INTERNAL POWER SUPPLY FOR AMPLIFIERS
20210376806 · 2021-12-02
Assignee
Inventors
Cpc classification
H03F2200/516
ELECTRICITY
H03F2200/411
ELECTRICITY
International classification
Abstract
An internal power supply for an amplifier is disclosed. The internal power supply floats according to a common mode voltage at the input to the amplifier and according to an input voltage at an input stage of the amplifier. Powering the input stage of the amplifier using the floating supply allows for the use of low voltage devices even when the range of possible common mode voltages includes high voltages. The use of low voltage devices can correspond to performance improvement for the amplifier and can help reduce the size of the amplifier. The internal supply can accommodate both positive and negative common mode voltages and can be used for current sense amplifiers of any gain.
Claims
1. A power supply comprising: a selector circuit configured to receive a common mode voltage (V.sub.CM), an upper external voltage (V.sub.DD), and a lower external voltage (V.sub.GND), the selector circuit configured to: output a maximum voltage (V.sub.MAX) as the larger of the common mode voltage (V.sub.CM) and the upper external voltage (V.sub.DD); and output a minimum voltage (V.sub.MIN) as the smaller of the common mode voltage (V.sub.CM) and the lower external voltage (V.sub.GND); and a floating supply circuit configured to receive V.sub.MAX and V.sub.MIN from the selector circuit, the floating supply circuit configured to generate a floating voltage range defined by an upper internal voltage (V.sub.INTP) and a lower internal voltage (V.sub.INTN), the floating voltage range is level-shifted according to V.sub.MAXX and V.sub.MIN.
2. The power supply according to claim 1, wherein V.sub.CM is in a range that includes positive and negative voltages.
3. The power supply according to claim 1, wherein the selector circuit includes: a first pair of diodes are configured to connect the larger of V.sub.CM and V.sub.DD to a maximum-voltage output; and a second pair of diodes configured to connect the smaller of V.sub.CM and V.sub.GND to a minimum-voltage output. cm 4. The power supply according to claim 3, wherein the first pair of diodes and the second pair of diodes are Schottky diodes.
5. The power supply according to claim 3, wherein: the first pair of diodes are cathode-coupled at the maximum-voltage output; and the second pair of diodes are anode-coupled at the minimum-voltage output.
6. The power supply according to claim 1, wherein the selector circuit includes: a first pair of transistors configured to switch the larger of V.sub.CM and V.sub.DD to a maximum-voltage output; and a second pair of transistors configured to switch the smaller of V.sub.CM and V.sub.GND to a minimum-voltage output.
7. The power supply according to claim 6, wherein the first pair of transistors include: a first PMOS transistor connected between V.sub.CM and the maximum-voltage output, the first PMOS transistor switched by V.sub.DD; and a second PMOS transistor connected between V.sub.DD and the maximum-voltage output, the second PMOS transistor switched by V.sub.CM.
8. The power supply according to claim 6, wherein the second pair of transistors include: a first NMOS transistor connected between V.sub.CM and the minimum-voltage output, the first NMOS transistor switched by V.sub.GND; and a second NMOS transistor connected between V.sub.GND and the minimum-voltage output, the second NMOS transistor switched by V.sub.CM.
9. The power supply according to claim 1, wherein the floating supply circuit includes a regulation device coupled between a first output of the floating supply circuit and a second output of the floating supply circuit, the first output configured to output V.sub.INTP and the second output configured to output V.sub.INTN.
10. The power supply according to claim 9, wherein the regulation device is Zener diode.
11. The power supply according to claim 9, wherein the floating supply circuit includes: an NMOS transistor configured to couple the first output to V.sub.MAX when V.sub.CM is greater than V.sub.DD; and a PMOS transistor configured to couple the second output to V.sub.MIN when V.sub.CM is less than V.sub.GND.
12. A method for generating a floating voltage range, the method comprising: receiving a common mode voltage (V.sub.CM), an upper external voltage (V.sub.DD), and a lower external voltage (V.sub.GND); generating a maximum voltage (V.sub.MAX) as the larger of the common mode voltage (V.sub.CM) and the upper external voltage (V.sub.DD); generating a minimum voltage (V.sub.MIN) as the smaller of the common mode voltage (V.sub.CM) and the lower external voltage (V.sub.GND); floating an upper internal voltage (V.sub.INTP) to V.sub.MAX or a lower internal voltage (V.sub.INTN) to V.sub.MIN based on V.sub.CM; and regulating a voltage range between V.sub.INTP and V.sub.INTN to generate the floating voltage range.
