Method of Making Copper-Nickel Alloy Foams

Abstract

The successful fabrication of alloy foam (or porous alloy) is very rare, despite their potentially better properties and wider applicability than pure metallic foams. The processing of three-dimensional copper-nickel alloy foams is achieved through a strategic solid-solution alloying method based on oxide powder reduction or sintering processes, or both. Solid-solution alloy foams with five different compositions are successfully created, resulting in open-pore structures with varied porosity. The corrosion resistance of the synthesized copper-nickel alloy foams is superior to those of the pure copper and nickel foams.

Claims

1. A composition of matter comprising a three dimensionally connected copper-nickel alloy foam of Cu9Ni1, Cu7Ni3, Cu5Ni5, Cu3Ni7, or Cu1Ni9.

2. The composition of claim 1 wherein the composition has a porosity of about 50 percent to about 90 percent with an open pore structure.

3. The composition of claim 1 wherein the copper-nickel alloy foam has a cooling rate for sintering of less than about 2 to about 5 Celsius per minute, or about less than about 3 Celsius per minute.

4. A method comprising: mixing copper oxide powder and nickel oxide powder to obtain a slurry solution; freeze casting the slurry solution of copper oxide powder and nickel oxide powder; reducing or sintering, or both, the freeze-casted slurry of copper oxide and nickel oxide powder at a high temperature; and after the reducing or sintering, producing a three dimensionally connected copper-nickel alloy foam of Cu9Ni1, Cu7Ni3, Cu5Ni5, Cu3Ni7, or Cu1Ni9.

5. The method of claim 4 wherein the nickel oxide powder has an average size of about 10 nanometers to about 1000 nanometers, and the copper oxide powder has an average size of about 10 nanometers to about 1000 nanometers.

6. The method of claim 4 wherein copper oxide powder and nickel oxide powder are mixed in water or other liquid solvent with a binder and a dispersant.

7. The method of claim 6 wherein the binder is polyvinyl alcohol and the dispersant is sodium polyacrylate powder.

8. The method of claim 6 comprising: stirring the slurry solution for from about 10 minutes to about 30 minutes; and after the stirring, sonicating the slurry solution for from about 30 minutes to about 60 minutes.

9. The method of claim 4 comprising: mechanically mixing the copper oxide powder and nickel oxide powder for from about 10 minutes to about 60 minutes to obtain a uniform particle mixing before mixing with water, binder, and dispersant.

10. The method of claim 4 comprising: freezing the slurry at a temperature from about −50 degrees Celsius to about −10 degrees Celsius to obtain a foam green body of a composition of copper oxide and nickel oxide.

11. The method of claim 4 comprising: drying the slurry at a temperature from about −50 degrees Celsius to about −10 degrees Celsius to obtain a foam green body of composition of copper oxide and nickel oxide.

12. The method of claim 10 comprising: reducing the foam green body of the composition copper oxide and nickel oxide at a temperature from about 250 degrees Celsius to about 350 degrees Celsius in an about 5 percent argon and hydrogen gas mixture.

13. The method of claim 12 comprising: after reducing, sintering the foam green body of the composition of copper oxide and nickel oxide at a temperature from about 700 degrees Celsius to about 1100 degrees Celsius in an about 5 percent argon and hydrogen gas mixture, thereby transforming the foam green body of the composition of copper oxide in the copper-nickel alloy foam.

14. The method of claim 13 wherein the copper-nickel alloy foam comprises a three-dimensional pore structure with uniformly distributed pores having diameters from about 2 microns to about 100 microns.

15. The method of claim 14 wherein the three-dimensional pore structure also comprise some nanometer pores having diameters from about 10 nanometers to about 400 nanometers in diameter.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0015] FIG. 1 shows a comparison of XRD patterns of the copper-nickel alloy foams with various compositions.

[0016] FIG. 2 shows a schematic diagram of the alloy formation mechanism in the copper-nickel solid-solution system.

[0017] FIG. 3 shows a variation of lattice constant determined by XRD versus the nickel content of the foams.

[0018] FIG. 4 shows optical micrographs of cross-sections parallel to the freezing direction for copper-nickel alloy foams with varying compositions exhibiting the lamellar macropore structure and copper-nickel strut walls.

