CHIP ATOMIC CLOCK MICROSYSTEM BASED ON NANO Y WAVEGUIDE

Abstract

The present invention discloses a chip atomic clock microsystem based on a nano Y waveguide, including a magnetic shielding portion, an optical system and a physical system. The optical system and the physical system are arranged in a magnetic shielding layer. The unique nano Y waveguide and nano vertical coupling gratings used in the optical system greatly improve the photoelectric conversion efficiency and a space utilization rate, and reduce the size of the atomic clock. In addition, especially the two-layer magnetic shielding design is adopted, which effectively improves the shielding effect. The chip atomic clock microsystem based on a nano Y waveguide according to the present invention has the advantages of being easy to mount, stable in performance, compact in structure, small in size, low in power consumption, long in service life and high in precision.

Claims

1. A chip atomic clock microsystem based on a nano Y waveguide, comprising a magnetic shielding portion (1), an optical system (2) and a physical system (4); wherein the magnetic shielding portion (1) comprises an external magnetic shielding housing (5) and an internal magnetic shielding housing (14), and the external magnetic shielding housing (5) is internally provided with a printed circuit board (PCB) (22); a voltage control module (8), a vertical cavity surface emitting laser (VCSEL) current control module (9), a radio frequency control module (10) and a temperature control module (12) are mounted on the PCB (22), and a panel below the internal magnetic shielding housing (14) is provided with outline openings of two nano vertical coupling gratings; the optical system (2) comprises a VCSEL (6), a micro-optical lens group (7) and a nano waveguide functional unit (3); the micro-optical lens group (7) comprises three lenses, namely an attenuation slice, a polarizer and a λ/4 wave plate; the nano waveguide functional unit (3) comprises a phase modulation unit (11), nano vertical coupling gratings (20) and a nano Y waveguide (21), the nano vertical coupling gratings (20) are respectively located at a bifurcated end and an end of the nano Y waveguide (21); the phase modulation unit (11) is located on one branch of the nano Y waveguide (21); the voltage control module (8) and the VCSEL current control module (9) are connected to the VCSEL (6), and the radio frequency control module (10) is connected to the phase modulation unit (11); the nano Y waveguide (21) is mounted and fixed on the PCB (22); the attenuation slice, the polarizer and the λ/4 wave plate are sequentially mounted on a PCB (22) bracket from top to bottom, and the VCSEL (6) is bonded on a space bracket above the attenuation slice; and the physical system (4) comprises photoelectric converters (15), C-field coils (16), polyimide insulation layers (17), ITOs (18) and an MEMS micro gas chamber (19); one C-field coil (16), one polyimide insulation layer (17) and one ITO (18) are sequentially arranged above the MEMS micro gas chamber (19) from top to bottom, and one ITO (18), one polyimide insulation layer (17) and one C-field coil (16) are sequentially arranged below the MEMS micro gas chamber (19) from top to bottom; the C-field coils (16) above the MEMS micro gas chamber (19) is provided with two photoelectric converters (15), the physical system (4) is arranged in the internal magnetic shielding housing (14), and the temperature control module (12) is connected to the ITO (18); and the outline openings of the panel below the internal magnetic shielding housing (14) are respectively clamped on the two nano vertical coupling gratings (20) at the bifurcated end of the nano Y waveguide (21).

2. The chip atomic clock microsystem based on a nano Y waveguide according to claim 1, wherein encapsulation steps are as follows: (1) the nano Y waveguide (21) is mounted and fixed above the PCB (22); (2) the attenuation slice, the polarizer and the λ/4 wave plate are sequentially mounted on the circuit board bracket from top to bottom; (3) the space bracket above the attenuation slice is provided with a pad of the VCSEL (6) and a pad of a thermistor, the VCSEL (6) and the thermistor are mounted on the space bracket, and the space bracket and the adjusted micro-optical lens group (7) are welded by using an indium wire to form a complete and fixed structure; (4) fixing of the MEMS micro gas chamber (19) to the ITO (18) and the polyimide insulation layer (17): the MEMS micro gas chamber, the ITO and a polyimide insulation layer optical path are aligned with each other by using the laser, and the MEMS micro gas chamber and these components are fixed together by ultraviolet curing glue; (5) after the above components are equipped, a PCB circuit and a chip of each control module are electrified and connected to an encapsulation tube base, and then all electrical connections therein are tested; (6) transmittance and a rubidium absorption curve of core components are tested; (7) when the transmittance and the rubidium absorption curve are good, the C-field coils (16) are mounted with ultraviolet curing glue; (8) conductive adhesive is applied to a slide of C-field coil, and the photoelectric converters (15) are fixed to the slide; (9) then the transmittance and the rubidium absorption curve are tested again; if the above tests are passed normally, vacuum encapsulation is performed by using the external magnetic shielding housing (5) and the internal magnetic shielding housing (14), and then the overall performance is tested.

