Fluid routing methods for a spiral heat exchanger with lattice cross section made via additive manufacturing
11193716 · 2021-12-07
Assignee
Inventors
Cpc classification
F28D7/0016
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F7/02
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28D7/04
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28D7/0033
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B33Y80/00
PERFORMING OPERATIONS; TRANSPORTING
F28D7/022
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
F28D7/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B33Y80/00
PERFORMING OPERATIONS; TRANSPORTING
F28F7/02
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28D7/04
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Abstract
A spiral heat exchanger features: a cold fluid inlet manifold, a hot fluid inlet manifold and at least one spiral fluid pathway. The cold fluid inlet manifold receives cold fluid and provide cold inlet manifold fluid. The hot fluid inlet manifold receives hot fluid and provide hot inlet manifold fluid. The at least one spiral fluid pathway includes cold spiral pathways configured to receive the cold inlet manifold fluid and provide cold spiral fluid pathway fluid, and hot spiral pathways configured to receive the hot inlet manifold fluid and provide hot spiral fluid pathway fluid. The cold spiral pathways and the hot spiral pathways are configured in relation to one another to exchange heat between the cold spiral pathway fluid and the hot spiral pathway fluid so that the hot spiral fluid pathway fluid warms the cold spiral fluid pathway fluid, and vice versa.
Claims
1. A heat exchanger comprising: a cold fluid inlet manifold configured to receive first fluid and provide first inlet manifold fluid; a hot fluid inlet manifold configured to receive second fluid and provide second inlet manifold fluid, the first fluid having a colder temperature than the second fluid; and an integral spiral fluid pathway having pathway rows and columns with cold spiral fluid pathways and hot spiral fluid pathways interwoven in relation to one another in alternating pathway rows and columns, the cold spiral fluid pathways being made or manufactured in every other pathway row and the hot spiral fluid pathways being made or manufactured in every other remaining pathway row, the cold spiral fluid pathways being made or manufactured in every other pathway column and the hot spiral fluid pathways in every other remaining pathway column, so that the cold spiral fluid pathways are configured in every other pathway row and column and the hot spiral fluid pathways are configured in every other remaining pathway row and column, the cold spiral fluid pathways configured to receive the first inlet manifold fluid and provide first spiral pathway fluid, and the hot spiral fluid pathways configured to receive the second inlet manifold fluid and provide second spiral pathway fluid, the cold spiral fluid pathways and the hot spiral fluid pathways being configured in relation to one another to exchange heat between the first spiral pathway fluid and the second spiral pathway fluid so that the second spiral pathway fluid warms the first spiral pathway fluid, and vice versa, the heat exchanger being made or manufactured in whole or in part using an additive manufacturing process; wherein the cold fluid inlet manifold comprises a cold inlet channeling block having an inlet portion with an inlet face configured to receive the first fluid and provide the first fluid to alternating rows and columns of the cold spiral fluid pathways; the hot fluid inlet manifold comprises a hot inlet channeling block having a corresponding inlet portion with a corresponding inlet face configured to receive the second fluid and provide the second fluid to alternating rows and columns of the hot spiral fluid pathways; the heat exchanger comprises a cold fluid outlet manifold including a cold outlet channeling block having an outlet portion with an outlet face configured to receive the first spiral pathway fluid from the cold spiral fluid pathways and provide the first spiral pathway fluid, and a hot fluid outlet manifold including a hot outlet channeling block having a corresponding outlet portion with a corresponding outlet face configured to receive the second spiral pathway fluid from the hot spiral fluid pathways and provide the second spiral pathway fluid; the inlet face and the corresponding inlet face are configured with respective channels/openings formed therein to allow fluid flow; the inlet face of the cold inlet channeling block is angled in relation to the corresponding outlet face of the hot outlet channeling block; the outlet face and the corresponding outlet face are configured with respective corresponding channels/openings formed therein to allow fluid flow; and the corresponding inlet face of the hot inlet channeling block is angled in relation to the outlet face of the cold outlet channeling block.
