Ni-P DURE No. g/L mass % ° C. PERIOD, s MENT PLATING C1 — — — — ↑ ↑ C2 — — — — ↑ ↑ C3 — — — — ↑ ↑ C4 — — — — ↑ ↑ C5 — — — — ↑ ↑ C6 — — — — ↑ ↑ C7 — — — — ↑ ↑ C8 — — — — ↑ ↑ C9 — — — — ↑ ↑ C10 40 50 25 20 ↑ ↑ C11 10 50 25 20 ↑ ↑ C12 80 50 25 20 ↑ ↑ C13 40 10 25 20 ↑ ↑ C14 40 60 25 20 ↑ ↑ C15 40 50 10 20 ↑ ↑ C16 40 50 30 20 ↑ ↑ C17 40 50 25  5 ↑ ↑ C18 40 50 25 60 ↑ ↑ D1 NONE NONE NONE NONE ↑ ↑ D2 NONE NONE NONE NONE ↑ ↑ D3 NONE NONE NONE NONE ↑ ↑ D4 NONE NONE NONE NONE ↑ ↑ D5 NONE NONE NONE NONE ↑ ↑ D6 NONE NONE NONE NONE ↑ ↑ D7 NONE NONE NONE NONE ↑ ↑ D8 NONE NONE NONE NONE ↑ ↑ D9 — — — — ↑ ↑ D10 — — — — ↑ ↑ D11 — — — — ↑ ↑ D12 — — — — ↑ ↑ D13 — — — — ↑ ↑ D14 — — — — ↑ ↑ D15 — — — — ↑ ↑ D16 — — — — ↑ ↑ D17 NONE NONE NONE NONE ↑ ↑ (1) The procedure No. C1 is the same procedure as in Embodiment 1. (2) The symbol “↑” means that a procedure is executed under the same.

(164) Each of the fabricated aluminum alloy substrates was measured and evaluated regarding yield stress, waviness, plating smoothness, and fluttering characteristics, in the same manner as in the first embodiment. The results of measurement and evaluation are shown in Tables 6 and 7. The following description will discuss each of the examples and comparative examples based on these tables.

(165) TABLE-US-00006 TABLE 6 FLUT- WAVINESS MAXIMUM TERING AMPLITUDE PLATING CHAR- SURFACE PROCE- 0.4-5.0 0.08-0.45 EVALU- SMOOTH- ACTER- ALLOY CASTING PROCESSING DURE mm mm ATION STRENGTH NESS ISTICS EXAMPLE 31 A1 CC GRINDING C2 1.6 1.1 B A A A EXAMPLE 32 A1 CC GRINDING C3 2.6 1.4 B A B A EXAMPLE 33 A1 CC GRINDING C4 2.3 1.1 B A A A EXAMPLE 34 A1 CC GRINDING C5 2.2 0.9 A A A A EXAMPLE 35 A1 CC GRINDING C6 2.3 1.2 B A B A EXAMPLE 36 A1 CC GRINDING C7 3.1 1.2 B A B A EXAMPLE 37 A1 CC GRINDING C8 2.2 0.9 A A B A EXAMPLE 38 A1 CC GRINDING C9 3.1 1.4 B A A A EXAMPLE 39 A1 CC GRINDING C10 2.2 0.8 A A A A EXAMPLE 40 A1 CC GRINDING C11 1.9 1.3 B A A A EXAMPLE 41 A1 CC GRINDING C12 2.7 1.5 B A B A EXAMPLE 42 A1 CC GRINDING C13 2.5 1.6 B A A A EXAMPLE 43 A1 CC GRINDING C14 2.0 0.9 A A A A EXAMPLE 44 A1 CC GRINDING C15 2.3 1.1 B A B A EXAMPLE 45 A1 CC GRINDING C16 2.3 1.1 B A B A EXAMPLE 46 A1 CC GRINDING C17 2.1 0.7 A A B A EXAMPLE 47 A1 CC GRINDING C18 3.0 2.0 B A A A EXAMPLE 48 A1 CC CUTTING + C1 1.9 0.6 A A A A GRINDING EXAMPLE 49 A1 CC CUTTING + C2 1.5 1.2 B A A A GRINDING EXAMPLE 50 A1 CC CUTTING + C3 2.6 1.3 B A B A GRINDING EXAMPLE 51 A1 CC CUTTING + C4 2.4 1.2 B A A A GRINDING EXAMPLE 52 A1 CC CUTTING + C5 2.1 0.9 A A A A GRINDING EXAMPLE 53 A1 CC CUTTING + C6 2.3 1.3 B A B A GRINDING EXAMPLE 54 A1 CC CUTTING + C7 3.1 1.3 B A B A GRINDING EXAMPLE 55 A1 CC CUTTING + C8 2.0 0.9 A A B A GRINDING EXAMPLE 56 A1 CC CUTTING + C9 2.9 1.2 B A A A GRINDING EXAMPLE 57 A1 CC CUTTING + C10 2.2 0.7 A A A A GRINDING EXAMPLE 58 A1 CC CUTTING + C11 2.0 1.3 B A A A GRINDING EXAMPLE 59 A1 CC CUTTING + C12 2.8 1.4 B A B A GRINDING EXAMPLE 60 A1 CC CUTTING + C13 2.5 1.6 B A A A GRINDING EXAMPLE 61 A1 CC CUTTING + C14 1.9 0.8 A A A A GRINDING EXAMPLE 62 A1 CC CUTTING + C15 2.4 1.0 B A B A GRINDING EXAMPLE 63 A1 CC CUTTING + C16 2.3 0.8 B A B A GRINDING EXAMPLE 64 A1 CC CUTTING + C17 2.0 0.7 A A B A GRINDING EXAMPLE 65 A1 CC CUTTING + C18 2.9 2.2 B A A A GRINDING

