ELECTRONIC CONTROL OF A COMPRESSOR, COMPRESSOR AND COOLING EQUIPMENT

Abstract

The present invention refers to an electronic control (1) of a compressor (2), the electronic control (1) disposed in an encasement 5 (3), wherein the electronic control (1) comprises: a main board (4) associated to at least an auxiliary board (5,6,7), wherein one of the auxiliary boards (5,6,7) is a heat-generating board (7), wherein the heat-generating board (7) is disposed at a first distance (D.sub.1) in relation to a first wall of the encasement (P.sub.1), wherein the other auxiliary boards 0 (5,6) are disposed at least at a second distance (D.sub.2, D.sub.3) in relation to the first wall of the encasement (P.sub.1), wherein the first distance (D.sub.1) is less than the second distance (D.sub.2). A compressor (2) and a cooling equipment are also described.

Claims

1. Electronic control (1) of a compressor (2), the electronic control (1) disposed in an encasement (3), wherein the electronic control (1) comprises: a main board (4) associated to a plurality of auxiliary boards (5, 6, 7), wherein the electronic control (1) is characterized in that: one of the auxiliary boards (5, 6, 7) is a heat-generating board (7), wherein the heat-generating board (7) is disposed at a first distance (Di) in relation to a first wall of the encasement (Pi), wherein the other auxiliary boards (5, 6) are disposed at least at a second distance (D2, D3) in relation to the first wall of the encasement (Pi), wherein the first distance (Di) is less than the second distance (D2), wherein each auxiliary board (5, 6, 7) and the main board (4) comprises an operation face (4a, 5a, 6a, 7a) and a track face (4b, 5b, 6b, 7b), wherein the operation face (7a) of the heat-generating board (7) faces the first wall of the encasement (Pi) and the operation face (5a, 6a) of the other auxiliary boards (5, 6) faces a second wall of the encasement (P2), wherein the first wall (Pi) is opposite the second wall (P2).

2. The electronic control (1) according to claim 1, characterized in that the association between the auxiliary boards (5, 6, 7) and the main board (4) occurs by way of a soldering process.

3. The electronic control (1) according to claim 1, characterized in that the operation face (4a, 5a, 6a, 7a) refers to the face of the auxiliary boards (5, 6, 7) and of the main board (4) which comprises most of the electronic components (8) of the board (4, 5, 6, 7) in question.

4. The electronic control (1) according to claim 3, characterized in that the auxiliary boards (5, 6, 7) are formed by: a first auxiliary board (5) configured as a power block, a second auxiliary board (6) configured as a control block, a third auxiliary board (7) configured as a block inverter, wherein the third auxiliary board (7) is a heat-generating board (5).

5. The electronic control (1) according to claim 4, characterized in that each auxiliary board (5, 6, 7) is disposed concurrently in relation to the main board (4).

6. The electronic control (1) according to claim 5, characterized in that at least one of the auxiliary boards (5, 6, 7) is disposed perpendicularly in relation to the main board (4).

7. The electronic control (1) according to claim 6, characterized in that the operation face (4a) of the main board (4) faces a third wall (P3) of the encasement, the third wall (P3) being adjacent to the first (Pi) and second wall (P2) of the encasement.

8. The electronic control (1) according to claim 7, characterized in that the operation face (4a) of the main board (4) further faces the compressor (2).

9. The electronic control (1) according to claim 8, characterized in that the operation face of the second auxiliary board (6a) faces the track face of the first auxiliary board (5b) and the track face of the second auxiliary board (6b) faces the track face of the third auxiliary board (7b).

10. The electronic control (1) according to claim 9, characterized in that the operation face (7a) of the heat-generating board (7) further comprises a conducting adhesive (9), wherein the conducting adhesive is associated to a heat dissipator (10).

11. The electronic control (1) according to claim 10, characterized in that the soldering process is a wave soldering process.

12. Compressor (2) of a cooling equipment, comprising an electronic control (1) as claimed in claim 1.

13. Cooling equipment, comprising an electronic control (1) as claimed in claim 1.

Description

SUMMARY DESCRIPTION OF THE DRAWINGS

[0033] The present invention will now be described in greater detail based on an exemplary embodiment represented in the drawings. The figures show:

[0034] FIG. 1—is a representation of the electronic control proposed in the present invention, showing its main board and its auxiliary boards;

[0035] FIG. 2—is a cutaway representation of the electronic control proposed in the present invention disposed in an encasement of a compressor;

[0036] FIG. 3—is a cutaway representation of the electronic control proposed in the present invention disposed inside an encasement;

[0037] FIG. 4—is an additional cutaway representation of the electronic control proposed in the present invention disposed inside an encasement;

[0038] FIG. 5 is a perspective and highlighted representation and of an encasement used to package the electronic control proposed in the present invention.