2. A heat exchanger according to claim 1, wherein the cold fluid outlet manifold is configured to receive the first spiral pathway fluid and provide first outlet manifold fluid, including to a cold fluid outlet; and the hot fluid outlet manifold is configured to receive the second spiral pathway fluid and provide second outlet manifold fluid, including to a hot fluid outlet.
3. A heat exchanger according to claim 1, wherein the heat exchanger comprises cold inlet route paths or pathways configured to receive the first fluid and provide first inlet route paths or pathways fluid; and the cold fluid inlet manifold is configured to receive the first inlet route paths or pathways fluid as the first fluid from the cold inlet route paths or pathways.
4. A heat exchanger according to claim 1, wherein the heat exchanger comprises hot inlet route paths or pathways configured to receive the second fluid and provide second inlet route paths or pathways fluid; and the hot fluid inlet manifold is configured to receive the second inlet route paths or pathways fluid as the second fluid from the hot inlet route paths or pathways.
Description
BRIEF DESCRIPTION OF THE DRAWING
(1) The drawing includes
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DETAILED DESCRIPTION OF BEST MODE OF THE INVENTION
Example of an Embodiment
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FIGS. 1-6
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(16) The function of this device will be described, e.g., by assuming that a hot fluid and cold fluid are being routed through the heat exchanger (HE) in a counterflow arrangement with the cold fluid being routed from the inside of the device towards the outside of the device in the cold fluid path generally indicated as (1), e.g., as shown in
(17) By way of example, and consistent with that shown in
(18) The hot fluid flow in this method follows the inverted path of the cold fluid. That is, it enters on the outside of the heat exchanger and leaves at the center. By way of example, and consistent with that shown in
FIGS. 7-12
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(20) This method uses a feature which will be referred to as at least one channeling block generally indicated as (5). The channeling block (5) takes fluid from a cold/hot fluid inlet/chamber (3a, 4a) and routes it to the appropriate spiral fluid pathways (3c, 4c), or takes fluid from the spiral fluid pathways (3c, 4c) and directs it to a cold/hot fluid outlet/chamber (3e, 4e). The channeling block (5) may be made of, or include, a multitude of diagonal paths which are angled relative to the spiral fluid pathways (3c, 4c), such that they connect a respective cold/hot chamber (5a, 5b) containing the appropriate cold/hot fluid for providing to/from the spiral pathways (3c, 4c) and the cold/hot fluid inlet (3a, 4a) or cold/hot fluid outlet (3e, 4e). By way of example, and consistent with that shown in
(21) Using this method the cold fluid enters through a cold fluid inlet/chamber (3a), then enters a cold inlet channeling block channel (3b), is routed into every other pathway row that form the cold spiral fluid pathway (3c), flows inwardly until it reaches the cold outlet channeling block channel (3d), and is directed to the cold fluid outlet/chamber (3e). Similarly, the hot fluid enters through a hot fluid inlet/chamber (4a), then enters a hot inlet channeling block channel (4b), is routed into every other pathway row that form the hot spiral fluid pathway (4c), flows inwardly until it reaches the hot outlet channeling block channel (4d), and is directed to the hot fluid outlet/chamber (4e). By way of example, the embodiment in
(22) In effect, the channeling block channels (3b, 4b, 3d, 4d) are configured as respective manifolds. For example, the channeling block channel (3b) is configured to distribute or multiplex cold fluid flowing from the cold fluid inlet/chamber (3a) into the cold spiral fluid pathway (3c); and the channeling block channel (4b) is configured to distribute or multiplex hot fluid flowing from the hot fluid inlet/chamber (4a) into the hot spiral fluid pathway (4c). In contrast, the channeling block channel (3d) is configured to distribute or demultiplex cold fluid flowing from the cold spiral fluid pathway (3c) to the cold fluid outlet/chamber (3e); and the channeling block channel (4d) is configured to distribute or demultiplex hot fluid flowing from the hot spiral fluid pathway (4c) to the hot fluid outlet/chamber (4e).