[0019] FIG. 5 shows optical micrographs of cross-sections perpendicular to the freezing direction for copper-nickel alloy foams with varying compositions.

[0020] FIG. 6A shows SEM images of the as-cast top morphology of freeze-cast copper-nickel alloy foams with varying compositions showing a hierarchical pore structure (macro lamellar pores and asymmetric micropores).

[0021] FIG. 6B shows variations of copper and nickel compositions measured by EDS in comparison with the initial copper and nickel powder compositions in the slurry.

[0022] FIG. 7 shows a grain structure in the struts of the foams.

[0023] FIG. 8 shows a comparison of the corrosion resistance of copper, Cu3Ni7, Cu5Ni5, Cu7Ni3, and nickel foams as a function of the weight loss with increasing time.

[0024] FIGS. 9A-9D show (9A) XPS Cu 2p and (9B) Ni 2p spectra of the Cu, Cu3Ni7, Cu5Ni5, Cu7Ni3, and nickel foams in comparison with (9C) XPS Cu 2p and (9D) Ni 2p spectra of the Cu, Cu3Ni7, Cu5Ni5, Cu7Ni3, and nickel foams after etching.

[0025] FIGS. 10A-10B show a comparison of (10A) compressive stress-strain curves of three representative copper-nickel alloy foam specimens and (10B) compressive stress-strain curves of the three copper-nickel alloy foam specimens normalized.

[0026] FIG. 11 shows an energy absorbed in the foams during compression to the strain of 0.4 for the freeze-casted copper-nickel foams as a function of the nickel content.

[0027] FIGS. 12A-12B show nanoindentation test results for the copper-nickel alloy foams: (12A) a representative load-displacement curve with a peak load of 123.76 micronewtons and (12B) variations of hardness and elastic modulus values of the copper-nickel alloy foams with an increasing composition of nickel.

DETAILED DESCRIPTION OF THE INVENTION

[0028] Manufacturing the porous foam structure includes the steps: (a) preparing a mixture of nickel oxide and copper oxide powder slurry mixed with polyvinyl alcohol binder (PVA binder) and water; (b) adding Darvan 811 (a low-molecular-weight sodium polyacrylate powder dispersant) as a dispersant; (c) dispersing the slurry by stirring for about 30 minutes and then by sonication for about 1 hour; (d) freezing the powder slurry when placed in a mold in contact with the cold surface of a copper rod; (e) sublimating the frozen slurry under reduced pressure and low temperature, forming a porous CuO—NiO foam green body; (f) sintering and nitriding the porous CuO—NiO foam green body at a low temperature of about 250 to 300 degrees Celsius and then maintaining at that temperature for about 2 to 3 hours to remove the binder and reduce the oxide, and subsequently sintering under a 5 percent argon, hydrogen gas mixture at the high temperature of about 800 Celsius to about 1000 degrees Celsius for about 3 hours to about 8 hours to create copper-nickel alloy foams.

[0029] This patent describes a three-dimensionally (3-D or 3D) connected porous structure of the copper-nickel foam created from the combination of the slurry freezing or sintering, or both, and their solid-solution alloying mechanism between copper and nickel during sintering can be used as an advanced material, which can provide higher surface area with decent mechanical and corrosion properties for potential use in various high-temperature structural and functional applications.

[0030] This patent describes the combination of the slurry freezing or sintering, or both, and the solid-solution mechanism between copper and nickel as a unique combination, which can be applied to other metallic alloys with the same chemical characteristic of solid-solution formation at elevated temperatures. In other words, a copper-nickel alloy foam is used as a model material to demonstrate a new facile invention of synthesizing solid solution alloy foams using freeze casting; however, the fundamental insights obtained in this invention can also apply more broadly to other alloy foams that can form partial or complete solid solutions.

[0031] Based on the solid-solution alloying mechanism, alloy foams with different ratios of copper and nickel can be produced. For example, Cu9Ni1, Cu7Ni3, Cu5Ni5, Cu3Ni7, and Cu1Ni9 alloy foams can be created using a technique as described in this patent.