DETAILED DESCRIPTION OF THE DRAWINGS

[0039] The present invention initially describes an electronic control 1, as can be seen from FIGS. 1 to 5.

[0040] In a fully valid embodiment of the present invention, said electronic control 1 can be applied to the control of a compressor 2, more specifically, the electronic control 1 can be used to control the speed of the electric motor of the compressor 2.

[0041] In any case, it is emphasized that the application of the electronic control 1 for the control of a compressor 2 should not be considered as a limitative characteristic of the present invention, such that the electronic control 1 proposed herein could very well be used in various other applications, such as the control of motors in general and integrated controls for compressor and refrigerator.

[0042] In a valid embodiment of the present invention and in reference to FIGS. 1 and 2, said electronic control is used in the control of a compressor 2 applied to a cooling equipment, such that cooling equipment is understood to be any refrigerator and/or freezer, be it domestic and/or commercial as well as any air-conditioning equipment, be it domestic, residential, portable, and applied to motor vehicles.

[0043] In any case, the application of the teachings of the present invention to a cooling equipment should not be considered as a limitative characteristic of the invention.

[0044] For due packaging and protection of the electronic control 1, it is proposed that it be disposed in an encasement 3, as represented in FIGS. 2 and 3.

[0045] It is emphasized that the illustration of the encasement 3 in the figures in question should not be considered as a limitative characteristic of the present invention, such that encasement 3 should be understood to be any element able to offer protection to the electronic control 1, and encasement 3 can also be understood to be any site for storing the control 1, such as a plastic box, metal box, any type of cabinet, the very shell of the compressor, among others.

[0046] In this embodiment of the present invention illustrated in FIGS. 2 and 3, the encasement 3 can be understood as a rectangular box of side walls Pi, P2, P3 and P4 wherein the electronic control 1 is disposed in the inner area of said encasement 3.

[0047] In reference to FIGS. 1 to 4, the present invention proposes that the electronic control 1 be formed by an electronic board 4 (main board 4) and by at least an auxiliary board 5 (auxiliary electronic board 5).

[0048] In this embodiment of the present invention, it is proposed that three auxiliary boards 5, 6 and 7 be used, as represented in FIGS. 1 to 4. It is emphasized that the amount of auxiliary boards referred to in the present invention should not be considered as a limitative characteristic of the teachings proposed herein, such that any amount of auxiliary boards could be used.

[0049] The auxiliary electronic boards 5, 6 and 7 can be respectively understood as a first auxiliary board 5, a second auxiliary board 6 and a third auxiliary board 7.

[0050] It is also understood that the main board 4 and each one of the auxiliary boards 5,6 and 7 comprises an operation face 4a, 5a, 6a, 7a and a track face 4b, 5b, 6b, 7b.

[0051] In specific reference to FIGS. 1 and 3, the operation face 4a, 5a, 6a, 7a of the boards in question 4, 5, 6 and 7 should be under stood with the face of the electronic boards wherein most of the electronic components (capacitors, resistors, diodes, transistors, varistors, among others) are disposed. Most electronic components 8 should be understood as the face of the boards 4, 5, 6 and 7 which comprises a greater quantity of electronic components when compared to the opposite face of the board in question.

[0052] So, FIG. 3 spotlights the operation face 4a, 5a, 6a, 7a of each one of the electronic boards 4, 5, 6 and 7.

[0053] The track face 4b, 5b, 6b, 7b should be understood as the face opposite the operation face 4a, 5a, 6a, 7a, so the track face 4b, 5b, 6b, 7b can be understood as the face that comprises most of the conducting tracks of the board. In any case, it is emphasized that the track face 4b, 5b, 6b, 7b may also contain some electronic components 8 on its surface.

[0054] Generally speaking, the operation face 4a, 5a, 6a, 7a can be understood as the face preferably used for housing the electronic components 8, while the track face 4b, 5b, 6b, 7b can be understood as being the preferred face for disposing the conducting tracks, the track face 4b, 5b, 6b, 7b may also contain electronic components 8.

