Full digital device of receiving transducer array of acoustic logging while drilling instrument

Abstract

An acoustic while drilling receiving transducer array adopts a full-digital structure and a non-oil-filled rubber encapsulation arrangement mode, and the full-digital device of the acoustic while drilling receiving transducer array includes first modules, configured to carry out acoustic-to-electric conversion on weakly received acoustic signals of strata; second modules, configured to carry out amplification, filtering, gain control and digital-to-analog conversion on the weakly received acoustic signals; and a third module, configured to control interfaces of the device and convert external input and output signals.

Claims

1. A full-digital device of an acoustic while drilling receiving transducer array, comprising: a plurality of first modules, configured to carry out acoustic-to-electric conversion on acoustic signals received from strata; a plurality of second modules, each configured to carry out amplification, filtering, gain control, and digital-to-analog conversion on signals received from one of the plurality of first modules; and a third module that controls interfaces of the device and convert external input and output signals of the device, wherein each second module comprises a pre-amplification circuit configured to perform two-time amplification and two-order low pass filtering of differential signals from one of the plurality of the first modules with a 3 dB attenuation point of filtering at 30 kHz, a band-pass filtering circuit configured to carrying out filtering of signals from the pre-amplification circuit with a filtering band having a 3 dB attenuation point of filtering of 200 Hz to 30 kHz, an automatic gain control circuit configured to implement 4 times to 128 times of adjustable gain control of signals from the band-pass filtering circuit, and an analog-to-digital conversion circuit configured to coverts signals from the automatic gain control circuit to digital signals with a sampling rate of 10 kHz, a sampling bit width of 16 bit, and a dynamic sampling range of 0-3.3 V.

2. The full-digital device of the acoustic while drilling receiving transducer array according to claim 1, comprising an even number of first modules, and each first module is independently packaged.

3. The full-digital device of the acoustic while drilling receiving transducer array according to claim 1, wherein each first module is a receiving type piezoelectric ceramic wafer.

4. The full-digital device of the acoustic while drilling receiving transducer array according to claim 3, wherein the receiving type piezoelectric ceramic wafer has a length of 40 mm and a width of 25.4 mm.

5. The full-digital device of the acoustic while drilling receiving transducer array according to claim 1, wherein each second module is an internal packaged circuit.

6. The full-digital device of the acoustic while drilling receiving transducer array according to claim 1, comprising a rubber encapsulation layer covering the plurality of second modules and the plurality of first modules, wherein each of the plurality of second modules is individually encapsulated with rubber.

7. The full-digital device of the acoustic while drilling receiving transducer array according to claim 1, wherein the third module is an interface MUX circuit.

8. The full-digital device of the acoustic while drilling receiving transducer array according to claim 7, wherein the interface MUX circuit adopts SPI serial communication interfaces for achieving external output and input.

9. The full-digital device of the acoustic while drilling receiving transducer array according to claim 7, wherein the interface MUX circuit is integrated with AGC logic, and is configured to carry out gain control adjustment operation on the plurality of second modules.

10. The full-digital device of the acoustic while drilling receiving transducer array according to claim 1, wherein the full-digital device of the acoustic while drilling receiving transducer array carries out communication in a differential mode.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) In order to more clearly describe technical solutions in embodiments of the present invention or the prior art, accompanying drawings required for describing the embodiments or the prior art will be briefly introduced hereinafter. Obviously, the accompanying drawings in the following description are merely some embodiments of the present invention, and for those skilled in the art, other accompanying drawings may be obtained based on structures shown in these accompanying drawings without paying creative labor.

(2) FIG. 1 shows a working state diagram of an acoustic logging while drilling instrument.

(3) FIG. 2 shows a structural diagram of a full-digital device of a receiving transducer array of an acoustic logging while drilling instrument according to an embodiment of the present invention.

(4) FIG. 3 shows a structural diagram of a second module of a full digital method and device of a receiving transducer array of an acoustic logging while drilling instrument according to an embodiment of the present invention.

(5) FIG. 4 shows a structural diagram of a 4-band receiving transducer array device implemented according to an embodiment of the present invention.

(6) FIG. 5 shows an interface MUX circuit module according to an embodiment of the present invention.

(7) FIG. 6 shows a packaged circuit module according to an embodiment of the present invention.

(8) FIG. 7 shows a schematic diagram of an arrangement structure according to an embodiment of the present invention.

(9) FIG. 8 shows a schematic diagram of received weak signals acquired after digitization according to an embodiment of the present invention.

(10) FIG. 9 shows a schematic diagram of structural layout dimensions of a receiving transducer array before encapsulation according to an embodiment of the present invention.

(11) FIG. 10 shows a schematic diagram of signals received at a 3 Khz excitation source according to an embodiment of the present invention.

