SYSTEMS AND METHODS HAVING MULTI-AXIS SENSITIVITY AND TRANSLATIONAL MODE SHAPES

Abstract

A hermetically-sealed multi-directional single-proof-mass accelophone that demonstrates a high sensitivity to micro-gravity level accelerations in a wide operational bandwidth by utilizing nano-scale transductions gaps and vacuum packaging. Stable operation of the wafer-level-packaged sensor is validated over a wide operational bandwidth greater than 10 kHz. Developing a noise-matched custom interface IC should enable a sensor noise performance near the Brownian noise floor of below 10 μg/√Hz. The sensor can be applied in detection of vital mechano-acoustic signals emanating from the body and can be easily incorporated in existing wearable health monitoring devices for multi-faceted health monitoring using a single integrated sensor.

Claims

1. A device comprising: a proof-mass; a frame supporting the proof-mass; and a sensing electrode separated from the proof-mass by a sensing gap of approximately 1000 nanometers or less; wherein the device has a constant-gain operational bandwidth ranging from 0 Hz to at least greater than 10 kHz.

2. The device of claim 1, wherein the frame is a hinge-frame supporting the proof-mass with a set of torsional support systems; wherein the sensing gap is an out-of-plane sensing gap; and wherein upon externally applied acceleration to the device, the proof-mass undergoes translational motion in an out-of-plane direction changing the size of the sensing gap, while a first set of opposing edges of the hinge-frame displace greater than the translational motion of the proof-mass.

3. The device of claim 1, wherein the frame is a hinge-frame supporting the proof-mass with a set of hybrid flexure systems; wherein the sensing gap is an out-of-plane sensing gap; wherein upon externally applied acceleration to the device, the proof-mass undergoes translational motion in an out-of-plane direction changing the size of the sensing gap, while a first set of opposing edges of the hinge-frame displace greater than the translational motion of the proof-mass; wherein each edge of a second set of opposing edges of the hinge-frame comprise one of the hybrid flexure systems of the set of hybrid flexure systems; and wherein a stiffness of the hinge-frame and hybrid flexure system is tunable to provide resonant modes of the device apart from a fundamental mode of operation of the device.

4. The device of claim 1, wherein the sensing gap is an out-of-plane sensing gap; and wherein upon externally applied acceleration to the device, the proof-mass undergoes motion in an out-of-plane direction or an in-plane direction, changing the size of the out-of-plane sensing gap.

5. A device comprising: a proof-mass; a frame supporting the proof-mass; and a sensing electrode separated from the proof-mass by a sensing gap.

6. The device of claim 5, wherein the sensing gap is an out-of-plane sensing gap; and wherein upon externally applied acceleration to the device, the proof-mass undergoes motion in an out-of-plane direction or an in-plane direction, changing the size of the out-of-plane sensing gap.

7. The device of claim 5, wherein the sensing gap is an out-of-plane sensing gap; and wherein upon externally applied acceleration to the device, the proof-mass undergoes translational motion in an out-of-plane direction, changing the size of the out-of-plane sensing gap.

8. The device of claim 5, wherein the device is a microelectromechanical system (MEMS) device; wherein the sensing gap is approximately 1000 nanometers or less; and wherein the MEMS device has a constant-gain operational bandwidth ranging from 0 Hz to at least greater than 10 kHz.

9. The device of claim 6, wherein the device is a multi-directional contact microphone; and wherein one or more: the proof-mass, the frame, the sensing electrode, and the out-of-plane sensing gap are enclosed within a casing configured to maintain a sub-atmospheric pressure; the multi-directional contact microphone has a constant-gain has a constant-gain frequency spectrum ranging from DC to greater than 10 kHz in at least one direction; the out-of-plane sensing gap is approximately 500 nanometers or less; an out-of-plane resolution of the multi-directional contact microphone is better than 10 micro-gravity per root Hz; and an integrated root mean square (rms) noise of the multi-directional contact microphone in a 10 kHz bandwidth is smaller than 0.1 percent of gravity level (g).

10. The device of claim 7, wherein the device is an accelerometer contact microphone (ACM); wherein the frame is a hinge-frame that supports the proof-mass with a set of torsional support systems; and wherein upon externally applied acceleration to the ACM, a first set of opposing edges of the hinge-frame displace greater than the translational motion of the proof-mass.

