Organic light emitting diode flexible array substrate with signal lines in different widths

Abstract

The present invention discloses an organic light emitting diode flexible array substrate including a displaying region, a folding region adjacent to the displaying region, a flexible substrate, barrier layer, a buffer layer, a polycrystalline layer stacked together, a first insulation layer disposed on the buffer layer and covering the polycrystalline layer, a first metal layer, a second metal layer, and a third metal layer. Folding signal lines are formed on a portion of the second metal layer in the folding region. Folding signal lines are formed on a portion of the third metal layer in the folding region. Double folding signal lines of the second metal layer and third metal layer drastically increase reliability and lifespan of the signal lines in the folding region.

Claims

1. An organic light emitting diode flexible array substrate, wherein the organic light emitting diode flexible array substrate comprises: a displaying region and a folding region located adjacent to the displaying region; a flexible substrate located in the displaying region and the folding region; a barrier layer disposed on the flexible substrate and located in the displaying region; a buffer layer disposed on the barrier layer and located in the displaying region; a polycrystalline layer disposed on the buffer layer and located in the displaying region; a first insulation layer disposed on the buffer layer, covering the polycrystalline layer, and located in the displaying region; a first metal layer disposed above the first insulation layer and located in the displaying region; a second insulation layer disposed above the first metal layer; a second metal layer disposed above the first insulation layer and located in the displaying region and the folding region, wherein a first plurality of folding signal lines are formed as a portion of the second metal layer in the folding region; a third insulation layer located above the second metal layer, wherein the third insulation layer at least comprises an organic material and an inorganic insulating material; and a third metal layer disposed above the first insulation layer and located in the displaying region and the folding region, wherein a second plurality of folding signal lines are formed as a portion of the third metal layer in the folding region; wherein a lower capacitor electrode plate and a plurality of flattened signal lines are formed as a portion of the second metal layer in the displaying region. wherein a width of each of the flattened signal lines of the second metal layer is less than a width of each of the folding signal lines of the second metal layer. wherein an interval of adjacent two of the flattened signal lines of the second metal layer is less than an interval of adjacent two of the folding signal lines of the second metal layer; wherein each folding signal line in the second metal layer is connected to a corresponding one of the flattened signal lines in the second metal layer through a transition line section with a width increasing gradually from the flattened signal line to the folding signal line.

2. The organic light emitting diode flexible array substrate as claimed in claim 1, wherein a width of each of the flattened signal lines of the third metal layer is less than a width of each of the folding signal lines of the third metal layer.

3. The organic light emitting diode flexible array substrate as claimed in claim 1, wherein an interval of adjacent two of the flattened signal lines of the third metal layer is less than an interval of adjacent two of the folding signal lines of the third metal layer.

4. The organic light emitting diode flexible array substrate as claimed in claim 1, wherein the folding signal lines of the second metal layer are formed on the first metal layer.

Description

DESCRIPTION OF DRAWINGS

(1) FIG. 1 is a top view of a conventional flexible display panel.

(2) FIG. 2 is a side view of the conventional flexible display panel in FIG. 1.

(3) FIG. 3 is a cross-sectional side view of an organic light emitting diode flexible array substrate of a first embodiment of the present invention.

(4) FIG. 4 is a partially enlarged top view of a second metal layer or a third metal layer of the present invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

(5) With reference to FIG. 3, an organic light emitting diode flexible array substrate of a first embodiment of the present invention includes a displaying region 100, a folding region 200 located adjacent to the displaying region 100, a flexible substrate 10, a barrier layer 20, a buffer layer 30, a polycrystalline layer 40, a first insulation layer 51, a first metal layer GE, a second insulation layer 52, a second metal layer SD1, a third insulation layer 53, a third metal layer SD2, at least one planarization layer 61, 62, a pixel definition layer 70, and an anode layer 80.

(6) The flexible substrate 10 is located in the displaying region 100 and the folding region 200. Furthermore, the flexible substrate 10 is made of polyimide.

(7) The barrier layer 20 is disposed on the flexible substrate 10 and is located in the displaying region 100.

(8) The buffer layer 30 is disposed on the barrier layer 20 and is located in the displaying region 100.

(9) The polycrystalline layer 40 is disposed on the buffer layer 30 and is located in the displaying region 100 .

(10) The first insulation layer 51 is disposed on the buffer layer 30, covers the polycrystalline layer 40, and is located in the displaying region 100.

(11) The first metal layer GE is disposed in the first insulation layer 51 and is located in the displaying region 100. Furthermore, signal lines are formed on the first metal layer GE.