[0055] Further and considering that a certain electronic component 8 is fastened to the main board 4 by means of a soldering process, the track face 4b can be understood as a face wherein the soldering points are visible.

[0056] Generally speaking, the track face should be understood as the face opposite the face that comprises most electronic components 8.

[0057] In this sense, FIG. 3 illustrates the track face 4b, 5b, 6b, 7b of each one of the electronic boards 4, 5, 6, 7 which make up the electronic control 1 proposed in the present invention.

[0058] From the teachings described above, it is understood that FIG. 1 respectively allows the visualization of the operation face 4a, 5a and 6a of the main electronic board 4 and auxiliary boards 5 and 6 as well as the visualization of the track face 7b of the third auxiliary electronic board 7.

[0059] An important characteristic of the electronic control 1 proposed in the present invention lies in the disposition and arrangement of the main electronic board 4 in addition to the auxiliary boards 5, 6, and 7. More specifically, it is proposed that each auxiliary board 5, 6 and 7 as well as the main board 4 represents a certain operation block of the electronic control, wherein each operation block will comprise the specific and necessary electronic components for the operation of said block.

[0060] Further, and as described in detail ahead, the disposition site and arrangement of the auxiliary boards 5, 6 and 7 and main board 4 (and its operation blocks) also refer to an important characteristic of the present invention.

[0061] The main electronic board 4 can be understood as a mother board that concentrates all the PTH (pin through hole components of the electronic control 1, that is, those electronic components 8 whose terminals are inserted into the holes (orifices) of the electronic board 4 and are then fastened thereto, for example, by means of soldering.

[0062] In this embodiment of the present invention, the electronic board 4 comprises the following electronic components 8: connectors, EMC filter, fuse, rectifier diodes, busbar capacitors, cables, jumpers, besides obviously comprising the auxiliary boards 5, 6 and 7 as well.

[0063] So, the main board 4 can be understood as a fastening block, and this block is responsible for concentrating the PTH components of the electronic control 1, as described previously.

[0064] Similarly, the present invention proposes that the first auxiliary electronic board 5 be configured as a power block, more specifically, the electronic board 5 can be understood as an SMPS board (switched mode power supply), thus being responsible for providing low-voltage power to the other boards of the product.

[0065] Therefore, and in a configuration of the present invention, the auxiliary electronic board 5 comprises the following electronic components 8: integrated SMPS circuit, inductor, voltage regulator, capacitors, diodes, and resistors.

[0066] Configuring the first auxiliary board 5 in a power block, as proposed, it is entirely possible to design various auxiliary boards 5 with different efficiencies, such that for each type of application desired, an auxiliary board 5 with the desired efficiency can be used.

[0067] So, if there is a need to change the efficiency of the electronic control 1, there is the possibility of replacing just the auxiliary board 5, not making any alteration to the main board 4 or to the other auxiliary boards 6 and 7 either.

[0068] Similarly to that described above, the second auxiliary board 6 represents a control block of the electronic control 1. More specifically, the auxiliary board concentrates the opto-communication couplers, microprocessor, microcontroller and its peripherals.

[0069] Therefore, it is possible to design only a new auxiliary board 6 if it is desirable to alter the microcontroller/microprocessor of the electronic control 1, thus not affecting the other boards of the control 1. Similarly, should the need for repair and/or replacement arise, it is possible to substitute only the second board 6, which ends up significantly reducing the costs involved.

[0070] The third auxiliary board 7 acts as a block inverter, said board 7 comprising the electronic keys responsible for driving the electric motor of the compressor 2, and also for comprising drivers and peripheral circuits of the electronic control 1.

[0071] Therefore, and for effectively concentrating the components necessary for the operation of the electric motor of the compressor 2, the block inverter (third board 7) is understood to be the one that generates most heat in the electronic control 1. Put otherwise, when compared to the other boards of the electronic control 1 (main board 4 and auxiliary boards 5 and 6), the third auxiliary board 7 is the one that generates most heat (coming essentially from the operation of the electronic keys), and can thus be understood as a heat-generating board.

[0072] Therefore, heat-generating board 7 should be understood to be the board of the electronic control 1 that generates most heat.

[0073] Considering the block inverter (third auxiliary board 7) as the one that generates most heat in the electronic control 1, the disposition and arrangement of the auxiliary boards 5, 6 and 7 assumes an important characteristic in the electronic control 1 proposed in the pre sent invention.