11. The device of claim 7, wherein the device is an ACM; wherein the frame is a hinge-frame that supports the proof-mass with a set of hybrid flexure systems; wherein upon externally applied acceleration to the ACM, a first set of opposing edges of the hinge-frame displace greater than the translational motion of the proof-mass; wherein each edge of a second set of opposing edges of the hinge-frame comprise one of the hybrid flexure systems of the set of hybrid flexure systems; and wherein a stiffness of the hinge-frame and hybrid flexure system is tunable to provide resonant modes of the ACM apart from a fundamental mode of operation of the ACM.

12. The device of claim 8, wherein the proof-mass, the frame, the sensing electrode, and the sensing gap are enclosed within a casing configured to maintain a sub-atmospheric pressure; wherein the proof-mass, the frame, the sensing electrode, and the sensing gap are enclosed within a casing configured to maintain a vacuum pressure of 1-10 Torr; wherein a first resonant frequency of the MEMS device is greater than 10 kHz; wherein upon an externally applied acceleration to the MEMS device, the proof-mass has a uniform translational displacement in an out-of-plane direction, while opposing edges of the frame are displaced greater than the displacement of the proof-mass; and wherein shock-stop features are located in proximity to the opposing edges of the frame, wherein upon an externally applied acceleration to the MEMS device, the proof-mass has a uniform translational displacement in an out-of-plane direction, while the shock-stop features are displaced greater than the displacement of the proof-mass.

13. The device of claim 8 further comprising shock-stop features located in proximity to opposing edges of the frame; wherein the proof-mass, the frame, the sensing electrode, and the sensing gap are enclosed within a casing configured to maintain a sub-atmospheric pressure; wherein upon an externally applied acceleration to the MEMs device, the proof-mass has a uniform translational displacement in an out-of-plane direction: while opposing edges of the frame are displaced greater than the displacement of the proof-mass; and while the shock-stop features are displaced greater than the displacement of the proof-mass; and wherein a first resonant frequency of the MEMs device is greater than 10 kHz.

14. The device of claim 10, wherein each edge of a second set of opposing edges of the hinge-frame comprise one of the torsional support systems of the set of torsional support systems; wherein each torsional support system comprises: a center support; and torsional beam flexures; and wherein upon externally applied acceleration to the ACM, the first set of opposing edges of the hinge-frame displace greater than the translational motion of the proof-mass via torsion of at least one of the torsional beam flexures about the center support.

15. The device of claim 10, wherein one or more: the proof-mass, the hinge-frame, the sensing electrode, and the out-of-plane sensing gap are enclosed within a casing configured to maintain a sub-atmospheric pressure; the proof-mass, the hinge-frame, the sensing electrode, and the out-of-plane sensing gap are enclosed within a casing configured to maintain a vacuum pressure of 1-10 Torr; the ACM has a constant-gain frequency spectrum ranging from DC to greater than 10 kHz; the ACM has an operational bandwidth determined by the resonant frequency of the ACM; the ACM has an operational bandwidth determined by the resonant frequency of the ACM, and wherein the resonant frequency of the ACM is approximately 14.3 kHz; the ACM has an operational bandwidth determined by the resonant frequency of the ACM, and wherein the resonant frequency of the ACM is tunable; the out-of-plane sensing gap is approximately 250 nanometers or less; an out-of-plane resolution of the ACM is better than 10 micro-gravity per root Hz; and an integrated root mean square (rms) noise of the ACM in a 10 kHz bandwidth is smaller than 0.1 percent of gravity level (g).

16. The device of claim 10 further comprising at least one damping electrode and shock-stop feature in proximity to each edge of the first set of opposing edges of the hinge-frame.

17. The device of claim 11, wherein one or more: the stiffness of the hinge-frame and hybrid flexure system is tunable to limit sensitivity of the ACM to externally applied in-plane and angular accelerations; the stiffness of the hinge-frame and hybrid flexure system is tunable to limit sensitivity of the ACM to only out-of-plane accelerations, being orthogonal to the plane; and each hybrid flexure system comprises: a center support; and torsional beam flexures; and wherein upon externally applied acceleration to the ACM, the first set of opposing edges of the hinge-frame displace greater than the translational motion of the proof-mass via torsion of at least two of the torsional beam flexures about the center support.

