Receiver module integrated with duct

Abstract

Disclosed is a receiver module integrated with a duct. The present disclosure provides a receiver module integrated with a duct in which a back volume and a duct are provided at an outer circumference of a frame of a receiver.

Claims

1. A receiver module integrated with a duct, the receiver module comprising: a receiver including a magnetic circuit, a frame covering the magnetic circuit, a voice coil, and a diaphragm and having a back hole for ventilation on the frame; a back volume communicating with the back hole of the receiver and an outside and amplifying sound through resonance; and a duct provided in the back volume and having a communication hole communicating with the outside separately from the back volume, wherein the back volume is disposed on an outer circumference of the receiver, wherein the back volume is defined by an air module body coupled to an outer circumference of the frame, the frame, and a plate bonded to a lower surface of the air module body.

2. The receiver module of claim 1, wherein the back volume has a size not exceeding an overall height of the receiver.

3. The receiver module of claim 1, wherein the air module body comprises a partition forming a duct.

4. A receiver module integrated with a duct, the receiver module comprising: a receiver including a magnetic circuit, a frame covering the magnetic circuit, a voice coil, and a diaphragm and having a back hole for ventilation on the frame; a back volume communicating with the back hole of the receiver and an outside and amplifying sound through resonance; a duct provided in the back volume and having a communication hole communicating with the outside separately from the back volume; an air module body having a lower surface coupled to an inner circumference of the frame and a side surface coupled to an outer circumference of the frame and defining the back volume with the frame; and a duct body coupled within the air module body and defining the duct.

5. The receiver module of claim 4, wherein the lower surface of the air module body comprises a back volume communication hole communicating with the back volume and a duct communication hole communicating with the duct.

6. A receiver module integrated with a duct, the receiver module comprising: a receiver including a magnetic circuit, a frame covering the magnetic circuit, a voice coil, and a diaphragm, and having a back hole provided at the frame for ventilation; a back volume communicating with the back hole of the receiver and an outside and amplifying sound through resonance; and a duct provided in the back volume and having a communication hole communicating with the outside separately from the back volume, wherein the back volume is provided in the frame, wherein the frame of the receiver has an inner wall coupled to a yoke, an outer wall formed to be spaced apart from the inner wall, and a duct forming partition traversing the inner wall and the outer wall, wherein the receiver module further comprises a plate coupled to the inner wall and the outer wall of the frame and having a back volume communication hole and a duct communication hole.

7. The receiver module of claim 6, wherein the back volume has a size not exceeding an overall height of the receiver.

8. The receiver module of claim 6, wherein the back volume has a size not exceeding an overall height of the receiver.

9. A receiver module integrated with a duct, the receiver module comprising: a receiver including a magnetic circuit, a frame covering the magnetic circuit, a voice coil, and a diaphragm, and having a back hole provided at the frame for ventilation; a back volume communicating with the back hole of the receiver and an outside and amplifying sound through resonance; and a duct provided in the back volume and having a communication hole communicating with the outside separately from the back volume, wherein the back volume is disposed within an overall height of the receiver, wherein a rear space of the receiver which is opposite to the diaphragm is utilized as an installation space of a PCB (printed circuit board) or related hardware of the PCB.

10. The receiver module of claim 9, wherein the back volume is defined by an air module body coupled to an outer circumference of the frame, the frame, and a plate bonded to a lower surface of the air module body.

11. The receiver module of claim 10, wherein the air module body comprises a partition forming a duct.

12. The receiver module of claim 9, further comprising: an air module body having a lower surface coupled to an inner circumference of the frame and a side surface coupled to an outer circumference of the frame and defining a back volume with the frame; and a duct body coupled within the air module body and defining the duct.

13. The receiver module of claim 12, wherein the lower surface of the air module body comprises a back volume communication hole communicating with the back volume and a duct communication hole communicating with the duct.

14. The receiver module of claim 9, wherein the frame of the receiver has an inner wall coupled to a yoke, an outer wall formed to be spaced apart from the inner wall, and a duct forming partition traversing the inner wall and the outer wall, and wherein the receiver module further comprises: a plate coupled to the inner wall and the outer wall of the frame and having a back volume communication hole and a duct communication hole.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a perspective view of a bracket installation of an opened air type earphone having a bracket for forming a duct according to the related art as viewed from a rear housing;

(2) FIG. 2 is a cross-sectional view of an opened air type earphone having a bracket for forming a duct according to the related art;

(3) FIG. 3 is a perspective view of an opened air type earphone having a bracket for forming a duct according to the related art as viewed from the inside of the bracket;

(4) FIG. 4 is a rear view of a receiver module integrated with a duct according to a first embodiment of the present disclosure;

