Precipitation-hardening Ag—Pd—Cu—In—B alloy

Abstract

A precipitation-hardening alloy, including 17 to 23.6 at % of Ag, 0.5 to 1.1 at % of B, and a total of 74.9 to 81.5 at % of Pd and Cu, wherein the at % ratio of the Pd and Cu is 1:1 to 1:1.2, and the rest includes In and inevitable impurities. This provides an alloy with good overall balance, having all of maintaining low specific resistance, at least almost equal to that of conventional Ag—Pd—Cu alloys, and also having contact resistance stability (oxidation resistance), good plastic workability, and higher hardness than before.

Claims

1. A quinary precipitation-hardening Ag—Pd—Cu—In—B alloy, consisting essentially of 17 to 23.6 at % of Ag, 0.5 to 1.1 at % of B, and a total of 74.9 to 81.5 at % of Pd and Cu, wherein an at % ratio of the Pd and Cu is 1:1 to 1:1.2, and a rest comprises In and inevitable impurities.

2. The quinary precipitation-hardening Ag—Pd—Cu—In—B alloy according to claim 1, characterized by being applied to electric and electronic equipment.

3. The quinary precipitation-hardening Ag—Pd—Cu—In—B alloy according to claim 1, characterized by being applied to contact probe pins.

4. The quinary precipitation-hardening Ag—Pd—Cu—In—B alloy according to claim 1, characterized in that Vickers hardness is 515 HV or more.

5. The quinary precipitation-hardening Ag—Pd—Cu—In—B alloy according to claim 4, characterized by being applied to electric and electronic equipment.

6. The quinary precipitation-hardening Ag—Pd—Cu—In—B alloy according to claim 4, characterized by being applied to contact probe pins.

7. The quinary precipitation-hardening Ag—Pd—Cu—In—B alloy according to claim 4, characterized in that specific resistance is 15 μΩ cm or less.

8. The quinary precipitation-hardening Ag—Pd—Cu—In—B alloy according to claim 7, characterized by being applied to electric and electronic equipment.

9. The quinary precipitation-hardening Ag—Pd—Cu—In—B alloy according to claim 7, characterized by being applied to contact probe pins.

10. The quinary precipitation-hardening Ag—Pd—Cu—In—B alloy according to claim 7, characterized by having a crystal grain size of 1.0 μm or less and a metallographic structure having uniformly distributed intermetallic compounds.

11. The quinary precipitation-hardening Ag—Pd—Cu—In—B alloy according to claim 10, characterized by being applied to electric and electronic equipment.

12. The quinary precipitation-hardening Ag—Pd—Cu—In—B alloy according to claim 10, characterized by being applied to contact probe pins.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is an SEM image of the cross-sectional structure of a solution-treated material in Example (No. 4).

(2) FIG. 2 is an SEM image of the cross-sectional structure of a solution-treated material in Comparative Example (No. 20).

(3) FIG. 3 is an SEM image of the cross-sectional structure of a solution-treated material in Comparative Example (No. 21).

(4) FIG. 4 is an SEM image of the cross-sectional structure of a precipitation-hardened material in Example (No. 4).

(5) FIG. 5 is an SEM image of the cross-sectional structure of a precipitation-hardened material in Comparative Example (No. 20).

(6) FIG. 6 is an SEM image of the cross-sectional structure of a precipitation-hardened material in Comparative Example (No. 21).

(7) FIG. 7 is an explanatory drawing showing a relationship between Vickers hardness and specific resistance of the cross-section of precipitation-hardened materials according to the present invention.

(8) FIG. 8 is an explanatory drawing showing a relationship between Vickers hardness and specific resistance of the cross-section of precipitation-hardened materials according to the present invention.

MODE FOR CARRYING OUT THE INVENTION

(9) Examples and Comparative Examples of precipitation-hardening Ag—Pd—Cu—In—B alloys in the present invention will now be described with reference to the drawings.