[0032] FIG. 1 shows a comparison of XRD patterns of the copper-nickel alloy foams with various compositions.

[0033] FIG. 2 shows a schematic diagram of the alloy formation mechanism in the copper-nickel solid-solution system.

[0034] FIG. 3 shows a variation of lattice constant determined by XRD versus the nickel content of the foams.

[0035] FIG. 4 shows optical micrographs of cross-sections parallel to the freezing direction for copper-nickel alloy foams with varying compositions exhibiting the lamellar macropore structure and copper-nickel strut walls.

[0036] Note that each strut wall contains asymmetric micropores (formed only on one side) and, to a lesser extent, within their volumes. The green-body foams were first heated to about 250-300 degrees Celsius in a furnace and then maintained at the temperature for about 2-3 hours to burn off the binder and reduce the oxides to metals. They were then subsequently sintered at about 800 degrees Celsius, 900 degrees Celsius, or 1000 degrees Celsius under a 5 percent argon, hydrogen gas mixture depending on the composition of the slurry.

[0037] FIG. 5 shows optical micrographs of cross-sections perpendicular to the freezing direction for copper-nickel alloy foams with varying compositions. The green-body foams were first heated to about 250-300 degrees Celsius in a furnace and then maintained at the temperature for about 2-3 hours to burn off the binder and reduce the oxides to metals. They were then subsequently sintered at about 800 degrees Celsius, 900 degrees Celsius, or 1000 degrees Celsius under a 5 percent argon, hydrogen gas mixture depending on the composition of the slurry.

[0038] FIG. 6A shows SEM images of the as-cast top morphology of freeze-cast copper-nickel alloy foams with varying compositions showing a hierarchical pore structure (macro lamellar pores and asymmetric micropores).

[0039] FIG. 6B shows variations of copper and nickel compositions measured by energy-dispersive X-ray spectroscopy (EDS) in comparison with the initial copper and nickel powder compositions in the slurry.

[0040] FIG. 7 shows a grain structure in the struts of the foams.

[0041] FIG. 8 shows a comparison of the corrosion resistance of copper, Cu3Ni7, Cu5Ni5, Cu7Ni3, and nickel foams as a function of the weight loss with increasing time in the still sulfuric environment of a diluted H2SO4 pH1 solution at about 70-80 degrees Celsius for 30 days. The values next to the graphs represent the porosity of the alloy foams.

[0042] FIGS. 9A-9D show (9A) XPS Cu 2p and (9B) Ni 2p spectra of the Cu, Cu3Ni7, Cu5Ni5, Cu7Ni3, and nickel foams in comparison with (9C) XPS Cu 2p and (9D) Ni 2p spectra of the Cu, Cu3Ni7, Cu5Ni5, Cu7Ni3, and nickel foams after etching (removing the native oxides by argon sputtering).

[0043] FIGS. 10A-10B show a comparison of (10A) compressive stress-strain curves of three representative copper-nickel alloy foam specimens (Cu3Ni7, Cu5Ni5, and Cu7Ni3) with about 53-73 percent porosity and pores oriented parallel to the compressive loading direction and (10B) compressive stress-strain curves of the same three copper-nickel alloy foam specimens normalized by σ/(A(ρ*)1.5) to exclude the effect of the porosity.

[0044] FIG. 11 shows an energy absorbed in the foams during compression to the strain of 0.4 for the freeze-casted copper-nickel foams as a function of the nickel content.

[0045] FIGS. 12A-12B show nanoindentation test results for the copper-nickel alloy foams: (12A) a representative load-displacement curve with a peak load of 123.76 micronewtons and (12B) variations of hardness and elastic modulus values of the copper-nickel alloy foams with an increasing composition of nickel.