(5) FIG. 5 is a rear perspective view of the receiver module integrated with a duct according to the first embodiment of the present disclosure;

(6) FIG. 6 is a rear view of the receiver module integrated with a duct according to the first embodiment of the present disclosure;

(7) FIG. 7 is a view showing a state in which the receiver module integrated with a duct according to the first embodiment of the present disclosure is coupled with a front housing of an earphone;

(8) FIG. 8 is an exploded view of a receiver module integrated with a duct according to a second embodiment of the present disclosure;

(9) FIG. 9 is a cross-sectional view of a receiver module integrated with a duct according to the second embodiment of the present disclosure;

(10) FIG. 10 is an exploded view of a receiver module integrated with a duct according to a third embodiment of the present disclosure;

(11) FIG. 11 is a cross-sectional view of a receiver module integrated with a duct according to the third embodiment of the present disclosure; and

(12) FIG. 12 is a graph showing a comparison between sound pressure by frequency of an earphone to which a receiver module integrated with a duct according to an embodiment of the present disclosure is applied, a duct-divided earphone of the related art, and a ductless earphone.

DETAILED DESCRIPTION

(13) FIG. 4 is a rear view of a receiver module integrated with a duct according to a first embodiment of the present disclosure, FIG. 5 is a rear perspective view of the receiver module integrated with a duct according to the first embodiment of the present disclosure as viewed from the rear side, and FIG. 6 is a rear perspective view of the receiver module integrated with a duct according to the first embodiment.

(14) The receiver module integrated with a duct according to the first embodiment of the present disclosure includes a receiver 300, an air module body 200 coupled to the receiver 300 to form a duct and a back volume, and a plate 220.

(15) The receiver 300 has a general shape and includes a frame 310 having an outer wall, a yoke 320 coupled within the frame 310 and forming a lower surface, a magnet bonded to the yoke 320, a voice coil located in a magnetic gap between the yoke 320 and the magnet, and a diaphragm vibrated by vibration of the voice coil and generating sound. The frame 310 covers a magnetic circuit including the yoke 320 and the magnet, the voice coil and the diaphragm, and has a back hole (not shown) for ventilation on the frame.

(16) The air module body 200 is coupled to an outer wall of the frame 310, surrounds the outer wall of the frame 310, and has an overall height smaller than that of the frame 310. The plate 220 is bonded to a lower surface of the air module body 200 and has a ring shape. An inner circumference of the plate 220 is coupled to the frame 310 and an outer circumference thereof is coupled to the air module body 200.

(17) The air module body 200 includes an “L”-shaped partition 202 at a partial region thereof to partition upper and lower spaces, thereby partitioning a back volume 210 and a duct 223. The back volume 210 communicating with the back hole of the frame of the receiver is formed at a rear of the receiver 300 and serves to amplify sound of the receiver 300. In addition, the duct 223 serves to perform a frequency tuning function to particularly amplify a sound pressure in a low frequency range to flatten sound pressure in the entire frequency range. Here, frequency tuning through the duct 223 may be easily adjusted by changing a length of the partition 202 (i.e., an angle occupied by the partition in 360°).

(18) The plate 220 includes a back volume communication hole 221 communicating with the back volume 210 and a duct communication hole 224 communicating with the duct 223. A mesh or the like may be bonded to the back volume communication hole 221 and the duct communication hole 224 to prevent inflow of foreign matter.

(19) Here, it is preferable that the plate 220 is coplanar with a yoke 320 of the receiver 300. The flat surface of the yoke 320 and the plate 220 may facilitate installation of PCB or its related hardware components for configuring an earphone on a rear surface of the yoke 320 and the plate 220. Preferably, such omission of the bracket of the related art at the rear space may facilitate installation of PCB or its related hardware components for implementing the wireless earphone on the rear space.

(20) FIG. 7 is a view showing a state in which a receiver module integrated with a duct according to the first embodiment of the present disclosure is coupled with a front housing of an earphone.

(21) Sound generated by the receiver 300 is emitted through a sound emitting hole 110 of the front housing 100, and since the receiver 300 itself has the back volume 210 and the duct 223, a design of a rear surface of the earphone may be freely changed. In addition, since the back volume 210 and the duct 223 are included in the receiver module, there is no need to change the structure of the duct 223 and the back volume 210 even if design of a device mounted on the rear surface of the earphone is changed. Therefore, there is an advantage that the structure of the duct 223 may be standardized (modularized) regardless of earphone design.