(12) FIG. 11 shows a schematic diagram of signals received at a 12 Khz excitation source according to an embodiment of the present invention.

(13) FIG. 12 shows a schematic diagram of signals acquired by a full-digital array of 8 receiving transducers (8 ceramic wafers) after encapsulation according to an embodiment of the present invention.

(14) The achievement of objectives, functional characteristics and advantages of the present invention will be further explained with reference to the accompanying drawings in conjunction with the embodiments.

DETAILED DESCRIPTION OF THE EMBODIMENTS

(15) Exemplary embodiments will be described in detail herein and examples of exemplary embodiments are illustrated in accompanying drawings. When the following description refers to the drawings, same numerals in the different accompanying drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Contrarily, they are merely examples of devices and methods consistent with some aspects of the present disclosure, as detailed in the appended claims.

(16) Terms “first”, “second” and the like in the description and claims of the present disclosure are used for distinguishing similar objects and not for describing a specific order or sequence. It should be understood that data thus used is interchangeable under appropriate circumstances, so that the embodiments of the present disclosure described herein can be implemented in sequences other than those illustrated or described herein. Moreover, the terms “comprising” and “including,” as well as any modifications thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or apparatus including a series of steps or units are not necessarily limited to those steps or units expressly listed, but may comprise other steps or units not expressly listed or inherent to such process, method, product, or apparatus.

(17) “A plurality of” includes two or more.

(18) It should be understood that “and/or”, as for the term “and/or” as used in this disclosure, merely describes an association of associated objects, and means that there may be three relationships. For example, A and/or B can mean three relationships: A is present alone, A and B are present simultaneously, and B is present alone.

(19) The present invention provides a full-digital device of an acoustic while drilling receiving transducer array, so as to achieve preprocessing and acquisition of received acoustic signals in a while-drilling process. The device adopts a full-digital structure, nearby sampling of received signals and an arrangement structure of the whole device. Compared with the prior art, the device is simple in structure and easy to implement. Meanwhile, a non-oil-filled rubber encapsulation arrangement mode is adopted and is different from the prior art.

(20) The whole device 1 is composed of three different types of sub-modules, including sub-modules 2 (piezoelectric ceramic wafers 0-7, 8 in total), sub-modules 3 (packaged circuits 0-7, 8 in total) and a sub-module 4 (interface MUX, 1). The structure is shown in FIG. 2.

(21) The overall length of the device is 1300 mm, the sub-modules 2 are placed at the interval of 152.4 mm, and the packaged circuit is placed between the two sub-modules 2.

(22) The device includes the eight receiving ceramic wafers. Each receiving ceramic wafer is independently packaged; and the receiving ceramic wafers are placed at the interval of 152.4 mm after being encapsulated with rubber. The ceramic wafer is a piezoelectric ceramic wafer with the length of 40 mm and the width of 25.4 mm, and the ceramic wafer is generally adopted by development of wireline logging and logging while drilling instruments.

(23) Sub-module 2: receiving type piezoelectric ceramic wafer: acoustic-to-electric conversion is carried out on acoustic signals of strata.

(24) Sub-module 3: internal packaged circuit: amplification, filtering, gain control and analog-to-digital conversion on weakly received signals are achieved, and the internal packaged circuit includes: a pre-amplification circuit 5 configured to amplify and filter weak current signals; a filter 6 configured to achieve band-pass filtering; an automatic gain control (AGC) circuit 7 configured to achieve automatic gain control on weak signals; and an analog-to-digital conversion (ADC) circuit 8 configured to achieve analog-to-digital conversion operation of digitalization on the signals.

(25) Sub-module 4: interface MUX circuit: control on interfaces of the whole device and conversion of external input and output signals of the whole device are achieved. SPI serial communication interfaces are adopted for achieving external output and input. In order to improve transmission efficiency and reliability, the device carried out communication in a differential mode. Automatic gain control (AGC) logic is also integrated in the sub-module 4, an external control circuit of the device can carry out gain control and adjustment operation on each sub-module 3 through an SPI interface.

(26) Hereinafter, 5, 6, 7, 8 of the internal packaged circuit of the sub-module 3 are described in detail in connection with FIG. 3.

(27) Sub-module 5: pre-amplification circuit: weak signals of the ceramic wafers are received, and are amplified and filtered. Specific functions of the sub-module 5 are shown in the following figure. Two-time amplification and two-order low-pass filtering of differential signals are achieved, and the 3 dB attenuation point of filtering is 30 kHz.

(28) Sub-module 6: band-pass filtering is carried out, and the filtering band (3 dB point) is 200 Hz to 30 kHz.

(29) Sub-module 7: AGC is carried out, and 4 times to 128 times of adjustable gain control can be achieved.