Exemplary Embodiment 1: Synthesizing Copper-Nickel Alloy Foams

[0046] Nickel oxide powder (NiO, with an average particle size less than about 20 nanometers) and copper oxide powder (CuO, with a particle size of about 40 nanometers to about 80 nanometers) are used to fabricate copper-nickel alloy foams. First, a mixture of 3 weight-percent polyvinyl alcohol binder (PVA binder with molecular weight of about 89,000-98,000 gram per molar) and distilled water is prepared and subsequently heated up to 80 degrees Celsius to dissolve the binder. Various weight ratios of copper and nickel powders are then suspended in the prepared solution to obtain copper-nickel slurries with various compositions. To improve the stability of the suspension, 0.09 grams of Darvan 811 (a low-molecular-weight sodium polyacrylate powder dispersant) is also added as a dispersant. The slurry solution is then dispersed first by stirring for about 30 minutes and then by sonication for about 1 hour. To ensure sufficient particle dispersion, this process is repeated twice.

[0047] The copper rod is cooled using liquid nitrogen and controlled using a thermocouple and temperature controller. Once the freezing process is complete, the frozen green-body CuO—NiO foam sample is removed from the mold and sublimated at about 185 Kelvin (−88 degrees Celsius) for about 48 hours in a freeze-dryer under a 0.005-torr residual atmosphere.

[0048] The green-body foam is then heat-treated in two steps. First, it is heated to about 250-300 degrees Celsius in a furnace and then maintained at this temperature for about 2 hours to about 3 hours to burn off the binder and reduce the oxides to metals. It is then subsequently sintered at about 800 degrees Celsius, 900 degrees Celsius, or 1000 degrees Celsius under a 5 percent argon, hydrogen gas mixture depending on the composition of the slurry. Heating rates were about 5 degrees Celsius per minute and the final cooling rate was about 3 degrees Celsius per minute. The sintered copper-nickel alloy foam samples containing 100, 90, 70, 50, 30, 10 and 0 weight-percent copper are denoted as copper, Cu9Ni1, Cu7Ni3, Cu5Ni5, Cu3Ni7, Cu1Ni9, and nickel, respectively.

Exemplary Embodiment 2: Phase Analysis, and Corrosion and Mechanical Properties of the Synthesized Copper-Nickel Alloy Foams

[0049] To confirm the complete transformation of porous CuO—NiO into copper-nickel alloy foam, an X-ray powder diffraction (XRD) analysis was carried out. FIG. 1 compares the XRD patterns of the prepared CuO—NiO foam green body and synthesized copper-nickel alloy foam, before and after the simultaneous reduction or sintering process, or both, in a box furnace under a 5 percent argon, hydrogen gas atmosphere. The XRD patterns confirmed that the starting CuO—NiO powder was completely transformed to the combination of copper-nickel phases based on their high-temperature solid-solution alloying mechanism (FIG. 2), as seen from the XRD patterns of the final synthesized copper-nickel alloy foams.

[0050] FIG. 3 shows the lattice constant determined by XRD versus the nickel content of the foams for the three different alloy foams and two pure foams of copper and nickel. In addition, the straight line represents the theoretical variation of the lattice parameter as a function of nickel concentration in copper-nickel solid-solution alloy foams. It can be seen that the measured lattice constants were very close to the theoretical values, suggesting that the material in the struts was a solid solution for all created alloy foams. This result is also supported by the lack of the peaks of other phases in the XRD patterns (FIG. 1).

[0051] FIGS. 4 and 5 show the optical images of copper-nickel foams' cross sections that are cut parallel (FIG. 4) or perpendicular (FIG. 5) to the freezing direction. All samples show dendritic walls with thickness in the order of about 0.60-1.45 microns (see FIG. 4). Notably, the morphology of the pure nickel foam is influenced not only by the nucleation conditions, but also by the solidification kinetics. After the randomly oriented rapid growth of the ice crystals near the contact point of the copper rod, a single solidification front consisting of numerous grains grows along the temperature gradient, which subsequently leads to an oriented and continuous lamellar dendrite morphology in both parallel and perpendicular directions to the ice front; the optical images of the cross-sections in FIG. 4 show the representative areas of the middle sections along the temperature gradient. The morphology of the vertically aligned, lamellar macro-pores replicating ice dendrite colonies are seen to have directional growth during freezing as a result of the higher growth velocity in the parallel direction rather than perpendicular to the temperature gradient (FIG. 5).

