5-6 GHz wideband dual-polarized massive MIMO antenna arrays
11205847 · 2021-12-21
Assignee
Inventors
Cpc classification
H01Q19/005
ELECTRICITY
H01Q21/068
ELECTRICITY
International classification
H01Q19/00
ELECTRICITY
H01Q21/06
ELECTRICITY
Abstract
5-6 GHz wideband dual-polarized MIMO array antennas are disclosed. The antennas comprise a double layered PCB, a single layered PCB and a plurality of microstrip patch antennas. The microstrip patches are radiating elements which are coupled to apertures in the ground plane. The aperture coupling avoids the need for complex multi-layered boards with plated via holes. Standard SMA connectors can be used with the array antenna.
Claims
1. An antenna comprising: a first substrate; a ground plane positioned on a first side of the first substrate wherein the ground plane comprises two or more coupling apertures and two or more feed pin apertures passing through the first substrate; a micro-strip layer on a second side of the first substrate further comprising at least one pair of micro-strip elements wherein each element of the pair of micro-strip elements comprises a first end and a second end and further wherein the micro-strip element engages one of the feed pin apertures; and a second substrate positioned on the micro-strip layer of the first substrate wherein the second substrate comprises one or more patches.
2. The antenna of claim 1 wherein the ground plane further comprises a first coupling aperture and a second c-shaped coupling aperture.
3. The antenna of claim 1 wherein the pair of micro-strip elements further comprises a first leg positioned substantially perpendicular to a second leg.
4. The antenna of claim 3 wherein the first leg and the second leg have the same length.
5. The antenna of claim 3 wherein the first leg and the second leg have different lengths.
6. The antenna of claim 5 wherein the antenna is an array of coupling apertures, feed pin apertures, micro-strip elements, and patches, the array further comprises 64 antenna elements.
7. The antenna of claim 6 wherein the 64 antenna element array has >28 dBi effective peak gain.
8. The antenna of claim 1 wherein the antenna is a 5-6 GHz wideband dual-polarized MIMO array antenna.
9. The antenna of claim 1 wherein each aperture coupled patch has >7 dBi peak gain.
10. A single panel MIMO array comprising: a first substrate; a ground plane positioned on a first side of the first substrate wherein the ground plane comprises a row of aperture clusters in a first direction and a column of aperture clusters in a second direction; a micro-strip layer on a second side of the first substrate further comprising a row of micro-strip elements in a first direction and a column of micro-strip elements in a second direction wherein each element of the microstrip elements comprises a first end and a second end and further wherein each of the micro-strip elements engages a feed pin aperture of one of the aperture clusters on the ground plane; and a second substrate positioned on the micro-strip layer of the first substrate wherein the second substrate comprises a row of patches in a first direction and a column of patches in a second direction, wherein the array has an effective peak gain>28 dBi.
11. The single panel MIMO array of claim 10 wherein each aperture cluster further comprises a first coupling aperture and a second c-shaped coupling aperture.
12. The single panel MIMO array of claim 10 wherein the pair of microstrip elements have a first leg positioned substantially perpendicular to a second leg.
13. The single panel MIMO array of claim 12 wherein the first leg and the second leg have the same length.
14. The single panel MIMO array of claim 12 wherein the first leg and the second leg have different lengths.
15. The single panel MIMO array of claim 10 wherein the array is 64 antenna elements.
16. The single panel MIMO array of claim 10 wherein the antenna is a 5-6 GHz wideband dual-polarized MIMO array antenna.
17. The single panel MIMO array of claim 10 wherein each aperture coupled patch has >7 dBi peak gain.
18. A system comprising: a mounting device further comprising a first surface engaging a plurality of SMA connectors, a pair of arms, and a cable holder positioned between the pair of arms, an antenna comprising a first substrate, a ground plane positioned on a first side of the first substrate wherein the ground plane comprises two or more coupling apertures and two or more feed pin apertures passing through the first substrate, a micro-strip layer on a second side of the first substrate further comprising at least one pair of micro-strip elements wherein each element of the pair of micro-strip elements comprises a first end and a second end and further wherein the micro-strip element engages one of the feed pin apertures, and a second substrate positioned on the micro-strip layer of the first substrate wherein the second substrate comprises one or more patches wherein the antenna engages the first surface of the mounting device; and a plurality of cables.
