Connection system for tiered stages
11367983 · 2022-06-21
Assignee
Inventors
Cpc classification
G06N10/00
PHYSICS
H01R9/0524
ELECTRICITY
H01R13/5219
ELECTRICITY
H01R13/719
ELECTRICITY
H01R43/26
ELECTRICITY
H01R13/6315
ELECTRICITY
H01R13/7197
ELECTRICITY
H01R13/521
ELECTRICITY
International classification
H01R24/54
ELECTRICITY
H01R13/7197
ELECTRICITY
G06N10/00
PHYSICS
H01R43/26
ELECTRICITY
Abstract
A connection system for a quantum computer that employs constant impedance connectors with attenuation or filtering components or both embedded therein or within an adaptor removably insertable within an adaptor housing for use in a cryogenically cooled quantum computer. The connection system provides a higher density of cables traversing through a hermetic sealed top plate, and which are accessible to chill blocks to reduce the thermal energy from the signal lines. Attenuators or filter circuits are embedded in the constant impedance connector housings, or provided in adaptors that connect on each end to form mating constant impedance connections, in order to reduce signal strength as the signal progresses through the cryogenic environment and to remove extraneous electrical signal noise.
Claims
1. A connection system for transmitting signal cables through tiered stages, wherein at least one stage comprises: a first signal cable having a center conductor terminated by a first receptacle connector or first plug connector; a header housing plate, said header housing plate having a first header housing receptacle connector or a first header housing plug connector mounted on a first side, and a second header housing receptacle connector or a second header housing plug connector mounted on a second side opposite said first side, wherein said first header housing connector on said first side is complementary to said first receptacle connector or said first plug connector of said first signal cable; and a first or top plate for securing said header housing plate, such that said header housing plate is received within a removed portion of said first or top plate.
2. The connection system of claim 1 wherein said first receptacle connector or first plug connector in conjunction with said first header housing receptacle connector or said first header housing plug connector form a constant impedance connector.
3. The connection system of claim 1 including a second signal cable having a center conductor terminated by a second receptacle connector or second plug connector, wherein said second receptacle connector is a complementary connector to said second header housing receptacle connector or said second header housing plug connector, such that said second receptacle connector attaches on said second side of said header housing plate.
4. The connection system of claim 3 wherein said second receptacle connector or second plug connector in conjunction with said second header housing receptacle connector or said second header housing plug connector form a constant impedance connector.
5. The connection system of claim 1 including a removable attenuator or filter component connected at one end to said first receptacle connector or first plug connector and at an opposing end to said first header housing plug connector or first header housing receptacle connector, respectively, for signal attenuation and/or electrical signal filtering.
6. The connection system of claim 5 wherein said first receptacle connector or said first plug connector of said first cable includes said attenuator or filter component embedded therein for signal attenuation and/or electrical signal filtering.
7. The connection system of claim 3, wherein said second receptacle connector or said second plug connector of said second cable includes an attenuator or filter component embedded therein for signal attenuation and/or electrical signal filtering.
8. The connection system of claim 1 including an adaptor housing having a plurality of apertures for mounting a plurality of attenuators or filter components, or both, each of said attenuators and/or filters associated with a signal cable.
9. The connection system of claim 8 including a plug housing block attachable to said adaptor housing on a first side, and a receptacle housing block attachable to adaptor housing on a second side opposite said first side.
10. The connection system of claim 9 wherein said plug housing block and/or said receptacle housing block house a mating section of a constant impedance connector.
11. The connection system of claim 8 wherein said adaptor housing is attached to a plate that provides either thermal conduction, ground potential, or both.
12. A connection system for transmitting signal cables through tiered stages, wherein at least one stage comprises: a first signal cable having a center conductor terminated by a first receptacle connector or first plug connector; a header housing plate, said header housing plate having a first header housing receptacle connector or a first header housing plug connector mounted on a first side, and a second header housing receptacle connector or a second header housing plug connector mounted on a second side opposite said first side, wherein said first header housing connector on said first side is complementary to said first receptacle connector or said first plug connector of said first signal cable; a removable attenuator or filter component connected at one end to said first receptacle connector or first plug connector and at an opposing end to said first header housing plug connector or first header housing receptacle connector, respectively, for signal attenuation and/or electrical signal filtering; and a resilient thermally and/or electrically conductive component attached exterior to said attenuator or filter component to transmit thermal and/or electrical energy away from said attenuator or filter component.
13. The connection system of claim 12 wherein said resilient thermally and/or electrically conductive component is slidable and compressible.