13. The method for generating a floating voltage range according to claim 12, wherein the V.sub.CM is in a range that includes positive and negative voltages.
14. The method for generating a floating voltage range according to claim 12, wherein: generating V.sub.MAX includes using a first pair of diodes to switch the larger of V.sub.CM and V.sub.DD to a first output of a selector circuit; and generating V.sub.MIN includes using a second pair of diodes to switch the smaller of V.sub.CM and V.sub.GND to a second output of the selector circuit.
15. The method for generating a floating voltage range according to claim 14, wherein: the first pair of diodes and the second pair of diodes are Schottky diodes.
16. The method for generating a floating voltage range according to claim 12, wherein: generating V.sub.MAX includes using a first pair of transistors to switch the larger of V.sub.CM and V.sub.DD to a first output of a selector circuit; and generating V.sub.MIN includes using a second pair of transistors to switch the smaller of V.sub.CM and V.sub.GND to a second output of the selector circuit.
17. The method for generating a floating voltage range according to claim 14, wherein: the first pair of transistors are PMOS transistors, and the second pair of transistors are NMOS transistors.
18. The method for generating a floating voltage range according to claim 12, wherein the floating V.sub.INTP to V.sub.MAX or V.sub.INTN to V.sub.MIN based on V.sub.CM includes: coupling V.sub.INTP to V.sub.MAX when V.sub.CM is greater than V.sub.DD; and coupling V.sub.INTN to V.sub.MIN when V.sub.CM is less than V.sub.GND.
19. The method for generating a floating voltage range according to claim 12, wherein the regulating a voltage range between V.sub.INTP and V.sub.INTN to generate the floating voltage range includes: biasing a regulation device between V.sub.INTP and V.sub.INTN to generate the voltage range between V.sub.INTP and V.sub.INTN.
20. A floating power supply comprising: a selector circuit configured to receive a common mode voltage (V.sub.CM), an upper external voltage (V.sub.DD), and a lower external voltage (V.sub.GND), the selector circuit including: a maximum voltage (V.sub.MAX) circuit configured to output the larger of V.sub.CM and V.sub.DD as V.sub.MAX; and a minimum voltage (V.sub.MIN) circuit configured to output the smaller of V.sub.CM and V.sub.GND as V.sub.MIN; and a floating supply circuit configured to receive V.sub.MAX and V.sub.MIN from the selector circuit and to output an upper internal voltage (V.sub.INTP) and a lower internal voltage (V.sub.INTN), the floating supply circuit including: a regulation device configured to maintain a voltage difference between V.sub.INTP and V.sub.INTN; a first transistor configured to pull-up V.sub.INTP to V.sub.MAX when V.sub.CM is larger than V.sub.DD; and a second transistor configured to pull-down V.sub.INTN to V.sub.MIN when V.sub.CM is smaller than V.sub.GND.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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[0021] The components in the drawings are not necessarily to scale relative to each other. Like reference numerals designate corresponding parts throughout the several views.
DETAILED DESCRIPTION
[0022] The present disclosure describes an amplifier having a floating internal power supply (i.e., internal power supply) for generating a regulated voltage in a low voltage range. The regulated voltage is used to supply an input stage (i.e., core amplifier) so that it may receive an input voltage in a high voltage range. The regulated voltage is level-shifted (i.e., floated) to a voltage (V.sub.IN) appearing at an input stage so that the core amplifier may operate using low voltage (LV) devices, which can offer an improved performance (e.g., relative to a core amplifier that uses high voltage (HV) devices).
[0023] The disclosed circuits and techniques can be used for general purpose amplifiers or current sense amplifiers and can be used with amplifiers that operate with a unidirectional (e.g., positive) or a bidirectional (e.g., positive and negative) power supply and/or common mode input voltages. The disclosed circuits and techniques can reduce the number of HV devices in the amplifier required for operation with HV input common mode voltages and/or a HV external power supply voltages.
[0024] A reduction of the HV devices in the amplifier can result in a performance improvement. The performance improvement of the amplifier may correspond to an improvement (e.g., reduction) of a voltage offset (V.sub.OS), an improvement (e.g., increase) of a common-mode rejection ratio (CMRR), and/or an improvement (e.g., reduction) of a die area for (e.g., required for) the amplifier. For example, the disclosed circuits and techniques may result in a V.sub.OS that is approximately constant over a range of input common mode voltages.