19. An antenna comprising: a first substrate; a ground plane disposed on a first side of the first substrate, the ground plane comprising a plurality of aperture clusters, each aperture cluster comprising at least a coupling aperture and a pair of feed pin apertures passing through the first substrate; a plurality of pairs of microstrip elements disposed on a second side of the first substrate, each pair of microstrip elements located opposite an aperture cluster, each microstrip element of the pairs of microstrip elements being connected to a different one of the pair of feed pin apertures of the opposing aperture cluster; and a second substrate comprising one or more patches, the plurality of pairs of microstrip elements disposed between the ground plane and the second substrate.
20. The antenna of claim 19, wherein each of the one or more patches on the second substrate is vertically aligned with an aperture cluster and the pair of microstrip elements opposite the aperture cluster.
21. The antenna of claim 20, wherein each patch extends over at least a portion of the coupling aperture in the aperture cluster with which the patch is aligned.
22. The antenna of claim 20, wherein the feed pin apertures of each of the aperture clusters are located outward of the patch vertically aligned with that aperture cluster, such that the patch does not extend over the feed pin apertures.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The novel features of the invention are set forth with particularity in the appended claims. A better understanding of the features and advantages of the present invention will be obtained by reference to the following detailed description that sets forth illustrative embodiments, in which the principles of the invention are utilized, and the accompanying drawings of which:
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12)
(13)
(14)
(15)
DETAILED DESCRIPTION
(16) Disclosed are microstrip patch antennas. The microstrip patch antennas are stacked, aperture-coupled patch antenna arrays with dual-polarization and multiple-input, multiple-output (MIMO) architecture. The antenna array incorporates 64 antenna elements, arranged in a symmetrical array. Other symmetrical array configurations can be used in Massive MIMO architecture. A single stacked patch in this array can be used as a high gain broadband patch solution. This can be expended into a modular design with an unlimited number of antennas in the array. Each antenna element incorporates two ports for dual polarization. With 64 antenna elements, the result is a 128-antenna wireless antenna system.
(17) The disclosed antenna array utilizes a double layered printed circuit board (PCB) and a single layered PCB with no vias. An aperture coupled-feed with a two-layer substrate stack is provided for increased bandwidth. The antenna is dual linear polarized which allows the antenna to transmit on one polarization and receive on another, opposing, polarization. This configuration results in zero interference between transmitting and receiving signals. The microstrip patches are used as radiating elements which are coupled with apertures in the ground plane to excite radiation in a desired frequency. Thus, the design allows for phase shift needed for beam steering and is suitable for 5G applications where high gain directive beams can be used to address high-bandwidth demands. The disclosed antenna array uses aperture coupling forms of excitation (which is non-contact) which avoids the need to provide complex multi-layered boards.
(18) The disclosed antenna array can be used with standard off-the-shelf SubMiniature Version A (SMA) connectors, along with common soldering techniques as a result of the aperture coupling feed structure. SMA pins can be easily accessed and soldered to the microstrip feed lines. The SMA connectors can also be bolted to a conductive back panel with the pin extended though the optimized airgap between substrates to be soldered onto the microstrip feed lines. The back plate is grounded to the PCB ground layer by conductive spaces fixed between the conductive back panel and the PCB. This allows the SMA connectors to bear the weight of RF cables leading from each antenna port. The conductive back plate also acts as a reflector, increasing the gain of each directive antenna element.
(19) The stacked substrate design enables ultra-wide bandwidth (UWB) coverage, e.g. 1 GHz 10 dB instantaneous bandwidth, with the aperture coupling design allowing greater peak gain per antenna versus that of a typical patch antenna. The massive MIMO architecture allows for data to be transmitted and received over multiple antennas which increases coverage and capacity gain with no additional power or bandwidth requirement.
(20) The disclosed antenna array comprises a two-layer substrate stack consisting of a first substrate (e.g., lower substrate) and a second substrate (e.g., an upper substrate). Each of the two substrates is illustrated as square and substantially planar with a substantially uniform thickness. The length and width of the lower substrate can be identical to the length and width of the upper substrate. The lower substrate is formed of dielectric material with copper cladding, an example of which is double-layered Rogers 4750 board. The back side of the lower substrate forms the ground plane; it contains an array of apertures, a number of which facilitate the passage of pin-mount SMA connectors to elements on the front side of the lower substrate. The front side of the lower substrate contains an array of metal micro-strip lines which serve as radiating elements. The upper substrate is a single-layer dielectric material. The back side of the upper substrate contains an array of radiating metal patches, whose step-size matches that of the metal micro-strip lines on the lower substrate. The back side of the upper substrate is aligned with and secured to the front side of the lower substrate so that the radiating features on each substrate align, forming an array of combined patch/micro-strip radiating features.
