HEATSINK ARRANGEMENT FOR A POWER CONVERTER

Abstract

The present invention pertains to a heatsink arrangement for a power converter, wherein the heatsink is grounded via a grounding capacitor. The invention also pertains to a power converter for driving an electric motor, including a corresponding heatsink, semiconductor switches mounted on the heatsink and a fluid cooling system.

Claims

1. A heatsink arrangement for a power converter, wherein its heatsink is grounded via a grounding capacitor.

2. The heatsink arrangement according to claim 1, wherein a resistor is provided in parallel to the grounding capacitor.

3. The heatsink arrangement according to claim 1, wherein a voltage monitor measuring the voltage across the grounding capacitor is provided for detecting faults.

4. The heatsink arrangement according to claim 3, characterized in that the voltage across the grounding capacitor is monitored and beyond a defined threshold, a signal is sent to a controller.

5. The heatsink arrangement according to claim 1, wherein the current through the capacitor during faults is limited to less than 30 A.

6. The heatsink arrangement according to claim 1, wherein the capacitor's capacitance is smaller than 19 μF and is preferably in the range of 0.1-10 μF.

7. A power converter for driving an electric motor, comprising a heatsink arrangement according to claim 1, semiconductor switches mounted on the heatsink and a fluid cooling system.

8. The power converter according to claim 7, wherein the fluid of the fluid cooling system is non-deionized water.

9. The power converter according to claim 7, wherein the semiconductor switches have limited electrical isolation towards the heatsink which is bridged by a parasitic capacitance.

10. The heatsink arrangement according to claim 2, wherein a voltage monitor measuring the voltage across the grounding capacitor is provided for detecting faults.

11. The heatsink arrangement according to claim 2, wherein the current through the capacitor during faults is limited to less than 30 A.

12. The heatsink arrangement according to claim 3, wherein the current through the capacitor during faults is limited to less than 30 A.

13. The heatsink arrangement according to claim 4, wherein the current through the capacitor during faults is limited to less than 30 A.

14. The heatsink arrangement according to claim 2, wherein the capacitor's capacitance is smaller than 19 μF and is preferably in the range of 0.1-10 μF.

15. The heatsink arrangement according to claim 3, wherein the capacitor's capacitance is smaller than 19 μF and is preferably in the range of 0.1-10 μF.

16. The heatsink arrangement according to claim 4, wherein the capacitor's capacitance is smaller than 19 μF and is preferably in the range of 0.1-10 μF.

17. The heatsink arrangement according to claim 5, wherein the capacitor's capacitance is smaller than 19 μF and is preferably in the range of 0.1-10 μF.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Further features, details and advantages of the invention can be derived from the claim set and the figures described below. The figures show:

[0018] FIG. 1: schematic view of a floating heatsink arrangement in a medium voltage drive according to the state of the art;

[0019] FIG. 2: schematic view of a solid grounded heatsink arrangement in a medium voltage drive according to the state of the art;

[0020] FIG. 3: schematic view of a heatsink arrangement in a medium voltage drive according to the present invention; and

[0021] FIG. 4: schematic view of a heatsink arrangement in a medium voltage drive according to the present invention and including heatsink voltage monitor and a parallel resistor.

DETAILED DESCRIPTION

[0022] FIG. 1 is a schematic view of a heatsink 1 in a medium voltage drive 10 according to the state of the art. The heatsink 1 is a “floating” heatsink 1 i.e. it is left ungrounded. Therefore, the fluid of the fluid cooling system 6 is chosen to be an isolating fluid such as deionized water. Grounding is indicated by GND in the figures and corresponds to an earthing.

[0023] Typically, semiconductor switches 5 are mounted on the heatsink 1 via an insulation layer comprising a parasitic capacitance 7. A fluid cooling system 6 cools the switches 5 through the heatsink 1. The use of deionized water as a cooling fluid raises the production and maintenance costs of the drive 10 and complicates its maintenance. For the sake of convenience, the same reference numbers refer to the same features throughout the figures.