3. The chip atomic clock microsystem based on a nano Y waveguide according to claim 1, wherein there is one turn of C-field coil (16), such that a current passing through the coil can be greatly reduced, thereby minimizing the power consumption of the physical encapsulation.

4. The chip atomic clock microsystem based on a nano Y waveguide according to claim 1, wherein the C-field coil (16), the polyimide insulation layer (17), the ITO (18) and the MEMS micro gas chamber (19) are each set into a rectangular sheet structure with the same size, which is favorable for alignment between layers and facilitates mounting; and the C-field coil (16) is a Helmholtz coil, which is matched with the shape of the MEMS micro gas chamber (19), thereby improving the performance of the chip atomic clock.

5. The chip atomic clock microsystem based on a nano Y waveguide according to claim 1, wherein the MEMS micro gas chamber (19) is implemented by using an anodic bonding process and is filled with buffer gas, and the buffer gas has functions of fluorescence quenching and narrowing of a spectral line width; and the buffer gas may be a mixed gas of N.sub.2 and argon, or a mixed gas of neon and argon.

6. The chip atomic clock microsystem based on a nano Y waveguide according to claim 1, further comprising a bottom plate (13) with supporting legs.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0023] FIG. 1 is a schematic diagram of overall encapsulation of a chip atomic clock microsystem with double optical paths based on a nano Y waveguide;

[0024] FIG. 2 is an exploded view of each part of a chip atomic clock microsystem with double optical paths based on a nano Y waveguide;

[0025] FIG. 3 is a schematic diagram of a nano waveguide functional unit; and

[0026] FIG. 4 is a schematic cross-sectional diagram of an MEMS micro gas chamber.

[0027] In the figures: 1. magnetic shielding portion, 2. optical system, 3. nano waveguide functional unit, 4. physical system, 5. external magnetic shielding housing, 6. internal magnetic shielding housing, 7. micro-optical lens group, 8. voltage control module, 9. VCSEL current control module, 10. radio frequency control module, 11. phase modulation unit, 12. temperature control module, 13. bottom plate, 14. internal magnetic shielding housing, 15. photoelectric converter, 16. C-field coil, 17. polyimide insulation layer, 18. ITO, 19. MEMS micro gas chamber, 20. nano vertical coupling grating, 21. nano Y waveguide, 22. PCB, 23. alkali metal atomic gas chamber, 24. glass, 25. Si, 26. .sup.87Rb atoms, 27. gas chamber microchannel, 28. reaction residue.

DESCRIPTION OF THE EMBODIMENTS

[0028] The present invention is further described below with reference to the accompanying drawings. In the drawings, the same parts are denoted by the same reference numerals.

[0029] FIGS. 1 and FIG. 2 are schematic diagrams of a physical encapsulation structure of a chip atomic clock microsystem based on a nano Y waveguide, mainly including a magnetic shielding portion 1, an optical system 2 and a physical system 4.

[0030] The magnetic shielding portion 1, namely an external magnetic shielding housing 5 and an internal magnetic shielding housing 14, are molded in one time by using a 3D printing technology and sealed by a welding process, such that they have good gas tightness and shielding performance, especially the inner and outer shielding design, which effectively improves the shielding effect. Especially, the height of the internal magnetic shielding housing 14 is matched with the height of the internal core component, and the top of the physical system 4 is connected to the internal magnetic shielding housing, which ensures that the mechanical structure of the internal system is not easy to break and separate and has good impact resistance.

[0031] The optical system 2 includes a VCSEL 6, a micro-optical lens group 7 and a nano waveguide functional unit 3. The VCSEL 6 is bonded to a space bracket above the micro-optical lens group 7 and configured to emit linearly polarized light, and the space bracket can provide a free space for the linearly polarized laser, and make the laser diverge to a predetermined light spot size. The micro-optical lens group 7 is composed of three lenses, namely an attenuation slice, a polarizer and a λ/4 wave plate. The attenuation slice is configured to attenuate light intensity, the polarizer is configured to determine the polarization direction of light, and the λ/4 wave plate is configured to convert the linearly polarized light into circularly polarized light. The attenuation slice, the polarizer and the λ/4 wave plate are welded and fixed with an indium wire to form an enclosed space inside, which reduces the heat loss caused by gas flow, so that a VCSEL current control module 9 and a temperature control module 12 can work independently and ensure the performance stability of the whole chip atomic clock. The nano waveguide functional unit 3 is composed of a phase modulation unit 11, nano vertical coupling gratings 20 and a nano Y waveguide 21. The functional unit divides, by using the nano vertical coupling grating 20 and the nano Y waveguide 21, the linearly polarized light emitted by the VCSEL 6 and the circularly polarized light converted after passing through the lens group 7 into two beams with the same intensity, one of which is used as reference light, the other beam enters the physical system 4 after passing through the phase modulation unit 11. After passing through the same detection unit, i.e., a photoelectric converter 15, the two beams enter a subtraction unit for subtraction to obtain a transition signal of the atomic clock.