EXAMPLES

(10) Ag, Pd, Cu, In and B were blended so that various target compositions were obtained, followed by high frequency melting to produce an ingot (Φ15 mm×L 100 mm). The composition in each of Examples and Comparative Examples (CE for short) is shown in Table 1. It should be noted that Comparative Examples 19 and 20 show the compositions of conventional Ag—Pd—Cu alloys, and Comparative Example 21 shows the composition of a conventional Ag—Pd—Cu—In alloy.

(11) In and inevitable impurities, the rest in the component composition, were shown as Balance (Bal.) by quantitative analysis of various compositions.

(12) It should be noted that the method for producing an ingot according to the present invention is not limited to high frequency melting, and any melting method developed presently and in the future such as gas melting, an electric furnace, vacuum melting, continuous casting or one melting can be applied to the present invention.

(13) TABLE-US-00001 TABLE 1 Compositions (at %) In and Total of Inevitable Pd and Cu At % ratio of No. Ag Pd Cu B impurities (at %) Pd and Cu Examples 1 19.00 44.10 35.30 0.80 Bal. 79.40 1:0.8  2 19.00 37.99 41.41 0.80 Bal. 79.40 1:1.09 3 19.00 39.70 39.70 0.80 Bal. 79.40 1:1   4 19.00 37.40 42.00 0.80 Bal. 79.40 1:1.12 5 19.00 36.93 42.47 0.80 Bal. 79.40 1:1.15 6 19.00 36.10 43.30 0.80 Bal. 79.40 1:1.20 7 19.00 33.10 46.30 0.80 Bal. 79.40 1:1.40 8 17.00 40.73 40.73 0.75 Bal. 81.46 1:1   9 20.00 39.23 39.23 0.75 Bal. 78.46 1:1   10 23.58 37.45 37.45 0.75 Bal. 74.90 1:1   11 15.00 41.73 41.73 0.75 Bal. 83.46 1:1   12 22.64 32.20 40.45 3.96 Bal. 72.65 1:1.26 13 23.13 32.67 41.03 2.41 Bal. 73.70 1:1.26 14 23.38 32.91 41.33 1.62 Bal. 74.24 1:1.26 15 23.50 33.03 41.48 1.22 Bal. 74.51 1:1.26 16 20.50 38.75 38.75 0.50 Bal. 77.50 1:1   17 17.40 40.50 40.50 1.10 Bal. 81.00 1:1   18 17.00 40.50 40.50 1.50 Bal. 81.00 1:1   CE 19 20.00 40.00 40.00 — — 80.00 1:1   20 24.70 33.40 41.90 — — 75.30 1:1.25 21 23.90 33.40 41.90 — Bal. 75.30 1:1.25

(14) Subsequently, melting defects such as shrinkage of the above ingot were removed, and plastic working was then carried out by wire drawing until a predetermined size (Φ1.0 mm). After that, heating was carried out in a reducing atmosphere (a mixed atmosphere of H.sub.2 and N.sub.2) at 800° C. for 60 min, and water cooling was carried out to ambient temperature for solution treatment to obtain a solution-treated material.

(15) It should be noted that the plastic working method of the present invention is not limited to wire drawing, and various plastic working methods can be applied alone or in combination depending on desired characteristics and shapes. Examples thereof include rolling, groove rolling and swaging and the like.

(16) The observation results of the cross-sectional structure of the above solution-treated material by SEM (Scanning Electron Microscope) are shown in FIGS. 1 to 3.

(17) Subsequently, the above solution-treated material was subjected to wire drawing to evaluate plastic workability.

(18) It should be noted that the plastic working method for a solution-treated material according to the present invention is not limited to wire drawing, and various plastic working methods can be applied alone or in combination depending on desired characteristics and shapes. Examples thereof include rolling, groove rolling and swaging and the like.

(19) The evaluation of plastic workability of a solution-treated material is defined as:
Reduction in area (%)=[(cross-sectional area before plastic working−cross-sectional area after plastic working)/cross-sectional area before plastic working]×100,
and was made by examining a reduction in area until e.g. cracks or ruptures are caused at the time of wire drawing.