Manifolds
(23) In fluid mechanics, as one skilled in the art would appreciate, a manifold is understood to be a fluid distribution device for distributing a fluid depending on the direction of the fluid flow. For example, the fluid distribution device may include, or take the fold of, a wide and/or larger pipe, chamber or channel coupled to small pipes or chambers for distributing, multiplexing or demultiplexing the fluid. Fluid flowing from the wide and/or larger pipe, chamber or channel in one direction is distributed or multiplexed into the small pipes or chambers. In comparison, fluid flowing from the small pipes or chambers in an opposite direction is distributed or demultiplexed to the wide and/or larger pipe, chamber or channel.
Additive Manufacturing Process
(24) By way of example, the embodiments disclosed in
(25) As one skilled in the art would appreciate, additive manufacturing refers to a process by which digital 3D design data is used to build up a component in layers by depositing material. The term “3D printing” is increasingly used as a synonym for additive manufacturing.
(26) The additive manufacturing process is very well suited for making or manufacturing complicated 3 dimensional mechanical structures, e.g., including an interwoven, checker board or honeycomb structural implementation.
(27) By way of example, different types and kinds of additive manufacturing techniques are set forth below:
Additive Manufacturing (AM)
(28) Techniques for implementing additive manufacturing (AM) are known in the art, and the scope of the invention is not intended to be limited to any particular type or kind thereof either now known or later developed in the future.
(29) The following is a brief description of techniques for implementing AM that are known in the art.
(30) By way of example, AM is understood to be a transformative approach to industrial production that enables the creation of lighter, stronger parts and systems. It is another technological advancement made possible by the transition from analog to digital processes. In recent decades, communications, imaging, architecture and engineering have all undergone their own digital revolutions. Now, AM can bring digital flexibility and efficiency to manufacturing operations.
(31) By way of example, AM may be implemented using data computer-aided-design (CAD) software or 3D object scanners to direct hardware to deposit material, layer upon layer, in precise geometric shapes. As its name implies, AM adds material to create an object. In contrast, when one creates an object by traditional means, it is often necessary to remove material through milling, machining, carving, shaping or other means.
(32) Although the terms “3D printing” and “rapid prototyping” may typically be used to discuss AM, each process is actually understood to be a subset of AM in general. AM has been around for several decades. In the right applications, AM delivers a trifecta of improved performance, complex geometries and simplified fabrication. As a result, opportunities abound for those who actively embrace AM. The term “AM” references technologies that grow three-dimensional objects one superfine layer at a time. Each successive layer bonds to the preceding layer of melted or partially melted material. It is possible to use different substances for layering material, including metal powder, thermoplastics, ceramics, composites, glass and even edibles like chocolate.
(33) By way of example, objects may be digitally defined by the computer-aided-design (CAD) software that is used to create .stl files that essentially “slice” the object into ultra-thin layers. This information guides the path of a nozzle or print head as it precisely deposits material upon the preceding layer. Or, a laser or electron beam selectively melts or partially melts in a bed of powdered material. As materials cool or are cured, they fuse together to form a three-dimensional object.
(34) The journey from .stl file to 3D object is revolutionizing manufacturing. Gone are the intermediary steps, like the creation of molds or dies, that cost time and money. There are a variety of different AM processes, e.g., including the following: Material Extrusion: Material extrusion is one of the most well-known AM processes. Spooled polymers are extruded, or drawn through a heated nozzle mounted on a movable arm. The nozzle moves horizontally while the bed moves vertically, allowing the melted material to be built layer after layer. Proper adhesion between layers occurs through precise temperature control or the use of chemical bonding agents. Directed Energy Deposition (DED): The process of DED is similar to material extrusion, although it can be used with a wider variety of materials, including polymers, ceramics and metals. For example, an electron beam gun or laser mounted on a four- or five-axis arm may be configured to melt either wire or filament feedstock or powder. Material Jetting: With material jetting, a print head moves back and forth, much like the head on a 2D inkjet printer. However, it typically moves on x-, y- and z-axes to create 3D objects. Layers harden as they cool or are cured by ultraviolet light. Binder Jetting: The binder jetting process is similar to material jetting, except that the print head lays down alternate layers of powdered material and a liquid binder. Sheet Lamination: Laminated object manufacturing (LOM) and ultrasonic AM (UAM) are two sheet lamination methods. LOM uses alternate layers of paper and adhesive, while UAM employs thin metal sheets conjoined through ultrasonic welding. LOM excels at creating objects ideal for visual or aesthetic modeling. UAM is a relatively low-temperature, low-energy process used with various metals, including titanium, stainless steel and aluminum. Vat Polymerization: With vat photopolymerization, an object is created in a vat of a liquid resin photopolymer. A process called photopolymerization cures each microfine resin layer using ultraviolet (UV) light precisely directed by mirrors. Powder Bed Fusion: Powder Bed Fusion (PBF) technology is used in a variety of AM processes, including direct metal laser sintering (DMLS), selective laser sintering (SLS), selective heat sintering (SHS), electron beam melting (EBM) and direct metal laser melting (DMLM). These systems use lasers, electron beams or thermal print heads to melt or partially melt ultra-fine layers of material in a three-dimensional space. As the process concludes, excess powder is blasted away from the object.
