METHOD AND SYSTEM FOR APPLYING A PATTERN ON A MASK LAYER
20220176688 · 2022-06-09
Assignee
Inventors
Cpc classification
B41C1/003
PERFORMING OPERATIONS; TRANSPORTING
H04N1/405
ELECTRICITY
G03F7/2016
PHYSICS
International classification
Abstract
A method for applying a pattern on a mask layer includes obtaining an image file representing pixels with a first pixel size in a first direction parallel to an edge of the pixel, and a second pixel size in a second direction perpendicular to the first direction, where the first and second pixel size are the same or different, treating the mask layer such that a plurality of areas with altered physical properties are created in the mask layer, the plurality of areas corresponding to a plurality of pixels of the image file, where the treatment is done such that a first and/or a second area size of an area of said plurality of areas, seen in said first and/or said second direction, is smaller than the first and/or second pixel size, respectively.
Claims
1. A method for applying a pattern on a mask layer, said method comprising: obtaining an image file representing pixels with a first pixel size in a first direction parallel to an edge of the pixel, and a second pixel size in a second direction perpendicular to the first direction, wherein the first and second pixel size are the same or different; treating the mask layer such that a plurality of areas with altered physical properties are created in the mask layer, said plurality of areas corresponding to a plurality of pixels of the image file, wherein the treatment is done such that a first and/or a second area size of an area of said plurality of areas, seen in said first and/or said second direction, is smaller than the first and/or second pixel size, respectively; wherein the method is performed without manipulating the image file for obtaining a surface screen pattern on the mask.
2. The method of claim 1, wherein the treatment is done such that an area size of an area of said plurality of areas, seen in said first and said second direction, is smaller than the first and second pixel size, respectively.
3. A method for applying a pattern on a mask layer, said method comprising: obtaining an image file representing pixels with a first pixel size in a first direction parallel to an edge of the pixel, and a second pixel size in a second direction perpendicular to the first direction, wherein the first and second pixel size are the same or different; treating the mask layer such that a plurality of areas with altered physical properties are created in the mask layer, said plurality of areas comprising at least a first and second area corresponding to directly adjacent first and second pixels of the image file, wherein the treatment is done such that the first and second area do not overlap in the first direction and/or in the second direction.
4. The method according to claim 1, wherein the plurality of areas correspond to a plurality of holes or to a plurality of areas with a transparency to electromagnetic radiation which is different from the transparency of the untreated mask material.
5. The method according to claim 1, wherein the first and/or second area size is in the range of 20% to 99%, preferably in the range of 30% to 90%, more preferably in the range of 40% to 80%, of the first and/or second pixel size, respectively.
6. The method according to claim 1, where the step of treating the mask layer is done using a beam of a first electromagnetic radiation.
7. The method according to claim 6, wherein the beam has a first and second beam size in said first and second direction, wherein said first and/or second beam size is smaller than the first and/or second pixel size, respectively, said first and second beam size being the longest distance in an intensity profile, of a cross section of the beam in said first and second direction, respectively, between two points in the intensity profile where the intensity equals 50% of the maximum intensity in this cross section.
8. The method according to claim 7, wherein the first and/or second beam size is in the range of 20% to 95%, respectively.
9. The method according to claim 6, wherein the beam is chosen to have a wavelength, a first and second beam size, a beam power and an on-time, wherein said beam power and/or said first and/or second beam size and/or said on-time is set based on an analysis of the obtained image file.
10. The method according to claim 6, wherein a beam used for generating areas corresponding with pixels of a first region of the image file is different from a beam used for generating areas corresponding with pixels of a second region of the image file.
11. The method according to claim 6, wherein a beam, and in particular the first and/or second beam size and/or the beam power thereof, is chosen in function of a tonal value of pixels of a halftone region of the image file.
12. The method according to claim 6, wherein the cross section of the beam has a circular, elliptic, square, rectangular or polygonal shape, and/or wherein the intensity profile of the beam is Gaussian, trapezoidal or rectangular.
13. The method according to claim 6, wherein the mask layer initially is essentially in-transparent for first the electromagnetic radiation of the beam; and/or wherein the mask layer is undergoing a change in transparency due to ablation, and/or bleaching, and/or color change, and/or polarization change when exposed to the first electromagnetic radiation.