(20) Specifically, samples with a reduction in area of less than 50% as plastic working, those with a reduction in area of 50% or more and less than 75%, and those with a reduction in area of 75% without e.g. cracks or ruptures were evaluated as C, B and A, respectively. Plastic workability in each of Examples and Comparative Examples (CE for short) is shown in Table 2. It should be noted that Examples and Comparative Examples are distinguished by numbers, and shown in Table 2 in a form corresponding to Table 1.

(21) TABLE-US-00002 TABLE 2 Vickers Specific hardness resistance Plastic Comprehensive No. (HV) (μΩ .Math. cm) workability evaluation Examples 1 379 22.0 A F 2 555 12.6 A P 3 538 12.8 A P 4 564 13.0 A P 5 539 14.0 A P 6 520 15.0 A P 7 464 22.0 A F 8 545 13.1 A P 9 527 13.0 A P 10 515 14.0 A P 11 474 15.0 A F 12 475 22.0 C F 13 470 20.0 C F 14 480 17.0 B F 15 485 15.0 B F 16 545 14.6 A P 17 520 15.0 A P 18 448 27.0 B F CE 19 393 16.0 A F 20 455 13.0 A F 21 484 16.0 A F

(22) From Table 2, the evaluation of A, equivalent to plastic workability of the Ag—Pd—Cu alloys and Ag—Pd—Cu—In alloy, conventional alloys, is obtained in the specific composition region of the present invention.

(23) It should be noted that in order to compare and evaluate the present invention and Comparative Examples under the same conditions, the reduction in area is 75%, which can be suitably used for contact probe pin application, in Table 2; however, the reduction in area can be increased or reduced from 0 to 99.5% depending on desired characteristics such as hardness in the present invention.

(24) Subsequently, a solution-treated material was completely subjected to precipitation hardening to precipitate inter metallic compounds, precipitates, by heating at 360° C. for 60 min in a reducing atmosphere (a mixed atmosphere of H.sub.2 and N.sub.2) after wire drawing. The obtained precipitation-hardened material can be suitably used for electric and electronic equipment application or contact probe pin application.

(25) It should be noted that the implementation and degree of precipitation hardening for the precipitation-hardening alloy of the present invention can be properly adjusted depending on desired characteristics.

(26) The observation results of the cross-sectional structure of the above precipitation-hardened material by SEM (Scanning Electron Microscope) are shown in FIGS. 4 to 6. In addition, the Vickers hardness (test load 0.2 kg) and specific resistance of precipitation-hardened materials in Examples and Comparative Examples are also shown in Table 2. The specific resistance of precipitation-hardened materials was calculated from the actual size of the precipitation-hardened materials by measuring a resistance value by the four-terminal method using a digital multi-meter.

(27) From Table 2, it could be verified that both low specific resistance, 15 μΩ.Math.cm or less, which is not a practical problem, and high hardness, a Vickers hardness of 515 HV or more, could be obtained in the specific composition region of the present invention compared to those of Ag—Pd—Cu alloys and Ag—Pd—Cu—In alloy, conventional alloys.

(28) The oxidation resistance of the above precipitation-hardened materials was evaluated. As the method for evaluating oxidation resistance, a precipitation-hardened material was retained in a high temperature atmosphere, 150° C., using a thermostat for 24 hours, the surface of the precipitation-hardened material was observed with naked eyes and using an electronic microscope after testing, and changes in color (change in quality of oxides and other substances) were examined. Furthermore, changes in specific resistance of the precipitation-hardened material were examined before and after the testing.

(29) As a result, it could be verified that changes in color were not caused, specific resistance was not changed, and good oxidation resistance was obtained under high temperature environment in all of the Examples and Comparative Examples of the present invention.

