Damping arrangement for power electronics applications

Abstract

What is provided is a damping arrangement for power electronics applications having a circuit board, and a current sensor electrically connected to the circuit board, which current sensor is held in a current sensor housing, and an electrical contact pin passing through the circuit board and surrounded by the current sensor housing, wherein a damping element is arranged between the current sensor housing and the electrical contact pin.

Claims

1. A damping arrangement for power electronics applications having a circuit board, and a current sensor electrically connected to the circuit board, which current sensor is held in a current sensor housing, and an electrical contact pin passing through the circuit board and surrounded by the current sensor housing, wherein a damping element is arranged between the current sensor housing and the electrical contact pin.

2. The damping arrangement as claimed in claim 1, wherein the damping element is fastened on the electrical contact pin.

3. The damping arrangement as claimed in claim 1, wherein the damping element is formed of at least one of an electrically insulating material or an electrically non-insulating material.

4. The damping arrangement as claimed in claim 1, wherein the damping element is formed of an elastomer.

5. The damping arrangement as claimed in claim 1, wherein the damping element is formed of an electrically insulating material having a strength value of less than or equal to 50 SHORE A.

6. The damping arrangement as claimed in claim 1, wherein the current sensor housing is formed in two parts.

7. The damping arrangement as claimed in claim 1, wherein the damping element completely surrounds the electrical contact pin.

8. The damping arrangement as claimed in claim 1, wherein the electrical contact pin has a cavity for receiving a fastening means configured to fasten a first component and a second component provided on different sides of the circuit board.

Description

(1) Preferred embodiments of the invention will be explained in more detail below with reference to the appended drawing.

(2) FIG. 1 shows a view of a damping arrangement for power electronics applications according to one embodiment of the present invention.

(3) The proposed damping arrangement for power electronics applications is advantageously used for axle drives. It is advantageously used in at least partly electrically or fully electrically driven vehicles.

(4) The aim of the invention is to reduce or even to avoid vibrational loading between the current sensor, more precisely between the current sensor housing 1 that surrounds the current sensor or in which the current sensor is arranged, and the electrical contact pin 2. Another aim is to achieve lower loading resulting from vibrational excitations for the connection points 41 between the current sensor and the circuit board 4, which connection points are generally designed as solder points. The likelihood of failure of the components is thus also reduced.

(5) In the application in the field of power electronics for axle drives, described below in the form of an exemplary embodiment, the current sensor channels a low voltage and is thus an LV current sensor, and the electrical contact pin channels a high voltage and is thus an HV electrical contact pin.

(6) Vibrational loading occurs primarily when components or component parts rub against one another for example due to movements or vibrational excitations. This may give rise to abrasion. This may lead to damage to or failure of individual components or component parts, with results as severe as the failure of the entire power electronics. In the arrangement described here, the current sensor 2 may especially fail and the connection points 41 between the current sensor and the circuit board 4 may be loaded due to vibrational excitations. The connection points 41 advantageously protrude from the current sensor housing 1 in the form of pins, such that they are able to be plugged through corresponding openings in the circuit board 4 and be soldered thereto.

(7) As is illustrated by way of example in FIG. 1, the current sensor housing 1 may be designed in two parts, wherein the division 5 is made such that one part serves as cover 51, such that the current sensor arranged inside the current sensor housing 1 is able to be exchanged, for example. A single-part design is likewise possible.

(8) In order to achieve improved protection against vibrational loading, a damping element 3 is arranged between the electrical contact pin 2 and the current sensor housing 1, as illustrated in FIG. 1. This damping element is designed such that it contributes to damping the vibrational excitation between the current sensor housing 1 and the electrical contact pin 2. As a result of the damping properties, it may furthermore also serve to provide better protection against vibrational loading for the connection points 41 between the current sensor and the circuit board 4. This thus achieves a reduction in wear and avoids component failures, without in the process impairing the required air gap and creepage paths between the HV electrical contact pin 2 and the LV current sensor in the region of the current sensor housing 1 from being maintained. Insulation between high voltage HV and low voltage LV may also be provided by selecting a suitable non-conductive material.

(9) The damping element 3 is advantageously provided completely around the electrical contact pin 2 and attached there. This additional material is fastened on the electrical contact pin 2, for example through a mounting process such as adhesive bonding, a two-component injection-molding process, or attached in another way. Mounting is thus simplified. This additional material has a damping and insulating property in order to create the air gap and creepage paths between the current sensor in the current sensor housing 1 and the HV electrical contact pin 2. The applied material additionally damps the movement of the components, in particular of the current sensor housing 1 with respect to the electrical contact pin 2, but the connection points 41 between the current sensor and the circuit board 4 are also protected against undesired loading, meaning that wear is thus reduced and component failures are more effectively prevented.

(10) The material that is used for the damping element 3 is preferably an elastomer whose hardness value is defined using what is known as the SHORE hardness. The SHORE hardness is an identifier that is generally used to specify hardness for elastomers and rubber-elastic polymers. It is thus a measure of material hardness, and may thus be referred to as a strength value. The material of the damping element 3 for the present invention is generally what is known as a soft elastomer, meaning that the SHORE A hardness should be used as a measure of the hardness value of the material. In one embodiment, a material having a SHORE A hardness of less than or equal to 50 is used as material for the damping element 3. The thickness and length of the damping element 3 is selected by a person skilled in the art depending on the electrical contact pin 2 and the current sensor housing 1 that are used.

(11) By virtue of arranging a damping element 3 on the electrical contact pin 2 such that said damping element is arranged between the current sensor housing 1 and the electrical contact pin 2, lower wear between the two components 1 and 2 is achieved, as well as lower loading and less abrasion. At the same time, the solder points 41 between the current sensor and the circuit board 4 are loaded to a lesser extent, which in turn reduces the likelihood of failure.

(12) To connect further components 71 and 72 from one side of the circuit board 4 to the other side of the circuit board 4 via the electrical contact pin 2, the electrical contact pin 2 may be designed as a hollow element. A corresponding fastening means 6 may then be routed through the cavity, for example a screw, as shown in FIG. 1. The electrical contact pin 2 may of course also be produced from a solid material.

REFERENCE SIGNS

(13) 1 current sensor housing 2 electrical contact pin 3 damping element 4 circuit board 41 current sensor to circuit board connection points 5 division of the current sensor housing 51 cover 6 fastening means 71, 72 external components