14. The method according to claim 1, wherein the step of treating the mask layer is controlled, such that, for an image region of the image included in the image file, the plurality of areas corresponding to the at least one image region form a pattern, wherein preferably said pattern is any one of the following: a regular or periodic pattern, a stochastic pattern or a combination thereof; wherein the image region corresponds to a halftone region or a solid region.
15. The method according to claim 14, wherein the step of treating the mask layer is controlled, such that, for an image region of the image included in the image file, the first and/or second area size and/or the distribution of the areas is the same or different in an area close to the center and an area close to the edge of the image region.
16. The method according to claim 1, wherein the step of treating the mask layer is controlled, such that, for an image region of the image included in the image file, the density of the areas is set in function of the size of the image region and/or the density of the areas increases or decreases from the center of the image region to the edge of the image region.
17-18. (canceled)
19. The method according to claim 1, wherein the obtained image file has not been manipulated by changing the image file resolution and/or has not been manipulated by removing pixels to generate said plurality of areas within the image file.
20. (canceled)
21. The method according to claim 1, wherein the mask layer is comprised in a printing plate precursor; wherein the printing plate precursor comprises one or more layers selected from the list consisting of a support layer, a photoactive layer, a protective layer, a barrier layer, a diffracting layer, a diffusing layer, an adhesive layer, or combinations thereof.
22. A method to form an imaged layer composition, said method comprising the steps: combining a mask layer and a substrate layer to form a layer composition, applying a pattern to the mask layer according to the method of claim 1, treating the layer composition such that the substrate layer undergoes a property change in a plurality of substrate areas corresponding with the plurality of areas created in the patterned mask layer, such that an imaged layer composition is formed.
23. The method according to claim 22, wherein the step of treating the layer composition is done with a second electromagnetic radiation.
24-43. (canceled)
44. A system for applying a pattern on a mask layer, said system comprising: a control module configured for obtaining an image file representing pixels with a first pixel size in a first direction parallel to an edge of the pixel, and a second pixel size in a second direction perpendicular to the first direction, wherein the first and second pixel size are the same or different; a treatment means configured for treating the mask layer such that a plurality of areas with altered physical properties are created in the mask layer, said plurality of areas corresponding to a plurality of pixels of the image file; wherein said control module is further configured to control the treatment such that a first and/or second area size of an area of said plurality of areas, as measured in said first and second direction, is smaller than the first and second pixel size, respectively; wherein the controlling is performed without manipulating the image file for obtaining a surface screen pattern on the mask.
45. A system for applying a pattern on a mask layer, said system comprising: a control module configured obtaining an image file representing pixels with a first pixel size in a first direction parallel to an edge of the pixel, and a second pixel size in a second direction perpendicular to the first direction, wherein the first and second pixel size are the same or different; a treatment means configured for treating the mask layer such that a plurality of areas with altered physical properties are created in the mask layer, said plurality of areas comprising at least a first and second area corresponding with directly adjacent first and second pixels of the image file; wherein said control module is further configured to control the treatment means such that the first and second area do not overlap in the first and/or second direction.
Description
BRIEF DESCRIPTION OF THE FIGURES
[0056] The accompanying drawings are used to illustrate presently preferred non-limiting exemplary embodiments of methods and systems of the present invention. The above and other advantages of the features and objects of the invention will become more apparent and the invention will be better understood from the following detailed description when read in conjunction with the accompanying drawings, in which:
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DETAILED DESCRIPTION OF EMBODIMENTS
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[0068] The beam, and in particular the beam size, is chosen such that an area size h of a hole 5 of the plurality of holes 5 is smaller than the pixel size p. The plurality of holes 5 comprises at least a first and second area A1, A2, here a first and second hole 5a, 5b corresponding to directly adjacent first and second pixels 4a, 4b of the image file, wherein the treatment by the beam is done such that the first and second hole 5a, 5b do not overlap. When referring to directly adjacent pixels, it is meant that the pixels have a common edge, i.e. either an edge in the first direction or an edge in the second direction. In other words, in the example of
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[0070] In another non-illustrated example the area is substantially elliptic with a first smallest area size h1 extending in a first direction, which is smaller than the pixel size p, and with a second larger area size h2 extending in a second direction perpendicular on the first direction, which is also smaller than the pixel size p (h1<p, h2<p). In that way a plurality of areas A1, A2 can be formed which do not overlap in the first and second direction.