(30) Furthermore, when the cross-sectional structures of the solution-treated materials in FIGS. 1 to 3 and the precipitation-hardened material s in FIGS. 4 to 6 were compared, coarse crystal grains caused at the time of solution treatment remained even after precipitation hardening and a heterogeneous metallographic structure is obtained in conventional ternary precipitation-hardening Ag—Pd—Cu alloys and quaternary precipitation-hardening Ag—Pd—Cu—In alloy (FIG. 2 and FIG. 5, and FIG. 3 and FIG. 6).

(31) When coarse crystal grains remaining in these precipitation-hardened materials of the alloys were examined, crystal grains with a largest grain size of 5 μm remained. It should be noted that the largest crystal grain size was found by observing cross-sectional structures at optional 5 sites of a precipitation-hardened material by SEM (Scanning Electron Microscope) with a magnification of 10000 times and measuring the long diameter of crystals existing in each observation area.

(32) In the quinary precipitation-hardening Ag—Pd—Cu—In—B alloy of the present invention, meanwhile, coarse crystal grains not including an intermetallic compound do not exist in the metallographic structure thereof, and the metallographic structure having homogeneously precipitated intermetallic compounds throughout the alloy could be verified (FIG. 1 and FIG. 4).

(33) Furthermore, when crystal grains remaining in a precipitation-hardened material in the specific composition region of the invention of the present application were examined in the same manner as above, it could be verified that the largest grain size was 1.0 μm and an extremely minute homogeneous metallographic structure having uniformly distributed intermetallic compounds was obtained.

(34) Such phenomenon is a phenomenon verified for the first time in the specific composition region of the present invention.

(35) For this unique phenomenon it is thought, that because the generation of intermetallic compounds is promoted in the specific composition region of the present invention compared to that or conventional alloys, a homogeneous minute metallographic structure is obtained and both higher hardness and low specific resistance can be maintained by such metallographic structure.

(36) It is thought that precipitates in the present invention include at least one or more intermetallic compounds having at least two elements selected from the group of Ag, Pd, Cu, in and B.

(37) FIG. 7 shows a relationship between Vickers hardness and specific resistance of the cross-section of precipitation-hardened materials in Examples (No. 1 to No. 7) in Table 2.

(38) From FIG. 7, it could be verified that both high hardness, 515 HV or more, and low specific resistance, 15 μΩ.Math.cm or less, could be obtained only in the specific composition region of the present invention.

(39) FIG. 8 shows a relationship between Vickers hardness and specific resistance of the cross-section of precipitation-hardened materials when the at % ratio of Pd and Cu is fixed to 1:1 and moreover the Ag content is changed in Examples (No. 3, No. 8 to No. 11) in Table 2.

(40) When Examples (in FIG. 8) and Comparative Examples (No. 20-21) were compared, it could be verified that both higher hardness, 515 HV or more, and low specific resistance, 15 μΩ.Math.cm or less, could be obtained in the specific composition region of the present invention even when the Ag content was changed.

(41) Here, the comprehensive evaluation of each Example is carried out. As the evaluation method, only particularly good cases of Examples, meeting all of the 4 conditions of a specific resistance of 15 μΩ.Math.cm or less, plastic workability with a reduction in area of 75% or more, a Vickers hardness of 515 HV or more, and contact resistance stability (oxidation resistance) under high temperature environment, are evaluated as pass and shown by P in Table 2, and the other cases are evaluated as fail and shown by F in Table 2.

(42) From the above results it could be verified that a material for contact probe pins with good overall balance, having al of low specific resistance (15 μΩ.Math.cm or less), plastic workability (a reduction in area of 75% or more), and contact resistance stability (oxidation resistance) at least almost equal to those of previous alloys, and higher hardness (515 HV or more) than before in the specific composition region of the present invention, could be provided. It, could be also verified that a material for electric and electronic equipment (e.g. a connector, a terminal, an electrical contact) having these characteristics could be provided.

(43) It should be noted that the embodiment of the present invention is not limited to the above embodiment, and can be properly adjusted depending on target shapes, sizes and characteristics.