COMPOSITION FOR ENCAPSULATION

Abstract

The present disclosure relates to a composition for encapsulating an organic electronic element and an organic electronic device comprising the same, and provides an encapsulation composition which can form an encapsulation structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifespan of the organic electronic device and implementing endurance reliability of the encapsulation structure at high temperature and high humidity, and has high shape retainability, and an organic electronic device comprising the same.

Claims

1. An encapsulation composition comprising: a non-reactive olefin-based compound; and a reactive olefin-based compound included in a range of 10 to 150 parts by weight relative to 100 parts by weight of the non-reactive olefin-based compound.

2. The encapsulation composition according to claim 1, wherein the non-reactive olefin-based compound has a weight average molecular weight in a range of 500 g/mol to 100,000 g/mol.

3. The encapsulation composition according to claim 1, wherein the non-reactive olefin-based compound is included in a range of 40 to 90 wt % in the encapsulation composition.

4. The encapsulation composition according to claim 1, wherein the reactive olefin-based compound has a weight average molecular weight in a range of 1,000 g/mol to 50,000 g/mol.

5. The encapsulation composition according to claim 1, wherein the reactive olefin-based compound has one or more reactive functional groups at the end of the reactive olefin-based compound.

6. The encapsulation composition according to claim 1, wherein the reactive olefin-based compound has an active energy ray-curable functional group.

7. The encapsulation composition according to claim 6, wherein the active energy ray-curable functional group is a radical-curable functional group.

8. The encapsulation composition according to claim 6, wherein the active energy ray-curable functional group includes a vinyl group, an acryloyl group or a methacryloyl group.

9. The encapsulation composition according to claim 1, wherein the non-reactive olefin-based compound or the reactive olefin-based compound comprises an isobutylene monomer as a polymerization unit.

10. The encapsulation composition according to claim 1, wherein the reactive olefin-based compound is included in a range of 50 wt % or less in the encapsulation composition.

11. The encapsulation composition according to claim 1, wherein the reactive olefin-based compound is included in a range of 25 to 90 parts by weight relative to 100 parts by weight of the non-reactive olefin-based compound.

12. The encapsulation composition according to claim 1, further comprising a curable monomer.

13. The encapsulation composition according to claim 12, wherein the curable monomer has a weight average molecular weight of 50 g/mol or more and less than 1,000 g/mol.

14. The encapsulation composition according to claim 12, wherein the curable monomer comprises an epoxy compound, an oxetane compound or an acrylate monomer.

15. The encapsulation composition according to claim 12, wherein the curable monomer is included in an amount of 10 to 60 parts by weight relative to 100 parts by weight of the non-reactive olefin-based compound.

16. The encapsulation composition according to claim 1, further comprising an inorganic filler.

17. The encapsulation composition according to claim 16, wherein the inorganic filler is included in an amount of 0.1 parts by weight to 300 parts by weight relative to 100 parts by weight of the non-reactive olefin-based compound.

18. The encapsulation composition according to claim 1, further comprising a cationic initiator or a radical initiator.

19. The encapsulation composition according to claim 1, further comprising a moisture adsorbent.

20. An organic electronic device comprising: a substrate; an organic electronic element formed on the substrate; and a side encapsulation layer formed on the periphery of the substrate so as to surround the side surfaces of the organic electronic element and containing the encapsulation composition according to claim 1.

21. A method for manufacturing an organic electronic device, comprising steps of: applying the encapsulation composition of claim 1 on the periphery of a substrate, on which an organic electronic element is formed, so as to surround the side surfaces of the organic electronic element, and curing the encapsulation composition.

Description

DESCRIPTION OF DRAWINGS

[0071] FIG. 1 is a cross-sectional view showing an organic electronic device according to one example of the present invention.

EXPLANATION OF REFERENCE NUMERALS

[0072] 1: encapsulation composition [0073] 10: side encapsulation layer [0074] 11: top encapsulation layer [0075] 21: substrate [0076] 22: cover substrate [0077] 23: organic electronic element

DETAILED DESCRIPTION

[0078] Hereinafter, the present invention will be described in more detail by way of examples according to the present invention and comparative examples not according to the present invention, but the scope of the present invention is not limited by the following examples.

[0079] Hereinafter, the compounds used in Examples and Comparative Examples are as follows.

[0080] An acid anhydride-modified polyisobutylene resin (BASF, Glissopal SA, Mw: 1,000 g/mol, hereinafter, PIBSA), polybutene (INEOS, Mw: 2,000 g/mol, H-1900) and Modified-PIB (Mw: 10,000 to 20,000 g/mol), in which in the structure of the following formula 1, R is an acryloyl group, were used as olefin-based compounds.

[0081] In addition, hydrogenated epoxy (Kukdo, ST-3000), epoxy acrylate (Sartomer, CN110), and urethane acrylate (Sartomer, CN307) were used as reactive compounds, and an alicyclic epoxy compound (Daicel, Celloxide 2021P, Mw: 250 g/mol, epoxy equivalent 130 g/eq, viscosity 250 cPs, hereinafter, C2021P), 1,6-hexanediol diacrylate (HDDA) and monofunctional acrylate (SR420) were used as curable monomers.