[0024] FIG. 2 is a schematic view of an alternative drive 10 layout, which is also known from the art. Here, the heatsink 1 is grounded. Normal tap water, i.e. non-deionized and therefore conductive water may be used as the cooling fluid instead of the deionized water used in the example of FIG. 1. The grounding may protect the conductive fluid against harmful voltages, while the cooling systems 6 is cheaper and easier to maintain than the cooling system of the previous example. However, as a drawback, ground current may exceed the 30 A limit set by standard UL 347A for medium voltage power conversion equipment during faults. In both embodiments of FIGS. 1 and 2 the switches 5 have limited electrical isolation towards the heatsink 1, wherein the isolation is bridged by a parasitic capacitance 7.

[0025] FIG. 3 is a schematic view of a heatsink 1 in a medium voltage drive 10. Both components are shown according to the present invention. The drive 10 may be a medium voltage drive 10 for driving an electric motor not shown in the figures. Here, the heatsink 1 is grounded via a grounding capacitor 2, connecting the heatsink 1 with ground GND. The capacitor 2 protects the fluid of the fluid cooling system 6 against capacitively coupled voltages. Therefore, grounding the heatsink 1 via a grounding capacitor 2 makes it possible to use simple tap water or generally non-deionized water or some other conductive fluid in the fluid cooling system 6. The invention provides a low-cost fluid cooling system and simplifies the operation and maintenance of the drive 10. At the same time, ground current during faults may be limited to less than 30 A by proper choice of capacitance value of the capacitor 2.

[0026] FIG. 4 shows an embodiment of the invention in which a resistor 3 is provided in parallel to the grounding capacitor 2, further enhancing the performance of the drive by providing a path for DC (leakage) currents from heatsink 1 to ground GND.

[0027] Additionally or alternatively, a voltage monitor 4 measuring the voltage across the grounding capacitor 2 may be provided for detecting faults. In the embodiment of FIG. 4, both, the voltage monitor 4 and the resistor 3 are shown. However, the invention may be carried out with either of these two components. Both, the voltage monitor 4 and the resistor 3 may be arranged in parallel to the capacitor 2. No other electrical components may be present in the parallel branches of the capacitor 2, the resistor 3 and/or the voltage monitor 4.

[0028] The voltage monitor 4 may be connected to some control device or controller not shown in the figure. The connection to the control device is indicated by the arrow left of the voltage monitor 4. In case the voltage monitor 4 detects a voltage, which is beyond some threshold value, the control device may output some corresponding signal to indicate the detected transgression. Thus, the voltage monitor 4 may be used to indicate that maintenance and/or replacement of the drive 10 or parts thereof are necessary. The signal of the voltage monitor 4 may also be used to trip a circuit breaker that is connected between the main power supply and the drive.

[0029] The characteristics of the capacitor 2 may be selected such that the current through the capacitor 2 during faults is limited to less than 30 A. As an example, when the supply voltage is 4.16 kV with 60 Hz, the capacitor's 2 capacitance may be derived such that it is smaller than the term 30 A/4.16 kV/(2×π×60 Hz)=19 μF. Preferably, the capacitor's 2 capacitance may be selected to be in the range of 0.1-10 μF.

[0030] Similarly, to what is known from the art, semiconductor switches 5 may be mounted on the heatsink 1 of the drive. Furthermore, the semiconductor switches 5 may have limited electrical isolation towards the heatsink 1, wherein the isolation is bridged by a parasitic capacitance 7. The capacitance of the isolation may be in the order of magnitude of 1 nF, i.e. orders of magnitude smaller than the chosen capacitance of capacitor 2.

[0031] The fluid cooling system 6 may comprise conduits, pumps and further components fluidly connected to the heatsink 1 and conductively connected to ground GND. The heatsink 1 may comprise conduits for the cooling fluid. The conduits of the heatsink 1 may be connected to the cooling system 6 or may be part of the cooling system 6. As the heatsink 1 is grounded via the capacitor 2, the fluid of the fluid cooling system 6 may be a conductive fluid such as non-deionized water.

[0032] The invention is not limited to any of the above embodiments. It may be modified in manifold ways. All features present in the claims, the description and the figures including constructive details, special configurations may be relevant to the invention on their own or in combination with each other.