Battery protection circuit package and method of fabricating the same

Abstract

A method of fabricating a battery protection circuit package according to one aspect of the present invention includes forming a first mounting structure by mounting battery protection circuit elements on a printed circuit board (PCB), forming a second mounting structure by mounting the first mounting structure on a lead frame which comprises an input/output terminal portion for external connection and at least one metal tab for battery cell connection, forming an encapsulation structure by encapsulating the second mounting structure with a molding material to encapsulate at least a part of the battery protection circuit elements while exposing the input/output terminal portion and the at least one metal tab of the lead frame, and bonding at least one flexible printed circuit board (FPCB) to the input/output terminal portion of the encapsulation structure.

Claims

1. A method of fabricating a battery protection circuit package, the method comprising: forming a first mounting structure by mounting battery protection circuit elements on a printed circuit board (PCB); forming a second mounting structure by mounting the first mounting structure on a lead frame which comprises an input/output terminal portion for external connection and at least one metal tab for battery cell connection; forming an encapsulation structure by encapsulating the second mounting structure with a molding material to encapsulate at least a part of the battery protection circuit elements while exposing the input/output terminal portion and the at least one metal tab of the lead frame; and bonding at least one flexible printed circuit board (FPCB) to the input/output terminal portion of the encapsulation structure.

2. The method of claim 1, wherein the forming of the first mounting structure comprises mounting the battery protection circuit elements on the PCB using a surface mounting technology (SMT).

3. The method of claim 1, wherein the at least one metal tab comprises at least one metal tap formed to protrude from a side of the lead frame.

4. The method of claim 3, wherein the lead frame and the at least one metal tab are integrally formed.

5. The method of claim 4, wherein the lead frame and the at least one metal tab are made of copper (Cu) or nickel (Ni).

6. The method of claim 1, wherein the input/output terminal portion comprises at least one pair of input/output terminal portions disposed at both ends of the lead frame and the lead frame may further include at least one current path portion that extends in a longitudinal direction to connect the pair of input/output terminal portions and is connected to input/output pads of the PCB to allow current flow through the PCB and parallel current flow.

7. The method of claim 6, wherein the at least one current path portion comprises one pair of current path portions spaced apart from each other and the at least one pair of input/output terminal portions comprise two pairs of input/output terminal portions connected to ends of the one pair of current path portions.

8. The method of claim 1, wherein the forming of the second mounting structure comprises mounting the first mounting structure on the lead frame using an SMT.

9. The method of claim 1, further comprising, prior to the encapsulating, underfilling at least a part of junctions of the battery protection circuit elements mounted on the PCB with an epoxy.

10. The method of claim 1, wherein the bonding comprises bonding a pair of FPCBs to both ends of the lead frame of the second mounting structure.

11. The method of claim 1, further comprising, after the bonding, bending at least a part of the FPCB.

12. A battery protection circuit package comprising: a lead frame configured to comprise an input/output terminal portion for external connection and at least one metal tab for battery cell connection; a printed circuit board (PCB) mounted on the lead frame; battery protection circuit elements mounted on the PCB; a molding material configured to encapsulate at least a part of the battery protection circuit elements while exposing the input/output terminal portion and the at least one metal tab of the lead frame; and at least one flexible printed circuit board (FPCB) bonded to the input/output terminal portion of the lead frame.

13. The battery protection circuit package of claim 12, wherein the input/output terminal portion comprises at least one pair of input/output terminal portions disposed at each ends of the lead frame and the lead frame may further include at least one current path portion which extends in a longitudinal direction to connect the one pair of input/output terminal portions and is connected to input/output pads of the PCB to allow current flow through the PCB and parallel current flow.

14. The battery protection circuit package of claim 13, wherein the at least one current path portion comprises one pair of current path portions spaced apart from each other and the at least one pair of input/output terminal portions comprise two pairs of input/output terminal portions connected to ends of the one pair of current path portions.

15. The battery protection circuit package of claim 13, wherein the at least one FPCB comprises one pair of FPCBs bonded to the at least one pair of input/output terminal portions disposed at both ends of the lead frame.

