Textured copper tape
20210386061 ยท 2021-12-16
Inventors
Cpc classification
A01P1/00
HUMAN NECESSITIES
A01N25/34
HUMAN NECESSITIES
B23P9/00
PERFORMING OPERATIONS; TRANSPORTING
International classification
Abstract
A method for the fabrication of a textured copper or brass substrate in order to improve its disinfection process. The substrate can be a textured copper or brass tape or any product or touch surface that can be texturized. The textured metallic substrate can be a tape or a sheet or film or panel or any metallic surface that can be texturized (e.g. door knobs, hand rails, medical equipment, or table tops). Thus, already existing touch surfaces can be treated with the inventive texturing to enhance its disinfection effectiveness and reduce the transmission of diseases. The texturization process may be determined by the microbes to be confronted and their determined dimensions and configurations and may be texturized to a depth and width of between 2-10,000 microinches.
Claims
1. A method of disinfecting a copper substrate, comprising the steps of: analyzing the type of microbe or microbes to be disinfected; determining the physical configuration and dimensions of the microbe or microbes; providing a copper substrate; determining the texture to incorporate onto the surface of the copper substrate based upon the physical configuration and dimensions of the microbe or microbes; and texturizing the copper substrate with the determined texture.
2. The method of making a disinfecting copper substrate as recited in claim 1, wherein the depth and width of the texturing is between 5-500 microinches.
3. A method of disinfecting a copper substrate, comprising the steps of: providing a copper substrate; analyzing the environmental conditions of its use; and s determining the texturization to be applied to the substrate based upon its environmental conditions.
4. A textured copper substrate comprising a copper substrate selected from the group consisting of a tape, sheet or panel, wherein the surface of the copper substrate is texturized to a depth and width of between 2-10,000 microinches.
5. The textured copper substrate as recited in claim 4, wherein the depth and width is between 5-125 microinches.
6. The textured copper substrate as recited in claim 3, wherein the depth and width is between 125-500 microinches.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0012]
[0013]
[0014] Similar reference characters denote corresponding features consistently throughout the attached drawings.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0015] The invention provides a method for the fabrication of a textured copper tape 12, as shown in
[0016] The preferred metallic substrate copper or brass. Additives of zinc or other materials may be used but are generally less effective at reducing or disinfecting microorganisms, mold, spores, viruses etc.
[0017] The invention is achieved by realizing that the copper substrate must be texturized (as depicted in
[0018] The dimensions and configuration of the textured surface preferably matches microbes intended to be confronted. The texturization may take the configuration of a single pattern 16 or a plurality of different patterns 16, 17, and or 18, as depicted in
[0019] As shown in
[0020] It is to be understood that the present invention is not limited to the embodiments described above, but encompasses any and all embodiments within the scope of the following claims.