[0025] Variations in common mode voltage (V.sub.CM) can change a bias point of a differential pair in the input stage of a typical amplifier due of mismatches between the devices in the input differential pair. This change is pronounced when HV devices are used. The mismatch may affect the amplifier's performance. For example, a range of V.sub.CM at the input of an amplifier using HV devices in the input stage can result in an input offset voltage (V.sub.OS) that is above a level desirable for precision applications, such as current sensing. On the other hand, an input stage with a differential pair including LV devices can be better matched. The improved matching decreases the variability in performance with V.sub.CM. The LV devices, however, cannot handle a wide range of V.sub.CM. Thus, using HV devices in an input stage can accommodate a wide range of V.sub.CM but can reduce the performance of the amplifier and increase the overall size of the amplifier. Schemes, such as chopping architectures, have been devised to improve the performance of amplifiers using HV devices. These approaches, however, can significantly add complexity. The amplifiers described herein address these issues in that they handle wide variations in V.sub.CM with high performance (e.g., comparable to chopping architectures) but without significant added complexity.
[0026]
[0027] In a possible implementation, the amplifier 120 may be a general purpose amplifier (GPA), which can be configured for various functions (e.g., buffer amplifier, inverting amplifier, summing amplifier, etc.) through feedback. In another possible implementation, the amplifier 120 may be a current sense amplifier (CSA). In the CSA implementation, the amplifier 120 may include a current sense (CS) resistor network 130 to sense a current and to provide a gain.
[0028] The amplifier 120 includes various stages to provide functions to receive an input signal (i.e., input) and provide an output signal. The amplifier 120 may be configured to amplify an input signal defined as a voltage different between a relatively positive (i.e., positive) input terminal (INP) of the amplifier 120 and a relatively negative (i.e., negative) input terminal (INN) of the amplifier. In some cases, the input signal includes a common mode voltage (V.sub.CM), and in some applications, such current sensing, it is desirable to ignore, reduce, or eliminate the V.sub.CM. Accordingly, a differential amplifier that responds only to voltage differences may be included in the amplifier to effectively eliminate the V.sub.CM. As shown in
[0029] The core amplifier 140 can amplify a voltage difference at its input (i.e., INP_AMP-INN_AMP) using a differential pair of transistors provided that the transistors are biased appropriately. For example, if the voltage difference at the input of the core amplifier is 5V but the common mode voltage is 20V then the core amplifier can (e.g., must) be powered by at least the common mode voltage in order to perform the voltage difference amplification. This condition implies that high power supply voltages and/or transistors with high voltage ratings (i.e., HV transistors) can (e.g., must) be used for the core amplifier if large V.sub.CM are possible. As discuss previously, however, high voltage transistors in the input stage (i.e., core amplifier140) can negatively affect the overall size and performance of the amplifier 120. For example, accommodating a range of V.sub.CM using HV devices and/or high power supplies may lead to amplifiers that have large (e.g., >5 millivolt (mV)) V.sub.OS variations or the range of V.sub.CM.
[0030] The disclosed circuits and techniques can accommodate for a range of V.sub.CM that includes high voltages with a low voltage (LV) core amplifier 140 that includes low voltage devices (e.g., transistors) to avoid the reduction in performance. To enable operation of the LV core amplifier 140 with low voltage devices, the amplifier 120 includes an internal power supply 200 capable of floating with V.sub.CM so that the LV core amplifier 140 is properly biased to amplify the difference signal (i.e., INP_AMP_INN_AMP) regardless of the V.sub.CM at the input.
[0031] The internal power supply 200 (i.e., internal floating power supply) is configured to generate a floating voltage range defined by an upper internal voltage (V.sub.INTP) and a lower internal voltage (V.sub.INTN), the floating voltage range is level-shifted to a voltage based on a V.sub.CM at the input of the amplifier 120 and based on an a voltage (V.sub.IN) at the input of the core amplifier 140 so that the output of the core amplifier is in a first voltage range that corresponds to (e.g., is equivalent to) the floating voltage range (i.e., V.sub.INTN to V.sub.INTP).
[0032] The amplifier 120 further includes at least one output stage 150 to convert the first voltage range at the output of the LV core amplifier 140 to a second (i.e., output) voltage range at the output of the amplifier 120. The second voltage range at the output of the amplifier corresponds to (e.g., is equivalent to) the voltage range provided by the external power supply 110 (i.e., the fixed voltage range, V.sub.GND to V.sub.DD). The one or more output stages may function to convert (e.g., level shift) high voltages to low voltages or convert low voltages to high voltages depending on the implementation. Accordingly, the output stage(s) may include HV devices to perform the conversion. The inclusion of HV devices after the input stage does not significantly affect the overall performance of the amplifier 120.