[0071] In the embodiment of
[0072] In the embodiment of
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EXAMPLES
[0077] In table 1 three examples of the prior art (Ref. 1 to Ref. 3) are compared with two examples (Ex. 1 to Ex. 2) of the present invention.
[0078] Different methods and beam sizes were applied to a digital printing plate precursor comprising an integrated mask layer, which may be ablated by an IR Laser beam. Table 1 contains the specific dimensions, beam shapes and intensity profiles, as well as the results obtained upon printing (solid ink density).
TABLE-US-00001 TABLE 1 Relative Number Rel- Relative Laser of ative File Sur- size of Beam tonal file size face Size hole Image Surface Dia- values size after screen- of in the File Pattern Beam meter @150 lpi in % sur- ing hole mask reso- Pixel Reso- Dia- (% of classic (typ- face comp- in (% of Solid lution size lution meter Beam Intensity pixel screen ical screen- utation mask pixel Ink Sample (dpi) (μm) (lpi) (μm) Shape profile size) ruling file) ing time (μm) size) density Ref. 1 2540 10 none 11 Round Gauss 110 286 ~120 equal none 12.5 125 low Fig. 4A Ref. 2 4000 6.35 none 7 Round Gauss 110 711 ~220 equal none 8 125 low Fig. 4B Ref. 3 4000 6.35 1414 7 Round Gauss 110 89 ~250 larger extra 12.7 200 high Fig. 4C Ex. 1 2000 12.7 2000 6 Round Gauss 47 177 ~100 equal none 6 47 high Fig. 5A Ex. 2 2540 10 2540 6 Round Gauss 60 286 ~120 equal none 6 60 high Fig. 5B
[0079] The image file resolution (dpi) is the number of pixels per inch, counted in one dimension and expressed in dpi (dots per inch) or ppi (pixels per inch), in the image file. For the examples of the table the pixels are square. The pixel size, in micron and in that dimension, is the inverse of the resolution in dpi, multiplied by 25400.
[0080] The beam diameter (micron) is the longest measured distance in the intensity profile, of any cross section of the beam, between two points in the intensity profile where the intensity equals 50% of the maximum intensity in this section. The intensity profile is the intensity profile of light as generated by a single imaging pixel.
[0081] The intensity profile is the spatial distribution of the light intensity (W/mm2) of the laser beam. Typical profiles can be merely Gaussian, merely rectangular (top hat) or merely trapezoidal. The intensity profile is the intensity profile of light as generated by a single imaging pixel.
[0082] The beam shape is the 2-D shape of a cross section of the intensity profile at a specific intensity value. Typical beam shapes are elliptical or round, or are polygonal (square, rectangular, triangular, hexagonal, . . . ). The intensity profile is the intensity profile of light as generated by a single imaging pixel.
[0083] The number of tonal values in a classic screen with additional surface screening is the number of surface pattern elements in a full tone classic screen element. It is equal to the square of the ratio between the surface screen lpi and the classic screen lpi.
[0084] The size of the hole in the mask in micron is the size of the hole in the mask, created by the intensity profile of the exposing light, generated by a single imaging pixel. It is analyzed with a transmitted light microscope and uses the transmitted light intensity profile. It is measured as the longest distance in the transmitted intensity profile between two points in the transmitted intensity profile where the transmitted intensity equals 50% of the maximum transmitted intensity.
[0085] The solid ink density is measured on a printed sample of a solid area, as the reflected density using a digital densitometer.
[0086] The results for examples 1 and 2 in table 1 clearly show that a high ink density was obtained in a shorter time and without manipulation of the image file.
[0087] The table above shows that the surface pattern screening resolution that can be obtained with the embodiments of
[0088] Whilst the principles of the invention have been set out above in connection with specific embodiments, it is to be understood that this description is merely made by way of example and not as a limitation of the scope of protection which is determined by the appended claims.