14. A method of connecting electrical cables in a tiered staged connection system, comprising: mounting as a first stage a first top plate; mounting a header housing plate within said first top plate, such that said header housing plate is received within a portion of said top plate; mounting a first header housing receptacle connector or a first header housing plug connector on a first side of said header housing plate; mounting a second header housing receptacle connector or a second header housing plug connector on a second side of said header housing plate opposite said first side connecting a first receptacle connector or a first plug connector having a first signal cable to said first header housing receptacle connector or said first header housing plug connector; and connecting a second receptacle connector or a second plug connector having a second signal cable to said second header housing receptacle connector or said second header housing plug connector; such that either said first header housing receptacle connector or said first head housing plug connector attaches to said first receptacle connector or a first plug connector, respectively, in a constant impedance cable connection, or said second header housing receptacle connector or said second header housing plug connector attaches to said second receptacle connector or a second plug connector, respectively, in a constant impedance cable connection.
15. The method of claim 14 including connecting a removable attenuator or filter component at one end to said first header housing receptacle connector or said first header housing plug connector and at an opposing end to said second header housing receptacle connector or said second header housing plug connector for signal attenuation and/or electrical signal filtering.
16. The method of claim 14 including mounting an adaptor housing as a second stage, said adaptor housing having a removably insertable adaptor in electrical communication with said second receptacle connector or a second plug connector second signal cable, such that electrical connections are extended from said first stage to said second stage.
17. The method of claim 16 including embedding an attenuation or filtering component or both within said adaptor.
18. The method of claim 17 wherein said embedding of said attenuation or filtering component includes contacting a resilient thermally and/or electrically conductive component attached exterior to said attenuator or filter component with said adaptor in order to transmit thermal and/or electrical energy away from said attenuator or filter component.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The features of the invention believed to be novel and the elements characteristic of the invention are set forth with particularity in the appended claims. The figures are for illustration purposes only and are not drawn to scale. The invention itself, however, both as to organization and method of operation, may best be understood by reference to the detailed description which follows taken in conjunction with the accompanying drawings in which:
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DESCRIPTION OF THE PREFERRED EMBODIMENT(S)
(13) In describing the preferred embodiment of the present invention, reference will be made herein to
(14) The present invention provides a connection system for electrical signals. The invention is preferably used to accommodate computer architecture, and preferably quantum computer architecture, although uses outside of computer architecture are not prohibited. For illustrative purposes, the application of the connection system of the present invention is demonstrated in computer architecture; however, other uses for electrical signal protection using the connection system are not precluded.
(15) In one embodiment, the present invention lends itself to operation in a cryogenically cooled environment, although the present invention is not limited to cryogenically cooled environment applications. The need for reducing input power that would otherwise provide degrading thermal effects to the internal system is mitigated through the introduction of attenuators embedded within the housing of specialized constant impedance connectors, or formed as adapters that are designed to extend a constant impedance connection. In both instances the connectors are designed with a direct thermal connection to heat sinking elements, such as refrigeration plates, or the like. In certain instances, the attenuators are cryogenically-design. Similarly, in lieu of, or in addition to, attenuators, the present invention may also accommodate filters that are either embedded within the housing of specialized constant impedance connectors or attached as adapters to extend the constant impedance connections.
(16) The design for embedding attenuators or providing an attenuating adaptor that extends a constant impedance connector readily lends itself to the implementation of filtering components within the connector or adaptor housing to reduce unwarranted coupling on the signal lines. In this manner, extraneous power on the line is further reduced by shunting at least a portion of the electrically coupled noise to ground before it travels to the colder portions of the cryogenically cooled environment.
(17) Standardized constant impedance connectors accommodate large radial and axial misalignment tolerances found in modular applications. Constant impedance technology, as that found in the PkZ® connectors of Palco Connector, Inc., of Naugatuck, Conn.—an affiliate of The Phoenix Company of Chicago—ensures constant impedance with low insertion forces and no internal engagement spring. These connectors provide consistent performance by maintaining constant impedance over the larger Z-axis mating gaps caused by system and connector tolerance challenges. This is advantageous over the SMA connectors of the prior art, which are generally threaded and unable to accommodate movement of components at low temperatures. The Palco PkZ® connectors are implemented in this design as exemplary constant impedance connectors that will maintain signal integrity in a challenging environment.
(18) The operating signals may be either RF or digital signals, typically in frequencies less than 40 GHz, but may be as high as 40 GHz to 60 GHz, with approximately 1 watt max power. This is in contrast to SMA connectors currently found in the art, which operate on the order of less than 20 GHz.