[0032] The physical system 4 includes the photoelectric converter 15, C-field coils 16, polyimide insulation layers 17, ITOs 18 and an MEMS micro gas chamber 19. The constant and uniform C-field required for energy level splitting of atoms can be generated by a group of coils. In the present invention, there is one turn of C-field coil 16, such that a current passing through the coil can be greatly reduced, thereby minimizing the power consumption of the physical encapsulation. The polyimide insulation layer 17 reduces heat conduction and heat loss, thus reducing the overall power consumption of the chip atomic clock system. A thermistor is fixed on the ITO 18 by using a pad, the ITO 18 controls the heating of the MEMS micro gas chamber 19 by using the pad through the temperature control module 12, and the thermistor thereon can acquire temperature data at the same time and feed temperature signal data back to the temperature control module 12, so as to control the temperature of the MEMS micro gas chamber 19. The MEMS micro gas chamber 19 is implemented by using an anodic bonding process and is filled with .sup.87Rb atoms and buffer gas. The buffer gas has the functions of fluorescence quenching and narrowing of a spectral line width. The buffer gas may be a mixed gas of N.sub.2 and argon, or a mixed gas of neon and argon. The C-field coil 16, the polyimide insulation layer 17, the ITO 18 and the MEMS micro gas chamber 19 are each set into a rectangular sheet structure with the same size and are made of a transparent material, which is favorable for alignment between layers and facilitates mounting; and the C-field coil 16 is a Helmholtz coil, which is matched with the shape of the MEMS micro gas chamber 19, thereby improving the performance of the chip atomic clock.

[0033] The nano Y waveguide in the optical system 2 splits the light emitted by the VCSEL, and needs to be tightly connected to each optical path portion in the process of encapsulation of a physical portion, thus reducing the size of the chip atomic clock. In addition, the impact of optical power fluctuation and frequency fluctuation noise is also greatly reduced, and the adverse impact of background noise on short-term stability is also greatly weakened. The application of the nano vertical coupling grating 20 solves the problem of low photoelectric conversion transmission efficiency, improves the space utilization rate of the chip atomic clock, and achieves the purpose of small size and low power consumption of the chip atomic clock.

[0034] The overall encapsulation steps of the system are as follows.

[0035] (1) The nano Y waveguide 21 is mounted and fixed above the PCB 22; (2) the attenuation slice, the polarizer and the λ/4 wave plate are sequentially mounted on a bracket from top to bottom, and it should be particularly noted that an included angle between an optical axis of the λ/4 wave plate and a polar axis of the VCSEL is 45°, and the distance between the lenses is adjusted carefully; (3) encapsulation and electrical testing of the VCSEL system: a pad of the VCSEL 6 and a pad of a thermistor are fixed to the space bracket, the VCSEL 6 and the thermistor are mounted on the space bracket, and the space bracket and the adjusted micro-optical lens group 7 are welded by using an indium wire to form a complete and fixed structure; (4) fixing of the MEMS micro gas chamber 19 to the ITO 18 and the polyimide insulation layer 17: the MEMS micro gas chamber, the ITO and a polyimide insulation layer optical path are aligned with each other by using the laser, and the MEMS micro gas chamber and these components are fixed together by ultraviolet curing glue, that is, a small amount of glue solution is added dropwise on the surface of the gas chamber, and an area coated with the curing glue is irradiated with an ultraviolet lamp with a wavelength of 365 nm for solidification; (5) after the above core components are equipped, a PCB circuit and a chip of each control module are electrified and connected to an encapsulation tube base, and then all electrical connections therein are tested; (6) transmittance and a rubidium absorption curve of core components are tested; (7) when the transmittance and the rubidium absorption curve are good, the C-field coils 16 are mounted with ultraviolet curing glue; (8) an anode of the photoelectric converter 15 is on the back, and the photoelectric converters 15 are fixed to the slide; (9) then the transmittance and the rubidium absorption curve are tested again; if the above tests are passed normally, vacuum encapsulation is performed, and then the overall performance is tested.

[0036] It can be seen from the technical solution that in the present invention, the optimized design of miniaturization of the physical system under the condition of the existing micromachining technology is implemented.