[0033] The use of the terms high voltage (HV) and low voltage (LV) are relative to the scenario of a particular fixed voltage range provided to an amplifier designed for a V.sub.CM of zero. Voltages outside this particular fixed range can be considered as high voltages while voltages within this particular fixed range can be considered as low voltages. In one possible implementation the particular fixed voltage range is 5V (i.e., VDD=+5V, VGND=0V). Based on this scenario, a V.sub.CM in the range of 0V to +5V can be considered as a low voltage, while a V.sub.CM that is less than 0V or greater than +5V can be considered as a high voltage. The disclosed circuits and techniques allow the LV core amplifier to operate over a range of common mode voltages that may include high and low voltages and that may include positive or negative voltages. For the scenario described above (i.e., VDD=+5V, V.sub.GND=0V), V.sub.CM may be in a range of −80V to +80V. One advantage of the disclosed circuits and techniques is that they can accommodate a range of V.sub.CM that may include both positive and negative voltages.
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[0035] The selector circuit 210 may be implemented in a variety of ways.
[0036] To determine V.sub.MIN in the selector circuit of
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[0038] As mentioned previously, the internal power supply 200 also includes a floating supply circuit 220. The floating supply circuit 220 receives the selected V.sub.MAX and V.sub.MIN from the selector circuit 210. Additionally, the floating supply circuit 220 receives an input voltage (V.sub.IN) from the input to the LV core amplifier 140. In some implementations (e.g., the GPA), V.sub.IN is equivalent to V.sub.CM, while in other implementations (e.g., the CSA), V.sub.IN may differ from V.sub.CM due to the resistor network 130 for current sensing. Further, it should be noted that, in some implementations, V.sub.IN might be received at the floating supply circuit 220 from the positive input terminal (INP_AMP) of the core amplifier 140, while in other implementations V.sub.IN may be received at the floating supply circuit 220 from the negative input terminal (INN_AMP) of the core amplifier 140. Based on the received voltages, the floating supply circuit 220 is configured to generate a voltage range defined by an upper (i.e., relatively positive) internal voltage (V.sub.INTP) and a lower (i.e., relatively negative) internal voltage (V.sub.INTN), which are provided to the LV core amplifier 140 for operation.
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[0040] The floating supply circuit effectively level shifts (i.e., floats) a regulated voltage range (VREG) that is determined by a regulation device 225 (e.g., a voltage regulation device). The regulation device 225 may be selected/adjusted to provide a LV voltage range, which in some implementations may be approximately the range generated by the external power supply. For example, if V.sub.DD-V.sub.GND=5V then V.sub.REG may be configured as approximately 5V (e.g., 6V). The regulation device 225 may be a Zener diode or other regulating device (e.g., a PN diode, a diode-connected transistor, etc.). When a Zener diode is used as the regulation device 225, the breakdown voltage of the Zener diode corresponds to V.sub.REG.
[0041] The floating supply circuit 220 may pull-up (i.e., float, regulate, set, etc.) the regulated voltage range to V.sub.MAX using the sourcing current source 222 and the NMOS transistor 221. For example, if V.sub.CM>V.sub.DD (i.e., V.sub.MAX=V.sub.CM) then the NMOS transistor 221 and the sourcing current source 222 will operate together (i.e., based on V.sub.MAX and V.sub.IN) to effectively pull (i.e., regulate, set, etc.) V.sub.INTP up to V.sub.MAX. After V.sub.INTP is set, then V.sub.INTN is regulated below V.sub.INTP. In other words, after V.sub.INTP is pulled up to V.sub.MAX, the regulation device 225 (e.g., biased by sinking current source 224) regulates V.sub.INTN relative to V.sub.INTP by a regulated voltage drop (V.sub.REG). For example, if V.sub.MAX=20V, V.sub.REG=6V, and V.sub.IN is equal (or close to) V.sub.MAX, then the floating voltage range will be defined by V.sub.INTP≈20V and V.sub.INTN≈14V.