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[0082] In Formula 1 above, m repeating unit is a polymerization unit derived from an isobutylene monomer, m is any one of 10 to 1000, n repeating unit is a hydrocarbon repeating unit, and n is any one of 10 to 1000.

[0083] As the inorganic filler, fumed silica (Aerosil, Evonik, R805, particle size 10 to 20 nm, BET=150 m.sup.2/g) was used and as the moisture adsorbent, calcium oxide (CaO, average particle diameter 8 μm, Aldrich) was used.

[0084] As the photo-initiator, a photo-cationic initiator (San-apro, CPI-101A) and a radical initiator (TPO) were used. In addition, a latent thermal curing agent (Adeka, EH-4357S) was used as the thermal curing agent.

Examples 1 to 2 and Comparative Examples 1 to 6

[0085] For the above composition, components were compounded in the weight ratios as shown in Table 1 below and introduced into a mixing vessel. The unit is parts by weight. In the mixing vessel, uniform compositions were prepared using a planetary mixer (Kurabo, KK-250s).

TABLE-US-00001 TABLE 1 Example Comparative Example 1 2 1 2 3 4 5 6 PIBSA 60 65 70 10 H-1900 55 48 65 Modified-PIB 20 31 50 60 ST-3000 15 CN110 15 15 10 CN307 15 20 20 C2021P 5 HDDA 5 3 5 5 5 10 5 25 SR420 20 18 10 10 25 10 R805 10 10 7 10 9 7 7 10 CaO 60 60 60 60 60 60 60 60 CPI-101A 5 2 5 TPO 5 5 5 5 5 5 5 5 EH-4357S 10

[0086] Hereinafter, the physical properties of the encapsulation composition prepared in Examples and Comparative Examples were evaluated in the following manner and the results are shown in Table 2 below.

[0087] 1. Application Characteristics

[0088] The compositions for encapsulation prepared in Examples or Comparative Examples were each set to draw a 150 mm×150 mm square using a coating bar (Musashi 200DS) on a 0.7 T Soda-Lime glass, and then the application characteristics were observed during application (needle number: #18, dispensing speed: 10 mm/sec).

[0089] It was classified as O in the case where there was no inflow of air bubbles or clogging during application, Δ in the case where air bubbles were introduced during application or its original shape was lost after application to spread widely, and X in the case where a large amount of air bubbles were introduced during application or the nozzle was clogged and the application was cut off.

[0090] 2. Heat Resistance and Moisture Resistance

[0091] The composition solutions for encapsulation prepared in Examples or Comparative Examples were each applied on a 0.7 T soda-lime glass to a layer of 200 μm using a coating bar. Then, a sample was prepared by laminating it with the same glass, the encapsulation composition was irradiated with light (metal halide lamp) having a wavelength range of the UV-A region band at a light quantity of 3 J/cm.sup.2 and then, in Comparative Example 3, heat was additionally applied thereto in an oven at 100° C. for 3 hours. Then, the sample was held in a constant temperature and humidity chamber at 85° C. and 85% relative humidity for about 1000 hours.

[0092] The measurement of heat resistance was indicated as 0 in the case where there was no change in the inside and the side of the coating region, A in the case where 2 or less voids occurred inside the coating region, and X in the case where a large number of voids, such as 3 or more voids, occurred inside the coating region.

[0093] The measurement of moisture resistance was indicated as 0 in the case where there was no lifting of the region penetrated with moisture, A in the case where the lifting partly occurred, and X in the case where the moisture penetration site was greatly lifted from the glass.

[0094] 3. Moisture Barrier Property

[0095] Calcium was deposited to a size of 5 mm×5 mm and a thickness of 100 nm on a glass substrate having a size of 100 mm×100 mm and the compositions for encapsulation of Examples and Comparative Examples were each applied to the edge part excluding the calcium so that a 3 mm bezel was formed. After it was laminated with a cover glass having a size of 100 mm×100 mm in the coated state, UV irradiation was performed at a light quantity of 3 J/cm.sup.2 using a metal halide light source, and then heat was applied thereto in an oven at 100° C. for 1 hour. The obtained specimens are observed in a constant temperature and humidity chamber at 85° C. and 85% relative humidity to observe the time when calcium begins to become transparent by oxidation reaction due to moisture penetration.

TABLE-US-00002 TABLE 2 Heat Resistance/ Moisture Application Moisture Barrier Property Characteristics Resistance (hour) Example 1 ◯ ◯/◯ 1400 2 ◯ ◯/◯ 1700 Comparative 1 ◯ ◯/X 700 Example 2 ◯ ◯/X 900 3 ◯ X/X Not measurable 4 ◯ X/X Not measurable 5 X X/X Not measurable 6 ◯ ◯/X Not measurable