Conductor arrangement and production method

Abstract

The present disclosure provides a conductor arrangement for transmitting differential communication signals, the conductor arrangement includes a conductor carrier, a plurality of pairs of first conductors, two of the first conductors being electrically coupled together at their ends, and a plurality of pairs of second conductors, two of the second conductors being electrically coupled together at their ends, and wherein, as conductor bundles, in each case one of the first conductors of a pair and one of the second conductors of a pair are jointly arranged on a first side of the conductor carrier and the further first conductor of the respective pair and the further second conductor of the respective pair are arranged on a second side of the conductor carrier.

Claims

1. A conductor arrangement for transmitting differential communication signals, the conductor arrangement comprising: a conductor carrier, a number of pairs of first conductors, wherein two of the first conductors are electrically coupled to each other at their ends, and a number of pairs of second conductors, wherein two of the second conductors are electrically coupled together at their ends, and wherein, as conductor bundles, in each case one of the first conductors of a pair and one of the second conductors of a pair are arranged jointly on a first side of the conductor carrier and the further first conductor of the respective pair and the further second conductor of the respective pair are arranged on a second side of the conductor carrier.

2. The conductor arrangement according to claim 1, wherein on opposite sides of the conductor carrier the first conductors and the second conductors are arranged in such a way that a first conductor and a second overlap alternatingly.

3. The conductor arrangement according to claim 1, wherein a thickness of the conductor carrier is selected depending on a characteristic impedance predetermined for the conductor arrangement.

4. The conductor arrangement according to claim 3, wherein the thickness of the conductor carrier is between at least one of 200 μm and 1000 μm and 400 μm to 600 μm.

5. The conductor arrangement according to claim 1, wherein a distance between the first conductor and the corresponding second conductor on one side of the conductor carrier is between 100 μm and 600 μm.

6. The conductor arrangement according to claim 1, wherein the conductor arrangement further comprises four pairs of first conductors and four pairs of second conductors.

7. The conductor arrangement according to claim 1, wherein the conductor bundles are arranged at least one of side by side on the conductor carrier and one above the other on different layers of the conductor carrier.

8. The conductor arrangement according to claim 1, further comprising a jacket enclosing the conductor carrier and the conductor.

9. A manufacturing method for a conductor arrangement for transmitting differential communication signals, the manufacturing method comprising the steps of: providing a conductor carrier, arranging a plurality of pairs of first conductors on said conductor carrier, arranging a plurality of pairs of second conductors on said conductor carrier, and electrically coupling in each case two of the first conductors at their ends and two of the second conductors at their ends, and wherein, as conductor bundles, in each case one of the first conductors of a pair and one of the second conductors of a pair are jointly arranged on a first side of the conductor carrier and the further first conductor of the respective pair and the further second conductor of the respective pair are arranged on a second side of the conductor carrier.

10. The manufacturing method according to claim 9, wherein on opposite sides of the conductor carrier, the first conductors and the second conductors are arranged such that a first conductor overlaps with a second conductor.

11. The manufacturing method according to claim 9, wherein the thickness of the conductor carrier is selected in dependence on a characteristic impedance predetermined for the conductor arrangement and wherein the thickness of the conductor carrier is selected from a range of at least one of between 200 μm and 1000 μm and between 400 μm and 600 μm.

12. The manufacturing method according to claim 9, wherein a distance between the first conductor and the corresponding second conductor on one side of the conductor carrier is adjusted between 100 μm and 600 μm.

13. The manufacturing method according to claim 9, wherein four pairs of first conductors and four pairs of second conductors are arranged on the conductor carrier.

14. The manufacturing method according to claim 9, wherein the conductor bundles are arranged at least one of side by side on the conductor and one above the other on different layers of the conductor carrier.

15. The manufacturing method according to claim 9, wherein a jacket is arranged around the conductor carrier and the conductors.

Description

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

(1) Further advantages features and details of the various embodiments of this disclosure will become apparent from the ensuing description of a preferred exemplary embodiment and with the aid of the drawings. The features and combinations of features recited below in the description, as well as the features and feature combination shown after that in the drawing description or in the drawings alone, may be used not only in the particular combination recited, but also in other combinations on their own, with departing from the scope of the disclosure.

