Device, and Method of Manufacture, for use in Mechanically Cleaning Nanoscale Debris from a Sample Surface
20210396784 · 2021-12-23
Inventors
- Weijie Wang (Thousand Oaks, CA, US)
- Shuiqing Hu (Santa Barbara, CA, US)
- Jason Osborne (Lompoc, CA, US)
- Chanmin Su (Ventura, CA, US)
Cpc classification
G01Q80/00
PHYSICS
International classification
Abstract
A mechanical method of removing nanoscale debris from a sample surface using an atomic force microscope (AFM) probe. The probe is shaped to include an edge that provides shovel-type action on the debris as the probe is moved laterally to the sample surface. Advantageously, the probe is able to lift the debris without damaging the debris for more efficient cleaning of the surface. The edge is preferably made by focused ion beam (FIB) milling the diamond apex of the tip.
Claims
1. A mechanical device for removing nanoscale debris from a sample surface comprising: a surface configured to contact a bottom portion of the debris and lift the debris when moved laterally to the sample surface.
2. The device of claim 1, wherein the mechanical device is an AFM probe having a tip, and the surface defines part of the tip.
3. The device of claim 2, wherein the tip is a diamond tip and the surface defines a notch formed between proximal and distal ends of the tip.
4. The device of claim 1, wherein the notch is formed by focus ion beam (FIB) milling.
5. The device of claim 1, wherein the sample surface is a surface of a lithography mask used in semiconductor fabrication.
6. An AFM having a probe according claim 1.
7. A method of cleaning nanoscale debris from a sample surface, the method comprising: a mechanical device including a surface configured to contact a bottom portion of the debris and lift the debris when moved laterally to the sample surface.
8. The method of claim 7, wherein the mechanical device is an AFM probe having a tip, and the surface defines part of the tip.
9. The method of claim 8, further comprising moving the tip in a vector having both lateral and vertical components resulting in scooping of the debris from the sample surface.
10. The method of claim 8, further comprising: engaging the tip to the surface; and providing relative lateral motion between the surface and the tip so that the surface secures the debris against the tip and lifts the debris.
11. The method of claim 10, further comprising AFM imaging the sample surface prior to the engaging step to identify the debris.
12. The method of claim 8, further comprising providing relative orthogonal motion between the probe and the sample so as to lift the debris with the tip to a predetermined height.
13. A method of manufacturing a device to clean nanoscale debris from a sample surface, the method comprising: providing a probe including a diamond tip; and modifying the tip such that when the probe is moved laterally to the sample surface and interacts with the nanoscale debris the modified tip contacts a bottom portion of the debris so as to provide an upward force to the debris.
14. The method of claim 13, wherein the tip has a first and second ends, and wherein modifying step comprises cutting a notch in a surface of the tip between the first and second ends.
15. The method of claim 14, wherein, prior to being modified, the tip is generally conical in shape.
16. The method of claim 14, wherein the modifying step includes focused ion beam (FIB) milling the tip.
17. An AFM probe made according to the method of claim 13.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0027] A preferred exemplary embodiment of the invention is illustrated in the accompanying drawings in which like reference numerals represent like parts throughout, and in which:
[0028]
[0029]
[0030]
[0031]
[0032]
[0033]
[0034]
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0035] Referring initially to
[0036] In the preferred embodiments, focused ion beam (FIB) milling is used to form the surface so it is configured to lift debris as relative lateral motion is provided by the AFM scanner. As shown in
[0037] Turning to
[0038]
[0039] More particularly, the vector direction for debris removal is determined and set in the pre-repair image through a graphical user interface (GUI) linked to the repair control. This vector direction is positioned relative to all other surface features so as to avoid any incidental interaction with surface features other than the debris to be removed. There are usually several parallel vectors in a repair area for any debris removal action.
[0040] A location marker is placed in the pre-repair image to define the leading-edge location in the path of the repair vector associated with the debris to be removed using the control GUI. The primary vector direction is typically parallel to the XY plane of the sample surface and provides relative lateral (X-Y) motion until the leading-edge location trigger is reached during the repair vector move.
[0041] After reaching the leading-edge trigger location, the repair vector direction changes to orthogonal to the sample XY plane, and provides motion so that the probe moves in Z up away from the XY plane of the sample surface, preferably to a predetermined height. After this upward motion is completed, the repair vector direction returns to parallel with the XY sample plane and continues to complete the requested length of the repair vector if any distance remains after the leading-edge trigger placement.
[0042] The AFM then lifts, for example, the probe and returns to the start location for the next repair vector defined is the series of repair vector moves.
[0043] This process is illustrated in more detail in
[0044] In summary, the shovel probe is engaged with the surface of the sample at an appropriate height. The probe is then pushed towards the pre-identified defects, with the opening concaved ends moving towards the defect(s). When the shovel tip pushes the defect, the force on the defect is upward. This keeps the defect a whole piece and loosens the defect's attachment with the surface. Due to the forward force, the defect has a larger chance to move towards the concaved portion of the shovel tip.
[0045] Then the shovel tip is then lifted upward to hold the defect off the surface. And in the last step, the shovel tip moves forward to secure the defect.
[0046] Note that in the focused ion beam (FIB) process, the energy level of the Ga+ beam (ion current) was optimized to mill the notch. In particular, the energy is preferably adjusted to maintain the integrity of the tip material (diamond) while still providing milling efficiency. Well-defined milling masks are used to suppress stray ion beam energy to achieve accurate final diamond tip geometry. The sample (diamond tip) was mounted on a proper sample holder and tilted at certain angles to accommodate the ion milling process. For example, the sample holder may be designed to match the 13° use angle when installed in an AFM, and thereafter adjusted according the milling process employed. Notably, what has been presented here is a preferred geometry, but note that any number of blade shapes could be created using known techniques.
[0047] Although the best mode contemplated by the inventors of carrying out the present invention is disclosed above, practice of the present invention is not limited thereto. It will be manifest that various additions, modifications and rearrangements of the features of the present invention may be made without deviating from the spirit and scope of the underlying inventive concept.