ASSEMBLY COMPRISING A CIRCUIT CARRIER AND A HEAT SINK

Abstract

An arrangement is provided comprising a circuit carrier and a heat sink. The circuit carrier has at least one arc-shaped curved region, and the heat sink also has at least one arc-shaped curved region. The arc-shaped curved region of the circuit carrier is either inwardly or outwardly curved, and the arc-shaped curved region of the heat sink is the opposite either outwardly or inwardly curved. The contour of the arc-shaped curved region of the circuit carrier corresponds to the contour of the arc-shaped curved region of the heat sink. The curved region of the heat sink and the curved region of the circuit carrier are connected to one another.

Claims

1. An assembly comprising: a circuit carrier having at least one first arc-shaped curved region; and a heat sink having at least one second arc-shaped curved region, wherein at least one of: the first arc-shaped curved region is inwardly curved and the second arc-shaped curved region is outwardly curved, such that a contour of the first arc-shaped curved region corresponds to a contour of the second arc-shaped curved region; and the first arc-shaped curved region is curved outwards and the second arc-shaped curved region is curved inwards, such that a contour of the first arc-shaped curved outwards region corresponds to a contour of the second arc-shaped curved outwards region; and wherein the second curved region and the first curved region are connected to one another.

2. The assembly according to claim 1, wherein the second arc-shaped curved region is outwardly curved with a first radius about an axis and the first arc-shaped curved region is inwardly curved with a second radius about the same axis.

3. The assembly according to claim 2, wherein the second radius is at least as large as the first radius.

4. The assembly according to claim 1, wherein the second arc-shaped curved region is outwardly curved and the first arc-shaped curved region is inwardly curved, and are connected to each other via a heat-conducting paste or a heat-conducting pad as a thermally conductive intermediate layer.

5. The assembly according to claim 1, wherein the second arc-shaped curved region is outwardly curved and the first arc-shaped curved region is inwardly curved, and are directly connected to each other.

6. The assembly in accordance with claim 1, further including at least one connecting element via which the heat sink and the circuit carrier are connected to one another outside the first arc-shaped curved region and the second arc-shaped curved region.

7. The assembly according to claim 6, wherein the connecting element is monolithically connected to the heat sink.

8. An electronic unit having an assembly in accordance with claim 1, wherein the electronic unit comprises conductor tracks which are arranged in the first arc-shaped curved region.

9. The electronic unit according to claim 8, further including components which are arranged on at least one side of the circuit carrier.

10. The electronic unit according to claim 9, further including there is a heat-conducting connection between at least one of the components and the heat sink.

11. A method for producing an assembly from a circuit carrier and a heat sink according to claim 1, the method comprising the steps of: applying a circuit carrier having an inwardly curving first arc-shaped curved region to an outwardly curved region of a heat sink having an outwardly curving second arc-shaped curved region and bent over the outwardly curved region of the heat sink; or bending a circuit carrier having an outwardly curving first arc-shaped curved region, and then pressing the circuit carrier to an inwardly curved region of a heat sink having an inwardly curving second arc-shaped curved region with the aid of a stamp.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Reference is now made more particularly to the drawings, which illustrate the best presently known mode of carrying out the invention and wherein similar reference characters indicate the same parts throughout the views:

[0017] FIG. 1 is a section through an arrangement according to the invention.

DETAILED DESCRIPTION OF THE DRAWINGS

[0018] The inventional arrangement shown in FIG. 1 shows a heat sink 1, a circuit carrier 2 and a thermally conductive intermediate layer 3. The thermally conductive intermediate layer is provided between the circuit carrier 2 and the heat sink.

[0019] Heat sink 1 can be an aluminium part, in particular an aluminium die-cast part, which is processed by cutting. Heat sink 1 has a region 10 which is curved outwards about an axis with a first radius and whose surface area corresponds to that of a half cylinder.

[0020] The thermally conductive intermediate layer 3 is applied to the outwardly curved area 10 of heat sink 1.

[0021] The circuit carrier 2, which is initially in the form of a plate, is bent over the outwardly curved region 10 of heat sink 1 and the intermediate layer 3 applied to it. This results in an inwardly curved region 20 which rests on the thermally conductive intermediate layer 3. In order to make it possible to bend the circuit carrier 2, the curved region 20 is thinner than the adjacent flat regions 21 of the circuit carrier 2.

[0022] Via the thermally conductive intermediate layer 3, the inwardly curved region 20 of the circuit carrier 2 and the outwardly curved region 10 of the heat sink 1 are thermally conductively connected.

[0023] Conductor tracks (not represented) are provided in the curved region 20 of the circuit carrier with which components which can be arranged on an upper of the two planar regions 21 and components which can be arranged on a lower of the two planar regions 21 connect to one another. The tracks as well as the curved area 21 of the circuit carrier are comparatively thin and have only a low mass and thus only a low heat capacity. At the same time, large currents are to be transferred via the conductor paths, which, due to the resistance of the conductor paths, generate a large amount of heat that could not be dissipated sufficiently quickly by the curved region 21 of the circuit carrier. However, since the curved area 21 is thermally conductively connected to the heat sink 1, it is possible to dissipate the large amounts of heat without damaging the circuit carrier, the tracks or components on the circuit carrier.

REFERENCE SIGN LIST

[0024] 1 heat sink
10 curved region of the heat sink
2 circuit carriers
20 curved region of the circuit carrier
21 planar region of the circuit carrier
3 thermally conductive intermediate layer