18. The device of claim 11 further comprising at least one damping electrode and shock-stop feature in proximity to each edge of the first set of opposing edges of the hinge-frame.

19. The device of claim 11 further comprising: a substrate; damping electrodes; and shock-stop features; wherein each edge of the first set of opposing edges of the hinge-frame comprises the damping electrodes and shock-stop features in an alternating configuration along the length of each edge; and wherein the damping electrodes are alternatingly fixed to the hinge-frame and fixed to the substrate along the length of each edge.

20. A microelectromechanical system (MEMS) device comprising: a proof-mass; a frame supporting the proof-mass; and sensing electrodes, each sensing electrode separated from the proof-mass by a sensing gap.

21. The MEMS device of claim 20, wherein the proof-mass includes one or more sets of apertures; wherein each aperture of the proof-mass has positioned therein one sensing electrode of the sensing electrodes; wherein each sensing gap is approximately 1000 nanometers or less; and wherein the MEMS device has a constant-gain operational bandwidth ranging from 0 Hz to at least greater than 10 kHz.

22. The MEMS device of claim 20 further comprising: torsional beam flexures; damping electrodes; and shock-stop features; wherein the frame is a center-supported hinge-frame of a hybrid flexure system that includes the torsional beam flexures, wherein the center-supported hinge-frame supports the proof-mass using the torsional beam flexures; wherein each sensing gap is a transduction out-of-plane gap having a single transduction out-of-plane gap size; wherein upon an externally applied acceleration to the MEMS device, the proof-mass undergoes translational motion in an out-of-plane direction, while the center-supported hinge-frame rotates about the center support so a first set of opposing edges of the center-supported hinge-frame are displaced greater than the displacement of the proof-mass; wherein each edge of the first set of opposing edges comprises a portion of the damping electrodes and shock-stop features; and wherein the hybrid flexure system enables implementation of the damping electrodes and shock-stop features in the MEMS device that uses the same single transduction out-of-plane gap size.

23. The MEMS device of claim 20, wherein the proof-mass has at least three sets of a pair of apertures, an X-mode set of a first aperture and a second aperture, a Y-mode set of a first aperture and a second aperture, and a Z-mode set of a first aperture and a second aperture; wherein the sensing electrodes comprise at least three sets of a pair of sensing electrodes, an X-mode set of a first sensing electrode and a second sensing electrode, a Y-mode set of a first sensing electrode and a second sensing electrode, and a Z-mode set of a first sensing electrode and a second sensing electrode; wherein in each corresponding set of apertures and sensing electrodes: the first aperture is located a distance from the center of the proof-mass, and the second aperture is located the same distance from the center of the proof-mass as the first aperture, but point reflected about the center of the proof-mass from the first aperture; the first sensing electrode is positioned in the first aperture; the second sensing electrode is positioned in the second aperture; and the symmetrically-reflected locations of the first and second sensing electrodes cancel the effect of angular accelerations of the MEMS device; wherein each sensing gap is approximately 1000 nanometers or less; and wherein the MEMS device has a constant-gain operational bandwidth ranging from 0 Hz to at least greater than 10 kHz.

24. The MEMS device of claim 21, wherein each sensing gap is the same size, being uniformly sized among each sensing electrode and the proof-mass.

25. The MEMS device of claim 21, wherein at least two of the sensing gaps is a different size one from the other.

26. The MEMS device of claim 21, wherein each of the one or more sets of apertures includes a first aperture located a distance from the center of the proof-mass, and a second aperture located the same distance from the center of the proof-mass as the first aperture, but point reflected about the center of the proof-mass from the first aperture; and wherein the symmetrically-reflected locations of the sensing electrodes positioned in each set of apertures cancel the effect of angular accelerations of the MEMS device.

27. The MEMS device of claim 23, wherein all resonant frequencies of the MEMS device are greater than 10 kHz.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0075] The accompanying Figures, which are incorporated in and constitute a part of this specification, illustrate several aspects described below.

[0076] FIGS. 1A-C are graphs from use of a prior art device related to weak pathological heart sounds (FIG. 1A), physiological lung sound (FIG. 1B), and respiratory patterns recorded by placing the ACM on the chest wall (FIG. 1C).