(2) In the following, advantageous examples of the invention are explained with reference to the accompanying figures, wherein:

(3) FIG. 1 depicts a block diagram of a design example of a conductor arrangement according to the present invention;

(4) FIG. 2 depicts a block diagram of a further design example of a conductor arrangement according to the present invention;

(5) FIG. 3 depicts a block diagram of a further design example of a conductor arrangement according to the present invention;

(6) FIG. 4 depicts a block diagram of a further design example of a conductor arrangement according to the present invention;

(7) FIG. 5 depicts a block diagram of a further design example of a conductor arrangement according to the present invention; and

(8) FIG. 6 depicts a flow chart of an example of a manufacturing process according to the present invention.

DETAILED DESCRIPTION OF THE INVENTION

(9) As used throughout the present disclosure, unless specifically stated otherwise, the term “or” encompasses all possible combinations, except where infeasible. For example, the expression “A or B” shall mean A alone, B alone, or A and B together. If it is stated that a component includes “A, B, or C”, then, unless specifically stated otherwise or infeasible, the component may include A, or B, or C, or A and B, or A and C, or B and C, or A and B and C. Expressions such as “at least one of” do not necessarily modify an entirety of the following list and do not necessarily modify each member of the list, such that “at least one of “A, B, and C” should be understood as including only one of A, only one of B, only one of C, or any combination of A, B, and C.

(10) FIG. 1 depicts a block diagram of a design example of a conductor arrangement 100 in a sectional view. The conductor arrangement 100 has a conductor carrier 101. A first conductor 103 and a second conductor 105 are arranged side by side on the upper side of the conductor carrier 101. A second conductor 106 and a first conductor 104 are arranged on the underside of the conductor carrier 101. The four conductors 103, 104, 105, 106 together form a conductor bundle 102. A solid line shows that the first conductor 103 and the first conductor 104 are electrically coupled together. A dashed line shows that the second conductor 105 and the second conductor 106 are electrically coupled together. When data is transmitted via the conductor bundle 102, identical signals are present on the first conductors 103, 104 and identical signals are also present on the second conductors 105, 106.

(11) For the conductor arrangement 100 or with the conductor bundle 102 there is a first conductor 103, 104 next to a second conductor 105, 106. At the same time, a first conductor 103, 104 and a second conductor 105, 106 are opposite each other on the top and bottom of the conductor carrier 101.

(12) The conductor bundle 102 is used to replace a conductor pair, for example a twisted pair of a twisted pair line. As shown below, several conductor bundles 102 can be arranged on a conductor carrier 101, so that the number of parallel conductor bundles 102 can be adapted to the respective application. For example, four conductor bundles 102 can replace twisted-pair Ethernet cables with four wire pairs or eight wire pairs of conductors.

(13) Although not shown separately, it is understood that a jacket can surround the conductor carrier 101 with the first conductors 103, 104 and the second conductors 105, 106 for protection against mechanical or other environmental influences. Such a jacket can be made for example of rubber or plastic.

(14) If a signal is transmitted via the conductor bundle 102, the field characteristics shown in FIG. 2 will result.

(15) FIG. 2 shows a block diagram of a further embodiment example of a conductor arrangement 200 with the resulting fields 210, 211, 212, 213, 214, 215. The conductor arrangement 200 is based on the conductor arrangement 100. Consequently, the conductor arrangement 200 also has a conductor carrier 201 with two first conductors 203, 204 and two second conductors 205, 206.

(16) Shown are the dipole fields 210, 211, 212, 213, 214, 215, which result in vertical and horizontal directions when signals are transmitted via conductors 203, 204, 205, 206.

(17) Since the adjacent conductors are always arranged in opposite directions, i.e., have different polarities, the resulting dipole fields 210, 211, 212, 213, 214, 215 cancel each other out in the far field, as in a twisted pair line.