[0052] FIGS. 6A-6B show (6A) SEM images and (6B) EDS analysis results of the five copper-nickel alloy foams with varying ratios of copper and nickel. Based on the EDS analysis in FIG. 6B, all of the five alloy foams were confirmed to be successfully alloyed with the intended compositions of copper and nickel. Scanning electron microscope (SEM) images show different morphologies with varied compositions. The wall width of the alloy foams gradually increased from about 0.6 microns to about 1.36 microns with increasing nickel content because of the stronger particle-particle interaction of nickel atoms during the reduction and sintering process; in other words, the surface energy of nickel is greater than that of copper, resulting in stronger particle-particle interaction and denser walls. Another possible cause may be the considerable size difference between the initial powders of nickel oxide (e.g., less then 20 nanometers) and copper oxide (e.g., about 40-80 nanometers), resulting in more uniform dispersion and packing of the smaller nickel oxide particles in the prepared slurry.

[0053] The grain structure in the struts is shown in the SEM images in FIG. 7. The thin vertical lines on the images indicate wavy surfaces caused by the focused ion beam (FIB)-cutting process and referred to as the “curtaining” effect in the literature. The grains had sizes of between about 1 and 5 microns for all of the samples. Twins were frequently observed inside the grains, some of which had wavy shapes due to the “curtaining” effect. The mean grain sizes varied between about 1 and 2.8 microns for the different copper-nickel foams. It is evident that although there was no correlation between the chemical composition and the grain size for the created alloy foams, the pure metals had a smaller grain size than the alloy foams.

[0054] FIG. 8 shows the weight loss behaviors of the pure nickel and copper foams in comparison with those of the Cu7Ni3, Cu5Ni5, and Cu3Ni7 alloy foams. The Cu7Ni3 alloy foam showed the best corrosion resistance in sulfuric acid (H2504) solution, followed by Cu5Ni5, pure copper, Cu3Ni7 and pure nickel foams in the order listed. The Cu7Ni3 alloy foam with the best corrosion resistance suffered only about a 19.5 percent decrease after about 360 hours and about a 35.8 percent decrease after about 600 hours.

[0055] Contrary to the superior corrosion performance of bulk pure nickel and copper-nickel alloys with more than 30 percent nickel contents in sulfuric acid solution due to the formation of a passive film, the pure nickel foam sample in this study manifested the poorest stability in the sulfuric acid corrosive condition and was completely dissolved after about 150 hours (FIG. 8). The weight loss rate of the three different alloy foams also tended to be in proportion to the nickel content.

[0056] Two microstructural factors may be considered for this explanation. First, the amount of porosity may have contributed to the corrosion weight loss because higher porosity implies a greater surface area, providing a greater reaction area. Second, the morphology of strut walls and pores may have also contributed to the corrosion weight loss, as the pure nickel and copper-nickel alloy foams with higher nickel contents tend to exhibit finer strut and pore structure with a greater surface area (see SEM images of Cu3Ni7 and Cu1Ni9 foams in FIG. 6A) than pure copper and copper-nickel foams with lower nickel content; this finer strut and pore structure probably resulted from the much smaller initial powder size of nickel oxide (e.g., less than 20 nanometers).

[0057] To understand the high corrosion resistance of some copper-nickel alloy foams, X-ray photoelectron spectroscopy (XPS) analysis was also carried out. Based on the XPS Cu 2p and Ni 2p spectra displayed in FIGS. 9A and 9B, respectively, it was observable that nickel at the surface of the alloy foams were more significantly oxidized compared to that of the nickel foam, while copper in the alloy foams showed lower degree of oxidation than that in the copper foam.

[0058] The copper oxide signal roughly located at 935 electron volts (eV) belonged to the copper foam and its magnitude apparently decreased in the alloy foams. On the other hand, the peak of the metallic nickel at around 853 electron volts was indeed smaller in the alloy foams compared to that in the nickel foam. To further understand the electronic interaction between copper and nickel in the alloy foams, the XPS Cu 2p and Ni 2p spectra was measured after removing the native oxides by argon sputtering, which are respectively shown in FIGS. 9C and 9D. The binding energy positions of metallic copper and nickel peaks could be clearly compared, because oxide signals were hardly observable in this case.