(166) TABLE-US-00007 TABLE 7 FLUT WAVINESS MAXIMUM TERING AMPLITUDE PLATING CHAR- SURFACE PROCE- 0.4-5.0 0.08-0.45 EVALU- SMOOTH- ACTER- ALLOY CASTING PROCESSING DURE mm mm ATION STRENGTH NESS ISTICS COMPARATIVE A1 CC GRINDING D1 2.3 1.2 B A C A EXAMPLE 20 COMPARATIVE A1 CC GRINDING D2 5.3 2.0 C A C A EXAMPLE 21 COMPARATIVE A1 CC GRINDING D3 2.4 1.3 B A C A EXAMPLE 22 COMPARATIVE A1 CC GRINDING D4 2.6 1.4 B A C A EXAMPLE 23 COMPARATIVE A1 CC GRINDING D5 4.2 2.1 C A C A EXAMPLE 24 COMPARATIVE A1 CC GRINDING D6 6.3 2.4 C A C A EXAMPLE 25 COMPARATIVE A1 CC GRINDING D7 2.5 1.6 C A C A EXAMPLE 26 COMPARATIVE A1 CC GRINDING D8 5.8 1.8 C A C A EXAMPLE 27 COMPARATIVE A1 CC GRINDING D9 2.3 1.4 B A C A EXAMPLE 28 COMPARATIVE A1 CC GRINDING D10 5.3 2.0 C A C A EXAMPLE 29 COMPARATIVE A1 CC GRINDING D11 2.3 1.1 B A C A EXAMPLE 30 COMPARATIVE A1 CC GRINDING D12 2.5 1.2 B A C A EXAMPLE 31 COMPARATIVE A1 CC GRINDING D13 3.7 2.3 C A C A EXAMPLE 32 COMPARATIVE A1 CC GRINDING D14 6.4 2.2 C A C A EXAMPLE 33 COMPARATIVE A1 CC GRINDING D15 2.4 1.7 C A C A EXAMPLE 34 COMPARATIVE A1 CC GRINDING D16 6.0 1.7 C A C A EXAMPLE 35 COMPARATIVE A1 CC GRINDING D17 6.0 3.0 C A C A EXAMPLE 36 COMPARATIVE A1 CC CUTTING + D1 2.1 1.2 B A C A EXAMPLE 37 GRINDING COMPARATIVE A1 CC CUTTING + D2 5.0 1.9 C A C A EXAMPLE 38 GRINDING COMPARATIVE A1 CC CUTTING + D3 2.2 1.4 B A C A EXAMPLE 39 GRINDING COMPARATIVE A1 CC CUTTING + D4 2.7 1.5 B A C A EXAMPLE 40 GRINDING COMPARATIVE A1 CC CUTTING + D5 4.4 2.4 C A C A EXAMPLE 41 GRINDING COMPARATIVE A1 CC CUTTING + D6 6.1 2.4 C A C A EXAMPLE 42 GRINDING COMPARATIVE A1 CC CUTTING + D7 3.0 2.0 C A C A EXAMPLE 43 GRINDING COMPARATIVE A1 CC CUTTING + D8 5.2 1.6 C A C A EXAMPLE 44 GRINDING COMPARATIVE A1 CC CUTTING + D9 2.5 1.2 B A C A EXAMPLE 45 GRINDING COMPARATIVE A1 CC CUTTING + D10 5.4 1.8 C A C A EXAMPLE 46 GRINDING COMPARATIVE A1 CC CUTTING + D11 2.3 1.1 B A C A EXAMPLE 47 GRINDING COMPARATIVE A1 CC CUTTING + D12 2.3 1.1 B A C A EXAMPLE 48 GRINDING COMPARATIVE A1 CC CUTTING + D13 4.0 2.2 C A C A EXAMPLE 49 GRINDING COMPARATIVE A1 CC CUTTING + D14 6.0 1.8 C A C A EXAMPLE 50 GRINDING COMPARATIVE A1 CC CUTTING + D15 2.5 1.7 C A C A EXAMPLE 51 GRINDING COMPARATIVE A1 CC CUTTING + D16 5.7 1.7 C A C A EXAMPLE 52 GRINDING COMPARATIVE A1 CC CUTTING + D17 6.1 2.8 C A C A EXAMPLE 53 GRINDING COMPARATIVE A1 CC CUTTING C1 6.5 3.0 C A C A EXAMPLE 54 COMPARATIVE A1 CC — C1 9.3 4.0 C A C A EXAMPLE 55 COMPARATIVE A1 CC CUTTING C10 5.7 3.0 C A C A EXAMPLE 56 COMPARATIVE A1 CC — C10 9.2 3.7 C A C A EXAMPLE 57 COMPARATIVE A1 DC GRINDING C1 1.2 0.3 A C A A EXAMPLE 58 COMPARATIVE A1 DC GRINDING C10 1.4 0.2 A C A A EXAMPLE 59