(18) FIG. 3 depicts a block diagram of another embodiment of a conductor arrangement 300 with three conductor bundles 302, 320, 321. Further conductor bundles are indicated by three points. Each of the conductor bundles 302, 320, 321 have the same structure as the conductor bundle 102 of conductor arrangement 100. Consequently, each bundle of conductors 302, 320, 321 have a first conductor 303, 322, 326 on the top of the conductor carrier 301 next to a second conductor 305, 324, 328. On the underside of the conductor carrier 301, each conductor bundle 302, 320, 321 has a second conductor 306, 325, 329 next to a first conductor 304, 323, 327.

(19) In the conductor arrangement 300, the individual conductor bundles 302, 320, 321 are, for example, arranged next to each other on a strip-like conductor carrier 301. Needless to say, that other arrangements are also possible. For example, the conductor bundles 302, 320, 321 can also be stacked to adapt the outer geometry of the conductor arrangement to different applications.

(20) FIG. 4 depicts a block diagram of a side view of another conductor arrangement 400 in an electronic system 430, in which the conductor arrangement 400 is coupled to a circuit 436.

(21) The circuit 436 has, only as an example, a board 435 on which a transceiver 434 is arranged. The transceiver 434 is coupled with a plug 431, which has two contact springs 432, 433, via which the circuit 436 is coupled with the conductor arrangement 400.

(22) The arrangement of the FIG. 4 illustrates how a conductor arrangement 400 according to the invention can be coupled with a circuit 436 without the need for separate plugs. With the conductor arrangement 400, the conductors 403, 405 are used directly as contact surfaces. The electrical contact is established via the contact springs 432, 433. Consequently, changes in characteristic impedance due to changes in symmetry are substantially less vacant than in twisted pair arrangements with conventional plugs and sockets.

(23) The quality of the connection is therefore significantly increased with the conductor arrangement 400 as specified in the invention. Furthermore, the connection is less susceptible to external influences.

(24) Needless to say, the electrical connection of the first conductors of the conductor arrangement 400 and the second conductors of the conductor arrangement 400 in the electronic system 430 can also be made in a circuit 436.

(25) FIG. 5 depicts a block diagram of another conductor arrangement 500. The conductor arrangement 500 has four conductor bundles 502, 520, 521, 535. In contrast to the arrangement of FIG. 3, the conductor bundles 502, 520, 521, 535 are not all arranged next to each other in the conductor arrangement 500. With the conductor arrangement 500, two conductor bundles 502, 521 and 520, 535 are arranged relatively next to each other. The conductor bundles 520, 535 are also arranged above the conductor bundles 502, 521. The conductor arrangement 500 therefore has a stacked arrangement in which two bundles of conductors 502, 521, and 520, 535 are located on each level.

(26) Obviously, the conductor arrangements shown above are only of an exemplary nature and the conductor bundle can be arranged parallel to each other in any possible arrangement.

(27) FIG. 6 depicts a flow chart of an example of a manufacturing process for a conductor arrangement 100, 200, 300, 400, 500 for the transmission of differential communication signals. For a better understanding the reference signs of FIGS. 1-5, are retained for reference in the following.

(28) In a first step S1 of the provisioning, a conductor carrier 101, 201, 301, 401, 501 is provided. In a second step S2 of arranging a number of pairs of first conductors 103, 104, 203, 204, 303, 304, 322, 323, 326, 327, 403, 503, 504, 522, 523, 526, 527, 536, 537 are arranged on the conductor carrier 101, 201, 301, 401, 501. In a third step S3 a number of pairs of second conductors 105, 106, 205, 206, 305, 306, 324, 225, 328, 329, 405, 506, 507, 524, 525, 528, 529, 538, 539 are arranged on the conductor carrier 101, 201, 301, 401, 501. In a fourth step S4 of the electrical coupling, in each case two of the first conductors 103, 104, 203, 204, 303, 304, 322, 323, 326, 327, 403, 503, 504, 522, 523, 526, 527, 536, 537 are electrically coupled to each other at their ends and in each case two of the second conductors 105, 106, 205, 206, 305, 306, 324, 225, 328, 329, 405, 506, 507, 524, 525, 528, 529, 538, 539 are electrically coupled at their ends.