16. The battery protection circuit package of claim 12, wherein at least a part of junctions of the battery protection circuit elements mounted on the PCB is underfilled with an epoxy and then is encapsulated by the molding material.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a schematic diagram illustrating a battery protection circuit package and a method of fabricating the same according to an embodiment of the present invention.

(2) FIG. 2 is a schematic diagram illustrating a battery protection circuit package and a method of fabricating the same according to an embodiment of the present invention.

(3) FIG. 3 is a schematic diagram illustrating a battery protection circuit package and a method of fabricating the same according to an embodiment of the present invention.

(4) FIG. 4 is a schematic diagram illustrating a battery protection circuit package and a method of fabricating the same according to an embodiment of the present invention.

(5) FIG. 5 is a schematic diagram illustrating a battery protection circuit package and a method of fabricating the same according to an embodiment of the present invention.

(6) FIG. 6 is a schematic diagram illustrating a battery protection circuit package and a method of fabricating the same according to an embodiment of the present invention.

(7) FIG. 7 is a schematic diagram illustrating a battery protection circuit package and a method of fabricating the same according to an embodiment of the present invention.

(8) FIG. 8 is a schematic cross-sectional view showing a battery protection circuit package according to an embodiment of the present invention.

(9) Throughout the drawings and the detailed description, unless otherwise described, the same drawing reference numerals will be understood to refer to the same elements, features, and structures. The relative size and depiction of these elements may be exaggerated for clarity, illustration, and convenience.

REFERENCE NUMERALS

(10) 102: PCB

(11) 104: BATTERY PROTECTION CIRCUIT ELEMENT

(12) 112: PCB

(13) 114: METAL TAB

(14) 122: MOLDING MATERIAL

(15) 140: FPCB

DETAILED DESCRIPTION

(16) The invention is described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure is thorough, and will fully convey the scope of the invention to those skilled in the art. Moreover, in the drawings, the dimensions of layers and regions may be exaggerated for clarity of illustration.

(17) Throughout the specification, it will also be understood that when an element such as layer, region, or substrate is referred to as being “on”, “connected to”, “stacked” or “coupled with” another element, then the element can be directly on, connected to, stacked, or coupled with the other element, and/or intervening elements may be present. In contrast, when an element is referred to as being “directly on”, “directly connected to”, “directly stacked” or “directly coupled with” another element, it will be understood that there are no intervening elements. Like reference numerals denote like elements. As used herein the term “and/or” includes any and all combinations of one or more of the associated listed items.

(18) Although the terms first, second, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not necessarily be limited by such terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer, or section discussed below could be termed a second element, component, region, layer, or section without departing from the teachings of the present invention.

(19) Furthermore, relative terms such as “below,” “lower,” “above,” and “upper” may be used herein to describe one element's relationship to another element as illustrated in the accompanying drawings. Such relative terms are intended to encompass different orientations of illustrated technologies in addition to the orientation depicted in the accompanying drawings. For example, if a device in the accompanying drawings were turned over, then the elements described as being on the “lower” side of other elements would then be oriented on “upper” sides of the other elements. Similarly, if the device in one of the drawings were turned over, elements described as “below” or “beneath” other elements would then be oriented “above” the other elements. Therefore, the example terms “below” and “lower” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

(20) The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

(21) Embodiments of the invention are described herein with reference to schematic illustrations of idealized embodiments of the invention. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, embodiments of the invention should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing.

(22) FIGS. 1 to 7 are schematic diagrams illustrating a battery protection circuit package and a method of fabricating the same according to an embodiment of the present invention.

(23) Referring to FIG. 1, battery protection circuit elements 104 may be mounted on a printed circuit board (PCB) 102 to form a first mounting structure 110.

(24) For example, the PCB 102 may include a structure which is a rigid substrate structure in which a circuit pattern is formed on a core structure. In addition, the PCB 102 may include via electrodes penetrating the inside thereof to electrically connect the battery protection circuit elements 104 mounted on an upper portion of the PCB 102 to a bottom portion. Furthermore, the PCB 102 may further include a wiring pattern or a pad pattern for rewiring the via electrodes.