(21) Turning now to
(22) Upon the lower substrate front surface 110, resides a plurality of micro-strip pair 114 elements. The micro-strip pair 114 elements are shown arranged on the lower substrate front surface 110 in a square, orthogonal array whose row and column axes are aligned, respectively, with the x- and y-axes of reference coordinate system 112. Other configurations can be used without departing from the scope of the disclosure. The micro-strip pair 114 elements are regularly and uniformly spaced across both row and column dimensions. As illustrated, the micro-strip pair 114 elements number eight per array row 116 and eight per array column 117. There are eight array rows 116 on lower substrate front surface and eight array columns 117, resulting in a total of sixty-four micro-strip pair 114 elements in the array on lower substrate front surface 110.
(23)
(24)
(25)
(26)
(27) To characterize performance of the antenna array, a number of simulations were performed for an exemplar 2×1 antenna array with four ports. Because each antenna element is identical in the disclosed 8×8 array, it is expected that many data curves will overlap almost exactly. This characteristic is borne out in results of the simulation. Furthermore, it is expected that the results of the simulation for a 2×1 array may be extended to those for the 8×8 antenna array of the disclosure.
(28)
(29) The bottom layer 310 has backside aperture cluster 130 which consist of a pair of feed-pin apertures 124, a first coupling aperture 132 and a second coupling aperture 134. The two-sided substrate 320 has feed-pin apertures 124 that pass from the bottom layer 310 to the top layer 330. The top layer 330 has a plurality of micro-strip pair 114 elements. The upper layer 350 has metal patch elements 212.
(30) TABLE-US-00001 TABLE 1 Exemplar Dimensions Layer Length (mm) Width (mm) Thickness (mm) Bottom Layer 315 315 0.033 Two-sided substrate 315 315 0.8 Top Layer 315 315 0.033 One-sided substrate 315 315 0.8 Upper Layer 315 315 0.033
As will be appreciated by those skilled in the art, the dimensions provided in Table 1 are provided as an example of dimensions for purposes of illustration. The dimensions can be scaled up or down depending on a variety of factors including, but not limited to, desired frequency and substrate material used.
(31)
(32)
(33)
(34)
(35)
(36)
(37)
(38) In operation, the antenna array is dual linear polarized to transmit on one polarization and receive on an opposite polarization. This results in zero interference between the transmitting signals and the received signals. The microstrip patches act as the radiating elements. The microstrip patches are coupled with the apertures in the ground plane to excite radiation in a desired frequency, this allows the antenna array to provide phase shift needed for beam steering. The metal backplate mechanically holds the weight of 128 low loss RF cables and acts as a reflector to the existing radiation to improve directionality and gain of each individual antenna element. The stacked substrate design allows for an ultra-wide band coverage allowing >7 dBi peak gain per antenna. An 8×8 element panel, as illustrated has >28 dBi effective peak gain. This gain can be increased with the use of a conductive plate reflector mounted behind the PCB panels.
(39)
(40) The cable holder 1110 can be a plastic support for the cables that connect to each SMA connector 1140. As shown above, the system can have, for example, 128 cables. Each cable would lead to a separate radio for each antenna and the cable holder 1110 is configured to support cable ties for the cables, thus allowing the cables to be secured and neatly positioned. As will be appreciated by those skilled in the art, there is no shape limitation to the cable holder 1110. Other shapes can be employed if the size and/or volume of the shape will serve the desired function. For example, where the size and shape can be used to secure a conductive back panel and hold the weight of each cable. A metal flap can optionally be provided which is used to mount the entire holder to a pole mount.
(41) While preferred embodiments of the present invention have been shown and described herein, it will be obvious to those skilled in the art that such embodiments are provided by way of example only. Numerous variations, changes, and substitutions will now occur to those skilled in the art without departing from the invention. It should be understood that various alternatives to the embodiments of the invention described herein may be employed in practicing the invention. It is intended that the following claims define the scope of the invention and that methods and structures within the scope of these claims and their equivalents be covered thereby.