(29) In the steps of arranging S2, S3, one of the first conductors 103, 104, 203, 204, 303, 304, 322, 323, 326, 327, 403, 503, 504, 522, 523, 526, 527, 536, 537 of a pair and one of the second conductors 105, 106, 205, 206, 305, 306, 324, 225, 328, 329, 405, 506, 507, 524, 525, 528, 529, 538, 539 of a pair are arranged together as a conductor bundle 102, 302, 320, 321, 502, 520, 521, 535 on a first side of the conductor carrier 101, 201, 301, 401, 501. The further first conductor 103, 104, 203, 204, 303, 304, 322, 323, 326, 327, 403, 503, 504, 522, 523, 526, 527, 536, 537 of the respective pair and the further second conductor 105, 106, 205, 206, 305, 306, 324, 225, 328, 329, 405, 506, 507, 524, 525, 528, 529, 538, 539 of the respective pair are arranged on the second side of the conductor carrier 101, 201, 301, 401, 501.

(30) On the opposite sides of the conductor carrier 101, 201, 301, 401, 501, the first conductors 103, 104, 203, 204, 303, 304, 322, 323, 326, 327, 403, 503, 504, 522, 523, 526, 527, 536, 537 and the second conductors 105, 106, 205, 206, 305, 306, 324, 225, 328, 329, 405, 506, 507, 524, 525, 528, 529, 538, 539 can be arranged in such a way that a first conductor 103, 104, 203, 204, 303, 304, 322, 323, 326, 327, 403, 503, 504, 522, 523, 526, 527, 536, 537 each overlaps a second conductor 105, 106, 205, 206, 305, 306, 324, 225, 328, 329, 405, 506, 507, 524, 525, 528, 529, 538, 539.

(31) To adapt the conductor arrangement 100, 200, 300, 400, 500 to different applications, the thickness of the conductor carrier 101, 201, 301, 401, 501 can be selected depending on a characteristic impedance specified for the conductor arrangement 100, 200, 300, 400, 500. For example, the thickness of the conductor carrier 101, 201, 301, 401, 501 can be selected from between 200 μm and 1000 μm.

(32) Likewise, the distance between the first conductor 103, 104, 203, 204, 303, 304, 322, 323, 326, 327, 403, 503, 504, 504, 522, 523, 526, 527, 536, 537 and the corresponding second conductor 105, 106, 205, 206, 305, 306, 324, 225, 328, 329, 405, 506, 507, 524, 525, 528, 529, 538, 539 on one side of the conductor carrier 101, 201, 301, 401, 501 can each be adjusted from between 100 μm and 600 μm.

(33) To replace a conventional twisted pair cable for Ethernet, four pairs of first conductors 103, 104, 203, 204, 303, 304, 322, 323, 326, 327, 403, 503, 504, 522, 523, 526, 527, 536, 537 and four pairs of second conductors 105, 106, 205, 206, 305, 306, 324, 225, 328, 329, 405, 506, 507, 524, 525, 528, 529, 538, 539 can be arranged on the conductor carrier 101, 201, 301, 401, 501.

(34) The geometric arrangement of the conductor bundles 102, 302, 320, 321, 502, 520, 521, 535 can be selected depending on the geometric conditions in the respective application. For example, the conductor bundles 102, 302, 320, 321, 502, 520, 521, 535 can be arranged next to each other on the conductor carrier 101, 201, 301, 401, 501 and/or different layers of the conductor carrier 101, 201, 301, 401, 501 can be arranged one above the other.

(35) For mechanical protection, a jacket can be arranged around the conductor carrier 101, 201, 301, 401, 501 and the conductors 103, 104, 203, 204, 303, 304, 322, 323, 326, 327, 403, 503, 504, 522, 523, 526, 527, 536, 537, 105, 106, 205, 206, 305, 306, 324, 225, 328, 329, 405, 506, 507, 524, 525, 528, 529, 538, 539.

(36) Since the devices and processes described in detail above are exemplary embodiments, they can be modified to a large extent in the usual way by a person skilled in the art without leaving the field of the invention. In particular, the mechanical arrangements and the proportions of the individual elements to each other are simply exemplary. Having described some aspects of the present disclosure in detail, it will be apparent that further modifications and variations are possible without departing from the scope of the disclosure. All matter contained in the above description and shown in the accompanying drawings shall be interpreted as illustrative and not in a limiting sense.