(25) The battery protection circuit elements 104 may include elements for protecting the battery during operation of the battery, for example, charging and discharging operation. For example, the battery protection circuit elements 104 may include at least one transistor, for example, a field effect transistor (FET), a protection integrated circuit (IC), and passive elements.

(26) The protection IC may control the on/off operation of the FET to monitor the voltage and control the charging or discharging operation. For example, the protection IC may turn off the FET when the protection IC detects an overcurrent or an overdischarge state during a battery discharge process or detects an overcurrent or an overcharge state during a battery charge process. The passive elements may include at least one resistor and at least one capacitor.

(27) For example, an operation of forming the first mounting structure 110 may include mounting the battery protection circuit elements 104 on the PCB 102 using a surface mounting technology (SMT). The SMT may refer to a technology of attaching parts to a surface of the PCB 102. Therefore, the battery protection circuit elements 104 may be attached to the circuit pattern on the surface of the PCB 102 using the SMT. For example, the battery protection circuit elements 104 may be attached to the circuit pattern on the surface of the PCB 102 using soldering technique.

(28) Referring to FIGS. 2 and 3, the first mounting structure 110 may be mounted on a lead frame 112 to form a second mounting structure 120.

(29) After the first mounting structure 110 is disposed on the lead frame 112 having a metal tab 114 as shown in FIG. 2, the first mounting structure 110 may be mounted on the lead frame 112 using the SMT, as shown in FIG. 3. For example, the first mounting structure 110 may be attached to a surface of the lead frame 112 using a soldering technique. Thereafter, optionally, a deflux process may be added to remove solder flux.

(30) In the present embodiment, the battery protection circuit elements 104 may not be directly connected to the lead frame 112, but may be mounted on the PCB 102 and then connected to the lead frame 112 through the PCB 102.

(31) For example, the lead frame 112 may include an input/output terminal portion 116 for external connection and at least one metal tab 104 for battery cell connection. Furthermore, the input/output terminal portion 116 may include at least one pair of input/output terminal portions 116 disposed at both ends of the lead frame 112.

(32) The lead frame 112 may include at least one current path portion 118 that extends in the longitudinal direction to connect the pair of input/output terminal portions 116 and is connected to the input/output pads of the PCB 102 to allow current flow through the PCB 102 and parallel current flow. Furthermore, a pair of current path portions 118 may be formed to be spaced apart from each other, and two pairs of input/output terminal portions 116 may be connected to ends of the pair of current path portions 118.

(33) The input/output pads of the PCB 102 may be connected on the current path portions 118, and these input/output pads may be connected to each other through internal wiring of the PCB 102, and at the same time, connected in parallel through the current path portions 118 of the lead frame 112. This allows parallel current flow, which may reduce internal resistance.

(34) For example, the metal tab 114 for battery cell connection may be formed to protrude from the side of the lead frame 112. Moreover, the lead frame 112 and the metal tab 114 may be integrally formed. For example, the lead frame 112 and the metal tab 114 may be formed of the same metal material, for example, copper (Cu) or nickel (Ni). The metal tab 114 may be used when the lead frame 112 is connected to an external device, and may be electrically connected to the external device through such a method as soldering, laser welding, or the like.

(35) FIG. 4 is a partial cross-sectional view of the second mounting structure 120 for showing a fabrication process in accordance with some embodiments of the present invention.

(36) Referring to FIG. 4, before encapsulation of the second mounting structure 120, an operation of underfilling at least a part of junctions of the battery protection circuit elements 104 mounted on the PCB 102 may be provided.

(37) For example, an underfill process may be performed by filling an epoxy 108 between the battery protection circuit elements 104 and the PCB 112 so as to cover solders 106 that bond the battery protection circuit elements 104 and the PCB 102. For example, an underfill process may be performed with the epoxy 108 to cover the field effect transistor (FET) and the solders 106 of the protection integrated circuit among the battery protection devices 104.