AM Technologies
(35) Sintering is the process of creating a solid mass using heat without liquefying it. Sintering is similar to traditional 2D photocopying, where toner is selectively melted to form an image on paper.
(36) Within DMLS, a laser sinters each layer of metal powder so that the metal particles adhere to one another. DMLS machines produce high-resolution objects with desirable surface features and required mechanical properties. With SLS, a laser sinters thermoplastic powders to cause particles to adhere to one another.
(37) In contrast, materials are fully melted in the DMLM and EBM processes. With DMLM, a laser completely melts each layer of metal powder while EBM uses high-power electron beams to melt the metal powder. Both technologies are ideal for manufacturing dense, non-porous objects.
(38) Stereolithography (SLA) uses photopolymerization to print ceramic objects. The process employs a UV laser selectively fired into a vat of photopolymer resin. The UV-curable resins produce torque-resistant parts that can withstand extreme temperatures.
AM Materials
(39) It is possible to use many different materials to create 3D-printed objects. AM technology fabricates jet engine parts from advanced metal alloys, and it also creates chocolate treats and other food items.
(40) By way of examples, AM materials include the following: Thermoplastics: To date, thermoplastic polymers remain the most popular class of AM materials. Acrylonitrile butadiene styrene (ABS), polylactic acid (PLA) and polycarbonate (PC) each offer distinct advantages in different applications. Water-soluble polyvinyl alcohol (PVA) is typically used to create temporary support structures, which are later dissolved away. Metals: Many different metals and metal alloys are used in AM, from precious metals like gold and silver to strategic metals like stainless steel and titanium. Ceramics: A variety of ceramics have also been used in AM, including zirconia, alumina and tricalcium phosphate. Also, alternate layers of powdered glass and adhesive are baked together to create entirely new classes of glass products. Biochemicals: Biochemical healthcare applications include the use of hardened material from silicon, calcium phosphate and zinc to support bone structures as new bone growth occurs. Researchers are also exploring the use of bio-inks fabricated from stem cells to form everything from blood vessels to bladders and beyond.
AM Advantages
(41) AM allows the creation of lighter, more complex designs that are too difficult or too expensive to build using traditional dies, molds, milling and machining.
(42) AM also provides for rapid prototyping. Since the digital-to-digital process eliminates traditional intermediate steps, it is possible to make alterations on the run. When compared to the relative tedium of traditional prototyping, AM offers a more dynamic, design-driven process.
(43) Whether AM is used for prototyping or production, lead times are frequently reduced. Lead times for certain jet engine parts have been reduced by a year or more. Also, parts once created from multiple assembled pieces are now fabricated as a single, assembly-free object.
(44) In designing everything from bridges to skyscrapers, engineers have long sought to minimize weight while maximizing strength. With AM, designers realize the dream of utilizing organic structures to greatly reduce the weight of objects.
(45) Advantages of using the AM process for implementing the present invention disclosed herein may include substantially improved heat exchange efficiency when compared with prior art heat exchangers.