[0059] It was noteworthy that the copper peaks did not show a considerable change in their positions, while there was a gradual shift of the nickel peak in the negative direction with increasing copper content in the foam. This result indicates that copper supplies electrons to nickel in the copper-nickel alloy foam, which matches well with the trend in electronegativity; nickel has higher electronegativity than copper, although the difference is insignificant. The electrons provided from copper to nickel would then suppress the oxidation of nickel and also dissolution of nickel in the form of cation. Given that the standard potential of nickel or Ni.sup.2+ is significantly lower than that of copper or Cu.sup.2+ by 0.6 volts, it can be easily expected that nickel first oxidizes or dissolves prior to copper they are in direct contact.

[0060] Therefore, the high corrosion resistance of copper-nickel alloy foam can be attributed to the electronic interaction between copper and nickel. The negative shift of metallic nickel peak was also observable at the surface of the alloy foam in FIG. 9B, indicating that the electronic interaction is significant at the surface, where the actual corrosion occurs.

[0061] Typical compressive stress-strain curves are shown in FIG. 10A for the Cu7Ni3, Cu5Ni5, and Cu3Ni7 alloy foams with pore orientation parallel to the load axis. The alloy foam samples tended to follow typical the ductile metallic behavior with linear elasticity at low stresses followed by a collapse plateau, which eventually leads to a densification region in stress that rises steeply. Here, it is noted that the directionality with respect to the loading axis is important for these directionally solidified metal foams.

[0062] For example, metal foams with their pores normal to the loading axis yield at about one third of the yield stress of the foams with the pores parallel to the loading axis due to bending being the major deformation mode of the walls as opposed to the plastic buckling of the latter. Strain-hardening behavior is seen for all the three alloy foams in the plastic region of 10 percent strain for Cu7Ni3 foam and up to about 35 percent strain for Cu5Ni5 and Cu3Ni7 foams, where the stress then dramatically decreased. Even with the presence of possible cracks and fractures inside the foam, the 3-D connected struts in the foams could probably withstand high stresses and finally have high compressive strengths up to near complete deformation. The Cu7Ni3 alloy foam has about a 53 percent porosity plus or minus about 2 percent porosity, thus resulting in the relatively higher yield strength of 72 megapascals plus or minus about 2 megapascals, whereas the Cu5Ni5 and Cu3Ni7 alloy foams have about 67 percent porosity plus or minus about 2 percent porosity and 73 percent porosity plus or minus about 2 percent porosity, resulting in the lower yield strengths of 29 megapascals plus or minus about 2 megapascals and 14 megapascals plus or minus about 2 megapascals, respectively. Therefore, stress normalization σ divided by (A(ρ*).sup.1.5) was carried out to compare the strength of the alloy foams in terms of their compositions alone, with their differences in porosity being excluded (FIG. 10B).

[0063] For the normalization, the Gibson-Ashby (G-A) model was used to predict the strength of porous material as presented in an equation,

[00001]$\frac{{\sigma }^{\star }}{{\sigma }_s}={A\left(\frac{\rho }{{\rho }_s}\right)}^{1.5},$

[0064] where A is a constant equal to 0.3 for metal and σ.sub.s and ρ.sub.s are the yield strength and density of the corresponding bulk material, respectively. A value of measured yield strength was taken for σ* and a measured value of relative density was also taken for ρ divided by ρ.sub.s in the G-A equation. Even after normalization, the normalized strength (σ.sub.s) of Cu7Ni3 foam was still the largest with a value of about 852 megapascals plus or minus about 3 megapascals, and that of the Cu3Ni7 foam was the smallest, with a value of 418 megapascals plus or minus about 2 megapascals.

[0065] FIG. 11 shows that the energy absorbed by the foams during compression to a strain of 0.4 is higher for the Cu7Ni3, Cu5Ni5, and Cu5Ni5 alloy foams than the pure copper and nickel foams, which can be explained by their solid-solution alloying effects.

[0066] Nanoindentation testing was carried out to determine the elastic modulus and hardness of the struts of all seven synthesized copper-nickel alloy foams. FIG. 12A displays a representative curve of the force versus displacement for the Cu5Ni5 alloy foam with the calculated results of the elastic modulus and hardness values directly obtained from the unloading curve and the peak force value where the peak load is 120 micronewtons.