[0077] FIG. 2A is a graph showing the effects of scaling down transduction gaps to sub-micron levels for implementation of wideband accelophones). 250 nm gaps provide improved sensitivity with along with lower noise density level. Simulations assume a 2 mm×2 mm device with 1 pF static sense capacitance. FIG. 2B is a graph illustrating the simulated quality factor for the present accelophone to operate at about 20 Torr pressure level.

[0078] FIG. 3 is a schematic of the structural design of present device illustrating the hybrid flexure system comprising tethers 1, 2 and 3, the tethers with varying length and widths. The flexure system is fixed using a center support. The width of the hinge-frame is determined by the location of tether 3. Two pair of differential electrodes are placed diagonally and housed with the proof-mass. Shock-stops and damping electrodes are placed along the width of the hinge-frame.

[0079] FIG. 4A illustrates a perspective view of a simulated operational mode shape of the present invention, with a resonant frequency of 14.3 kHz. FIG. 4B illustrates a side view highlighting the torsional motion of the hinge-frame and translational motion of the proof-mass.

[0080] FIGS. 5A-5B show magnified views of the hybrid tether structure before and during proof-mass acceleration. The hybrid flexure system comprises tethers 1, 2 and 3 with varying length and widths. As shown, tethers 1 and 3 exhibit torsional motion, while tether 2 move translationally, providing high stiffness in the in-plane directions.

[0081] FIGS. 6A-6B provide end and perspective view schematics of differential electrode implementation. The differential electrode topology is implemented by fixing the polysilicon structure to the proof-mass at the ‘+’ electrode, and creating an overhang using the polysilicon structure at the ‘−’ electrode. This same principle is applied to the damping electrodes and shock stop features along the edge of the hinge-frame. Alternating damping electrodes are connected to the hinge-frame and the substrate to create an overhanging structure for enabling damping and shock stop ability.

[0082] FIG. 7 presents the structural design of triaxial configuration of the device illustrating the decoupling frame system comprising tether 1 and 2 with varying length and widths and placed perpendicular to each other. Two pair of differential electrodes are used for sensing acceleration along each axis and are placed diagonally within the proof-mass to reduce effects of angular acceleration. Damping electrodes sloped at 45-degrees are used to enable damping along all orthogonal axes. Shock-stop features placed at multiple locations along the proof-mass and decoupling frame that exhibit maximum displacement.

[0083] FIGS. 8A-C shows sensor design and fabrication of the embodiment of the present invention of FIG. 7. FIG. 8A is a SEM view of a fabricated ACM. FIG. 8B include close-up images of the device, tether structures, shock-stop features and sensing electrodes. FIG. 8C illustrates simulated fundamental mode shapes of the ACM.

[0084] FIG. 9 is a graph of linear sensitivity of 11 fF/g and 15.1 fF/g along the in-plane and out-of-plane axes, respectively achieved using nano-scale transduction gaps. Cross-axis sensitivity is less than 3% along all axes (limited by mounting set-up).

[0085] FIG. 10 is an Allan deviation plot for the three-axis ACM is evaluated by sampling the output signal for an extended period.

[0086] FIG. 11 is another graph illustrating ACM performance measured using off-the-shelf readout electronics. A near flat response up to 10 kHz indicated wide operational bandwidth.

DETAILED DESCRIPTION OF THE INVENTION

[0087] Although preferred exemplary embodiments of the disclosure are explained in detail, it is to be understood that other exemplary embodiments are contemplated. Accordingly, it is not intended that the disclosure is limited in its scope to the details of construction and arrangement of components set forth in the following description or illustrated in the drawings. The disclosure is capable of other exemplary embodiments and of being practiced or carried out in various ways. Also, in describing the preferred exemplary embodiments, specific terminology will be resorted to for the sake of clarity.

[0088] As used in the specification and the appended claims, the singular forms “a,” “an” and “the” include plural referents unless the context clearly dictates otherwise.

[0089] Also, in describing the preferred exemplary embodiments, terminology will be resorted to for the sake of clarity. It is intended that each term contemplates its broadest meaning as understood by those skilled in the art and includes all technical equivalents which operate in a similar manner to accomplish a similar purpose.