(12) The second insulation layer 52 is disposed above the first metal layer GE.

(13) The second metal layer SD1 is disposed in the first insulation layer 51 and is located in the displaying region 100 and the folding region 200. A plurality of folding signal lines W2 are formed on a portion of the second metal layer SD1 in the folding region 200.

(14) The third metal layer SD2 is disposed on the first insulation layer 51 and is located in the displaying region 100 and the folding region 200. A plurality of folding signal lines W2 are formed on a portion of the third metal layer SD2 in the folding region 200.

(15) The planarization layer 61, 62 is disposed on the first insulation layer 51 and is located in the displaying region 100 and the folding region 200. Furthermore, the planarization layer 61, 62 can be two or more planarization layers 61, 62 stacked sequentially over each other.

(16) The pixel definition layer 70 is disposed on planarization layer 61, 62 and is located in the displaying region 100 and the folding region 200.

(17) The anode layer 80 is disposed on the planarization layer 61, 62, is located in the displaying region 100 and is connected electrically to the third metal layer SD2 through a vial holes.

(18) With reference to FIG. 4, In an embodiment of the present invention, a lower capacitor electrode plate and a plurality of flattened signal lines W1 are formed on a portion of the second metal layer SD1 in the displaying region 100. A Width of each of the flattened signal lines W1 of the second metal layer SD1 is less than a width of each of the folding signal lines W2 of the second metal layer SD1. an interval of adjacent two of the flattened signal lines W1 of the second metal layer SD1 is less than an interval of adjacent two of the folding signal lines W2 of the second metal layer SD1.

(19) The third insulation layer 53 is located above the second metal layer. The third insulation layer 53 at least includes an organic material and an inorganic insulating material.

(20) With reference to FIG. 4, In an embodiment of the present invention, an upper capacitor electrode plate and a plurality of flattened signal lines W1 are formed on the portion of the third metal layer SD2 in the displaying region 100. The upper capacitor electrode plate corresponds to the upper capacitor electrode plate. In an embodiment of the present invention, a width of each of the flattened signal lines W1 of the third metal layer SD2 is less than a width of each of the folding signal lines W2 of the third metal layer SD2. In an embodiment of the present invention, an interval of adjacent two of the flattened signal lines W1 of the third metal layer SD2 is less than an interval of adjacent two of the folding signal lines W2 of the third metal layer SD2.

(21) In an embodiment of the present invention, the first insulation layer 51 is an inorganic insulation layer including silicon oxide, silicon nitride, etc. The second insulation layer 52 can be an inorganic film layer located in the flattened region 100. In the folding region 200, the second insulation layer 52 is entirely removed.

(22) In an embodiment of the present invention, first insulation layer 51 an inorganic insulation layer including silicon oxide, silicon nitride, etc. The second insulation layer 52 can be a stacked structure of an organic film layer and an inorganic film layer. The organic film layer is located in the flattened region 100 and the folding region 200. The inorganic film layer is located in the flattened region 100. In the folding region 200, the inorganic film layer is entirely removed.

(23) In an embodiment of the present invention, the third insulation layer 53 is located above the second metal layer SD2. The third insulation layer 53 at least includes an organic film layer and an inorganic film layer. The organic film layer is located in the flattened region 100 and the folding region 200. The inorganic film layer is located in the flattened region 100. In the folding region 200, the inorganic film layer is entirely removed.

(24) Compared to the prior art, the present invention organic light emitting diode flexible array substrate has advantages as follows.

(25) 1. The present invention disposes the folding signal lines W2 of the second metal layer SD1 and the third metal layer SD2 in the folding region 200, which can increase strength and reliability of the signal lines in the folding region 200.

(26) 2. The folding signal lines W2 of the second metal layer SD1 and third metal layer SD2 extend respectively from the lower capacitor electrode plate and the upper capacitor electrode plate in the displaying region 100, instead of additional metal layers, therefore only one yellow light etching process is required to for simultaneously manufacturing the lower capacitor electrode plate, the upper capacitor electrode plate and the second metal layer SD1 and third metal layer SD2. Thus, the present invention can achieve double layers of signal lines of the folding region 200 without an additional process.

(27) 3. The folding signal lines W2 of the second metal layer SD1 and the third metal layer SD2 in the folding region 200, compared to the flattened signal lines in the displaying region 100, adequately increases a width of the lines and an interval between the lines, which makes the folding region 200 obtain better anti-folding effect.