(30) Sub-module 8: ADC: analog to digital conversion of the signals can be achieved, wherein the sampling rate is 10 kHz, the sampling bit width is 16 bit, and the dynamic sampling range is 0-3.3 v.

(31) According to the whole device, the sub-modules 3 are firstly encapsulated with rubber, and after rubber encapsulation is finished, the sub-modules 3 and the sub-modules 2 are integrally encapsulated with rubber.

(32) The use example is as follows: after the device is integrally packaged, as shown in FIG. 4, the 4-band (B1 to B4) receiving transducer array device is realized. After being connected with 12 signal lines from external, the analog acquisition circuit can read the received signals of the receiving transducer array in real time through the SPI interfaces, and after processing through digital filtering, the signals were sent to outside through CAN bus by using FPGA of Cyclone series and ARM of STM32 series, wherein the sampling rate reaches 100 kHz. Meanwhile, after digital packaging of the 8 receiving type ceramic wafers is realized, power consumption of the device is controlled within 1 W at normal temperature, and is controlled within 1.6 W at the temperature of 175° C. Meanwhile, the device can bear the external annular pressure of 172 Mpa after being encapsulated with rubber. The device can be simply applied to development of the logging while drilling and wireline logging instruments.

(33) According to the device provided by the present invention, digital operation of the received acoustic signals can be realized. The sampling rate is 100 kHz, and the bit width is 16 bit. The adjustable dynamic gain range is 4 to 128 times. The dynamic range of the sampling voltage is 0-3.3 v.

(34) The technical effect verification process is as follows:

(35) (1) The signal-to-noise ratios of the signals are improved after the receiving transducer array is digitized, for receiving the weak signals, various processing including analog signal processing such as acquisition, matching, filtering, amplification and re-filtering of the weak signals is carried out on the interface MUX circuit module and the packaged circuit module, and then analog-to-digital conversion is realized through the ADC.

(36) According to the arrangement structure and method of FIG. 7, six groups of ceramic wafers, the interface MUX circuit module (as shown in FIG. 5) and the packaged circuit module (as shown in FIG. 6) are subjected to overall electric fitting and testing (electric fitting is carried out according to the layout method, but encapsulation is not carried out), full digitalization of the six receiving type ceramic wafers is realized, and the received weak signals acquired after digitalization are as shown in FIG. 8. The consistency, signal-to-noise ratios and the anti-interference capability of the signals are improved.

(37) (2) The quality of the signals acquired after the full-digital receiving transducer array (2 ceramic wafers) is encapsulated is further improved.

(38) The diagram of structural layout dimensions of the receiving transducer array before encapsulation is shown in FIG. 9. According to the layout dimension, non-oil-filled encapsulation of the full-digitalization receiving transducers in two arrays is achieved, and then the two full-digitalization receiving transducer arrays are placed in silicone oil for testing acoustic system performance, and the quality of the received signals is improved under the excitation sources of 3 Khz (shown in FIG. 10) and 12 KHz (shown in FIG. 11).

(39) The performance of the bands after whole encapsulation is as follows:

(40) power consumption at the normal temperature: 1.14 W

(41) power consumption at the temperature of 180° C.: less than 1.5 W

(42) noise: 50 mv@20 kHz

(43) sampling rate: 100 kHz

(44) sampling accuracy: 16 bit

(45) sampling voltage: 0 v to 3.3 v

(46) gain: adjustable from 4 to 128 times

(47) withstand pressure: 125 Mpa (actually measured confining pressure)

(48) (3) The signals acquired after the full-digital array of 8 receiving transducers (8 ceramic wafers) is encapsulated are shown in FIG. 12.

(49) The performance of the receiving bands after encapsulation is as follows:

(50) time difference: 330 m/s

(51) excitation frequency: 5 kHz, single cycle, sine

(52) actual amplitude of the receiving signals (consistent with a hydrophone): 110 uv

(53) amplitudes CH1-CH8 are gradually reduced

(54) sampling rate: 100 kHz

(55) sampling accuracy: 16 bit

(56) minimal resolution: 50 nv (effective sampling 10 bit)

(57) dynamic sampling range: 0 v to 3.3 v

(58) gain: 65,000 times, 64-order adjustable

(59) power consumption at the normal temperature: 1.14 W

(60) power consumption at the temperature of 180° C.: less than 1.5 W

(61) dimensions: 1300*50*15 mm

(62) interface: SPI*2, 10 Mbps

(63) power supply: ±3.3 v

(64) Embodiments of the present invention are described above in connection with the accompanying drawings, but the present invention is not limited to the specific embodiments described above, which are merely illustrative and not limiting; and many forms may be made by those skilled in the art without departing from the spirit of the present invention and the scope of the claims under inspiration of the present invention, and these are all within the scope of the present invention.