PLATING HANGER FOR OBTAINING HOMOGENEOUS PLATING

Abstract

A plating hanger is provided. The plating hanger provides a homogeneous plating by equalizing high current and low current zones by changing distances of part connections holding materials to be coated to an anode. The plating hanger includes at least one hanger frame, and a hanger body having part connections holding the materials to be coated on the plating hanger

Claims

1. A plating hanger for a homogeneous plating of materials to be coated by an immersion method comprising at least one hanger frame, and a hanger body having part connections holding the materials to be coated on the plating hanger, wherein the material to be coated in low current zones of the plating hanger are attached on a first part connections of the part connections, and lengths of the first part connections are kept long and thereby approximated to an anode, and the material to be coated in high current zones are attached on a second part connections of the part connections, and lengths of the second part connections are kept short and kept away from the anode.

2. The plating hanger according to claim 1, wherein both sides of the plating hanger have a convex form from edge parts of the plating hanger towards middle parts of the plating hanger.

3. The plating hanger according to claim 1, wherein the hanger body is within the at least one hanger frame the materials to be coated are hanged on the at least one hanger frame, and the hanger body is monolithic and filled with a conductive plate.

4. The plating hanger according to claim 1, further comprising a hanger head, wherein the hanger head enables to be attached to a busbar and determines a direction and a density of a current.

5. The plating hanger according to claim 4, wherein the hanger head comprises at least one hanger head busbar connecting terminal designed in a U-shape to determine the direction of the current.

6. The plating hanger according to claim 4, wherein the hanger head comprises a hunger head frame connecting body to distribute the current on the at least one hanger frame at an equal density.

7. The plating hanger according to claim 6, wherein the hunger head frame connecting body has two long edges extending at a certain angle towards right and left upper corners of the at least one hanger frame and short edges extending towards the at least one hanger frame such as to be in a parallel from a middle of each of the two long edges (14.2.1) to an other edge to distribute the current to the at least one hanger frame at the equal density.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0011] FIG. 1 shows the figurative representation of the plating density in use of the old-type hanger head.

[0012] FIG. 2 shows the output of the simulation program of the plating density in use of the hanger head according to the invention.

[0013] FIG. 3 shows a perspective view of the plating hanger according to the invention.

[0014] FIG. 4 shows a front view of the plating hanger according to the invention.

[0015] FIG. 5 shows a side view of the plating hanger according to the invention.

REFERENCE NUMBERS

[0016] 10. Plating hanger

[0017] 11. Hanger body

[0018] 12. Hanger frame

[0019] 13. Busbar

[0020] 14. Hanger head [0021] 14.1 Hanger head busbar connecting terminal [0022] 14.2 Hunger head frame connecting body [0023] 14.2.1. Long edge [0024] 14.2.2. Short edge

[0025] 15. Material to be coated (part)

[0026] 16. Part (material to be coated) connecting terminal

[0027] 17. Part connection

[0028] CD. Current direction

[0029] HPD. High plating density

[0030] LPD. Low plating density

DETAILED DESCRIPTION OF THE EMBODIMENTS

[0031] In this detailed description, all the technical features and structure of the plating hanger (10), which is developed to ensure the chrome plating of the materials to be coated (15) by chrome in a homogeneous way by the immersion method, will be detailed. FIGS. 3, 4 and 5 show views of the plating hanger (10) according to the invention. In the plating process, the materials to be coated (15) in the central region of the plating hanger (10) are less coated because they remain in the low current zone, whereas the edge regions have more plating thickness because they remain in the high current zone. The high current and low current zones are equalized by changing the distances of the part connections (17), which hold the materials to be coated (15) on the plating hanger (10), to the anode. Accordingly, the distance and angle of the part connecting ends (17), which hold the materials to be coated (15), to the hanger body (11) are changed whereby the distances of the materials to be coated (15) to the anode are changed.

[0032] In this way, the materials to be coated (15) in the low current zones of the plating hanger (10) are brought closer to the anode, and the materials to be coated (15) in the high current zones thereof are kept away from the anode whereby it is obtained a more homogeneous plating. This is achieved by changing the length of the part connections (17). The distances of the part connecting terminals (16) to said hanger body (11) is changed by which part connections (17) on the sides are selected shorter and those on the middle part are selected longer such as to form a convex form. Thus, the homogeneous plating is obtained by changing the distance of the material to be coated (15) to the anode according to the current density of said material to be coated (15). The views of FIGS. 3 and 5 illustrate the selected lengths of said part connections (17). The homogeneous plating obtained by said curved (convex) form made on both surfaces of the plating hanger (10) according to the invention is fixed by all experimental data. In a preferred embodiment of the present invention, the hanger body (11) within the hanger frame (12), on which the materials to be coated (15) are hanged, is monolithic and filled with conductive plate. Thus, the current flowing to the materials to be coated (15) on the plating hanger (10) is distributed homogeneously and the plating thickness on the materials to be coated (15) is homogeneous.

[0033] In the plating hanger of the present invention, the hanger head (14) which provides the current passage by attaching the plating hanger (10) to the busbar (13) is designed differently from the prior art applications. The result obtained by said hanger head (14) will be more clearly understood by examining the views of FIGS. 1 and 2. FIG. 1 shows the output of the simulation program of the plating density in use of the old-type hanger head. FIG. 2 shows the output of the simulation program of the plating density in use of the hanger head (14) pertaining to the plating hanger (10) according to the invention. In the former embodiment shown in FIG. 1, the outer frame of the hanger constitutes the high current zone, even further since the upper left part is the first part that the current enters, it is coated considerably thicker than the parts in the other zone. More homogeneous plating is obtained when the hanger head (14) of the plating hanger (10) according to the invention (see FIG. 2) is being used. The hanger head busbar connecting terminal (14.1) is designed in U shape and determines the direction of current. Again, the hunger head frame connecting body (14.2) has two long edges (14.2.1) extending at a certain angle towards the right and left upper corners of said hanger frame (12) and short edges (14.2.2) extending towards said hanger frame (12) such as to be in a parallel from the middle of both long edges (14.2.1) to the other edge (14.2.1) in order to distribute the current to the hanger frame (12) at equal density. With this developed form, the materials to be coated (15) in the hanger corner/edge region is prevented to take excessive current and thereby to be coated thin and burned. The plating hanger (10) according to the invention may have different dimensions in alternative areas of application. Therefore, dimensional changes have not been emphasized in the narratives.