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(20) As will be discussed in further detail below, the modification of the constant impedance connection may be presented in different distinct designs and at different stages. For example, in a first embodiment, an attenuator or filter is embedded in either a constant impedance connector receptacle or plug. As depicted in
(21) In a second embodiment an attenuator component or filter component adaptor is employed within its own adapter body which is then mounted into an adaptor housing, which preferably accommodates a plurality of adaptor bodies. The adaptor housing is then mounted to a plate, such as a refrigeration plate. The adaptor housing will receive on one side connectors from a receptacle housing block, and on the other side connectors from a plug housing block. It is also possible for an adaptor housing to be designed to receive connectors from a receptacle housing block on both sides, or connectors from a plug housing block on both sides, such that, in either embodiment, a constant impedance connection is made on each side of the adaptor housing.
(22) The attenuator lowers the power on each center conductor without changing the signal integrity. In cooling applications, the excess thermal energy from the attenuated signals is then dissipated through the housing to a heat sink, such as refrigeration plate. The system is designed to accommodate a plurality of such heat sinks. Additional plates may have further attenuation components for further signal conditioning. External cabling then extends from bottom housing stage 10 to the computer internal electronics, and ultimately to the processor.
(23) It is noted that for optimum operation of the connection system within a quantum computer application most or approximately all of the materials of the connection system are designed of non-magnetic material. For other applications, non-magnetic material may not be necessitated.
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(26) As will be discussed in further detail below, in an alternative embodiment, a second constant impedance mating plug may be introduced, which is mated with a second constant impedance receptacle. The second receptacle is altered from the first receptacle discussed above insomuch as the second receptacle requires a different internal termination to accommodate a different cable, allowing the connection to proceed from a generally standard cabling material to cabling 32, which may be superconducting cabling material. In this manner, different cabling may be used under a similar connection scheme.
(27) Following the signal cabling from the external environment towards the cryogenically cooled environment, through the hermetic seal stage, the cabling extends from connector housing 22b to lower housing stage 8.
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(29) By attenuating the cable signals, energy is removed from the cables and shunted via the attenuator to the adjoining plate. In this manner, heat energy is kept further away from the internal computer electronics downstream.
(30) Constant impedance receptacle 36 is then mated to a mating plug 44 which is inserted within, and secured by, mating plug housing block 9b. Mating plug 44 extends the signal conductor to a cable 46, which under certain circumstances may be a superconducting cable. Cable 46 does not necessarily have to be the same material as cable 32, and any mating plug would be designed to accommodate the different conducting cable material, including superconducting cabling material.
(31) Receptacle and plug housing blocks 9a, 9b are attached to, and in thermal communication with, lower housing stage 8 via a specialized clamp 50a,b. Clamp 50a,b are each designed to hold extended ribs 48a,b on the perimeter of each housing block 9a,b respectively. Clamps 50a,b are mechanically fastened to lower housing stage 8 on one side via a threaded or other removable attachment scheme. The bottom side of clamp 50b is in thermal communication with lower housing stage 8.
(32) Cables 46 extend from plug housing block 9b and may traverse through one or more plates that may utilize heat sinks, and which may be configured in the same manner as described above.
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(34) In this manner, one end of the receptacle or plug portion component 82, 84 is a mating constant impedance connector receptacle or plug, which is designed to mate with the complementary attenuator or filter component 72, such that a constant impedance connection is formed. The mating attachment is slidably connected to the receiving attachment on the attenuator or filter component 72. By this design, the attenuator or filter components 72 may be interchangeable, insomuch as attenuator components may be replaced with filter components, and vice versa. As an illustrative example, plug housing block 78 is depicted with a PkZ® plug, and receptacle housing block 80 is depicted with a PkZ® receptacle. The present invention can also accommodate the interchanging of plugs and receptacles so that the constant impedance connection is still maintained.
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(36) A resilient, thermally and/or electrically conductive component 100 is attached to the outside of attenuator or filter component 72 to transmit thermal energy from the attenuator or filter component 72 to the inner wall of aperture 74 upon insertion. The resilient thermally or electrically conductive component 100 may be in the form of a spring or other resilient structure for forming a slideable, compressible connection against the inner wall of aperture 74. The resilient component 100 provides movement and flexibility that a press-fit device (as depicted by the first embodiment above) cannot provide, while assuring improved thermal conductivity and/or electromagnetic interference protection.
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(40) In order to replace the attenuation adaptors 72, fixing hardware is removed on both the plug housing block and the receptacle housing block. The connector housings are then removed, and the attenuation adaptors are removed and replaced.
(41) After separating the connector housing, the attenuation adaptors may be removed using appropriate tools. At this point, the entire housing may be removed for work outside of the connection system environment, or replaced with another housing containing different attenuation adaptors and/or other components.
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(43) While the present invention has been particularly described, in conjunction with a specific preferred embodiment, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art in light of the foregoing description. It is therefore contemplated that the appended claims will embrace any such alternatives, modifications and variations as falling within the true scope and spirit of the present invention.