[0074] Specifically, and viewing the best possible thermal performance for the electronic control 1, this embodiment of the present invention proposes that a heat-generating board 7 be distanced from the other components of the control 1, especially those components most sensitive to temperature. In an embodiment of the present invention, components most sensitive to temperature can be understood as the busbar capacitor 80 disposed on the main board 4, the capacitor 80′ disposed on the first auxiliary board 5 and the microprocessor 80″ dis posed on the second auxiliary board 6, as represented in FIG. 3.

[0075] FIGS. 2, 3 and 4 illustrate a valid arrangement for disposing the electronic control 1 considering the teachings of the present invention. It is emphasized that the FIG. 2 illustrates a valid disposition of the control 1 in relation to the compressor 2, since the FIGS. 3 and 4 only illustrate the electronic control 1 and considering the arrangement form displayed in FIG. 2.

[0076] As already described previously, it is proposed that the electronic control 1 be disposed in an encasement 3, such that said encasement should be associated to the compressor 2, according to the illustration in FIG. 2. In the embodiment represented in this figure, it is noted that the electronic control 1 is disposed next to the compressor 2 such that the main board 4 be disposed vertically (with its operation face 4a towards the compressor 2) in any case, any other disposition arrangement would be fully acceptable.

[0077] Providing important thermal advantages for the electronic control 1 described in the present invention, it is proposed that the board generating most heat in the control 1, that is, the third auxiliary board 7 be distanced from the other boards of the electronic control 1.

[0078] Therefore, the present invention proposes that the heat generating board 7 be disposed at a first distance Di in relation to the first wall of the encasement Pi, reference is made to FIG. 4. Therefore, the other auxiliary boards 5 and 6 must be respectively disposed at a second D2 and third distances D3 in relation to the same wall Pi.

[0079] As illustrated in FIG. 4, it is proposed that the first distance Di be less than the second and third distances D2 and D3, that is, the heat-generating board 7 is nearer the first wall Pi than the other auxiliary boards 5 and 6.

[0080] Another important characteristic of the electronic control 1 proposed herein and viewing efficient thermal dissipation of the heat generated chiefly on the third auxiliary board 7, it is proposed that the operation face 7a of the heat-generating board 7 faces the first wall of the encasement Pi, as represented in FIG. 3.

[0081] So “to face” means that the operation face 7a of the heat generating board 7 faces towards the first wall Pi, as represented in FIGS. 3 and 4.

[0082] Similarly, and still in reference to FIGS. 3 and 4, the auxiliary boards 5 and 6 should preferably be disposed such that the operation face 5a, 6a of said boards faces towards the second wall of the encasement P2, wherein the first wall Pi is opposite the second wall P2, as represented in FIG. 3.

[0083] More specifically, and still in reference to FIG. 3, it is noted that the operation face of the second auxiliary board 6a faces the track face of the first auxiliary board 5b, while the track face of the second auxiliary board 6b faces the track face 7b of the heat-generating board 7.

[0084] This form of disposition guarantees that the thermally most sensitive components, such as the busbar electrolyte capacitor 80 disposed on the main board 4, the microprocessor 80″ disposed on the auxiliary board 6 and the electrolyte capacitor 80′ disposed on the auxiliary board 5 will undergo significantly less interference from the heat generated by the third auxiliary board 7, thus improving the efficiency and reliability of the electronic control 1.

[0085] Further in relation to the disposition and arrangement proposed for the electronic control 1, it is noted that the operation face 4a of the main board 4 faces a third wall P3 of the encasement, the third wall P3 being adjacent to the first wall Pi and the second wall P2, as illustrated in FIGS. 3 and 4. More specifically, and also based on the illustration of FIG. 2, it is noted that the operation face 4a of the mother board (main board) faces the side portion of the compressor 2.

[0086] The disposition of the electronic components 8 of the mother board on a lateral plane to the body of the compressor, as described above, hinders the thermal exchange with the environment via convection, which ultimately boosts the operation of the electronic control 1, since the main board 4 is the one that comprises one of the components 8 most sensitive to temperature (busbar capacitor 80).

[0087] Therefore, the disposition proposed ends up distancing the heat-generating board 7 of the thermally most sensitive components and which are disposed on the main board 4, in other words, with the arrangement in question the auxiliary boards 5 and 6 act as a shield, thus protecting the thermally most sensitive components and which are disposed on the main electronic board 4.