[0090] Ranges can be expressed herein as from “about” or “approximately” one particular value and/or to “about” or “approximately” another particular value. When such a range is expressed, another exemplary embodiment includes from the one particular value and/or to the other particular value.

[0091] Using “comprising” or “including” or like terms means that at least the named compound, element, particle, or method step is present in the composition or article or method, but does not exclude the presence of other compounds, materials, particles, method steps, even if the other such compounds, material, particles, method steps have the same function as what is named.

[0092] Mention of one or more method steps does not preclude the presence of additional method steps or intervening method steps between those steps expressly identified. Similarly, it is also to be understood that the mention of one or more components in a device or system does not preclude the presence of additional components or intervening components between those components expressly identified.

[0093] The present invention can be modelled as a second-order system, wherein the proof-mass displaces due to acoustic vibrations from its contact surface and causes a change in capacitance between the sensing electrode and the proof-mass. To capture most of the acoustic vibrations, the device requires a minimum operational bandwidth of 10 kHz. However, as shown in FIGS. 2A-B, increased operational bandwidth requires a high resonant frequency, consequently reducing the displacement of the proof-mass significantly, to the order of a few nanometers. Detection of such small displacements using capacitive transduction is extremely challenging due to substantial degradation of the signal-to-noise ratio. Hence, the transduction gap size is scaled to sub-micron levels (250 nm), effectively increasing the ratio between displacement and capacitive transduction gap, to achieve a higher signal strength.

[0094] Moreover, the resonant frequency of the MEMS structure along with the air damping caused by the nano-scale capacitive gaps dictates the operational bandwidth of such a device. The present invention is designed to operate at low pressure levels of about 20 Torr to efficiently control the squeeze film damping and minimize the environmental degradation effects on the sensor. Additional damping electrodes are implemented to achieve critical damping, thus avoiding ringing and overshoot, and extending the bandwidth to the maximum limit while making it feasible to be integrated with other resonant sensors such as gyroscopes for sensor fusion.

[0095] As shown in FIG. 3, the present invention 100 comprises a proof-mass 120, a supporting flexure (hybrid flexure system) 140 and at least one sensing electrode 160 that is separated from the proof-mass 120 by a sub-micron capacitive gap 180 and works in moderate vacuum. The device 100 can be fabricated using the high aspect-ratio combined poly- and single-crystal silicon micromachining technology (HARPSS) process on an SOI wafer and wafer-level packaged at sub-atmospheric pressure. The sub-micrometer capacitive gap 180 changes under external DC acceleration and vibration, and the sensing electrodes 160 function as a capacitive pick-up. The operational bandwidth of the device 100 is determined by the resonant frequency of the device, which can be controlled by adjusting the dimensions of the supporting flexure 140. A high resonant frequency (˜20 kHz) is necessary to capture all acoustic vibrations in a very low noise device. A hermetically-sealed vacuum package of the device can be sued to provide stable operating conditions, reduce the effects of squeeze film damping to enable high operational bandwidth, as well as protects device from environmental and accidental damage.

[0096] The hybrid flexure system 140 enables the implementation of damping electrodes 220 and shock-stop features 240 in a MEMS devices that use a single transduction gap size in the out-of-plane direction.

[0097] The hybrid flexure system 140 can comprises of a center-supported hinge-frame 142 that in turn supports the device proof-mass using torsional beam flexures 144 for an out-of-plane translational motion. As shown in FIGS. 4A-4B, 5A-5B, upon externally applied acceleration, the proof-mass 120 moves translationally perpendicular to the plane, while the hinge-shaped frame 140 rotates about the center support 142. Due to this rotational motion, the edges 146 of the hinge-frame displace greater than the translational motion of the proof-mass 120 in the out-of-plane direction, effectively having different displacements at different locations within the same device.

[0098] The areas with higher displacement are utilized for implementation of damping electrode and shock-stop features 220, 240, while the areas with lower displacement are used to implement the sensing electrodes 160. The stiffness of the hybrid flexure system 140 (hinge-frame and torsional beam tethers 142, 144) is optimized by varying their length and width to ensure that the subsequent resonant modes of the device 100 are further apart from the fundamental mode of operation. This limits/prevents the sensitivity of the device 100 to in-plane and angular accelerations, and only responds to accelerations orthogonal to the plane.