(22) Meanwhile, in the case of the related art structure, a thickness of the receiver and the duct corresponds to the sum of a thickness of a receiver unit and even a thickness of a bracket. However, in the case of the receiver module integrated with a duct, since the air module body 200 and the plate 220 are installed within a thickness range of the receiver, the thickness of the receiver corresponds to a thickness of the receiver module integrated with a duct. That is, in the present disclosure, the thickness (overall height) may be reduced as much as the thickness of the bracket of the related art. This brings about an effect of reducing a thickness of the rear surface of the earphone on which the receiver module integrated with a duct according to the present disclosure is installed.

(23) FIG. 8 is an exploded view of a receiver module integrated with a duct according to a second embodiment of the present disclosure, and FIG. 9 is a cross-sectional view of a receiver module integrated with a duct according to the second embodiment of the present disclosure.

(24) The receiver module integrated with a duct according to the second embodiment of the present disclosure has a lower surface 201a coupled to an inner circumference of the frame 310 and a side surface 202a coupled to an outer circumference of the frame 310 and includes an air module body 200a defining a back volume 210a with the frame 310. Here, unlike the first embodiment, a partition defining a duct is not integrally formed in the air module body 200a, and a duct body 203a defining a duct 230a is provided.

(25) In order to be in stably contact with the inner circumference of the frame 310, the lower surface 201a may have a bent portion bent upward (downward in the drawing), and the lower surface 201a may have a back volume communication hole 221a communicating with the back volume 210a and a duct communication hole 224a formed at a region to which the duct body 203a is coupled, as in the first embodiment.

(26) The air module body 200a does not cover the yoke 320, and thus the lower surface 201a has a ring shape with a central hole. Accordingly, the duct body 203a coupled to the air module body 200a also has a shape of a part of a ring. A length of the duct 230a may be changed by changing a length of the duct body 203a, and thus a sound pressure in a low register may be tuned. Since the air module body 200a and the duct body 203a have a ring shape, the length of the duct 230a may vary depending on an angle occupied by the duct body 203a at 360°, which is the angle of the entire air module body 200a.

(27) The duct body 203a may not be separately manufactured but may be integrally manufactured when the air module body 200a is manufactured. However, when the duct body 203a is separately manufactured, sound characteristics of the receiver module may be advantageously tuned by changing only the length of the duct body 203a coupled to the air module body 200a.

(28) FIG. 10 is an exploded view of a receiver module integrated with a duct according to a third embodiment of the present disclosure, and FIG. 11 is a cross-sectional view of a receiver module integrated with a duct according to the third embodiment of the present disclosure.

(29) In the receiver module integrated with a duct according to the third embodiment of the present disclosure, the air module body in the first and second embodiments is formed integrally with the frame.

(30) In the receiver module integrated with a duct according to the third embodiment of the present disclosure, a frame 310a of a receiver includes an inner wall 312a surrounding a yoke 320 and an outer wall 314a spaced apart from the yoke 320, and a space between the inner wall 312a and the outer wall 314 is used as the back volume 210a. In the back volume 210a, a partition 316a for defining the duct 223a is provided as in the previous embodiments. A length of the duct 223a varies according to a length of the partition 316a, the sound characteristics of the receiver module also vary.

(31) The plate 220, whose inner circumference and outer circumference are respectively coupled to the inner wall 312a and the outer wall 314a of the frame 310a, and which defines the back volume 210a and the duct 223a together with the frame 310a is provided. The plate 220 is the same as the plate in the first embodiment. The plate 220 includes a back volume communication hole 221 in communication with the back volume 210a and a duct communication hole 224 in communication with the duct 223a.

(32) FIG. 12 is a graph showing a comparison between sound pressure by frequency of an earphone to which a receiver module integrated with a duct according to an embodiment of the present disclosure is applied, a duct-divided (existing) earphone of the related art, and a ductless earphone.

(33) As can be seen from the graph, compared to an earphone without a duct, when a duct is formed, the sound pressure in the low frequency band may be improved to achieve flattening of overall sound. It can be seen that the effect of improving the low-frequency characteristics is the same without a significant difference between when a separate bracket is provided and installed in the rear housing (duct-divided, existing) as in the related art and when the module is formed integrally with the receiver as in the present disclosure.

(34) Therefore, since the back volume and the duct are disposed within the overall height of the receiver, while obtaining the same effect of improving the sound pressure in the low register, the receiver module including the back volume and the duct may be placed in the earphone housing and space utilization of the rear surface of the receiver module may be increased.

(35) Although specific embodiments have been illustrated and described herein, it will be appreciated by those of ordinary skill in the art that a variety of alternate and/or equivalent implementations may be substituted for the specific embodiments shown and described without departing from the scope of the present invention. This application is intended to cover any adaptations or variations of the specific embodiments discussed herein. Therefore, it is intended that this invention be limited only by the claims and the equivalents thereof.