(167) Examples 31 to 65, which were fabricated based on the aluminum alloy (Alloy A1) having a preferable composition by preferable procedures (in particular, preferable compound removal process), were evaluated as acceptable regarding plating smoothness and fluttering characteristics.

(168) In contrast, the aluminum alloy substrates of Comparative Examples 20 to 59 were evaluated as unacceptable regarding any of the properties due to their fabrication processes or conditions, despite of the preferable alloy composition.

(169) Comparative Examples 20, 28, 37, and 45 were evaluated as unacceptable regarding plating smoothness. The poor plating smoothness was caused by deficiencies on the plated surface, which were generated because of incomplete removal of compound particles due to the low HF concentration of the solution used in the compound removal process.

(170) Comparative Examples 21, 29, 38, and 46 were evaluated as unacceptable regarding plating smoothness. The poor plating smoothness was caused by deficiencies on the plated surface resulting from a number of irregularities, which were generated because the substrate was severely dissolved due to the excessively high HF concentration of the solution used in the compound removal process. The poor plating smoothness resulted in a high level of waviness.

(171) Comparative Examples 22, 30, 39, and 47 were evaluated as unacceptable regarding plating smoothness. The poor plating smoothness was caused by deficiencies on the plated surface, which were generated because of incomplete removal of compound particles due to the low HNO.sub.3 concentration of the solution used in the compound removal process.

(172) Comparative Examples 23, 31, 40, and 48 were evaluated as unacceptable regarding plating smoothness. The poor plating smoothness was caused by deficiencies on the plated surface, which were generated because of incomplete removal of compound particles due to the excessively high HNO.sub.3 concentration of the solution used in the compound removal process.

(173) Comparative Examples 24, 32, 41, and 49 were evaluated as unacceptable regarding plating smoothness. The poor plating smoothness was caused by deficiencies on the plated surface, which were generated because of incomplete removal of compound particles due to a low rate of reaction resulting from a low temperature of the solution used in the compound removal process. The poor plating smoothness resulted in a high level of waviness.

(174) Comparative Examples 25, 33, 42, and 50 were evaluated as unacceptable regarding plating smoothness. The poor plating smoothness was caused by a number of irregularities, which were generated because the substrate was severely dissolved due to the high temperature of the solution used in the compound removal process. The poor plating smoothness resulted in a high level of waviness.

(175) Comparative Examples 26, 34, 43, and 51 were evaluated as unacceptable regarding plating smoothness. The poor plating smoothness was caused by deficiencies on the plated surface, which were generated because of incomplete removal of compound particles due to the insufficient reaction time resulting from the short compound removal process. The poor plating smoothness resulted in a high level of waviness.

(176) Comparative Examples 27, 35, 44, and 52 were evaluated as unacceptable regarding plating smoothness. The poor plating smoothness was caused by a number of irregularities, which were generated because the substrate was severely dissolved due to the excessive reaction resulting from the long compound removal process. The poor plating smoothness resulted in a high level of waviness.

(177) Comparative Examples 36 and 53 were evaluated as unacceptable regarding plating smoothness. The poor plating smoothness was caused by deficiencies on the plated surface, which were generated because of incomplete removal of compound particles by an existing electroless Ni—P plating process without the compound removal process. The poor plating smoothness resulted in a high level of waviness.

(178) Comparative Examples 54 and 56 were evaluated as unacceptable due to a high level of waviness, because the surface processing involved only cutting.

(179) Comparative Examples 55 and 57 were evaluated as unacceptable due to a high level of waviness, because no surface processing was conducted.

(180) Comparative Examples 58 and 59 were evaluated as unacceptable because the substrates were fabricated by the DC method and thus deformed during operation due to the low strength.

INDUSTRIAL APPLICABILITY

(181) The disclosure provides an aluminum alloy substrate having a low level of surface waviness, causing a low level of disk fluttering, and having reduced deficiencies on the electroless Ni—P plated surface. This configuration can achieve a thickness reduction of a magnetic disk, leading to an increase in the number of installable magnetic disks, achieve an expansion of the capacity of each magnetic disk, and achieve an increase in speed of reading and writing operations. This magnetic disk can contribute to enhancement of the capacity and speed of an HDD.