[0099] Additionally, the location of the tethers 144 is tuned for maximum out-of-plane sensitivity while providing adequate device area for implementation of the damping electrodes 220 and shock-stop features 240 on the hinge-frame. The sensing electrodes 160 are placed within the proof-mass area to minimize the device footprint. FIG. 3 illustrates using two pair of differential electrodes 160, placed diagonally to cancel out effects of angular accelerations. Additionally, the translational motion of the proof-mass 120 facilitates a high effective mass, resulting in lowered Brownian noise floor.

[0100] The edges of the frame include the damping electrodes 220 and shock-stop structures 240, which are displaced greater than the proof-mass, thus causing additional damping under normal operation and limiting/preventing damage to the device under high-acceleration shock conditions.

[0101] As shown in FIGS. 6A-6B, the damping electrodes 220 can be placed in an alternating configuration along the hinge-frame, such that one electrode 220 is fixed to the device, while the next electrode 220 is fixed to the substrate. This allows the shock-stop to work efficiently in both directions—as the proof-mass displaces up and down.

[0102] In another exemplary embodiment of the present invention, FIGS. 7 and 8A-C show device 300 having a triaxial configuration, in which a decoupling frame is utilized to support the proof-mass. The support flexures are placed within the proof-mass area to reduce device size and are perpendicular to each other. The stiffness of these flexures is optimized to ensure that the resonant frequency of all three fundamental modes of operation are close to one another for comparable performance along each axis.

[0103] The decoupling frame structure enables sensitivity to microgravity level accelerations over a wide operational bandwidth along all the orthogonal axes. Additional fixed damping electrodes are placed within the device area to provide additional damping for stable operation under vacuum conditions. The fingers of the damping electrodes are sloped at a 45-degree angle to offer damping along both in-plane axes using the same electrode.

[0104] Additionally, a polysilicon top-electrode can be configured on these electrodes to provide damping in the out-of-plane direction as well. Shock-stop features are placed selectively at locations of maximum displacement along the proof-mass and decoupling frame to protect the device from mechanical shocks. This exemplary embodiment also uses one pair of differential sensing electrodes per sensing direction, which are placed diagonally to minimize the effects of angular accelerations.

[0105] FIG. 8A is an SEM image of this tri-axial accelophone embodiment. The microstructure includes a 2.5 mm×2.5 mm×40 μm single-crystal silicon proof-mass anchored at the edges to support the device. The translational-mode accelerometer 300 utilizes dedicated electrodes to enable differential capacitance sensing for each axis. The implementation of a fully differential gap-changing topology eliminates the need for reference capacitors and reduces second-order temperature effects, from degrading the sensor performance. More importantly, the tether structures supporting the proof-mass are embedded in the monocrystalline silicon device layer instead of being formed using polysilicon structures deposited on top of the device layer, which are sensitive to process variations such as film thickness and stress. This translates to more robustness and increases the structural reliability and reproducibility of the sensor.

[0106] The device 300 comprises three pairs of sensing electrodes, with the in-plane electrodes employed using the sloped-electrode configuration, while the out-of-plane sensing electrodes are implemented using differential top-electrode topology. The support tethers are located at the edge of the proof-mass, creating a decoupling moving frame that enables translational motion of the proof-mass along the X-, Y-, and Z-axis directions. Two pairs of in-plane and out-of-plane damping electrodes are also implemented at the edges and corners of the proof-mass in this design, as shown in FIG. 8A.

[0107] FEM simulations using COMSOL were conducted to analyze the device 300 comprehensively and optimize geometries for the tethers and electrodes. The dimensions of the tethers are designed to ensure consistent performance with mechanical noise floor below 7 μg/√Hz and resonant frequencies ˜10 kHz along each direction as shown in FIG. 8C. The static capacitance on each electrode is optimized for maximum sensitivity, while reducing the amount of parasitic capacitance occurring due to the buried oxide layer underneath the electrode anchors.