[0088] Furthermore, the proposal in question of disposition of the heat-generating board 7, such that its operation face 7a faces the first wall Pi ultimately improves the thermal efficiency of the system. In a non-limitative manner, the first wall Pi should be understood as the upper wall of the encasement 3 which stores the electronic control 1, the electronic control 1 and the encasement 3 being mounted in their final use position. This final use position is illustrated in FIG. 2.

[0089] In this sense, and with a view to further boost the characteristics linked to the thermal dissipation of the electronic control 1, it is proposed that the first wall Pi of the encasement 3 comprise a heat dissipator 10, as represented in FIG. 5.

[0090] Generally speaking, the heat dissipator 10 can be under stood as a board made of metal material, such as aluminum, the objective of which is to transfer the heat generated by the third auxiliary board 7 directly to the environment.

[0091] In one configuration, the very wall of the encasement (first wall Pi) may configure the heat dissipator 10, so it is understood that the very wall Pi can be made of metal material, thus acting as the heat dissipator 10. In another fully valid configuration, the heat dissipator 10 can be associated to the first wall Pi, and said wall may be made of any material, such as a polymer material.

[0092] Furthermore, and in reference to FIG. 4, it is proposed that the electronic control 1 further comprise a conducting adhesive 9 associated to the operation face 7a of the heat-generating board 7, specifically, the conducting adhesive 9 is responsible for transmitting, by conduction, the heat generated in the components of the auxiliary board 7 to the heat dissipator 10, so subsequently the heat is dissipated to the environment, by convection and irradiation.

[0093] It is emphasized that the form and the disposition site of the conducting adhesive 9, as represented in FIG. 4, should not represent a limitative characteristic of the present invention.

[0094] In a non-limitative characteristic of the present invention, it is proposed that the association between the auxiliary boards 5, 6 and 7 and the main board occur by way of a soldering process. Preferably, said association occurs by way of a wave soldering process which results in an electronic control 1 endowed with sufficient mechanical stress and vibration.

[0095] In any case, it is emphasized that in the use of the soldering process, the wave should not be considered as a limitation of the pre sent invention, to the extent that other forms of association would be fully acceptable, such as the use of selective soldering or soldering by robot.

[0096] So what is proposed here is an electronic control wherein the auxiliary boards 5, 6 and 7 are disposed concurrently to the main electronic board 4, that is, it is understood that the plans defined by each one of the auxiliary boards 5, 6 and 7 are concurrent to the plane defined by the main board 4, as represented in FIGS. 1 to 4.

[0097] In a non-limitative characteristic of the present invention, and as represented in FIGS. 1 to 4, the auxiliary boards 5, 6 and 7 are disposed perpendicularly to the main board 4, in any case, it is under lined that other forms of disposition would be acceptable, such as the disposition of at least one of the boards 5, 6 and 7 slantedly in relation to the main board 4.

[0098] In another valid configuration, at least one of the auxiliary boards 5, 6 and 7 could be disposed perpendicularly in relation to the main board 4, such that the other boards of the electronic control could be disposed slantedly in relation to the board 4.

[0099] Furthermore, the disposition of the auxiliary boards 5, 6 and 7 in parallel to each other should not represent a limitation of the present invention either.

[0100] So, what is proposed is an electronic control 1 with efficient operation and excellent thermal and electromagnetic characteristics, also being compact, able to be disposed in an encasement 3 with dimensions preferably in the range of 120 (L)×90 (A)×45 (P) mm.

[0101] Further, and without entailing limitations to the teachings of the present invention, it is proposed that the main board 4 be configured as a single layer board and as daughter boards 5, 6 and 7 be con figured as dual layer boards, that is, boards that enable the disposition of electronic components on the two faces of the board. It is under lined that this characteristic does not refer to a limitation of the present invention.

[0102] The present invention further proposes a compressor 2 used in a cooling equipment, wherein the compressor 2 comprises an electronic control 1 as previously described.

[0103] Lastly, a cooling equipment is further proposed, endowed with an electronic control 1 as proposed in the present invention.

[0104] Having described an example of a preferred embodiment, it should be understood that the scope of the present invention encompasses other possible variations, being limited solely by the content of the accompanying claims, potential equivalents being included therein.