(38) Through the underfill process, bonding reliability between the battery protection circuit elements 104 and the PCB 112 may be increased, and furthermore, defects, such as cracks, may be prevented.

(39) Referring to FIG. 5, at least a part of the battery protection circuit elements 104 may be encapsulated with a molding material 122 to form a encapsulation structure 130.

(40) For example, a encapsulation structure may be formed by encapsulating the second mounting structure 120 with a molding material to encapsulate at least a part of the battery protection circuit elements 104 while exposing the input/output terminal portion 116 and the metal tab 114 of the lead frame 112.

(41) For example, the molding material 122 may cover the exposed portions of the battery protection circuit elements and further cover the side surfaces of the PCB 102 and the lead frame 112. Furthermore, the molding material 122 may cover a part of a lower surface of the lead frame 112.

(42) For example, the molding material 122 may be formed of an epoxy molding compound (EMC) using such a method as transfer molding or insert molding.

(43) Optionally, an electrical specification test may be conducted on the molding structure 130 to verify the reliability.

(44) Referring to FIGS. 6 to 7, an operation of bonding at least one flexible printed circuit board (FPCB) 140 to the encapsulation structure 130 may follow.

(45) For example, as shown in FIG. 6, a pair of FPCBs 140 may be disposed on the exposed input/output terminal portions 116 of the encapsulation structure 130. More specifically, the FPCBs 140 may be disposed on the input/output terminal portions 116 on a lower surface of both ends of the lead frame 112 exposed from a encapsulating material 122 in the encapsulation structure 130 and may be bonded on the input/output terminal portions 116 of the lead frames 112 using an SMT to form a battery protection circuit package 150.

(46) Optionally, an insulating coating may follow to insulate a solder exposed portions of the FPCBs 140.

(47) Optionally, an electrical specification test may be added and be followed by a packing operation.

(48) FIG. 8 is a schematic cross-sectional view showing a battery protection circuit package 150 according to an embodiment of the present invention.

(49) Referring to FIG. 8, the battery protection circuit package 150 may include a lead frame 112 including an input/output terminal portion 116 for external connection and at least one metal tab 114 for battery cell connection, a PCB 102 mounted on the lead frame 112, battery protection circuit elements 104 mounted on the PCB 102, a molding material 122 encapsulating at least a part of the battery protection circuit elements 104, and at least one FPCB 140 bonded to the lead frame 112.

(50) As described above, a pair of FPCBs 140 may be bonded on the input/output terminal portions 116 exposed from the molding material 122 at both ends of the lead frame 112.

(51) According to embodiments of the present invention, since the PCB 102 is mounted directly on the lead frame 112 without being directly connected to the outside, the PCB 102 may be made thinner than the conventional PCB. For example, a signal transmission pattern and a component pad may be configured on the PCB 102, and a power pattern may be configured on the lead frame 112.

(52) According to this structure, it is possible to separate the rigid PCB 102 and the FPCB 112 and to minimize the thickness of the PCB 102, thereby reducing fabrication costs.

(53) In addition, when compared to the existing technology using a rigid FPCB, the rigid PCB 102 and the FPCB 112 are separated from each other and the metal lead frame 112 is used so that thermal conductivity is increased, thereby improving heat radiation properties.

(54) Further, low resistance may be realized by utilizing the metal lead frame 112 as a power pattern and using it as a parallel current path, thereby providing high-speed operation characteristics, such as high-speed charging characteristics.

(55) According to some embodiments of the present invention made as described above, a battery protection circuit package capable of high-speed operation and superior in heat radiation properties and a method of fabricating the same may be provided. It is apparent that the scope of the present invention is not limited to the effects described above.

(56) A number of examples have been described above. Nevertheless, it will be understood that various modifications may be made. For example, suitable results may be achieved if the described techniques are performed in a different order and/or if components in a described system, architecture, device, or circuit are combined in a different manner and/or replaced or supplemented by other components or their equivalents. Accordingly, other implementations are within the scope of the following claims.