[0108] The three-axis ACM device 300 is fabricated on an SOI wafer having 40 μm thick device layer and wafer-level-packaged, using the HARPSS+ process. The SEM photo of the acceleration sensor is shown in FIG. 3(a). FIG. 8B shows the close-up images of the sensing electrodes, damping electrodes and the shock stop structure.

[0109] A preliminary verification test is conducted using an LCR meter on wafer-level-packaged parts. The static capacitance is measured at each electrode along the in-plane and out-of-plane directions. The in-plane electrodes exhibit a static capacitance of 2.5 pF, while the out-of-plane electrode exhibit 3.5 pF. After validation of the sensing capacitances of the device, the sensor is interfaced with commercially-available off-the-shelf wideband capacitive readout electronics for performance characterization, which introduce significant additional noise in the system.

[0110] First, the linear and cross-axis sensitivity along all three axes are measured by placing the device on a shaker table. The scale factors are measured to be 11 fF/g and 15.1 fF/g along the in-plane and out-of-plane axes, respectively as shown in FIG. 9. Cross-axis sensitivities of less than 3% are measured along all directions, arising mainly from misalignment of the manually placed device fixture used in the measurement setup.

[0111] The Allan deviation plots for the three-axis ACM is evaluated by sampling the output signal for an extended period, as shown in FIG. 10. Performance of each axis is measured individually while turning off the other axes. To measure the operational bandwidth of the device, each axis is individually interfaced to the readout circuit in succession during the measurement process. The device is placed on a shaker table and excited at frequencies from 10 Hz to 10 kHz. A near flat response up to 10 kHz is obtained along each axis, as shown in FIG. 11, verifying the larger than 10 kHz operational bandwidth of the sensor.

[0112] Table I provides a summary of the characterization results of the three-directional ACM prototype. These results verify the design and implementation of a low noise, wide bandwidth single-proof-mass three-axis ACM sensor. However, due to the noise limitations of the off-the-shelf interface electronics, the overall noise of the device+electronics is degraded. A low-noise interfaced IC capable of detecting 0.1 aF/√Hz will enable an ACM with a total noise equivalent acceleration of less than 10 μg/√Hz, mainly limited by the mechanical Brownian noise of the device.

TABLE-US-00001 TABLE I Parameter Three-Axis ACM Units Orientation X/Y-axis Z-axis — Size 2.5 × 2.5 mm.sup.2 Resonant Frequency 9.8, 10.1 10.3 kHz Operational Bandwidth >10 >10 kHz Measured Scale Factor 11 15.1 fF/g Full Scale Range ±40 (2% N.L.)   g ±16 (0.5% N.L.) Cross-Axis Sensitivity <3 (measured) % <0.1% (simulated)    No. of Electrodes  6 (2 per axis) — Static Capacitance 2.1 3.1 pF Brownian Noise Floor 6.22 6.71 μg/√HZ

[0113] Compared to prior art, the advantages of using a torsional and a translational mode shape device are integrated into a single device, while eliminating the drawbacks of each of the methods. A conventional torsional device offers the advantages of easy implementation of shock stop structures due to larger displacement of one end of the device, but it susceptible to angular accelerations and exhibits low effective mass. In a conventional translational device, implementation of a shock-stop structure using a single transduction gap throughout the device is challenging, while introduction of multiple transduction gap sizes increases fabrication cost and complexity significantly. The disclosed embodiment overcomes these challenges using the hybrid flexure system to create a device with a single transduction gap along with shock-stop structures and high effective mass.

[0114] It will be clear to a person skilled in the art that features described in relation to any of the embodiments described above can be applicable interchangeably between the different embodiments. The embodiments described above are examples to illustrate various features of the invention.

[0115] The reader's attention is directed to all papers and documents which are filed concurrently with or previous to this specification in connection with this application and which are open to public inspection with this specification, and the contents of all such papers and documents are incorporated herein by reference.

[0116] Numerous characteristics and advantages have been set forth in the foregoing description, together with details of structure and function. While the invention has been disclosed in several forms, it will be apparent to those skilled in the art that many modifications, additions, and deletions, especially in matters of shape, size, and arrangement of parts, can be made therein without departing from the spirit and scope of the invention and its equivalents as set forth in the following claims. Therefore, other modifications or embodiments as may be suggested by the teachings herein are particularly reserved as they fall within the breadth and scope of the claims here appended.