[0067] The hardness (H) and elastic modulus (E) values of the pure nickel and copper foams along with those of the five copper-nickel alloy foams are compared in FIG. 12B. The dependence of E and H on the composition of nickel is clearly seen with their values varying in the range of about 73.4-152.4 gigapascals and about 1.6-4.7 gigapascals, respectively.

[0068] Indeed, both the H and E of the pure and alloy foams vary in a similar manner; in other words, they both tend to increase with increasing degree of alloying. In particular, both the E and H are larger for the Cu5Ni5, Cu7Ni3 and Cu3Ni7 alloy foams than those for the pure copper and nickel foams. With the E value of the Cu5Ni5 alloy foam being only slightly higher, all three alloy foams show similarly higher E values than pure copper and nickel foams. On the other hand, the H value of the Cu5Ni5 alloy foam is clearly superior to those of the Cu7Ni3 and Cu3Ni7 alloy foams and pure copper and nickel foams.

[0069] A table below describes heat-treatment processing parameters and the main microstructural features of strut size, pore size, and porosity for the pure copper and nickel foams compared with the Cu9Ni1, Cu7Ni3, Cu5Ni5, Cu3Ni7, Cu1Ni9 alloy foams.

TABLE-US-00001 TABLE Heat Treatment Strut Size Pore Size Porosity (Under H2 Gas) (Microns) (Microns) (%) Cu 250° C., 2 h .fwdarw. 1.45 ± 0.38 1.48 ± 0.36 64.7 800° C., 6 h Cu9Ni1 300° C., 2 h .fwdarw. 1.36 ± 0.33 1.28 ± 0.35 55.8 900° C., 8 h Cu7Ni3 300° C., 2 h .fwdarw. 0.95 ± 0.32 1.13 ± 0.23 55.2 900° C., 8 h Cu5Ni5 300° C., 2 h .fwdarw. 0.74 ± 0.17 0.85 ± 0.17 54.5 900° C., 8 h Cu3Ni7 300° C., 2 h .fwdarw. 0.72 ± 0.24 1.20 ± 0.41 61.3 900° C., 8 h Cu1Ni9 300° C., 2 h .fwdarw. 0.60 ± 0.13 0.96 ± 0.30 62.2 900° C., 8 h Ni 300° C., 2 h .fwdarw. 0.73 ± 0.18 1.99 ± 0.41 60.1 1000° C., 6 h

[0070] Three dimensionally (3-D) connected copper-nickel alloy foams with five different compositions are successfully fabricated using a combination of CuO—NiO oxide powder mixing, freeze casting, and reduction or sintering process, or both, by utilizing their high-temperature alloying mechanism. The manufactured copper-nickel alloy foams have a porosity of about 50 percent to about 90 percent with open pore structure, and can thus provide large surface area and high permeability for various functional applications such as high-temperature filters, corrosion-resistant electrodes, and highly wear-resistant bulk alloys or composites when infiltrated with other materials.

[0071] The copper-nickel alloy foam as described above where the starting material is a mixture of nickel oxide (NiO) power (with the average size of about 10-1,000 nanometers) and copper oxide (CuO) power (with the average size of about 10-1,000 nanometers) mixed with water (or other liquid solvent), binder, and dispersant (Darvan). For better dispersion, the slurry solution is stirred for 10-30 minutes and then sonicated for 30-60 minutes.

[0072] The copper-nickel alloy foam as described above where the starting powder mixture of nickel oxide and copper oxide is mechanically mixed in a mixing machine for 10-60 minutes to obtain a uniform particle mixing, prior to being mixed with water, binder, and dispersant for slurry preparation.

[0073] The copper-nickel alloy foam as described above where the synthesis method is a combination of the slurry freezing or drying, or both, and thermal reduction or sintering, or both, methods. This invented process includes the low-temperature freezing (about −50 degrees Celsius to −10 degrees Celsius) or drying, or both, of the prepared CuO—NiO powder slurry as described above to make CuO—NiO foam green body. The CuO—NiO foam green body is then subjected to a simultaneous low-temperature reduction (about 250-300 degrees Celsius in a furnace under a 5 percent argon, hydrogen gas mixture) and sintering (about 700-1,100 degrees Celsius in a furnace under a 5 percent argon, hydrogen gas mixture) processes for the complete transformation to copper-nickel alloy foam, resulting in a 3-D pore structure with uniformly distributed pores typically several to tens of microns in diameter and occasional nanometer pores (a few tens to several hundreds of nanometers).