Complex Geometries
(46) The AM technology enables engineers to design parts that incorporate complexity that is not possible using other methods. Intricate features, such as conformal cooling passages, can be incorporated directly into a design. Parts that previously required assembly and welding or brazing of multiple pieces can now be grown as a single part, which makes for greater strength and durability. Designers are no longer restricted to the limitations of traditional machines and can create parts with greater design freedom.
Time Savings
(47) AM is ideal for getting prototypes made quickly. Parts are manufactured directly from a 3D CAD file, which eliminates the cost and lengthy process of having fixtures or dies created. Plus, changes can be made mid-stream with virtually no interruption in the process.
Weight Savings
(48) By incorporating organic structures into designs, designers can eliminate substantial weight while maintaining the part's strength and integrity.
Directed Energy Deposition (DED)
(49) DED covers a range of terminologies, e.g., including: ‘Laser engineered net shaping, directed light fabrication, direct metal deposition, 3D laser cladding’. It is a more complex printing process commonly used to repair or add additional material to existing components (Gibson et al., 2010).
(50) A typical DED machine consists of a nozzle mounted on a multi axis arm, which deposits melted material onto the specified surface, where it solidifies. The process is similar in principle to material extrusion, but the nozzle can move in multiple directions and is not fixed to a specific axis. The material, which can be deposited from any angle due to 4 and 5 axis machines, is melted upon deposition with a laser or electron beam. The process can be used with polymers, ceramics but is typically used with metals, in the form of either powder or wire.
(51) Typical applications include repairing and maintaining structural parts.
(52) By way of example, apparatus for implementing Direct Energy Deposition—Step by Step, may include as follows: 1. A 4 or 5 axis arm with nozzle moves around a fixed object. 2. Material is deposited from the nozzle onto existing surfaces of the object. 3. Material is either provided in wire or powder form. 4. Material is melted using a laser, electron beam or plasma arc upon deposition. 5. Further material is added layer by layer and solidifies, creating or repairing new material features on the existing object.
(53) The DED process uses material in wire or powder form. Wire is less accurate due to the nature of a pre-formed shape but is more material efficient when compared to powder (Gibson et al., 2010), as only required material is used. The method of material melting varies between a laser, an electron beam or plasma arc, all within a controlled chamber where the atmosphere has reduced oxygen levels. With 4 or 5 axis machines, the movement of the feed head will not change the flow rate of material, compared to fixed, vertical deposition (Gibson et al., 2010).
(54) Whilst in most cases, it is the arm that moves and the object remains in a fixed position, this can be reversed and a platform could be moved instead and the arm remain in a fixed position. The choice will depend on the exact application and object being printed. Material cooling times are very fast, typically between 1000-5000 degrees Celsius/second (Gibson et al., 2010). The cooling time will in turn affect the final grain structure of the deposited material, although the overlapping of material must also be considered, where the grain structure is changed as the overlapping can cause re-melting to occur, resulting in a uniform but alternating micro-structure. Typical layer thicknesses of 0.25 mm to 0.5 mm (Gibson et al., 2010).
AM Patent Documents
(55) The following is a list of patent documents, e.g., including US patent applications and issued US patent, that disclose AM technology, are all incorporated by reference in their entirety, and include the following:
(56) U.S. Pat. Nos. 4,575,330; 8,029,501; 9,884,455; 9,450,311 and 9,937,665.
(57) US Patent publication nos. 2004/0230117; 2007/0084839; 2012/0041428; 2015/0174822; 2016/0298213; 2017/0021565; 2017/0028631; 2017/0182561; 2017/0182595; 2017/0184108; 2017/0225403; 2017/0261087; 2017/0287685; and 2017/0312821.
(58) The incorporation by references of the aforementioned patent documents include the incorporation by reference of all the US patent applications and issued US patent either referenced or cited therein.
Possible Applications
(59) By way of example, one possible applications may include: Heat Exchangers
(60) However, the present invention may also be used in almost any situation in which it is desirable to change the temperature of a fluid. By way of example, possible applications may include one or more of the following: aerospace, viscous fluid processing, corrosive chemical processing, high temperature applications.
The Scope of the Invention
(61) While the invention has been described with reference to an exemplary embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In addition, may modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiment(s) disclosed herein as the best mode contemplated for carrying out this invention.