[0042] Alternatively, the floating supply circuit 220 may pull-down (i.e., float, regulate, set, etc.) the regulated voltage range to V.sub.MIN using the sinking current source 224 and the PMOS transistor 223. For example, if V.sub.CM<V.sub.GND (i.e., V.sub.MIN=V.sub.CM) then the PMOS transistor 223 and the sinking current source 224 will operate together (i.e., based on V.sub.MIN and V.sub.IN) to effectively pull (i.e., regulate, set, etc.) V.sub.INTN down to V.sub.MIN. After V.sub.INTN is set, then V.sub.INTP is regulated above V.sub.INTN. In other words, after V.sub.INTN is pulled down to V.sub.MIN, the regulation device 225 (e.g., biased by sourcing current source 222) regulates VINTP relative to V.sub.INTN by a regulated voltage rise (V.sub.REG). For example, if V.sub.GND=−20V, V.sub.REG=6V, and V.sub.IN is equal (or close to) V.sub.MIN, then the floating voltage range will be defined as V.sub.INTN≈−20V and V.sub.INTN≈−14V.
[0043] The internal power supply 200 self-regulates according to the voltage level (e.g., V.sub.CM) at the input of the core amplifier. This self-regulation is useful in accommodating a large range of voltages that includes both positive and negative voltages. The range of voltages may extend to voltages that are much higher than the devices in the LV core amplifier are rated. For example, V.sub.CM may be in a range of voltages that correspond to the limits of a device technology (e.g., −80V to +80V for devices with a maximum (e.g., V.sub.DS) rating of 80V), while the devices in the LV core amplifier are rated to receive less than the limits of the device technology (e.g., less than 10 volts). In other words, the fixed voltage range of an external power supply is smaller than the range of common-mode voltages, and the range of common-mode voltages is limited by a device technology, which may be selected as required. The internal power supply provides a consistent voltage level to the LV core amplifier even when V.sub.CM changes. This constant power corresponds to a voltage offset V.sub.OS of the LV core amplifier and is nearly constant as V.sub.CM varies. For example, V.sub.OS of a CSA amplifier implementation may have a maximum value of 2 millivolts (mV) over a full V.sub.CM range from −80V to +80V. Additionally, a power supply rejection ratio (i.e., PSRR) of the LV core amplifier in the CSA amplifier implementation may have a minimum value of 90 dB over the same range. The values of these parameters are similar to those expected from CSA amplifiers that utilize offset compensation techniques.
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[0047] The internal supply 200 shown in
[0048] The LV core amplifier 140 shown in
[0049] A first output stage 151 shown in
[0050] A second (i.e., final) output stage 152 shown in
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[0053] For the implementation shown in
[0054] The effect of the CSA gain on the floating voltage range is shown in
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[0056] In the specification and/or figures, typical embodiments have been disclosed. The present disclosure is not limited to such exemplary embodiments. The use of the term “and/or” includes any and all combinations of one or more of the associated listed items. Unless otherwise noted, specific terms have been used in a generic and descriptive sense and not for purposes of limitation. As used in this specification, a singular form may, unless definitely indicating a particular case in terms of the context, include a plural form.
[0057] It will be understood that, in the foregoing description, when an element, such as a component is referred to as being on, connected to, electrically connected to, coupled to, or electrically coupled to another element, it may be directly on, connected or coupled to the other element, or one or more intervening elements may be present. It will also be understood that, in the foregoing description, when a pair of voltages has constituent voltages described as positive or negative, this description is in reference to the relationship between the voltages in the pair and not necessarily in reference to the absolute value of each voltage. Likewise, when a terminal (i.e., connector, input) of a pair of terminals is described as positive or negative, this description is in reference to a voltage/current expected at the terminal in relation to the other terminal and not necessarily in reference to the absolute value of the voltage/current at the terminal.
[0058] Some implementations may be implemented using various semiconductor processing and/or packaging techniques. Some implementations may be implemented using various types of semiconductor processing techniques associated with semiconductor substrates including, but not limited to, for example, Silicon (Si), Gallium Arsenide (GaAs), Gallium Nitride (GaN), Silicon Carbide (SiC) and/or so forth.
[0059] While certain features of the described implementations have been illustrated as described herein, many modifications, substitutions, changes, and equivalents will now occur to those skilled in the art. It is, therefore, to be understood that the appended claims are intended to cover all such modifications and changes as fall within the scope of the implementations. It should be understood that they have been presented by way of example only, not limitation, and various changes in form and details may be made. Any portion of the apparatus and/or methods described herein may be combined in any combination, except mutually exclusive combinations. The implementations described herein can include various combinations and/or sub-combinations of the functions, components, and/or features of the different implementations described.