[0074] The copper-nickel alloy foam as described above where the cooling rate is less than about 2-5 degrees Celsius per minute. The lower cooling rate (less than about 3 degrees Celsius) is generally preferred for larger copper-nickel alloy foam samples to prevent them from cracking during cooling.

[0075] The copper-nickel foam as described above where the invented manufacturing process applies to various copper-nickel foams including Cu9Ni1, Cu7Ni3, Cu5Ni5, Cu3Ni7, and Cu1Ni9, depending on their target applications. The copper-nickel foams with various compositions are obtainable as copper and nickel can form a solid solution during the high-temperature sintering. Therefore, the processing routes described in this patent can also apply to other alloy foams that can form partial or complete solid solutions at elevated temperature.

[0076] In an implementation, a composition of matter include a three dimensionally connected copper-nickel alloy foam of Cu9Ni1, Cu7Ni3, Cu5Ni5, Cu3Ni7, or Cu1Ni9. The composition can have a porosity from about 50 percent to about 90 percent with an open pore structure. The copper-nickel alloy foam can have a cooling rate of less than about 2 to about 5 Celsius per minute, or about less than about 3 Celsius per minute, which will improve resistance against cracking during cooling.

[0077] In an implementation, a method include: mixing copper oxide powder and nickel oxide powder to obtain a slurry solution; freeze casting the slurry solution of copper oxide powder and nickel oxide powder; reducing or sintering, or both, the freeze-casted slurry of copper oxide and nickel oxide powder at a high temperature; and after the reducing or sintering, producing a three dimensionally connected copper-nickel alloy foam of Cu9Ni 1, Cu7Ni3, Cu5Ni5, Cu3Ni7, or Cu1Ni9.

[0078] The nickel oxide powder can have an average size of about 10 to about 1000 nanometers. The copper oxide powder can have an average size of about 10 to about 1000 nanometers.

[0079] The copper oxide powder and nickel oxide powder can be mixed in water or other liquid solvent with a binder and a dispersant. The binder can be polyvinyl alcohol. The disperant can be sodium polyacrylate powder. The method can include stirring the slurry solution for about 10 to 30 minutes; and after the stirring, sonicating the slurry solution for about 30-60 minutes. Also, the method can include mechanically mixing the copper oxide powder and nickel oxide powder for about 10-60 minutes to obtain a uniform particle mixing before mixing with water, binder, and dispersant.

[0080] The method can include freezing the slurry at a temperature from about −50 degrees Celsius to about −10 degrees Celsius to obtain a foam green body of a composition of copper oxide and nickel oxide. The method can include drying the slurry at a temperature from about −50 degrees Celsius to about −10 degrees Celsius to obtain a foam green body of composition of copper oxide and nickel oxide.

[0081] The method can include reducing the foam green body of the composition copper oxide and nickel oxide at a temperature from about 250 degrees Celsius to about 300 degrees Celsius in an about 5 percent argon, hydrogen gas mixture. The method can include after reducing, sintering the foam green body of the composition of copper oxide and nickel oxide at a temperature from about 700 degrees Celsius to about 1100 degrees Celsius in an about 5 percent argon, hydrogen gas mixture. The foam green body of the composition of copper oxide is transformed into the copper-nickel alloy foam.

[0082] The resulting copper-nickel alloy foam will have a three-dimensional pore structure with uniformly distributed pores having diameters from about 2 microns to about 100 microns. The three-dimensional pore structure can also include some nanometer pores having diameters from about 10 nanometers to about 400 nanometers in diameter.

[0083] This description of the invention has been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form described, and many modifications and variations are possible in light of the teaching above. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications. This description will enable others skilled in the art to best utilize and practice the invention in various embodiments and with various modifications as are suited to a particular use. The scope of the invention is defined by the following claims.